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2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)最新文献

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Epitaxial growth and crystalline properties of Ge1−x−ySixSny layers on Ge(001) substrates Ge1−x−ySixSny层在Ge(001)衬底上的外延生长和晶体性质
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874688
T. Asano, T. Terashima, T. Yamaha, M. Kurosawa, W. Takeuchi, N. Taoka, O. Nakatsuka, S. Zaima
We investigated the crystalline structure of Ge1-x-ySixSny layers epitaxially grown on Ge(001) substrates. The unstrained and compressive strained Ge1-x-ySixSny layers with very flat surface and high crystallinity can be grown. We found that the control of the strain direction is important to form a high quality Ge1-x-ySixSny layer even with small misfit strain.
我们研究了在Ge(001)衬底上外延生长的Ge1-x-ySixSny层的晶体结构。可以生长出表面非常平整、结晶度高的非应变和压缩应变的Ge1-x-ySixSny层。我们发现应变方向的控制对于形成高质量的Ge1-x-ySixSny层非常重要,即使错配应变很小。
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引用次数: 1
Thermal stability of highly compressive strained germanium-tin (GeSn) grown by molecular beam epitaxy 分子束外延生长高压缩应变锗锡(GeSn)的热稳定性
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874668
Wei Wang, Qian Zhou, Jisheng Pan, Zheng Zhang, E. Tok, Y. Yeo
Highly strained Ge1-xSnx films were epitaxially grown on Ge(001), with x up to 0.17. Good crystalline quality and a relatively flat surface were obtained. Critical temperatures exist for Sn segregation for various x. XPS shows that the Sn surface segregation could occur at temperatures as low as 400 °C for Ge0.932Sn0.068.
在Ge(001)上外延生长出高应变的Ge1-xSnx薄膜,x高达0.17。获得了良好的结晶质量和相对平坦的表面。对于不同的x,存在着锡偏析的临界温度。XPS表明,ge0.932和sn0.068的表面锡偏析温度低至400℃。
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引用次数: 0
Low temperature growth of SiSn polycrystals with high Sn contents on insulating layers 在绝缘层上低温生长高锡ssi多晶
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874680
M. Kurosawa, M. Kato, T. Yamaha, N. Taoka, O. Nakatsuka, S. Zaima
Comparative study between the poly-Si and the poly-SiSn layers reveals that the Sn incorporation is effective to decrease the crystallization temperature. Also, we found that the formation of SiSn polycrystal with a substitutional Sn content of around 30%, which is expected as a direct transition semiconductor, becomes possible on SiO2 at a low temperature growth of 150°C.
通过对聚硅层和聚sisn层的对比研究,发现Sn的掺入对降低结晶温度是有效的。此外,我们还发现,在150℃的低温生长条件下,在SiO2上形成取代锡含量约为30%的SiSn多晶,有望成为直接过渡半导体。
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引用次数: 5
Strained Ge FinFET structures fabricated by selective epitaxial growth 选择性外延生长制备应变Ge FinFET结构
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874674
R. Loo, Jia-Lin Sun, L. Witters, A. Hikavyy, B. Vincent, Y. Shimura, P. Favia, O. Richard, H. Bender, W. Vandervorst, N. Collaert, A. Thean
A one-growth step fabrication scheme for strained Ge FinFET structures has been successfully developed and implemented in a device fabrication scheme. From device point of view, the concept including two growth steps might be even more favorable. However, it requires an improvement of the pre-epi oxide removal from Si1-xGex surfaces.
一种应变Ge FinFET结构的单步生长制造方案已成功开发并在器件制造方案中实现。从设备的角度来看,包含两个增长步骤的概念可能更有利。然而,它需要改进Si1-xGex表面的预环氧化氧化物去除。
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引用次数: 6
Crystal growth of Sn-related group-IV alloy thin films for advanced Si nanoelectronics 先进硅纳米电子学用sn相关族iv合金薄膜的晶体生长
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874694
S. Zaima, O. Nakatsuka, N. Taoka, M. Kurosawa, T. Asano, T. Yamaha, W. Takeuchi
The incorporation of Sn into Ge and Si1-xGex effectively improves on the crystalline and electronic properties. Also, Sn-related group-IV materials give us new features of energy band engineering. The development of crystal growth of Sn-related alloys is essential for extending applications of future Si nanoelectronics.
在Ge和Si1-xGex中掺入Sn有效地改善了晶体性能和电子性能。此外,与sn相关的iv族材料为我们提供了能带工程的新功能。锡相关合金晶体生长的发展对扩大未来硅纳米电子学的应用至关重要。
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引用次数: 0
Shallow junction and contact realization by diffusion of heavily doped polycrystalline-germanium for Ge devices 锗器件中重掺杂多晶锗扩散实现浅结和接触
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874673
Kezheng Li, Yuan Hongyu, K. H. Kong, H. Gamble, D. McNeill, M. Armstrong
In conclusion, a unique method to achieve high quality shallow n+/p junction by out-diffusion of phosphorus from poly-Ge has been demonstrated. The technology and key issues of poly-Ge deposition by LPCVD is presented. Results shown from diode I-V characteristics indicate feasibility of poly-Ge used for junction and contact realization.
