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15th Annual GaAs IC Symposium最新文献

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Power HBT for 44 GHz operation 功率HBT为44 GHz操作
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394431
D. Deakin, W. Ho, E. Sovero, J. Higgins
The GaAs based heterojunction bipolar transistor (HBT) has been evaluated as an amplifying device at 44 GHz. The device type measured is essentially identical to that used for power MMICs between 4 and 20 GHz. No ultra fine lithography, no special layer systems were necessary for these devices to provide excellent performance at 44 GHz. Power added efficiencies of 30% at power outputs of 250 mW and small signal gains of over 10 dB are reported. These performance levels are demonstrated by devices obtained from a high yield potentially low cost process.<>
基于砷化镓的异质结双极晶体管(HBT)被评价为44 GHz的放大器件。测量的器件类型基本上与用于4到20 GHz之间的功率mmic的器件类型相同。这些器件不需要超精细光刻,也不需要特殊的层系统来提供44 GHz的优异性能。据报道,功率输出为250 mW时的功率增加效率为30%,信号增益超过10 dB。这些性能水平是由高产量、低成本工艺获得的器件所证明的
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引用次数: 7
An asynchronous GaAs MESFET static RAM using a new current mirror memory cell 一种异步GaAs MESFET静态RAM,采用新的电流镜像存储单元
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394495
A. Chandna, Richard B. Brown
An experimental 1 kB GaAs MESFET static RAM using a new memory cell has been designed, fabricated and tested. The new memory cell is not subject to the destructive read problems which constrain the design of the conventional six-transistor memory cell. The memory cell also provides a much larger access current for readout than is possible using a conventional memory cell of the same area and cell power. Address access times of 1.6 ns have been obtained from a 1 kb test circuit.<>
设计、制作并测试了一种采用新型存储单元的实验性1kb GaAs MESFET静态RAM。新的存储单元不受传统六晶体管存储单元设计的破坏性读取问题的限制。该存储单元还为读出提供了比使用相同面积和电池功率的传统存储单元大得多的访问电流。在1 kb的测试电路中获得了1.6 ns的地址访问时间。
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引用次数: 11
InAlAs/InGaAs HBT X-band double-balanced upconverter InAlAs/InGaAs HBT x波段双平衡上变频器
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394465
K. Kobayashi, L. Tran, S. Bui, A. Oki, D. Streit, Mark Rosen
The authors report on an InAlAs/InGaAs HBT Gilbert cell double-balanced mixer which upconverts a 3 GHz IF signal to an RF frequency of 5-12 GHz. The mixer cell achieves a conversion loss of between 0.8 dB and 2.6 dB from 5 to 12 GHz. The LO-RF and IF-RF isolation are better than 30 dB at an LO drive of +5 dBm across the RF band. A predistortion circuit is used to increase the linear input power range of the LO port to above +5 dBm. Discrete amplifiers designed for the IF and RF frequency ports make up the complete upconverter architecture which achieves a conversion gain of 40 dB for an RF output bandwidth of 10 GHz. The upconverter chip set fabricated with InAlAs/InGaAs HBTs demonstrates the widest gain-bandwidth performance of a Gilbert cell based upconverter compared to previous GaAs and InP HBT or Si-bipolar ICs.<>
作者报告了一种InAlAs/InGaAs HBT吉尔伯特单元双平衡混频器,它将3ghz中频信号上变频到5- 12ghz的射频频率。混频器单元在5至12 GHz范围内实现0.8 dB至2.6 dB的转换损耗。当LO驱动为+5 dBm时,整个RF频带的LO-RF和IF-RF隔离优于30 dB。使用预失真电路将LO端口的线性输入功率范围提高到+ 5dbm以上。为中频和射频频率端口设计的分立放大器构成了完整的上变频器架构,在10 GHz的射频输出带宽下实现了40 dB的转换增益。与以前的GaAs和InP HBT或si双极ic相比,用InAlAs/InGaAs HBT制造的上转换器芯片具有基于Gilbert单元的上转换器最宽的增益带宽性能。
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引用次数: 21
5 GHz sampling oscilloscope front-end based on heterojunction bipolar transistors (HBT) 基于异质结双极晶体管(HBT)的5ghz采样示波器前端
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394480
S. Naboicheck, S. Ems
Three HBT monolithic microwave integrated circuit (MMIC) designs from the basis of a complete digital oscilloscope front-end which has been designed, fabricated and tested. Theses devices are integrated into a thick-film hybrid which is currently being used as the front-end for a digital sampling oscilloscope (DSO). The three devices are based on a closed loop differential amplifier with a gain of 10 dB and a bandwidth greater than 6 GHz.<>
