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1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings最新文献

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Pass-transistor logic and its sub-Vdd voltage-swing behaviours in low-voltage circuit design 低压电路设计中的通管逻辑及其亚vdd电压摆幅行为
T. Cheung, H. Wong, Y. Cheng
Internal signal propagation with voltage swing less than the supply voltage have been proposed through various architecture or structures. Reduced supply voltage in digital and analog circuits is considered to be one of the best methods for achieving real low power dissipation circuits. In this paper, pass-transistor logic with suppressed internal voltage-swing is investigated and analyzed. A proposal on a reduced swing 14-bit parity generator and carry generation blocks of a parallel full adder are also given. In addition, optimization on propagation delay can be achieved by proper tapering of the dimension of the transistors.
通过各种架构或结构,提出了电压摆幅小于电源电压的内部信号传播方法。降低数字和模拟电路中的电源电压被认为是实现真正低功耗电路的最佳方法之一。本文研究和分析了抑制内摆压的通管逻辑。给出了一种减小摆幅的14位奇偶校验器和一种并行全加法器进位产生模块的设计方案。此外,通过适当减小晶体管的尺寸,可以实现传输延迟的优化。
{"title":"Pass-transistor logic and its sub-Vdd voltage-swing behaviours in low-voltage circuit design","authors":"T. Cheung, H. Wong, Y. Cheng","doi":"10.1109/TENCON.1995.496401","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496401","url":null,"abstract":"Internal signal propagation with voltage swing less than the supply voltage have been proposed through various architecture or structures. Reduced supply voltage in digital and analog circuits is considered to be one of the best methods for achieving real low power dissipation circuits. In this paper, pass-transistor logic with suppressed internal voltage-swing is investigated and analyzed. A proposal on a reduced swing 14-bit parity generator and carry generation blocks of a parallel full adder are also given. In addition, optimization on propagation delay can be achieved by proper tapering of the dimension of the transistors.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124196066","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Integrated digital input driver for active matrix liquid-crystal-on-silicon display 用于有源矩阵液晶单晶硅显示器的集成数字输入驱动器
H.C. Huang, P. Cheng, H. Kwok
A digital input driver was designed and integrated with an active matrix nematic liquid-crystal-on-silicon (LCOS) display. Fabricated by conventional 2-/spl mu/m CMOS technology, the driver in the periphery of the active matrix can easily incorporate versatile electronic functions into the silicon backplane. This integration makes the LCOS display easier to be interfaced with different image sources of various formats and, hence, leads to a versatile display system.
设计了一种数字输入驱动器,并将其与有源矩阵向列式硅基液晶显示器集成在一起。采用传统的2-/spl μ m CMOS技术制造,在有源矩阵外围的驱动器可以很容易地将多种电子功能集成到硅背板中。这种集成使得LCOS显示器更容易与各种格式的不同图像源连接,从而形成多功能显示系统。
{"title":"Integrated digital input driver for active matrix liquid-crystal-on-silicon display","authors":"H.C. Huang, P. Cheng, H. Kwok","doi":"10.1109/TENCON.1995.496444","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496444","url":null,"abstract":"A digital input driver was designed and integrated with an active matrix nematic liquid-crystal-on-silicon (LCOS) display. Fabricated by conventional 2-/spl mu/m CMOS technology, the driver in the periphery of the active matrix can easily incorporate versatile electronic functions into the silicon backplane. This integration makes the LCOS display easier to be interfaced with different image sources of various formats and, hence, leads to a versatile display system.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122498763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Analog and VLSI implementation of connectionist network for minimum spanning tree problems 最小生成树问题的连接网络模拟和VLSI实现
H. Ng, K. Lam, W. K. Tai
We describe a connectionist architecture which shows promise in obtaining the global optimal solution to the classical minimum spanning tree problem in a time independent of the problem size. Using commonly available analogue electronic components, a network prototype was found to give the global optimal solution within the microseconds range. Simulation results and limiting factors of the performance of analog and VLSI implementation circuits are discussed.
