Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659807
S. Henry, D. McAllister, Mark G. Allen, M. Prausnitz
Although modern biotechnology has produced extremely sophisticated and potent drugs, many of these compounds cannot be effectively delivered using current drug delivery techniques (e.g., pills and injections). Administration across skin by transdermal drug delivery is an attractive alternative, but it is limited by the remarkably poor permeability of the skin. Because the primary barrier to transport is located in the upper 10-15 /spl mu/m of skin, and because nerves are only found in deeper tissue, we made arrays of microneedles long enough to cross the permeability barrier but not so long that they stimulate nerves, thereby causing no pain. These microneedles were fabricated using the Black Silicon Method, which is a reactive ion etching process in which an SF/sub 6//O/sub 2/ plasma etches silicon anisotropically. When inserted into skin in vitro, these microneedles demonstrated excellent mechanical properties and enhanced skin permeability to calcein, a model drug, by up to four orders of magnitude. Limited tests on humans demonstrated that microneedles were painless.
{"title":"Micromachined needles for the transdermal delivery of drugs","authors":"S. Henry, D. McAllister, Mark G. Allen, M. Prausnitz","doi":"10.1109/MEMSYS.1998.659807","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659807","url":null,"abstract":"Although modern biotechnology has produced extremely sophisticated and potent drugs, many of these compounds cannot be effectively delivered using current drug delivery techniques (e.g., pills and injections). Administration across skin by transdermal drug delivery is an attractive alternative, but it is limited by the remarkably poor permeability of the skin. Because the primary barrier to transport is located in the upper 10-15 /spl mu/m of skin, and because nerves are only found in deeper tissue, we made arrays of microneedles long enough to cross the permeability barrier but not so long that they stimulate nerves, thereby causing no pain. These microneedles were fabricated using the Black Silicon Method, which is a reactive ion etching process in which an SF/sub 6//O/sub 2/ plasma etches silicon anisotropically. When inserted into skin in vitro, these microneedles demonstrated excellent mechanical properties and enhanced skin permeability to calcein, a model drug, by up to four orders of magnitude. Limited tests on humans demonstrated that microneedles were painless.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133655654","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659768
S. Nakamura, K. Suzuki, H. Fujita, T. Numazawa, H. Takada
Micromachining processes are developed to fabricate a high-aspect-ratio-microstructure (HARMS) actuator for head positioning system of Hard Disk Drives (HDDs) to increase the recording density of HDDs. The actuator is driven by electrostatic force and it has multiple parallel plate electrodes. Our process is to fabricate high-aspect-ratio gap using electroplated sacrificial layer. The process is very attractive to increase the generating force of the electrostatic actuator. Another process is to fabricate a one-body MEMS device composed of mutually insulated metallic parts. These process are essential to realize a compact MEMS device such as a piggy-back microactuator of HDDs.
{"title":"A one-body MEMS device composed of mutually insulated metallic parts-fabrication processes for a microactuator for high-density hard disk drives","authors":"S. Nakamura, K. Suzuki, H. Fujita, T. Numazawa, H. Takada","doi":"10.1109/MEMSYS.1998.659768","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659768","url":null,"abstract":"Micromachining processes are developed to fabricate a high-aspect-ratio-microstructure (HARMS) actuator for head positioning system of Hard Disk Drives (HDDs) to increase the recording density of HDDs. The actuator is driven by electrostatic force and it has multiple parallel plate electrodes. Our process is to fabricate high-aspect-ratio gap using electroplated sacrificial layer. The process is very attractive to increase the generating force of the electrostatic actuator. Another process is to fabricate a one-body MEMS device composed of mutually insulated metallic parts. These process are essential to realize a compact MEMS device such as a piggy-back microactuator of HDDs.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123772164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659748
C. Grosjean, G.B. Lee, W. Hong, Y. Tai, C. Ho
A robust, large-force, large-deflection micro balloon actuator for aerodynamic (manoeuvring) control of transonic aircraft has been developed. Using a novel process, high yield linear arrays of silicone balloons on a robust silicon substrate have been fabricated that can deflect vertically in excess of one mm. Balloon actuators have been tested under cyclic conditions to assess reliability. The actuators have been characterized in a wind tunnel to assess their suitability as aerodynamic control surfaces and flight-tested on a jet fighter to assess their resistance to varied temperatures and pressures at high velocity.
