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2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)最新文献

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Factorial designs of multi-coatings for induced stresses of advanced flexible displays 先进柔性显示器诱导应力复合涂层的析因设计
Chang-Chun Lee
Fatigue behavior of multi-stacked films type OLED devices under a flexural load been greatly paid attention while the requirement of thinner and more flexible packaging structure. To enhance mechanical reliability of related critical components utilized in foregoing OLED architecture, a mechanical model of multi-layers structure is demonstrated and validated by nonlinear finite element analysis, exploring the impact of several concerned mechanical parameters within a whole OLED packaging. The results indicated that the thickness of PI substrate is a significant parameter to determine the bending stress of indium tin oxide film. It is found that the use of thicker and softer film could be able to reduce the stress of ITO conductive film.
随着封装结构越来越薄、越来越柔性的要求,多层薄膜型OLED器件在弯曲载荷下的疲劳性能受到了人们的广泛关注。为了提高上述OLED结构中相关关键部件的机械可靠性,本文通过非线性有限元分析验证了多层结构的力学模型,探讨了几个相关力学参数对整个OLED封装的影响。结果表明,PI衬底厚度是决定氧化铟锡薄膜弯曲应力的重要参数。研究发现,采用较厚、较软的薄膜可以减小ITO导电膜的应力。
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引用次数: 0
Physics-based modeling of gate-leakage current in AlGaN/GaN high electron mobility transistors AlGaN/GaN高电子迁移率晶体管栅漏电流的物理建模
Xiaoyu Ma, Fei Yu, W. Deng, Junkai Huang
Gate-leakage currents AlGaN/GaN high electron mobility transistors (HEMTs) have been studied. The reverse bias gate-leakage current is decomposed into three dominant components, namely, Fowler-Nordheim tunneling, trap-assisted-tunneling, and trap-assisted Frenkel-Poole emission. A physics-based model to calculate this current is given, which follows the experimental gate-leakage current characteristics closely over a wide range of bias and temperature.
研究了栅极漏电流AlGaN/GaN高电子迁移率晶体管(hemt)。反向偏置栅漏电流分解为三个主要分量,即Fowler-Nordheim隧穿、陷阱辅助隧穿和陷阱辅助Frenkel-Poole发射。给出了一个基于物理的模型来计算该电流,该模型在很大的偏置和温度范围内密切遵循实验栅漏电流特性。
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引用次数: 0
Interface engineering for improving the electrical stability and photoelectric effects of organic memory transistors 提高有机存储晶体管电稳定性和光电效应的接口工程
Yu-Fu Wang, Sheng-Kuang Peng, Po-Kang Huang, Horng-Long Chen, W. Choua
In recent years, the electrical stability of organic devices is an essential issue in application of large integrated circuits. The properties of interface between semiconductor layer and dielectric layer play an important role to determine the electrical performance and memory effect of organic field-effect transistors. We propose some facile ways, in which the interface property could be modified, to overcome the stable issue. The electrical stability and photoelectric effect of organic transistors were successfully enhanced by using these interface engineering.
近年来,有机器件的电稳定性是大型集成电路应用中的一个重要问题。半导体层与介电层之间的界面特性对有机场效应晶体管的电性能和记忆效应起着重要的决定作用。我们提出了一些简单的方法,可以通过改变界面性质来克服稳定性问题。利用这些界面工程,成功地提高了有机晶体管的电稳定性和光电效应。
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引用次数: 0
1/f Noise characteristics of P-channel tin monoxide thin-film transistors 1/f p沟道氧化锡薄膜晶体管的噪声特性
Chan-Yong Jeong, Hee-Joong Kim, Jeong-Hwan Lee, S. Bae, H. Kwon
In this work, we investigate the low-frequency noise (LFN) properties of p-type tin monoxide (SnO) thin-film transistors (TFTs). The LFN from the p-type SnO TFT is successfully interpreted by the correlated carrier number-mobility fluctuation model. The density of near-interface insulator traps that can exchange charge carriers with the underlying SnO channel layer is found to be 5.2 × 1021 eV-1cm-3, which is about one or two orders of magnitude higher than that of the n-type amorphous indium-gallium-zinc oxide TFTs. The high density of near-interface insulator trap from the SnO TFT is considered to be a result of the high degree of disorder of the SnO channel layer.