基于一个完整的数字示波器前端,设计、制造和测试了三种HBT单片微波集成电路(MMIC)。这些器件集成到厚膜混合器件中,该器件目前被用作数字采样示波器(DSO)的前端。这三种器件都基于一个增益为10db、带宽大于6ghz的闭环差分放大器。
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引用次数: 8
Parameter extraction for HBT's temperature dependent large signal equivalent circuit model [MMIC oscillator] HBT温度相关大信号等效电路模型[MMIC振荡器]的参数提取
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394455
Peter, D. Seitzer
An eleven node large signal heterojunction bipolar transistors (HBT) model in hybrid-/spl pi/ configuration is investigated which is derived from HBT topology. This is the first circuit simulation model where the temperature is introduced as a variable simulation parameter using the concept of thermal resistance and pseudotemperature to account for the temperature dependent thermal conductivity of GaAs. The temperature and bias dependence of key model parameters -thermal resistance, transit time, emitter resistance, base-emitter and base-collector junction parameters- are extracted analytically from measured DC and S-parameter data in the temperature range from 20 to 160/spl deg/C using on wafer thermochuck measurements. The devices have f/sub t/ and f/sub max/ values of 40 GHz each. The verification of the proposed model is carried out on a simple oscillator circuit at 4.7 GHz, where the temperature dependence of oscillation frequency and output power of the first three harmonics is compared to measured data.<>
研究了一种基于HBT拓扑结构的混合/spl / pi/结构的11节点大信号异质结双极晶体管(HBT)模型。这是第一个电路仿真模型,其中使用热阻和伪温度的概念将温度作为可变仿真参数引入,以解释GaAs的温度依赖热导率。关键模型参数——热阻、传输时间、发射极电阻、基极-发射极和基极-集电极结参数——的温度依赖性和偏置依赖性是利用晶圆热夹测量从20至160/spl℃温度范围内测量的DC和s参数数据中解析提取出来的。这些设备的f/sub t/和f/sub max/值分别为40 GHz。在4.7 GHz的简单振荡器电路上对所提出的模型进行了验证,并将振荡频率和前三次谐波输出功率的温度依赖性与实测数据进行了比较
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引用次数: 17
HEMT-based MMIC single-balanced mixers for 60-GHz indoor communication systems 基于hemt的MMIC单平衡混频器,用于60ghz室内通信系统
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394500
T. Saito, N. Hidaka, Y. Ohashi, T. Shimura, Y. Aoki
The authors developed V-band monolithic active-gate and active-drain mixers with a single-balance configuration. The HEMTs in both active mixers have an AlGaAs/GaAs structure and gates 0.15 /spl mu/m long and 100 /spl mu/m wide. The single-balanced active-gate mixer has a maximum conversion gain of -4.3 dB and only 2.5 dBm LO drive at 60-GHz. The gate mixer has a noise figure of 5.3 dB at 58 GHz and 0 dBm LO drive power. The single-balanced active-drain mixer has a maximum conversion gain of -6 dB and 13.5 dBm LO drive at 60 GHz. The drain mixer has a noise figure of 6.8 dB at 58 GHz and 8.5 dBm LO drive. The RF performances of active-gate and active-drain mixers fabricated on the same wafer are compared.<>
作者开发了单平衡配置的v波段单片有源门和有源漏混频器。两个有源混频器中的hemt都具有AlGaAs/GaAs结构,栅极长0.15 /spl μ m,宽100 /spl μ m。单平衡有源门混频器的最大转换增益为-4.3 dB,在60 ghz时只有2.5 dBm的LO驱动。门混频器在58 GHz和0 dBm LO驱动功率下的噪声系数为5.3 dB。单平衡有源漏极混频器的最大转换增益为-6 dB,在60 GHz时具有13.5 dBm的LO驱动。漏极混频器在58 GHz和8.5 dBm LO驱动下的噪声系数为6.8 dB。比较了在同一晶片上制备的有源栅和有源漏混合器的射频性能。
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引用次数: 10
0.6 V suppy voltage 0.25 /spl mu/m E/D-HJFET(IS/sup 3/T) LSI technology for low power consumption and high speed LSIs 0.6 V电源电压0.25 /spl mu/m E/D-HJFET(IS/sup 3/T) LSI技术,用于低功耗和高速LSI
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394470
H. Hida, M. Tokushima, T. Maeda, M. Ishikawa, M. Fukaishi, K. Numata, Y. Ohno
A new technology for fabricating 0.25 /spl mu/m gate E/D-heterojunction FET LSIs is developed as a step towards the development of ultralow supply voltage LSIs. This technology, which is based upon all dry-process techniques, includes the formation of a 0.25 /spl mu/m gate opening through the use of optical lithography and inner SiO/sub 2/ sidewalls. The f/sub max/ and the g/sub max/ for a Y-shaped gate E-HJFET are 108 GHz and 530 mS/mm, respectively. Excellent performances are obtained with DCFL ring oscillators using n-AlGaAs/i-InGaAs pseudomorphic E/D-HJFETs. These include 18 ps/G unloaded delay and 109 ps/G loaded delay (FI=FO=3, L=1 mm) with 0.15 mW/G at a low supply voltage of 0.6 V, where inverters have a sufficient noise margin of more than 180 mV. Also, 10 Gbps error-free operation of a selector switch is demonstrated with 9.4 mW at 0.6 V.<>