{"title":"Micro balloon actuators for aerodynamic control","authors":"C. Grosjean, G.B. Lee, W. Hong, Y. Tai, C. Ho","doi":"10.1109/MEMSYS.1998.659748","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659748","url":null,"abstract":"A robust, large-force, large-deflection micro balloon actuator for aerodynamic (manoeuvring) control of transonic aircraft has been developed. Using a novel process, high yield linear arrays of silicone balloons on a robust silicon substrate have been fabricated that can deflect vertically in excess of one mm. Balloon actuators have been tested under cyclic conditions to assess reliability. The actuators have been characterized in a wind tunnel to assess their suitability as aerodynamic control surfaces and flight-tested on a jet fighter to assess their resistance to varied temperatures and pressures at high velocity.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124883846","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659725
H. Björkman, P. Rangsten, U. Simu, J. Karlsson, P. Hollman, K. Hjort
We are developing a microstructure technology for thick film diamond replicas, using deposition by hot filament CVD on microstructured silicon. This technology is primarily intended to make micromechanical structures for building-sets, fluidic cooling systems, systems for biochemical analyses and processes, and moulds for thermoplastic microstructures. In the thick film deposition on trenches in silicon, complete filling was possible with an aspect ratio up to 1.6. At higher aspect ratios, voids or channels are formed within the diamond replica. Ridges, trenches and capillary channels with high resolution coverage and low roughness, rms<2 nm, were created. Demonstrator structures for microfluidic, building-sets and polymer moulding applications are presented.
{"title":"Diamond microstructure replicas from silicon masters","authors":"H. Björkman, P. Rangsten, U. Simu, J. Karlsson, P. Hollman, K. Hjort","doi":"10.1109/MEMSYS.1998.659725","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659725","url":null,"abstract":"We are developing a microstructure technology for thick film diamond replicas, using deposition by hot filament CVD on microstructured silicon. This technology is primarily intended to make micromechanical structures for building-sets, fluidic cooling systems, systems for biochemical analyses and processes, and moulds for thermoplastic microstructures. In the thick film deposition on trenches in silicon, complete filling was possible with an aspect ratio up to 1.6. At higher aspect ratios, voids or channels are formed within the diamond replica. Ridges, trenches and capillary channels with high resolution coverage and low roughness, rms<2 nm, were created. Demonstrator structures for microfluidic, building-sets and polymer moulding applications are presented.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126096276","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659734
S. Wu, J. Mai, Y. Zohar, Y. Tai, C. Ho
A freestanding microchannel, with integrated temperature sensors, has been developed for high-pressure flow studies. These microchannels are approximately 20 /spl mu/m/spl times/2 /spl mu/m/spl times/4400 /spl mu/m, and are suspended above 80 /spl mu/m deep cavities, bulk micromachined using BrF/sub 3/ dry etch. The calibration of the lightly boron-doped thermistor-type sensors shows that the resistance sensitivity of these integrated sensors is parabolic with respect to temperature and linear with respect to pressure. Volumetric flow rates of NZ in the microchannel were measured at inlet pressures up to 578 psig. The discrepancy between the data and theory results from the flow acceleration in a channel, the nonparabolic velocity profile, and the bulging of the channel. Bulging effects were evaluated by using incompressible water flow measurements, which also measures 1.045/spl times/10/sup -3/N-s/m/sup 2/ for the viscosity of DI water. The temperature data from sensors on the channel shows the heating of the channel due to the friction generated by the high-pressure flow inside.