本文研究了p型氧化锡(SnO)薄膜晶体管(TFTs)的低频噪声(LFN)特性。用相关载流子数迁移率波动模型成功地解释了p型SnO TFT的LFN。可以与SnO通道层交换载流子的近界面绝缘子陷阱密度为5.2 × 1021 eV-1cm-3,比n型非晶铟镓锌氧化物tft高一到两个数量级。SnO TFT中近界面绝缘子陷阱的高密度被认为是SnO沟道层高度无序的结果。
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引用次数: 0
Multi-functional touch sensors with strained P(VDF-TrFE) deposited on metal oxide thin film transistor 在金属氧化物薄膜晶体管上沉积应变P(VDF-TrFE)的多功能触摸传感器
Taiyu Jin, Jeongjae Ryu, Hansaem Kang, K. No, S. Park
A novel pressure sensor based on indium gallium zinc oxide (IGZO) oxide TFT and strained piezoelectric polymer is demonstrated. Poly (vinylidene fluoride-trifluoroethylene) (P(VDF-TrFE)) is used as an organic piezoelectric material. The sensor demonstrate the possibility to be further used as a display polarizing film though a birefringence property showed by stretching the P(VDF-TrFE) film. Finally, the sensor shows a high stable and uniform signal to the pressure.
提出了一种基于氧化铟镓锌(IGZO)氧化物TFT和应变压电聚合物的新型压力传感器。聚偏氟乙烯-三氟乙烯(P(VDF-TrFE))是一种有机压电材料。通过拉伸P(VDF-TrFE)薄膜显示双折射特性,该传感器证明了进一步用作显示偏振光膜的可能性。最后,传感器对压力显示出高度稳定和均匀的信号。
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引用次数: 0
Large-grain Sn-doped Ge (100) on insulator by aluminum-induced crystallization at low-temperature for flexible electronics 柔性电子用铝诱导低温结晶法在绝缘子上制备大晶粒掺锡Ge (100)
M. Sasaki, M. Miyao, T. Sadoh
A low-temperature formation technique of Sn-doped Ge on insulator has been investigated by aluminum-induced crystallization using a-GeSn/Al stacked structures. For a-GeSn films (Sn concentration: 2%), the layer-exchange growth temperature is significantly decreased compared with a-Ge, which enables low temperature growth at 250°C. At such a low temperature, bulk nucleation of GeSn in Al layers is significantly suppressed, and (100)-oriented interface nucleation becomes dominant. On the other hand, growth rate becomes high by Sn-doping effects. As a result, formation of (100)-oriented large-grain (>10 μm) Sn-doped Ge (Sn concentration: 2%) crystals on insulating substrates becomes possible at a low temperature (250°C). This technique will be useful to realize advanced flexible electronics.
采用A - gesn /Al堆叠结构,研究了铝诱导结晶法在绝缘子上低温形成掺锡锗的工艺。对于a-GeSn薄膜(Sn浓度为2%),与a-Ge相比,层交换生长温度明显降低,可以在250℃下低温生长。在如此低的温度下,Al层中GeSn的体形核被明显抑制,(100)取向界面形核成为主导。另一方面,由于sn掺杂的影响,生长速率变得很高。因此,在低温(250°C)下,可以在绝缘衬底上形成(100)取向大晶粒(bbb10 μm)掺锡Ge (Sn浓度:2%)晶体。该技术将有助于实现先进的柔性电子器件。
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引用次数: 0
Evaluation of the infrared-ray sensors using poly-Si TFTs 多晶硅tft红外传感器的评价
Katsuya Kite, Shuhei Kitajima, T. Matsuda, M. Kimura, Mitsuo Tamura, Masahide Inoue
We have evaluated light and temperature dependences of transistor characteristics in n-type, p-type and pin-type poly-Si TFTs with and without infrared (IR) light illumination. It is found that light and temperature dependences of the off-leakage currents in the n-type and p-type TFTs are much larger than those of the on currents. Moreover, we confirmed that the light dependences with IR light illumination are much larger than the temperature dependences. Based on these results, we proposed three detection systems to proximity sense by the IR sensors using poly-Si TFTs.
