Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176最新文献
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659762
H. Ohji, P. Trimp, P. French
This paper presents a new technique of micromachining using single step electrochemical etching in hydrofluoric acid (HF). The electrochemical etching in HF is known as a technique for porous silicon formation. This etching technique is applied to fabricate 3-D structures in single crystal silicon by a combination of anisotropic and isotropic modes. The diameter of the pore or the width of the trench can be controlled by the current density. First, vertical walls are formed and after desired depth is obtained, current density is increased by adjusting the light intensity. The width of the trenches is increased under the structures without effecting the width of existing trenches. The connection of the trenches can be achieved and free standing beams obtained with only one mask. The free standing beams with height, width and length of 40 /spl mu/m, 2 /spl mu/m and 250 /spl mu/m, respectively, are made of single crystal silicon.
{"title":"Fabrication of free standing structure using single step electrochemical etching in hydrofluoric acid","authors":"H. Ohji, P. Trimp, P. French","doi":"10.1109/MEMSYS.1998.659762","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659762","url":null,"abstract":"This paper presents a new technique of micromachining using single step electrochemical etching in hydrofluoric acid (HF). The electrochemical etching in HF is known as a technique for porous silicon formation. This etching technique is applied to fabricate 3-D structures in single crystal silicon by a combination of anisotropic and isotropic modes. The diameter of the pore or the width of the trench can be controlled by the current density. First, vertical walls are formed and after desired depth is obtained, current density is increased by adjusting the light intensity. The width of the trenches is increased under the structures without effecting the width of existing trenches. The connection of the trenches can be achieved and free standing beams obtained with only one mask. The free standing beams with height, width and length of 40 /spl mu/m, 2 /spl mu/m and 250 /spl mu/m, respectively, are made of single crystal silicon.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122832866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659789
K. Tani, M. Suzuki, K. Furuta, T. Sakuhara, T. Ataka
We designed and fabricated a piezoelectric micromotor which has a new structure suited for miniaturization. The prototype piezoelectric micromotor we fabricated has 2 mm in diameter and 2 mm in height. It consists of a disk-shaped rotor, a cantilever stator and several oscillators with elements made by PZT ceramics. These elements are integrated into the prototype piezoelectric micromotor in a flat configuration. The rotor rotates at 50 to 450 rpm and a drive voltage ranging from 2 to 10 V/sub pp/.
{"title":"Development of a new type piezoelectric micromotor","authors":"K. Tani, M. Suzuki, K. Furuta, T. Sakuhara, T. Ataka","doi":"10.1109/MEMSYS.1998.659789","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659789","url":null,"abstract":"We designed and fabricated a piezoelectric micromotor which has a new structure suited for miniaturization. The prototype piezoelectric micromotor we fabricated has 2 mm in diameter and 2 mm in height. It consists of a disk-shaped rotor, a cantilever stator and several oscillators with elements made by PZT ceramics. These elements are integrated into the prototype piezoelectric micromotor in a flat configuration. The rotor rotates at 50 to 450 rpm and a drive voltage ranging from 2 to 10 V/sub pp/.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115315809","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659720
M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Haeberle, H. Rohrer, H. Rothuizen, P. Vettiger
In this paper we report on the microfabrication of a 5/spl times/5 2D cantilever array and its successful application to parallel imaging. The 5/spl times/5 array with integrated force sensing and tip heating has been fabricated using a recently developed, all dry silicon backside etching process. The levers on the array have integrated piezoresistive sensing. The array is scanned in x and y directions using voice coil actuators. Three additional voice coil z actuators are used in a triangular arrangement to approach the sample with the array chip. The system is thus leveled in the same way as an air table. We report details of the array fabrication, the x-y scanning and approach system as well as images taken with the system.