{"title":"A suspended microchannel with integrated temperature sensors for high-pressure flow studies","authors":"S. Wu, J. Mai, Y. Zohar, Y. Tai, C. Ho","doi":"10.1109/MEMSYS.1998.659734","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659734","url":null,"abstract":"A freestanding microchannel, with integrated temperature sensors, has been developed for high-pressure flow studies. These microchannels are approximately 20 /spl mu/m/spl times/2 /spl mu/m/spl times/4400 /spl mu/m, and are suspended above 80 /spl mu/m deep cavities, bulk micromachined using BrF/sub 3/ dry etch. The calibration of the lightly boron-doped thermistor-type sensors shows that the resistance sensitivity of these integrated sensors is parabolic with respect to temperature and linear with respect to pressure. Volumetric flow rates of NZ in the microchannel were measured at inlet pressures up to 578 psig. The discrepancy between the data and theory results from the flow acceleration in a channel, the nonparabolic velocity profile, and the bulging of the channel. Bulging effects were evaluated by using incompressible water flow measurements, which also measures 1.045/spl times/10/sup -3/N-s/m/sup 2/ for the viscosity of DI water. The temperature data from sensors on the channel shows the heating of the channel due to the friction generated by the high-pressure flow inside.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128498261","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659723
Isao Shimoyama, Osamu Kano, Hirofumi Miura
We've made a spatial micro-structure by folding at elastic hinges. However, the micro-folding causes the difficulties, e.g. hard access, a time-consuming task, and damage to the structure. In this report, we propose installing micro-actuators on a microstructure to fold it out of a planar structure. The actuator is based on the Lorentz force, which acts on a current in a magnetic field. This actuator can be made simply by using an external magnetic field. The amplitude of the Lorentz force can be controlled by either the current or the magnetic field. Also, the direction of the force can be controlled by the direction of the field.
{"title":"3D micro-structures folded by Lorentz force","authors":"Isao Shimoyama, Osamu Kano, Hirofumi Miura","doi":"10.1109/MEMSYS.1998.659723","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659723","url":null,"abstract":"We've made a spatial micro-structure by folding at elastic hinges. However, the micro-folding causes the difficulties, e.g. hard access, a time-consuming task, and damage to the structure. In this report, we propose installing micro-actuators on a microstructure to fold it out of a planar structure. The actuator is based on the Lorentz force, which acts on a current in a magnetic field. This actuator can be made simply by using an external magnetic field. The amplitude of the Lorentz force can be controlled by either the current or the magnetic field. Also, the direction of the force can be controlled by the direction of the field.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127076412","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659760
B. Hannemann, J. Fruhauf
We will demonstrate that the simple and inexpensive process of orientation dependent wet chemical etching can also be used for the preparation of more complex shapes and elements in microtechnics. In this way it is possible to apply unusual or any mask directions, multi-step etch processes by changing the mask or the etchant between the single steps, modified etchants (like etchants with inorganic or organic additives). The etch rates, the inclinations and the surface qualities of slow etching sidewall faces growing along mask edges in different directions and with different etchants are estimated. With the knowledge of the rates the etching process can be simulated for given mask dimensions and etch conditions.
{"title":"New and extended possibilities of orientation dependent etching in microtechnics","authors":"B. Hannemann, J. Fruhauf","doi":"10.1109/MEMSYS.1998.659760","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659760","url":null,"abstract":"We will demonstrate that the simple and inexpensive process of orientation dependent wet chemical etching can also be used for the preparation of more complex shapes and elements in microtechnics. In this way it is possible to apply unusual or any mask directions, multi-step etch processes by changing the mask or the etchant between the single steps, modified etchants (like etchants with inorganic or organic additives). The etch rates, the inclinations and the surface qualities of slow etching sidewall faces growing along mask edges in different directions and with different etchants are estimated. With the knowledge of the rates the etching process can be simulated for given mask dimensions and etch conditions.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"17 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125729179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659739
A. A. Yasseen, J. Mitchell, T. Streit, D.A. Smith, M. Mehregany
A 1/spl times/8 rotary electrostatic micromotor optical switch fabricated using deep reactive ion etching technology has been demonstrated. The switches consist of silent-pole micromotors with 1 mm-diameter, 200 /spl mu/m-thick rotors that support either a 200 /spl mu/m or a 500 /spl mu/m-tall, 900 /spl mu/m-wide mirror. After fabrication of the components, switches were assembled and operated for extended periods in room air. Typical switches were actuated at 50 V and found to have a rapid rotation with an average optical switching time between fiber ports of 18.4 ms. Optical testing was performed at 1310 nm in single and multi-mode, and at 850 nm in multi-mode. The optical beam was propagated in free space with minimal divergence through the use of externally-mounted collimating gradient-index (GRIN) lenses. With an aluminum coating, the mirror and external optics exhibited an input to output coupling loss as low as 0.96 dB in multi-mode and 2.32 dB in single-mode. Inter-channel cross talk was less than -45 dB.