我们评估了n型、p型和引脚型多晶硅tft在有和没有红外(IR)光照射下晶体管特性的光和温度依赖性。研究发现,在n型和p型tft中,关漏电流对光和温度的依赖性远大于通漏电流。此外,我们证实了红外光照明的光依赖性远远大于温度依赖性。基于这些结果,我们提出了三种利用多晶硅tft的红外传感器进行近距离传感的检测系统。
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引用次数: 1
Characteristic evaluation of photo-induced current by infrared light irradiation in low-temperature poly-Si TFT 低温多晶硅TFT中红外光辐照光感应电流特性评价
Shuhei Kitajima, Katsuya Kito, T. Matsuda, M. Kimura, Masahide Inoue
We confirmed that photo-induced current in off region changes when we irradiate infrared light to N-type, P-type and PIN-type low-temperature poly-Si TFTs. In addition, we found that the photo-induced current is proportional to the gate width, whereas it does not depend on the gate length. We can indicate that it is possible to detect infrared light above certain intensity from the relationship between the photo-induced current and the dark current.
我们证实了n型、p型和pin型低温多晶硅晶体管在红外照射下,关断区光感应电流发生了变化。此外,我们发现光感应电流与栅极宽度成正比,而与栅极长度无关。从光感电流与暗电流的关系可以看出,探测到一定强度以上的红外光是可能的。
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引用次数: 5
Graphene field-effect transistor for biosensor 生物传感器用石墨烯场效应晶体管
K. Matsumoto, R. Hayashi, Y. Kanai, Koichi Inoue, T. Ono
The sugar chain modified grapheme FET was applied to selectively detect the human type influenza virus and bird type influenza virus. Instead of the real virus, the pseud virus such as Lectin was used for the experiment for the safety. The human type pseud virus selectively reacts with the human type sugar chain which was modified on the grapheme surface and vise versa.
应用糖链修饰石墨烯场效应晶体管选择性检测人型流感病毒和禽流感病毒。为了安全起见,实验中使用了凝集素等假病毒代替真病毒。人型假病毒选择性地与石墨烯表面修饰的人型糖链发生反应,反之亦然。
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引用次数: 7
Single-walled carbon nanotubes (SWNTs); history and future prospects for electronic applications 单壁碳纳米管;电子应用的历史与未来展望
S. Jin
For more than the last 50 years, tremendous researchers have managed to drive revolutionary technology by shrinking silicon transistors, the key building blocks for all computing technology. However, as transistors are approaching fundamental roadblocks which cannot still be in a fashion to be smaller from silicon, researchers are therefore looking for materials to replace silicon. In this sense, among a variety of candidates beyond silicon, single walled carbon nanotubes (SWNTs) has been regarded as one of viable options because of ideal electrostatic coupling coming from one dimensional structure, the ability to operate at low voltages, and their exceptional electrical-performance in devices less than 10 nm. However, the road to producing transistors from single-walled carbon nanotubes (SWNTs) has been hedged about heterogeneous electrical properties (i.e., semiconducting vs. metallic) and controllably positioning these tiny molecular cylinders (~1 nm diameter). To address this issue, one of the most fascinating methods has been reported as "thermocapillarity enabled purification (TcEP)" for obtaining arrays of highly purified semiconducting CNTs with its process scalability and compatibility with the state of the art Si technology. In this talk, we will overview key technologies of TcEP and address future aspects on electronic application based on pristine form of SWNTs after purification.
在过去的50多年里,大量的研究人员成功地通过缩小硅晶体管来推动革命性的技术,硅晶体管是所有计算技术的关键组成部分。然而,由于晶体管正在接近基本的障碍,仍然不能以一种比硅更小的方式,研究人员因此正在寻找替代硅的材料。从这个意义上说,在硅之外的各种候选材料中,单壁碳纳米管(SWNTs)被认为是可行的选择之一,因为它具有理想的静电耦合,来自一维结构,在低电压下工作的能力,以及在小于10纳米的器件中具有出色的电性能。然而,从单壁碳纳米管(SWNTs)生产晶体管的道路一直受到不均匀电学性质(即半导体与金属)和控制这些微小分子圆柱体(直径约1nm)定位的限制。为了解决这个问题,最吸引人的方法之一被报道为“热毛细纯化(TcEP)”,用于获得高度纯化的半导体碳纳米管阵列,其工艺可扩展性和与最先进的Si技术的兼容性。在这次演讲中,我们将概述TcEP的关键技术,并讨论基于纯化后原始形式的单壁碳纳米管电子应用的未来方面。
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引用次数: 1
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2016 23rd International Workshop on Active-Matrix Flatpanel Displays and Devices (AM-FPD)
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