{"title":"Microfabrication and parallel operation of 5/spl times/5 2D AFM cantilever arrays for data storage and imaging","authors":"M. Lutwyche, C. Andreoli, G. Binnig, J. Brugger, U. Drechsler, W. Haeberle, H. Rohrer, H. Rothuizen, P. Vettiger","doi":"10.1109/MEMSYS.1998.659720","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659720","url":null,"abstract":"In this paper we report on the microfabrication of a 5/spl times/5 2D cantilever array and its successful application to parallel imaging. The 5/spl times/5 array with integrated force sensing and tip heating has been fabricated using a recently developed, all dry silicon backside etching process. The levers on the array have integrated piezoresistive sensing. The array is scanned in x and y directions using voice coil actuators. Three additional voice coil z actuators are used in a triangular arrangement to approach the sample with the array chip. The system is thus leveled in the same way as an air table. We report details of the array fabrication, the x-y scanning and approach system as well as images taken with the system.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"235 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114277908","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659766
W.J. Li, J. Mai, Chih-Ming Ho
The integration of MEMS sensors, actuators, and IC devices onto macro mechanical parts is a critical technology necessary for the potential realization of intelligent mechanical structures. The current planar fabrication methods offered by the MEMS/IC industry restrict the possibility of integrating micro devices onto contoured (non-planar) mechanical structures. We have developed a lithographic technique to directly fabricate micron-sized sensing and actuation structures onto a cylindrical surface. This novel technology includes the development of flexible masks, photoresist spraying technique, and customized alignment systems. Results indicate that line resolution of <5 /spl mu/m is possible for structures on the surface of a 2" (5.08 cm) long cylinder with a diameter of 1.25" (3.175 cm). This paper describes the procedures developed to fabricate sacrificially release micro structures onto a cylindrical surface. The performance of some micro thermal actuators and shear stress sensors on a quartz cylindrical substrate are also presented.
{"title":"A MEMS fabrication technique for non-planar substrates","authors":"W.J. Li, J. Mai, Chih-Ming Ho","doi":"10.1109/MEMSYS.1998.659766","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659766","url":null,"abstract":"The integration of MEMS sensors, actuators, and IC devices onto macro mechanical parts is a critical technology necessary for the potential realization of intelligent mechanical structures. The current planar fabrication methods offered by the MEMS/IC industry restrict the possibility of integrating micro devices onto contoured (non-planar) mechanical structures. We have developed a lithographic technique to directly fabricate micron-sized sensing and actuation structures onto a cylindrical surface. This novel technology includes the development of flexible masks, photoresist spraying technique, and customized alignment systems. Results indicate that line resolution of <5 /spl mu/m is possible for structures on the surface of a 2\" (5.08 cm) long cylinder with a diameter of 1.25\" (3.175 cm). This paper describes the procedures developed to fabricate sacrificially release micro structures onto a cylindrical surface. The performance of some micro thermal actuators and shear stress sensors on a quartz cylindrical substrate are also presented.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124117994","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659719
C. Nguyen
An overview of recent progress in the research and development of microelectromechanical devices for use in wireless communication sub-systems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, low loss micromechanical switches, and micro-scale vibrating mechanical resonators with Q's in the tens of thousands. Specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and future wireless transceivers.
{"title":"Microelectromechanical devices for wireless communications","authors":"C. Nguyen","doi":"10.1109/MEMSYS.1998.659719","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659719","url":null,"abstract":"An overview of recent progress in the research and development of microelectromechanical devices for use in wireless communication sub-systems is presented. Among the specific devices described are tunable micromachined capacitors, integrated high-Q inductors, low loss micromechanical switches, and micro-scale vibrating mechanical resonators with Q's in the tens of thousands. Specific applications are reviewed for each of these components with emphasis on methods for miniaturization and performance enhancement of existing and future wireless transceivers.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132483657","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659751
M. Emmenegger, S. Taschini, J. Korvink, H. Baltes
The physical dimensions of microsystems make the characteristic times of thermal and mechanical phenomena comparable. Thus, for the first time, we require the coupled analysis of this system. This paper tackles this challenge, presenting a general method to routinely investigate the frequency-domain behaviour of MEMS devices thermo-mechanically excited by an AC heating power. In particular, an application to a gas sensor is presented. For the device we can now correctly determine the amplitude/heating power ratio, given the air and structural damping model, together with the geometry and material description, Characteristics of the method are the use of finite elements for the space-discretization, and spectral analysis for the reduction of mechanical degrees of freedom.
