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2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)最新文献

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Single chip for imaging, color segmentation, histogramming and pattern matching 单芯片成像,颜色分割,直方图和模式匹配
R. Etienne-Cummings, P. Pouliquen, M. A. Lewis
128(H)/spl times/64(V)/spl times/RGB CMOS imager is integrated with region-of-interest selection, RGB-to-HSI transformation, HSI-based pixel segmentation, 36-bins/spl times/12b HSI histogramming, and sum-of-absolute-difference template matching. 32 learned color templates are stored and compared to each frame. At 30 frames/s, it uses 1 mW.
128(H)/spl次/64(V)/spl次/RGB CMOS成像仪集成了兴趣区域选择、RGB- HSI转换、基于HSI的像素分割、36-bin /spl次/12b HSI直方图和绝对差和模板匹配。存储32个学习过的颜色模板,并与每一帧进行比较。在30帧/秒时,它使用1mw。
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引用次数: 0
A quad 3.125 Gb/s/channel transceiver with analog phase rotators 带有模拟相位旋转器的四路3.125 Gb/s/通道收发器
Dong Zheng, Xuecheng Jin, E. Cheung, M. Rana, Gengyue Song, Yong Jiang, Y. Sutu, Bin Wu
A 0.18 /spl mu/m/sup 2/ CMOS quad transceiver provides 12.5 Gb/s full-duplex raw data throughput at 200 mW/channel consumption. An analog phase rotator in CDR (clock/data recovery) eliminates the quantization error of digital phase interpolation techniques, resulting in <17 ps peak-peak output jitter.
一个0.18 /spl mu/m/sup 2/ CMOS四路收发器在200mw /信道消耗下提供12.5 Gb/s的全双工原始数据吞吐量。CDR(时钟/数据恢复)中的模拟相位旋转器消除了数字相位插值技术的量化误差,导致峰值输出抖动<17 ps。
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引用次数: 20
A multichip on oxide of 1 Gb/s 80 dB fully-differential CMOS transimpedance amplifier for optical interconnect applications 用于光互连应用的1 Gb/s 80 dB全差分CMOS跨阻放大器
Jaeseo Lee, Seong-Jun Song, Sung Min Park, Choong-Mo Nam, Young-Se Kwon, H. Yoo
A 1.0 Gb/s 80 dB/spl Omega/ fully-differential TIA uses 0.25 /spl mu/m CMOS and multichip-on-oxide (MCO) process. MCO enables integration of PD, TIA, and planar inductors of Q=21.1 for shunt peaking on an oxidized silicon substrate. Interchannel crosstalk and power dissipation are <-40 dB and 27 mW, respectively. MCO and TIA chips are 5/spl times/5 mm/sup 2/ and 0.7/spl times/1 mm/sup 2/, respectively.
一个1.0 Gb/s 80 dB/spl Omega/全差分TIA采用0.25 /spl mu/m CMOS和多芯片氧化物(MCO)工艺。MCO可以集成PD、TIA和Q=21.1的平面电感器,在氧化硅衬底上实现分流峰值。通道间串扰和功耗分别<-40 dB和27 mW。MCO和TIA芯片分别为5/spl倍/ 5mm /sup 2/和0.7/spl倍/ 1mm /sup 2/。
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引用次数: 25
An 8-way VLIW embedded multimedia processor built in 7-layer metal 0.11 /spl mu/m CMOS technology 采用7层金属0.11 /spl mu/m CMOS技术的8路VLIW嵌入式多媒体处理器
H. Okano, A. Suga, T. Shiota, Y. Takebe, Yasuki Nakamura, N. Higaki, Haruo Kimura, H. Miyake, T. Satoh, K. Kawasaki, R. Sasagawa, W. Shibamoto, Mitsuru Sasaki, Naruyoshi Ando, Tomohiro Yamana, I. Fukushi, S. Tago, F. Hayakawa, Teruhiko Kamigata, S. Imai, Atsushi Satoh, Yasuaki Hatta, Noboru Nishimura, Y. Asada, Taizo Satoh, Takao Sukemura, S. Ando, Hiromasa Takahashi
A 533 MHz 2.5 W 2132 MIPS 12.8 GOPS 2.1 GFLOPS 8-way VLIW embedded multimedia processor occupies a 7.8/spl times/7.8 mm/sup 2/ die in a 7-layer metal 0.11 /spl mu/m CMOS at 1.2 V. VLIW, SIMD, dynamic branch prediction, non-aligned dual load/store mechanism and a crosstalk-aware design flow contribute to performance.
533 MHz 2.5 W 2132 MIPS 12.8 GOPS 2.1 GFLOPS 8路VLIW嵌入式多媒体处理器在1.2 V电压下,采用7层金属0.11 /spl mu/m CMOS芯片,占用7.8/spl次/7.8 mm/sup / 2/芯片。VLIW、SIMD、动态分支预测、非对齐双负载/存储机制和串扰感知设计流程有助于提高性能。
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引用次数: 11
A 138 dB dynamic range CMOS image sensor with new pixel architecture 一种具有新像素结构的138 dB动态范围CMOS图像传感器
D. Stoppa, A. Simoni, L. Gonzo, M. Gottardi, G. Dalla Betta
A 128/spl times/64 pixel image sensor in 0.35 /spl mu/m 3.3V CMOS technology achieves 138 dB dynamic range by adapting single-pixel integration time to the local illumination conditions. Video frame rate is achieved with 0.2% rms temporal noise and 14 mW power in a test chip.
