Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7051046
T. Kaneko, N. Minh-Dung, P. Quang-Khang, Y. Takei, T. Takahata, K. Matsumoto, I. Shimoyama
We propose a device that can measure pulse waves at various points on human body with high sensitivity. Pulse wave velocity was calculated from a synchronized pulse wave measurement on two points. The device had a piezoresistive cantilever placed on silicone oil. The cantilever with oil was embedded in polydimethylsiloxane (PDMS). Pressure waves from arteries can be well conveyed to the cantilever, for the human-skin-like acoustic impedance of the silicone oil and PDMS. The signal to noise ratio of the device was ~80 dB in 10-100 Hz, when excited ~1 μm in displacement.
{"title":"Pulse wave measurement in human using piezoresistive cantilever on liquid","authors":"T. Kaneko, N. Minh-Dung, P. Quang-Khang, Y. Takei, T. Takahata, K. Matsumoto, I. Shimoyama","doi":"10.1109/MEMSYS.2015.7051046","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7051046","url":null,"abstract":"We propose a device that can measure pulse waves at various points on human body with high sensitivity. Pulse wave velocity was calculated from a synchronized pulse wave measurement on two points. The device had a piezoresistive cantilever placed on silicone oil. The cantilever with oil was embedded in polydimethylsiloxane (PDMS). Pressure waves from arteries can be well conveyed to the cantilever, for the human-skin-like acoustic impedance of the silicone oil and PDMS. The signal to noise ratio of the device was ~80 dB in 10-100 Hz, when excited ~1 μm in displacement.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126395088","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7050930
C. Hung
MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS.
{"title":"Semiconductor ic packaging, the next wave","authors":"C. Hung","doi":"10.1109/MEMSYS.2015.7050930","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7050930","url":null,"abstract":"MEMS sensor growth in the future is expected with inevitable trend on miniaturization for smartphone and wearable devices. In this presentation, the next wave architecture of 3D IC packaging solution overview versus traditional packaging technologies will be demonstrated and discussed, for applications including MEMS.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"323 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115279737","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7051018
Y. Morimoto, S. Mori, S. Takeuchi
We propose a method for constructing fiber-type three-dimensional (3D) tissue of human iPS-derived cardiomyocytes and quantifying its contractile force in response to the addition of drug. By culturing the cardiomyocytes in micropatterned hydrogel with anchors, we succeeded in fabrication of the fibers with aligned cardiomyocytes and fixation of the fiber edges to the anchors. Since the fiber generated contractile force in a single direction due to alignment of cardiomyocytes, we can measure the contractile force accurately. Furthermore, as a demonstration of drug testing, we quantified contractile frequency and force in accordance with concentrations of pilsicainide. We believed that the fiber of human iPS-derived cardiomyocytes will be used in pharmacokinetic applications for drug development.
{"title":"3D human cardiac muscle on a chip: Quantification of contractile force of human iPS-derived cardiomyocytes","authors":"Y. Morimoto, S. Mori, S. Takeuchi","doi":"10.1109/MEMSYS.2015.7051018","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7051018","url":null,"abstract":"We propose a method for constructing fiber-type three-dimensional (3D) tissue of human iPS-derived cardiomyocytes and quantifying its contractile force in response to the addition of drug. By culturing the cardiomyocytes in micropatterned hydrogel with anchors, we succeeded in fabrication of the fibers with aligned cardiomyocytes and fixation of the fiber edges to the anchors. Since the fiber generated contractile force in a single direction due to alignment of cardiomyocytes, we can measure the contractile force accurately. Furthermore, as a demonstration of drug testing, we quantified contractile frequency and force in accordance with concentrations of pilsicainide. We believed that the fiber of human iPS-derived cardiomyocytes will be used in pharmacokinetic applications for drug development.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"166 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116698843","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7050974
Zhonglie An, M. Toda, G. Yamamoto, T. Hashida, T. Ono
We present the fabrication and characterization of a silicon micromirror with carbon nanotubes (CNTs)-nickel (Ni) composite beams, and evaluate the mechanical stability of the micromirror in terms of resonant frequency. A novel electroplating method is developed for the synthesis of the CNTs-Ni composite. The weight fraction of the CNTs in the electroplated composite is 2.6 wt%, and the ultramicroindentation hardness of the composite is 18.6 GPa. The maximum variation of the resonant frequency of the fabricated micromirror during a long term stability test is approximately 0.25%, and its scanning angle is approximately 20°. It shows the potential ability of the CNTs-Ni composite for micromechanical elements application.