{"title":"Simulation of a thermomechanically actuated gas sensor","authors":"M. Emmenegger, S. Taschini, J. Korvink, H. Baltes","doi":"10.1109/MEMSYS.1998.659751","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659751","url":null,"abstract":"The physical dimensions of microsystems make the characteristic times of thermal and mechanical phenomena comparable. Thus, for the first time, we require the coupled analysis of this system. This paper tackles this challenge, presenting a general method to routinely investigate the frequency-domain behaviour of MEMS devices thermo-mechanically excited by an AC heating power. In particular, an application to a gas sensor is presented. For the device we can now correctly determine the amplitude/heating power ratio, given the air and structural damping model, together with the geometry and material description, Characteristics of the method are the use of finite elements for the space-discretization, and spectral analysis for the reduction of mechanical degrees of freedom.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131615392","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659770
Koji Ikuta, Shoji Maruo, S. Kojima
We have developed a drastically advanced micro stereo lithography named "Super IH process". It is the most unique feature of this process that liquid UV (Ultra Violet) polymer can be solidified at a pinpoint position in 3D space by optimizing apparatus and focusing condition of the laser beam. This pinpoint exposure enables us to make real 3D micro structure without any support parts nor sacrificial layers. Therefore freely movable micro mechanism such as gear rotators and free connected chains can be made easily. Moreover, several problems which conventional micro stereo lithography has are completely solved. Submicron fabrication resolution has first achieved by simple desk top apparatus. Since total fabrication time of the super IH process is extremely fast, it is easy to apply to mass productive 3D micro fabrication process.
{"title":"New micro stereo lithography for freely movable 3D micro structure-super IH process with submicron resolution","authors":"Koji Ikuta, Shoji Maruo, S. Kojima","doi":"10.1109/MEMSYS.1998.659770","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659770","url":null,"abstract":"We have developed a drastically advanced micro stereo lithography named \"Super IH process\". It is the most unique feature of this process that liquid UV (Ultra Violet) polymer can be solidified at a pinpoint position in 3D space by optimizing apparatus and focusing condition of the laser beam. This pinpoint exposure enables us to make real 3D micro structure without any support parts nor sacrificial layers. Therefore freely movable micro mechanism such as gear rotators and free connected chains can be made easily. Moreover, several problems which conventional micro stereo lithography has are completely solved. Submicron fabrication resolution has first achieved by simple desk top apparatus. Since total fabrication time of the super IH process is extremely fast, it is easy to apply to mass productive 3D micro fabrication process.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"516 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133133134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659787
Quanfang Chen, D. Yao, C. Kim, G. Carman
A novel proof-of-concept prototype Mesoscale Actuator Device (MAD) has been developed. The MAD is similar to piezoelectric driven inchworm motors with the exception that mechanically interlocking microridges replace the traditional frictional clamping mechanisms. The interlocked microridges, fabricated from single crystal silicon, increase the load carrying capability of the device substantially. Tests conducted on the current design demonstrate that the interlocked microridges support 16 MPa in shear or that a 3/spl times/5 mm locked chip supports a 25 kgf load. To operate the MAD device at high frequencies an open loop control signal is implemented. Synchronizing the locking and unlocking of the microridges with the elongating and contracting actuator requires minor perturbations in the voltage signal supplied. The system was successfully operated from 0.2 Hz to 500 Hz (or speeds from 2 /spl mu/m/s to 5 mm/s). The upper limit (500 Hz) is imposed by software limitations and not related to physical limitations of the current device.
{"title":"Mesoscale actuator device with micro interlocking mechanism","authors":"Quanfang Chen, D. Yao, C. Kim, G. Carman","doi":"10.1109/MEMSYS.1998.659787","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659787","url":null,"abstract":"A novel proof-of-concept prototype Mesoscale Actuator Device (MAD) has been developed. The MAD is similar to piezoelectric driven inchworm motors with the exception that mechanically interlocking microridges replace the traditional frictional clamping mechanisms. The interlocked microridges, fabricated from single crystal silicon, increase the load carrying capability of the device substantially. Tests conducted on the current design demonstrate that the interlocked microridges support 16 MPa in shear or that a 3/spl times/5 mm locked chip supports a 25 kgf load. To operate the MAD device at high frequencies an open loop control signal is implemented. Synchronizing the locking and unlocking of the microridges with the elongating and contracting actuator requires minor perturbations in the voltage signal supplied. The system was successfully operated from 0.2 Hz to 500 Hz (or speeds from 2 /spl mu/m/s to 5 mm/s). The upper limit (500 Hz) is imposed by software limitations and not related to physical limitations of the current device.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132454275","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659732
S. Roy, R. Deanna, A. Izad, M. Mehregany
Ice detection systems using microfabricated diaphragms as sensing elements and portable capacitance detection circuitry are presented. Finite element analysis (FEA) is used to optimize the sensor geometry for enhanced sensitivity to ice accretion. The sensors are fabricated by bulk micromachining and wafer bonding of silicon and glass substrates. During operation, actuation forces are applied electrostatically to cause diaphragm deformation. Accumulation of ice on a diaphragm leads to an increase in its effective stiffness. Therefore, for a given actuation voltage, an ice-covered diaphragm exhibits a smaller deflection than a corresponding ice-free diaphragm. This deflection is measured using a customized, portable, high-sensitivity, differential capacitance measurement circuit. The sensors are operated with the diaphragms in their stiffness-sensitive mode, enabling discrimination between ice and water (or deicing fluids) films. Calibration experiments reveal that the miniature ice detection sensor system can successfully detect ice and water film thicknesses between approximately 0.5-1.5 mm. Finally, dynamic testing indicates that adhesion of ice to silicon is poor when the sensor is driven continuously.