我们描述了一种连接主义架构,该架构显示了在与问题大小无关的时间内获得经典最小生成树问题全局最优解的希望。利用常用的模拟电子元件,找到了在微秒范围内给出全局最优解的网络原型。讨论了模拟电路和VLSI实现电路的仿真结果和性能限制因素。
{"title":"Analog and VLSI implementation of connectionist network for minimum spanning tree problems","authors":"H. Ng, K. Lam, W. K. Tai","doi":"10.1109/TENCON.1995.496356","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496356","url":null,"abstract":"We describe a connectionist architecture which shows promise in obtaining the global optimal solution to the classical minimum spanning tree problem in a time independent of the problem size. Using commonly available analogue electronic components, a network prototype was found to give the global optimal solution within the microseconds range. Simulation results and limiting factors of the performance of analog and VLSI implementation circuits are discussed.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122690917","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
REALIZATION OF VIDEO-RATE STN DISPLAY USING ROW VOLTAGE MODULATION METHOD 用行电压调制方法实现视频率STN显示
S. Lee, Sung-Hoon Park, H. Lee, C. Kim, Chul‐Hi Han
A driving method which makes it possible to use conventional digital driver ICs and to achieve multi-gray displays with simple computation is proposed. Low cost video-rate 320/spl times/240 8-gray STN-LCD has been realized using the proposed method which adopts multi-line selection scheme.
提出了一种既能使用传统的数字驱动ic,又能以简单的计算实现多灰度显示的驱动方法。采用多线选择方案,实现了320/spl次/240的低成本视频速率的8灰STN-LCD。
{"title":"REALIZATION OF VIDEO-RATE STN DISPLAY USING ROW VOLTAGE MODULATION METHOD","authors":"S. Lee, Sung-Hoon Park, H. Lee, C. Kim, Chul‐Hi Han","doi":"10.1109/TENCON.1995.496441","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496441","url":null,"abstract":"A driving method which makes it possible to use conventional digital driver ICs and to achieve multi-gray displays with simple computation is proposed. Low cost video-rate 320/spl times/240 8-gray STN-LCD has been realized using the proposed method which adopts multi-line selection scheme.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"102 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121138806","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A finite width impurity source model for linear doping profiles 线性掺杂谱线的有限宽度杂质源模型
Tommy M. L. Lai, J. Sin, P. Ko
In order to provide high breakdown voltage in thin-film SOI devices, a linear doping profile in the drift region is needed. The linear doping profile can be obtained by using a lateral variation doping technique. In this technique, a smeared-out dopant distribution is implemented through the use of a sequence of small opening slits in the oxide with subsequent impurity implantation and drive-in processes. In this paper, an analytical model is presented to describe the impurity distribution of a finite width impurity source which is used to form the linear doping profile. This model provides a basis for determination of the slits width and silts spacing which are required to implement the linear doping profile.
为了在薄膜SOI器件中提供高击穿电压,需要在漂移区采用线性掺杂。通过使用横向变化掺杂技术可以获得线性掺杂轮廓。在该技术中,通过在氧化物中使用一系列小的开口狭缝,以及随后的杂质注入和驱动过程来实现涂抹出的掺杂剂分布。本文提出了一种描述用于形成线性掺杂谱线的有限宽度杂质源的杂质分布的解析模型。该模型为确定实现线性掺杂剖面所需的狭缝宽度和泥沙间距提供了依据。
{"title":"A finite width impurity source model for linear doping profiles","authors":"Tommy M. L. Lai, J. Sin, P. Ko","doi":"10.1109/TENCON.1995.496432","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496432","url":null,"abstract":"In order to provide high breakdown voltage in thin-film SOI devices, a linear doping profile in the drift region is needed. The linear doping profile can be obtained by using a lateral variation doping technique. In this technique, a smeared-out dopant distribution is implemented through the use of a sequence of small opening slits in the oxide with subsequent impurity implantation and drive-in processes. In this paper, an analytical model is presented to describe the impurity distribution of a finite width impurity source which is used to form the linear doping profile. This model provides a basis for determination of the slits width and silts spacing which are required to implement the linear doping profile.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121332814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Design study of passivation ledge in AlGaAs/GaAs heterojunction bipolar transistors AlGaAs/GaAs异质结双极晶体管钝化边缘设计研究
Yang-Hua Chang
A thin AlGaAs passivation ledge on the extrinsic base surfaces of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is widely used to reduce the extrinsic base surface recombination current and increase the common emitter current gain. However, the design of the ledge and its effectiveness on base current reduction need to be further investigated. In this paper, HBTs with different ledge structures are analyzed with 2-dimensional simulation. The results indicate that a thinner ledge provides better suppression of electron lateral (horizontal) diffusion in the base, and therefore reduces the electron component in base current. Optimization of the ledge design and GaAs surface passivation process is essential for device reliability, too. A new device structure with heavily doped extrinsic base layers is proposed to further improve the base current.