综上所述,我们证明了一种独特的方法,即通过从聚锗中向外扩散磷来获得高质量的浅n+/p结。介绍了LPCVD沉积多锗的工艺及关键问题。从二极管的I-V特性分析结果可以看出,将聚锗用于结和触点的实现是可行的。
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引用次数: 0
Si-Ge-Sn heterostructures: Growth and applications Si-Ge-Sn异质结构:生长与应用
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874691
D. Buca, S. Wirths, D. Stange, A. Tiedemann, G. Mussler, Z. Ikonić, S. Chiussi, J. Hartmann, D. Grutzmacher, S. Mantl
This study presents the synthesis of a SiGeSn buffer layer by reduced pressure CVD method. Band structure calculation and transmission electron microscopy are used for material characterization. The use of this heterostructure for MOSFET and MOS capacitor fabrication is also addressed.
本研究采用减压CVD法合成SiGeSn缓冲层。利用能带结构计算和透射电镜对材料进行表征。本文还讨论了这种异质结构在MOSFET和MOS电容器制造中的应用。
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引用次数: 1
Electrical characterization of pGeSn/nGe diodes pGeSn/nGe二极管的电学特性
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874640
B. Baert, Somya Gupta, F. Gencarelli, R. Loo, E. Simoen, N. D. Nguyen
I-V characteristics of pGeSn/nGe diodes have been measured and show very interesting properties. Simulations of the same structure are able to reproduce most of the observed behavior and point to the predominant influence of parameters such as the band gap energy of the GeSn layer. C-V characteristics showing little frequency dependence have also been measured, and their analysis for the determination of the carrier concentration is confirmed by simulations. More investigations of the effect of temperature, of other observed features in the C-V characteristics and of other defects at the interface or in the bulk of either layers, are still required in order to explain some of the observed behaviors, notably the reverse saturation current.
已经测量了pGeSn/nGe二极管的I-V特性,并显示出非常有趣的特性。对相同结构的模拟能够再现大多数观察到的行为,并指出诸如GeSn层的带隙能量等参数的主要影响。C-V特性显示出很少的频率依赖性也被测量,并通过模拟证实了他们对载流子浓度测定的分析。为了解释一些观察到的行为,特别是反向饱和电流,仍然需要对温度、C-V特性中其他观察到的特征以及界面或两层中大部分的其他缺陷的影响进行更多的研究。
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引用次数: 0
Effect of thermal nitridation on phosphorus diffusion in SiGe and SiGe:C and its implication on diffusion mechanisms 热氮化对磷在SiGe和SiGe:C中扩散的影响及其对扩散机制的启示
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874641
Yiheng Lin, H. Yasuda, H. Ho, M. Schiekofer, B. Benna, R. Wise, G. Xia
The effectiveness of thermal nitridation in retarding P diffusion in SiGe and SiGe:C is investigated in this study. Three types of masking layers are used to make P diffuse under vacancy injection, interstitial injection, and inert annealing conditions. A secondary ion mass spectroscopy is used to measure the diffusion profiles.
研究了热氮化对磷在SiGe和SiGe:C中扩散的影响。在空位注入、间隙注入和惰性退火条件下,采用三种类型的掩蔽层使P扩散。二次离子质谱法用于测量扩散谱。
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引用次数: 0
N-type SiGe/Ge superlattice structures for terahertz emission 太赫兹发射的n型SiGe/Ge超晶格结构
Pub Date : 2014-06-02 DOI: 10.1109/ISTDM.2014.6874635
J. Halpin, M. Myronov, S. Rhead, D. Leadley
Challenging n-type QCL structures have been grown using RP-CVD with good crystal quality in the active region. These structures represent significant progress towards terahertz emission from a Si/Ge structure. Similar SiGe superlattice structures reported in the literature have suffered from multiple dislocations entering the active region, [9] (grown on a thick buffer) and [10] (grown on a thin buffer). Detailed characterization will be presented along with growth details of our promising structures.
利用RP-CVD生长出具有挑战性的n型QCL结构,在活性区具有良好的晶体质量。这些结构代表了从Si/Ge结构向太赫兹发射的重大进展。文献中报道的类似SiGe超晶格结构在进入活性区时有多次位错,[9](生长在厚缓冲层上)和[10](生长在薄缓冲层上)。详细的表征将与我们有前途的结构的生长细节一起提出。
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引用次数: 0
期刊
2014 7th International Silicon-Germanium Technology and Device Meeting (ISTDM)
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