{"title":"Miniature ice detection sensor systems for aerospace applications","authors":"S. Roy, R. Deanna, A. Izad, M. Mehregany","doi":"10.1109/MEMSYS.1998.659732","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659732","url":null,"abstract":"Ice detection systems using microfabricated diaphragms as sensing elements and portable capacitance detection circuitry are presented. Finite element analysis (FEA) is used to optimize the sensor geometry for enhanced sensitivity to ice accretion. The sensors are fabricated by bulk micromachining and wafer bonding of silicon and glass substrates. During operation, actuation forces are applied electrostatically to cause diaphragm deformation. Accumulation of ice on a diaphragm leads to an increase in its effective stiffness. Therefore, for a given actuation voltage, an ice-covered diaphragm exhibits a smaller deflection than a corresponding ice-free diaphragm. This deflection is measured using a customized, portable, high-sensitivity, differential capacitance measurement circuit. The sensors are operated with the diaphragms in their stiffness-sensitive mode, enabling discrimination between ice and water (or deicing fluids) films. Calibration experiments reveal that the miniature ice detection sensor system can successfully detect ice and water film thicknesses between approximately 0.5-1.5 mm. Finally, dynamic testing indicates that adhesion of ice to silicon is poor when the sensor is driven continuously.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130178065","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1998-01-25DOI: 10.1109/MEMSYS.1998.659800
F. Sherman, S. Tung, C. Kim, Chih-Ming Ho, J. Woo
We introduce a new approach that alters the local flow condition using electrostatically driven microactuator moving in the in-plane direction such that form drag of the actuator can be eliminated. This is in contrast to the electromagnetically driven microflap moving normal to the substrate. A 60 /spl mu/m/spl times/200 /spl mu/m plate moving parallel to the substrate surface induces a "spanwise velocity" into the flow field. This spanwise velocity, when applied to the near-wall streaks, increases the transport of high-speed fluid away from the wall, therefore causing reduction in viscous drag. The microplate is attached at the end of a microcantilever capable of, even in non-resonance, large tip deflection (>100 /spl mu/m), tested at the operation frequencies of 500-1200 Hz. The cantilever is of a high-aspect-ratio structure (2 /spl mu/m wide, 6-17 /spl mu/m thick silicon) to ensure parallel motion over a long distance and provide robustness against out-of-plane deflection under external disturbances from the flow. We report the design and one-mask fabrication of the in-plane microactuator array made from Silicon-On-Insulator (SOI) wafers and experimental verification of the induced Stoke's flow and a local fluid flow.
{"title":"In-plane microactuator for fluid control application","authors":"F. Sherman, S. Tung, C. Kim, Chih-Ming Ho, J. Woo","doi":"10.1109/MEMSYS.1998.659800","DOIUrl":"https://doi.org/10.1109/MEMSYS.1998.659800","url":null,"abstract":"We introduce a new approach that alters the local flow condition using electrostatically driven microactuator moving in the in-plane direction such that form drag of the actuator can be eliminated. This is in contrast to the electromagnetically driven microflap moving normal to the substrate. A 60 /spl mu/m/spl times/200 /spl mu/m plate moving parallel to the substrate surface induces a \"spanwise velocity\" into the flow field. This spanwise velocity, when applied to the near-wall streaks, increases the transport of high-speed fluid away from the wall, therefore causing reduction in viscous drag. The microplate is attached at the end of a microcantilever capable of, even in non-resonance, large tip deflection (>100 /spl mu/m), tested at the operation frequencies of 500-1200 Hz. The cantilever is of a high-aspect-ratio structure (2 /spl mu/m wide, 6-17 /spl mu/m thick silicon) to ensure parallel motion over a long distance and provide robustness against out-of-plane deflection under external disturbances from the flow. We report the design and one-mask fabrication of the in-plane microactuator array made from Silicon-On-Insulator (SOI) wafers and experimental verification of the induced Stoke's flow and a local fluid flow.","PeriodicalId":340972,"journal":{"name":"Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126034410","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176
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