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1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings最新文献

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Localised bandgap engineering in III-V semiconductor quantum well structures for optoelectronic devices 光电器件III-V型半导体量子阱结构的局部带隙工程
B. Weiss
In this paper the processing, properties and applications of interdiffusion in III-V semiconductor quantum well structures for optoelectronic device applications are reviewed. The interdiffusion process and its influence on the characteristics of a range of III-V quantum well structures are discussed. The use of this process for the post growth modification of QW structures is also discussed, including the tuning of laser characteristics. In addition, the use of the process for three dimensional structuring of devices is important for the isolation in optical integrated circuits.
本文综述了III-V型半导体量子阱结构中互扩散的工艺、性质及其在光电器件中的应用。讨论了相互扩散过程及其对一系列III-V量子阱结构特性的影响。本文还讨论了该工艺在量子阱结构生长后修饰中的应用,包括激光特性的调谐。此外,在器件的三维结构中使用该工艺对光学集成电路的隔离也很重要。
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引用次数: 0
A new hybrid SOI LDMOS-IGBT power transistor 一种新型混合SOI LDMOS-IGBT功率晶体管
J. Zeng, P. Mawby, M. Towers, K. Board
A new hybrid LDMOS-IGBT structure using SOI film is reported. The new device integrates the advantages of SOI technology, the conductivity modulation of IGBT and the high switching speed of DMOSFET.
报道了一种基于SOI薄膜的新型LDMOS-IGBT杂化结构。该器件集成了SOI技术、IGBT的电导率调制和DMOSFET的高开关速度的优点。
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引用次数: 6
Perspective of silicon-based IC technology 硅基集成电路技术展望
Y. Nishi
Summary form only given, as follows. This paper discusses the past, present and the foreseeable future of silicon-based IC technology, placing the focus on the factors that have driven IC technology and the industry until today, and how they could change in the future. The role of consortia in the United States and Japan on the IC industry; technology drivers and their contributions to characterize technological features; and the trends of technology, R&D and manufacturing are the central theme.
仅给出摘要形式,如下。本文讨论了硅基集成电路技术的过去、现在和可预见的未来,将重点放在推动集成电路技术和行业发展到今天的因素上,以及它们在未来如何变化。美国和日本财团对集成电路产业的作用;技术驱动因素及其对技术特征的贡献技术、研发和制造的趋势是中心主题。
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引用次数: 0
Characterization of split-gate flash memory devices: reliability, gate-disturbance and capacitive coupling coefficients 分栅闪存器件的特性:可靠性、栅极干扰和电容耦合系数
D.M. Kim, Y. Jun, Y. Sohn, J. Kim, I. Choi
The split-gate flash memory device is characterized. The oxide breakdown due to cumulative electron tunneling, viz. repeated erasure is investigated with the use of current injection experiments. The results are correlated with the observed device cycling behaviour. Also data for the gate disturbance, programming efficiency and capacitive coupling coefficients are presented and discussed.
分栅闪存器件的特征。利用电流注入实验研究了由于累积电子隧穿即重复擦除引起的氧化物击穿。结果与观察到的器件循环行为相关。同时给出了栅极干扰、编程效率和电容耦合系数的数据并进行了讨论。
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引用次数: 2
Observation of solid phase epitaxial growth of amorphous SiGe on Si(100) substrate 非晶SiGe在Si(100)衬底固相外延生长的观察
W. Qi, B. Li, G. Jiang, Z. Gu, T. Kwok, R.J. Zhang, P. Chu
The solid phase hetero-epitaxial growth of amorphous SiGe on Si(100) substrate has been investigated in this paper. The experimental results indicate that the solid phase epitaxy of the heterostructure Si/sub 1-x/Ge/sub x//Si can be achieved with different compositions through high temperature thermal processes such as boron diffusion, annealing and oxidation.
本文研究了非晶SiGe在Si(100)衬底上的固相异质外延生长。实验结果表明,不同成分的异质结构Si/sub - 1-x/Ge/sub -x/ Si均可通过硼扩散、退火和氧化等高温热处理工艺实现固相外延。
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引用次数: 0
Selectivity enhancement of tin dioxide gas sensor with polymer membrane 聚合物膜增强二氧化锡气体传感器的选择性
Kk Wong, Zhenan Tang, J. Sin, P. Chan, P. Cheung, H. Hiraoka
The application of a polymer to enhance the selectivity of a tin dioxide gas sensor is presented. Commercial polymer, XU218 of Ciba-Geigy company, is coated on the sensing film of a tin dioxide gas sensor FIGARO TGS842 which was designed to detect methane. The polymer coated sensor is calibrated in a high accuracy testing chamber that is controlled by PC with GPIB and mass flow controllers (MFCs). Three gases, hydrogen, methane, and ammonia, are used to investigate the response of the sensor. It is found that the sensor shows a characteristic change in response to ammonia and almost negligible change in response to hydrogen and methane.