{"title":"A rotary electrostatic micromotor 1/spl times/8 optical switch","authors":"A. A. Yasseen, J. Mitchell, T. Streit, D.A. Smith, M. Mehregany","doi":"10.1109/MEMSYS.1998.659739","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659739","url":null,"abstract":"A 1/spl times/8 rotary electrostatic micromotor optical switch fabricated using deep reactive ion etching technology has been demonstrated. The switches consist of silent-pole micromotors with 1 mm-diameter, 200 /spl mu/m-thick rotors that support either a 200 /spl mu/m or a 500 /spl mu/m-tall, 900 /spl mu/m-wide mirror. After fabrication of the components, switches were assembled and operated for extended periods in room air. Typical switches were actuated at 50 V and found to have a rapid rotation with an average optical switching time between fiber ports of 18.4 ms. Optical testing was performed at 1310 nm in single and multi-mode, and at 850 nm in multi-mode. The optical beam was propagated in free space with minimal divergence through the use of externally-mounted collimating gradient-index (GRIN) lenses. With an aluminum coating, the mirror and external optics exhibited an input to output coupling loss as low as 0.96 dB in multi-mode and 2.32 dB in single-mode. Inter-channel cross talk was less than -45 dB.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117249863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659783
J. Martin, W. Bacher, O.F. Hagena, W. Schomburg
Strain gauge pressure and volume-flow transducers have been developed using the techniques of the so-called AMANDA process. It combines injection molding, surface micromachining, and membrane transfer and allows low-cost batch production of microfluidic devices. The strain gauges of the pressure transducer measure the deformation of a thin plate which is a linear function of the differential pressure. For temperature compensation, four strain gauges are arranged to a Wheatstone bridge, operated at constant supply voltage. Different designs cover the pressure range of up to 1 bar, the outer dimensions being 5.5/spl times/4.3/spl times/1.2 mm/sup 3/. A special design with an integrated capillary is used to measure volume flows.
{"title":"Strain gauge pressure and volume-flow transducers made by thermoplastic molding and membrane transfer","authors":"J. Martin, W. Bacher, O.F. Hagena, W. Schomburg","doi":"10.1109/MEMSYS.1998.659783","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659783","url":null,"abstract":"Strain gauge pressure and volume-flow transducers have been developed using the techniques of the so-called AMANDA process. It combines injection molding, surface micromachining, and membrane transfer and allows low-cost batch production of microfluidic devices. The strain gauges of the pressure transducer measure the deformation of a thin plate which is a linear function of the differential pressure. For temperature compensation, four strain gauges are arranged to a Wheatstone bridge, operated at constant supply voltage. Different designs cover the pressure range of up to 1 bar, the outer dimensions being 5.5/spl times/4.3/spl times/1.2 mm/sup 3/. A special design with an integrated capillary is used to measure volume flows.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130380319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659720
M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Haeberle, H. Rohrer, H. Rothuizen, P. Vettiger
In this paper we report on the microfabrication of a 5/spl times/5 2D cantilever array and its successful application to parallel imaging. The 5/spl times/5 array with integrated force sensing and tip heating has been fabricated using a recently developed, all dry silicon backside etching process. The levers on the array have integrated piezoresistive sensing. The array is scanned in x and y directions using voice coil actuators. Three additional voice coil z actuators are used in a triangular arrangement to approach the sample with the array chip. The system is thus leveled in the same way as an air table. We report details of the array fabrication, the x-y scanning and approach system as well as images taken with the system.
{"title":"Microfabrication and parallel operation of 5/spl times/5 2D AFM cantilever arrays for data storage and imaging","authors":"M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Haeberle, H. Rohrer, H. Rothuizen, P. Vettiger","doi":"10.1109/MEMSYS.1998.659720","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659720","url":null,"abstract":"In this paper we report on the microfabrication of a 5/spl times/5 2D cantilever array and its successful application to parallel imaging. The 5/spl times/5 array with integrated force sensing and tip heating has been fabricated using a recently developed, all dry silicon backside etching process. The levers on the array have integrated piezoresistive sensing. The array is scanned in x and y directions using voice coil actuators. Three additional voice coil z actuators are used in a triangular arrangement to approach the sample with the array chip. The system is thus leveled in the same way as an air table. We report details of the array fabrication, the x-y scanning and approach system as well as images taken with the system.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"235 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114277908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176
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