在AlGaAs/GaAs异质结双极晶体管(HBTs)的外源基极表面上加薄的AlGaAs钝化壁被广泛用于减小外源基极表面复合电流和增加共发射极电流增益。然而,平台的设计及其对基极电流的抑制效果还有待进一步研究。本文采用二维仿真的方法对不同岩架结构的HBTs进行了分析。结果表明,较薄的壁板可以更好地抑制电子在基极中的横向(水平)扩散,从而降低基极电流中的电子成分。平台设计和GaAs表面钝化工艺的优化对器件可靠性也至关重要。为了进一步提高基极电流,提出了一种重掺杂外源基极层的器件结构。
{"title":"Design study of passivation ledge in AlGaAs/GaAs heterojunction bipolar transistors","authors":"Yang-Hua Chang","doi":"10.1109/TENCON.1995.496351","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496351","url":null,"abstract":"A thin AlGaAs passivation ledge on the extrinsic base surfaces of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is widely used to reduce the extrinsic base surface recombination current and increase the common emitter current gain. However, the design of the ledge and its effectiveness on base current reduction need to be further investigated. In this paper, HBTs with different ledge structures are analyzed with 2-dimensional simulation. The results indicate that a thinner ledge provides better suppression of electron lateral (horizontal) diffusion in the base, and therefore reduces the electron component in base current. Optimization of the ledge design and GaAs surface passivation process is essential for device reliability, too. A new device structure with heavily doped extrinsic base layers is proposed to further improve the base current.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122068326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CoSi/sub 2//SiGe contact formation by Co/a-SiGe/Si solid state reaction Co/a-SiGe/Si固相反应形成CoSi/ sub2 //SiGe触点
W. Qi, B. Li, G. Jiang, W.N. Huang, Z. Gu
The Co/a-SiGe/Si solid state reaction has been studied in this paper. The experimental results demonstrated the simultaneously SiGe/Si solid phase hetero-epitaxy and CoSi/sub 2//SiGe contact formation. The SiGe crystallization is a result of the Ge rejection and interdiffusion with Si during the Co/a-SiGe/Si ternary interaction.
本文研究了Co/a-SiGe/Si的固相反应。实验结果表明,同时形成了SiGe/Si固相异质外延和CoSi/ sub2 //SiGe接触。SiGe的结晶是Co/a-SiGe/Si三元相互作用过程中Ge的排斥和Si的相互扩散的结果。
{"title":"CoSi/sub 2//SiGe contact formation by Co/a-SiGe/Si solid state reaction","authors":"W. Qi, B. Li, G. Jiang, W.N. Huang, Z. Gu","doi":"10.1109/TENCON.1995.496393","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496393","url":null,"abstract":"The Co/a-SiGe/Si solid state reaction has been studied in this paper. The experimental results demonstrated the simultaneously SiGe/Si solid phase hetero-epitaxy and CoSi/sub 2//SiGe contact formation. The SiGe crystallization is a result of the Ge rejection and interdiffusion with Si during the Co/a-SiGe/Si ternary interaction.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"58 34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125036993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Fluidic shear-stress measurement using surface-micromachined sensors 使用表面微机械传感器的流体剪切应力测量
Jin-Biao Huang, Chang Liu, F. Jiang, S. Tung, Y. Tai, Chih-Ming Ho
A poly-silicon hot-film shear-stress sensor insulated by a vacuum-chamber underneath has been designed and fabricated by the surface micromachining technology. The sensor is operated at both constant current and constant temperature modes. The dynamic performance (including time constant and cut-off frequency) measurement, calibration, and temperature compensation of the sensor have been realized.