采用0.35 /spl mu/m 3.3V CMOS技术的128/spl倍/64像素图像传感器通过调整单像素集成时间来适应局部照明条件,实现了138 dB的动态范围。在测试芯片中,视频帧率以rms为0.2%的时间噪声和14mw的功率实现。
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引用次数: 14
Single-chip surface-micromachined integrated gyroscope with 50/spl deg//hour root Allan variance 单片表面微机械集成陀螺仪与50/spl度//小时根艾伦方差
J. Geen, S. Sherman, J. F. Chang, S. R. Lewis
A MEMS surface-micromachined gyroscope integrated on a single 3/spl times/3 mm/sup 2/ chip with a 3 /spl mu/m BiCMOS process has 4 /spl mu/m-thick polysilicon structure, 5V 6 mA power supply, 0.05/spl deg///spl radic/s spot noise, 12.5 mV//spl deg//s, >30,000 g shock survival, and -55 to 85/spl deg/C operating range.
采用3/spl mu/m BiCMOS工艺的MEMS表面微机械陀螺仪集成在单个3/spl倍/3 mm/sup / 2/芯片上,具有4 /spl mu/m厚度的多晶硅结构,5V 6 mA电源,0.05/spl度//spl半径/s点噪声,12.5 mV//spl度//s, >30,000 g冲击存活,工作范围为-55至85/spl度/C。
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引用次数: 50
A gas detection system on a single CMOS chip comprising capacitive, calorimetric, and mass-sensitive microsensors 在单个CMOS芯片上的气体检测系统,包括电容式、量热式和质量敏感微传感器
C. Hagleitner, D. Lange, N. Kerness, A. Hierlemann, O. Brand, H. Baltes
A single-chip chemical microsensor system fabricated in industrial 0.8 /spl mu/m CMOS technology includes three different polymer-coated micromachined transducers. The chip forms an integral part of a handheld unit to detect volatile organics. On-chip circuitry includes signal conditioning, A/D-converters, filters, digital controller, and serial bus interface (I/sup 2/C).
采用工业0.8 /spl μ m CMOS技术制造的单芯片化学微传感器系统包括三种不同的聚合物包覆微机械传感器。该芯片构成用于检测挥发性有机物的手持装置的组成部分。片上电路包括信号调理,A/ d转换器,滤波器,数字控制器和串行总线接口(I/sup 2/C)。
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引用次数: 18
A 300 MHz multi-banked eDRAM macro featuring GND sense, bit-line twisting and direct reference cell write 一个300 MHz多银行eDRAM宏,具有GND感测,位线扭曲和直接参考单元写入
J. Barth, D. Anand, J. Dreibelbis, E. Nelson
A 0.12 /spl mu/m growable eDRAM macro has GND sense, bit-line twisting, direct reference cell write, a flexible multi-banking protocol, and column redundancy to support multi-banking. The protocol supports simultaneous activate, read/write and pre-charge to three different banks. Hardware measurements verify 300 MHz operation, 6.6 ns tacc, and 10 ns trc.
一个0.12 /spl mu/m的可生长eDRAM宏具有GND感知、位线扭曲、直接参考单元写入、灵活的多银行协议和支持多银行的列冗余。该协议支持同时激活,读/写和预充三家不同的银行。硬件测量验证300 MHz操作,6.6 ns tacc和10 ns trc。
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引用次数: 26
A 7b 450MSample/s 50mW CMOS ADC in 0.3mm/sup 2/ A 7b 450MSample/s 50mW CMOS ADC, 0.3mm/sup 2/ s
K. Sushihara, A. Matsuzawa
A 7b 450MSample/s CMOS ADC in 0.18/spl mu/m technology is used for the embedded digital read channel system in DVD SOC. A dynamic comparator and an interpolation circuit composed of gate-width-weighted transistors consumes 50mW and occupies 0.3mm/sup 2/.
采用0.18/spl mu/m技术的7b 450MSample/s CMOS ADC实现DVD SOC的嵌入式数字读通道系统。由门宽加权晶体管组成的动态比较器和插补电路消耗50mW,占用0.3mm/sup /。
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引用次数: 4
3-D integrable optoelectronic devices for telecommunications ICs 电信集成电路用3-D可积光电子器件
P. Dainesi, A. Ionescu, L. Thévenaz, K. Banerjee, M. Declercq, P. Robert, P. Renaud, P. Fluckiger, C. Hibert, G. Racine
3-D integrable SOI optoelectronic devices include telecommunication optical switches with 5 MHz bandwidth and unbalanced Mach Zehnder interferometers for filtering. Thermal compensation provides efficient modulation over 100 kHz -1 MHz and addresses 3-D IC thermal issues.
三维可积SOI光电子器件包括5 MHz带宽的通信光开关和用于滤波的非平衡马赫曾德尔干涉仪。热补偿提供了100 kHz -1 MHz以上的高效调制,解决了3-D集成电路的热问题。
{"title":"3-D integrable optoelectronic devices for telecommunications ICs","authors":"P. Dainesi, A. Ionescu, L. Thévenaz, K. Banerjee, M. Declercq, P. Robert, P. Renaud, P. Fluckiger, C. Hibert, G. Racine","doi":"10.1109/ISSCC.2002.993081","DOIUrl":"https://doi.org/10.1109/ISSCC.2002.993081","url":null,"abstract":"3-D integrable SOI optoelectronic devices include telecommunication optical switches with 5 MHz bandwidth and unbalanced Mach Zehnder interferometers for filtering. Thermal compensation provides efficient modulation over 100 kHz -1 MHz and addresses 3-D IC thermal issues.","PeriodicalId":423674,"journal":{"name":"2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124690937","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
期刊
2002 IEEE International Solid-State Circuits Conference. Digest of Technical Papers (Cat. No.02CH37315)
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