提出了0.25 /spl mu/m栅极E/ d异质结场效应晶体管的新工艺,为超低电源电压晶体管的发展迈出了一步。该技术基于所有干法工艺,包括通过使用光学光刻和内部SiO/sub /侧壁形成0.25 /spl mu/m的栅极开口。y型栅极E-HJFET的f/sub max/和g/sub max/分别为108 GHz和530 mS/mm。采用n-AlGaAs/i-InGaAs伪晶E/ d - hjfet的DCFL环形振荡器获得了优异的性能。其中包括18 ps/G的未加载延迟和109 ps/G的加载延迟(FI=FO=3, L=1 mm), 0.15 mW/G,低电源电压为0.6 V,其中逆变器具有超过180 mV的足够噪声裕度。此外,还演示了选择开关在0.6 v下以9.4 mW的电压实现10 Gbps无错误操作。
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引用次数: 21
GaAs integrated circuit fabrication at Motorola 摩托罗拉GaAs集成电路制造
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394487
P. O'Neil, B. Bernhardt, F. Nikpourian, C. Della, Y. Abad, G. Hansell
Compound Semiconductor (CS-1) is Motorola's first production-oriented gallium-arsenide integrated-circuit fabrication facility. Initiated in the Fall of 1990, CS-1 is a state-of-the-art manufacturing facility designed to support the growing internal Motorola needs for GaAs ICs for consumer products. The authors overview current CS-1 process flows, low-cost processing methodologies, online production monitoring, and fast cycle time capabilities.<>
化合物半导体(CS-1)是摩托罗拉第一个面向生产的砷化镓集成电路制造工厂。CS-1成立于1990年秋天,是一个最先进的制造工厂,旨在支持摩托罗拉内部对消费类产品GaAs ic不断增长的需求。作者概述了当前CS-1工艺流程,低成本的加工方法,在线生产监控和快速周期时间能力
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引用次数: 7
A 500 ps 32 /spl times/ 8 register file implemented in GaAs/AlGaAs HBTs [F-RISC/G processor] 在GaAs/AlGaAs HBTs [F-RISC/G处理器]中实现的500 ps 32 /spl times/ 8寄存器文件
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394497
K. Nah, R. Philhower, H. Greub, J. McDonald
A high speed register file has been designed that is well-suited for achieving the speed potential of a fast but yield-limited technology such as GaAs/AlGaAs HBT. Descriptions of address driver, write, and threshold voltage generator circuits developed are presented. The test strategy utilizes two linear feedback shift registers (LFSRs) to provide address and data patterns to the register file. A match circuit verifies valid memory function and indicates read access time. The test results indicate a read access time of 500 ps.<>
设计了一种高速寄存器文件,非常适合实现快速但产量有限的技术(如GaAs/AlGaAs HBT)的速度潜力。介绍了所开发的地址驱动电路、写入电路和阈值电压发生器电路。测试策略利用两个线性反馈移位寄存器(lfsr)向寄存器文件提供地址和数据模式。匹配电路验证有效的存储器功能并指示读访问时间。测试结果表明读访问时间为500ps。
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引用次数: 3
A power HEMT production process for high-efficiency Ka-band MMIC power amplifiers 一种高效率ka波段MMIC功率放大器的功率HEMT生产工艺
Pub Date : 1993-10-10 DOI: 10.1109/GAAS.1993.394438
M. Biedenbender, J. Lee, K. Tan, P. Liu, A. Freudenthal, D. Streit, G. Luong, R. Lai, M. Aust, B. Allen, T. Lin, H. Yen
The authors have developed a reproducible, high yield and high performance power HEMT Ka-band MMIC production process based on pseudomorphic AlGaAs/InGaAs/GaAs HEMTs. The details of the fabrication process and Ka-band MMIC power amplifier performance from 60 wafers are presented. State-of-the-art power performance have been achieved on both devices and MMICs. Single-stage MMICs with 400 /spl mu/m devices have demonstrated output power of 240 mW (0.6 W/mm) at 37 GHz with a power gain of 7.8 dB and power-added efficiency of 40%. The Ka-band MMIC power amplifiers have demonstrated output power of 1.3 W, 9 dB gain and 24% power added efficiency. Furthermore, the power MMIC HEMT process demonstrated a RF MMIC circuit yield of 25.8% for a total of 6936 possible chips from 60 wafers.<>
作者开发了一种基于伪晶AlGaAs/InGaAs/GaAs HEMT的可重复、高产率和高性能功率HEMT ka波段MMIC生产工艺。详细介绍了60片晶圆的制作工艺和ka波段MMIC功率放大器的性能。在器件和mmic上都实现了最先进的功率性能。具有400 /spl mu/m器件的单级mmic在37 GHz时的输出功率为240 mW (0.6 W/mm),功率增益为7.8 dB,功率附加效率为40%。该ka波段MMIC功率放大器的输出功率为1.3 W,增益为9 dB,功率附加效率为24%。此外,功率MMIC HEMT工艺显示RF MMIC电路良率为25.8%,来自60片晶圆的总共6936个可能的芯片
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引用次数: 23
期刊
15th Annual GaAs IC Symposium
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