{"title":"Synthesis of carbon nanotubes-Ni composite for micromechanical elements application","authors":"Zhonglie An, M. Toda, G. Yamamoto, T. Hashida, T. Ono","doi":"10.1109/MEMSYS.2015.7050974","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7050974","url":null,"abstract":"We present the fabrication and characterization of a silicon micromirror with carbon nanotubes (CNTs)-nickel (Ni) composite beams, and evaluate the mechanical stability of the micromirror in terms of resonant frequency. A novel electroplating method is developed for the synthesis of the CNTs-Ni composite. The weight fraction of the CNTs in the electroplated composite is 2.6 wt%, and the ultramicroindentation hardness of the composite is 18.6 GPa. The maximum variation of the resonant frequency of the fabricated micromirror during a long term stability test is approximately 0.25%, and its scanning angle is approximately 20°. It shows the potential ability of the CNTs-Ni composite for micromechanical elements application.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123806704","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7050977
S. Keshavarzi, U. Mescheder, H. Reinecke
This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.
{"title":"Bonding mechanism in the Velcro concept Si-Si low temperature direct bonding technique","authors":"S. Keshavarzi, U. Mescheder, H. Reinecke","doi":"10.1109/MEMSYS.2015.7050977","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7050977","url":null,"abstract":"This work presents a bonding mechanism between needle-like surfaces for room temperature Si-Si direct bonding similar to the Velcro-principle, a fully CMOS compatible approach suitable for system integration using Si-motherboard concept. The proposed bonding model is superior to other presented models since it considers humidity effect and the deformation mechanism of the needles during the bonding.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"316 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122782123","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7051106
D. Fujisawa, S. Ogawa, H. Hata, Mitsuharu Uetsuki, Koji Misaki, Yousuke Takagawa, M. Kimata
This paper reports a silicon-on-insulator diode uncooled infrared focal plane array (IRFPA) with through-hole plasmonic metamaterial absorbers (TH-PLMAs) for multi-color imaging with a 320×240 array format. Through-holes formed on the PLMA can reduce the thermal mass while maintaining both the single-mode and high absorption due to plasmonic metamaterial structures, which results in fast response and high responsivity. The detection wavelength of the PLMA with through-holes can be controlled over a wide range of the IR spectrum by varying the size of the micropatches on the top layer.
{"title":"Multi-color imaging with silicon-on-insulator diode uncooled infrared focal plane array using through-hole plasmonic metamaterial absorbers","authors":"D. Fujisawa, S. Ogawa, H. Hata, Mitsuharu Uetsuki, Koji Misaki, Yousuke Takagawa, M. Kimata","doi":"10.1109/MEMSYS.2015.7051106","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7051106","url":null,"abstract":"This paper reports a silicon-on-insulator diode uncooled infrared focal plane array (IRFPA) with through-hole plasmonic metamaterial absorbers (TH-PLMAs) for multi-color imaging with a 320×240 array format. Through-holes formed on the PLMA can reduce the thermal mass while maintaining both the single-mode and high absorption due to plasmonic metamaterial structures, which results in fast response and high responsivity. The detection wavelength of the PLMA with through-holes can be controlled over a wide range of the IR spectrum by varying the size of the micropatches on the top layer.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132198045","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7050884
Carlos Errando-Herranz, F. Niklaus, G. Stemme, K. Gylfason
We experimentally demonstrate a low-power MEMS tunable photonic ring resonator with 10 selectable channels for wavelength selection in reconfigurable optical networks operating in the C band. The tuning is achieved by changing the geometry of the slot of a silicon slot-waveguide ring resonator, by means of vertical electrostatic parallel-plate actuation. Our device provides static power dissipation below 0.1 μW, a wavelength tuning range of 1 nm, and a narrow bandwidth of 0.1 nm, i.e. 10 nW static power dissipation per selectable channel for TE mode tuning.
{"title":"A low-power MEMS tunable photonic ring resonator for reconfigurable optical networks","authors":"Carlos Errando-Herranz, F. Niklaus, G. Stemme, K. Gylfason","doi":"10.1109/MEMSYS.2015.7050884","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7050884","url":null,"abstract":"We experimentally demonstrate a low-power MEMS tunable photonic ring resonator with 10 selectable channels for wavelength selection in reconfigurable optical networks operating in the C band. The tuning is achieved by changing the geometry of the slot of a silicon slot-waveguide ring resonator, by means of vertical electrostatic parallel-plate actuation. Our device provides static power dissipation below 0.1 μW, a wavelength tuning range of 1 nm, and a narrow bandwidth of 0.1 nm, i.e. 10 nW static power dissipation per selectable channel for TE mode tuning.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114361693","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7050880
S. Dellea, F. Giacci, A. Longoni, P. Rey, A. Berthelot, G. Langfelder
This work presents in-plane and out-of-plane Coriolis rate gyroscopes based on nano-scale piezoresistive readout and using an eutectic bonding between the bottom wafer, where the sensor is formed, and the cap wafer, where routing and metal pads are fabricated. The gyroscopes feature a novel design with a central levered sense frame, to maximize the device symmetry and compactness. The position of the piezoresistive nano-gauges along the lever system optimizes the scale-factor. Operation on a ± 3000 dps full-scale-range (FSR) demonstrates quite competitive performance, with a linearity error lower than 0.25% and a cross-axis rejection 50× better than state-of-the art consumer gyroscopes.