采用表面微加工技术,设计并制作了一种下部真空室绝缘的多晶硅热膜剪切应力传感器。该传感器在恒流和恒温两种模式下工作。实现了传感器的动态性能(包括时间常数和截止频率)测量、校准和温度补偿。
{"title":"Fluidic shear-stress measurement using surface-micromachined sensors","authors":"Jin-Biao Huang, Chang Liu, F. Jiang, S. Tung, Y. Tai, Chih-Ming Ho","doi":"10.1109/TENCON.1995.496324","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496324","url":null,"abstract":"A poly-silicon hot-film shear-stress sensor insulated by a vacuum-chamber underneath has been designed and fabricated by the surface micromachining technology. The sensor is operated at both constant current and constant temperature modes. The dynamic performance (including time constant and cut-off frequency) measurement, calibration, and temperature compensation of the sensor have been realized.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126755199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Electro-absorption and refraction at 1.5 /spl mu/m in InGaAs/AlGaAs superlattice growth on GaAs substrate GaAs衬底上InGaAs/AlGaAs超晶格生长在1.5 /spl mu/m下的电吸收和折射
Michael C. Y. Chan, E. Li, K. S. Chan
High indium concentration In/sub 0.65/Ga/sub 0.35/As/Al/sub 0.33/Ga/sub 0.67/As superlattices on GaAs substrates are useful for modulators and optical communication applications. This is due to the lowest loss 1.55 /spl mu/m optimum wavelength for operation of fiber optic systems. The optical parameters such as absorption coefficient and change in refractive index with applied electric field are investigated.
砷化镓衬底上的高铟浓度In/sub 0.65/Ga/sub 0.35/As/Al/sub 0.33/Ga/sub 0.67/As超晶格可用于调制器和光通信应用。这是由于光纤系统运行的最低损耗1.55 /spl mu/m的最佳波长。研究了吸收系数和折射率随外加电场的变化等光学参数。
{"title":"Electro-absorption and refraction at 1.5 /spl mu/m in InGaAs/AlGaAs superlattice growth on GaAs substrate","authors":"Michael C. Y. Chan, E. Li, K. S. Chan","doi":"10.1109/TENCON.1995.496340","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496340","url":null,"abstract":"High indium concentration In/sub 0.65/Ga/sub 0.35/As/Al/sub 0.33/Ga/sub 0.67/As superlattices on GaAs substrates are useful for modulators and optical communication applications. This is due to the lowest loss 1.55 /spl mu/m optimum wavelength for operation of fiber optic systems. The optical parameters such as absorption coefficient and change in refractive index with applied electric field are investigated.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126873026","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Variable data rate Viterbi decoder with modified LOVA algorithm 基于改进LOVA算法的可变数据速率Viterbi解码器
S. Czaja, J. Robertson
This paper describes the implementation of a Viterbi decoder with a modified list-of-two List Output Viterbi Algorithm (LOVA) which is used to decode variable data rate frames in Code Division Multiple Access (CDMA) mobile stations. It performs the decoding of convolutional code k=9, rate=1/2 for fall, half, quarter, and eighth data rate frames. This Viterbi decoder is a part of a CDMA base-band processor used in an IS-95 cellular and Personal Communication System (PCS) mobile terminal.
本文介绍了一种采用改进的双表输出Viterbi算法(LOVA)的Viterbi解码器的实现,该解码器用于码分多址(CDMA)移动站中可变数据速率帧的解码。它执行卷积码k=9,率=1/2的解码为下降,一半,四分之一,和第八数据速率帧。该Viterbi解码器是用于is -95蜂窝和个人通信系统(PCS)移动终端的CDMA基带处理器的一部分。
{"title":"Variable data rate Viterbi decoder with modified LOVA algorithm","authors":"S. Czaja, J. Robertson","doi":"10.1109/TENCON.1995.496443","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496443","url":null,"abstract":"This paper describes the implementation of a Viterbi decoder with a modified list-of-two List Output Viterbi Algorithm (LOVA) which is used to decode variable data rate frames in Code Division Multiple Access (CDMA) mobile stations. It performs the decoding of convolutional code k=9, rate=1/2 for fall, half, quarter, and eighth data rate frames. This Viterbi decoder is a part of a CDMA base-band processor used in an IS-95 cellular and Personal Communication System (PCS) mobile terminal.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117107535","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings
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