介绍了聚合物在提高二氧化锡气体传感器选择性中的应用。Ciba-Geigy公司的商用聚合物XU218被涂在用于检测甲烷的二氧化锡气体传感器FIGARO TGS842的传感膜上。聚合物涂层传感器在高精度测试室中进行校准,该测试室由带有GPIB和质量流量控制器(mfc)的PC控制。三种气体,氢气,甲烷和氨气,被用来研究传感器的响应。结果表明,该传感器对氨的响应表现出特征变化,对氢和甲烷的响应变化几乎可以忽略不计。
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引用次数: 1
Voltage-controlled micromechanical SOI optical waveguides 电压控制微机械SOI光波导
T. Eng, S. Kan, G. Wong
We demonstrate the fabrication and the operation of voltage-controlled movable SOI optical waveguides. The fabrication process is based on surface micromachining the SOI substrates. The dynamic response is studied. Our results indicate that a switching voltage of only a few volts is enough to produce a useful deflection amplitude of the guided light for typical fiber optic switching applications. A deflection amplitude of 290 /spl mu/m for the guided light is demonstrated with voltage-controlled electrostatic actuation.
我们演示了压控可移动SOI光波导的制作和工作。制造工艺是基于表面微加工的SOI衬底。对其动力响应进行了研究。我们的结果表明,在典型的光纤开关应用中,仅几伏特的开关电压就足以产生有用的导光偏转幅度。在电压控制的静电驱动下,导光的偏转幅度为290 /spl mu/m。
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引用次数: 1
Nitridation of sputtered silicon dioxide films 溅射二氧化硅薄膜的氮化
E. Jelenkovic, K. Tong
It is shown that nitridation of sputtered oxide by reactive sputtering can give a hardened oxide-silicon interface with reduced interface states generation after stress. SIMS analysis has confirmed the existence of SiN peak close to the oxide/silicon interface. A stacked SiO/sub 2//SiO/sub x/N/sub y/ structure is discussed relative to charge trapping, leakage current and mid-gap voltage shift.
结果表明,通过反应溅射对溅射氧化物进行氮化处理,使氧化硅界面硬化,减少了应力后界面态的生成。SIMS分析证实了在氧化物/硅界面附近存在SiN峰。讨论了一种SiO/sub 2//SiO/sub x/N/sub y/结构的电荷俘获、漏电流和中隙电压漂移。
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引用次数: 0
Technology of infrared rapid thermal annealing and its application in VLSI 红外快速退火技术及其在超大规模集成电路中的应用
Hui Lin, Rong Liu, Bingsen Chen, Hongfa Luan
The technology and equipment of the infrared rapid thermal annealing for VLSI is reported. The equipment used for rapid thermal annealing has been made with an radio frequency (RF)-induced graphite heater in a quartz housing as an infrared heating source. By using this technology and equipment the fabrication of shallow junction, the formation of silicide, the effect of BPSG reflow and annihilating the micro defects and thermal donor in CZ Si single crystal are discussed.
介绍了超大规模集成电路红外快速退火的工艺和设备。用于快速退火的设备是用石英外壳中的射频(RF)感应石墨加热器作为红外热源制成的。利用该技术和设备,讨论了czsi单晶中浅结的制备、硅化物的形成、BPSG回流的影响以及微缺陷和热供体的湮灭。
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引用次数: 0
An implementation of branch target buffer for high performance applications 高性能应用程序分支目标缓冲区的实现
S. Sonh, Hoonmo Yang, M. Lee
Efficient executions of branch instructions are one of the most important issues in implementing high performance microprocessors. Branching instructions are above 20% of total instruction in most programs. BTB (Branch Target Buffer) enhances the speed of branch instruction execution by predicting the branch path, including currently executed branch instruction address, prediction information, and target address. The BTB is designed as a 4-way set associative organization with 256 branch entries. Pseudo-LRU algorithm is used for replacement of lines instead of ordinary LRU algorithm. Also IP(Instruction Pointer) chain is designed for verifying the BTB.
分支指令的有效执行是实现高性能微处理器最重要的问题之一。在大多数程序中,分支指令占总指令的20%以上。BTB (Branch Target Buffer)通过预测分支路径(包括当前执行的分支指令地址、预测信息和目标地址)来提高分支指令的执行速度。BTB被设计为具有256个分支条目的4路集合关联组织。采用伪LRU算法代替普通LRU算法进行行替换。此外,IP(指令指针)链是为验证BTB而设计的。
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引用次数: 2
期刊
1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings
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