{"title":"Large full scale, linearity and cross-axis rejection in low-power 3-axis gyroscopes based on nanoscale piezoresistors","authors":"S. Dellea, F. Giacci, A. Longoni, P. Rey, A. Berthelot, G. Langfelder","doi":"10.1109/MEMSYS.2015.7050880","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7050880","url":null,"abstract":"This work presents in-plane and out-of-plane Coriolis rate gyroscopes based on nano-scale piezoresistive readout and using an eutectic bonding between the bottom wafer, where the sensor is formed, and the cap wafer, where routing and metal pads are fabricated. The gyroscopes feature a novel design with a central levered sense frame, to maximize the device symmetry and compactness. The position of the piezoresistive nano-gauges along the lever system optimizes the scale-factor. Operation on a ± 3000 dps full-scale-range (FSR) demonstrates quite competitive performance, with a linearity error lower than 0.25% and a cross-axis rejection 50× better than state-of-the art consumer gyroscopes.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"97 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131646629","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7051125
Siddhartha Ghosh, G. Piazza
This paper presents a new type of acousto-optic modulator based on the conjunction of a piezoelectric contour mode resonator (CMR) with a photonic whispering gallery mode resonator (WGMR). The monolithic device fabricated in aluminum nitride (AlN) exhibits the coupling of piezoelectrically-generated lateral vibrations into a traveling-wave photonic ring resonator in a fully-integrated platform with electrodes directly patterned on the CMR body. We demonstrate the optical sensing of a piezoelectrically actuated mechanical mode at 654 MHz, enabling new possibilities for MEMS-based RF-photonics applications or new degrees of control of phonon-photon interactions in the field of optomechanics.
{"title":"Integrated piezoelectrically driven acousto-optic modulator","authors":"Siddhartha Ghosh, G. Piazza","doi":"10.1109/MEMSYS.2015.7051125","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7051125","url":null,"abstract":"This paper presents a new type of acousto-optic modulator based on the conjunction of a piezoelectric contour mode resonator (CMR) with a photonic whispering gallery mode resonator (WGMR). The monolithic device fabricated in aluminum nitride (AlN) exhibits the coupling of piezoelectrically-generated lateral vibrations into a traveling-wave photonic ring resonator in a fully-integrated platform with electrodes directly patterned on the CMR body. We demonstrate the optical sensing of a piezoelectrically actuated mechanical mode at 654 MHz, enabling new possibilities for MEMS-based RF-photonics applications or new degrees of control of phonon-photon interactions in the field of optomechanics.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133380764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-03-02DOI: 10.1109/MEMSYS.2015.7051101
M. Maldonado-Garcia, E. Mehdizadeh, Varun Kumar, J. C. Wilson, S. Pourkamali
This work presents chip-scale integration of MEMS resonant mass balances along with aerosol inertial impactors (airborne micro/nanoparticle collectors). A three mask microfabrication process has been developed to produce the main components; mass balance, impactor nozzle, and impaction micro-chamber on a single SOI substrate. In addition to extreme miniaturization of a conventionally bulky setup and allowing real-time particulate mass concentration data collection, this approach addresses assembly challenges for discrete versions of such systems, e.g. misalignment between MEMS resonators and nozzles. Furthermore, small nozzle diameters achievable through microfabrication, minimizes the air flow and therefore pump capacity requirements.
{"title":"Chip-scale aerosol impactor with integrated resonant mass balances for real time monitoring of airborne particulate concentrations","authors":"M. Maldonado-Garcia, E. Mehdizadeh, Varun Kumar, J. C. Wilson, S. Pourkamali","doi":"10.1109/MEMSYS.2015.7051101","DOIUrl":"https://doi.org/10.1109/MEMSYS.2015.7051101","url":null,"abstract":"This work presents chip-scale integration of MEMS resonant mass balances along with aerosol inertial impactors (airborne micro/nanoparticle collectors). A three mask microfabrication process has been developed to produce the main components; mass balance, impactor nozzle, and impaction micro-chamber on a single SOI substrate. In addition to extreme miniaturization of a conventionally bulky setup and allowing real-time particulate mass concentration data collection, this approach addresses assembly challenges for discrete versions of such systems, e.g. misalignment between MEMS resonators and nozzles. Furthermore, small nozzle diameters achievable through microfabrication, minimizes the air flow and therefore pump capacity requirements.","PeriodicalId":337894,"journal":{"name":"2015 28th IEEE International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"352 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-03-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115977843","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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