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1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings最新文献

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Localised bandgap engineering in III-V semiconductor quantum well structures for optoelectronic devices 光电器件III-V型半导体量子阱结构的局部带隙工程
B. Weiss
In this paper the processing, properties and applications of interdiffusion in III-V semiconductor quantum well structures for optoelectronic device applications are reviewed. The interdiffusion process and its influence on the characteristics of a range of III-V quantum well structures are discussed. The use of this process for the post growth modification of QW structures is also discussed, including the tuning of laser characteristics. In addition, the use of the process for three dimensional structuring of devices is important for the isolation in optical integrated circuits.
本文综述了III-V型半导体量子阱结构中互扩散的工艺、性质及其在光电器件中的应用。讨论了相互扩散过程及其对一系列III-V量子阱结构特性的影响。本文还讨论了该工艺在量子阱结构生长后修饰中的应用,包括激光特性的调谐。此外,在器件的三维结构中使用该工艺对光学集成电路的隔离也很重要。
{"title":"Localised bandgap engineering in III-V semiconductor quantum well structures for optoelectronic devices","authors":"B. Weiss","doi":"10.1109/TENCON.1995.496336","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496336","url":null,"abstract":"In this paper the processing, properties and applications of interdiffusion in III-V semiconductor quantum well structures for optoelectronic device applications are reviewed. The interdiffusion process and its influence on the characteristics of a range of III-V quantum well structures are discussed. The use of this process for the post growth modification of QW structures is also discussed, including the tuning of laser characteristics. In addition, the use of the process for three dimensional structuring of devices is important for the isolation in optical integrated circuits.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126674821","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Observation of solid phase epitaxial growth of amorphous SiGe on Si(100) substrate 非晶SiGe在Si(100)衬底固相外延生长的观察
W. Qi, B. Li, G. Jiang, Z. Gu, T. Kwok, R.J. Zhang, P. Chu
The solid phase hetero-epitaxial growth of amorphous SiGe on Si(100) substrate has been investigated in this paper. The experimental results indicate that the solid phase epitaxy of the heterostructure Si/sub 1-x/Ge/sub x//Si can be achieved with different compositions through high temperature thermal processes such as boron diffusion, annealing and oxidation.
本文研究了非晶SiGe在Si(100)衬底上的固相异质外延生长。实验结果表明,不同成分的异质结构Si/sub - 1-x/Ge/sub -x/ Si均可通过硼扩散、退火和氧化等高温热处理工艺实现固相外延。
{"title":"Observation of solid phase epitaxial growth of amorphous SiGe on Si(100) substrate","authors":"W. Qi, B. Li, G. Jiang, Z. Gu, T. Kwok, R.J. Zhang, P. Chu","doi":"10.1109/TENCON.1995.496425","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496425","url":null,"abstract":"The solid phase hetero-epitaxial growth of amorphous SiGe on Si(100) substrate has been investigated in this paper. The experimental results indicate that the solid phase epitaxy of the heterostructure Si/sub 1-x/Ge/sub x//Si can be achieved with different compositions through high temperature thermal processes such as boron diffusion, annealing and oxidation.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"23 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132312681","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Characterization of split-gate flash memory devices: reliability, gate-disturbance and capacitive coupling coefficients 分栅闪存器件的特性:可靠性、栅极干扰和电容耦合系数
D.M. Kim, Y. Jun, Y. Sohn, J. Kim, I. Choi
The split-gate flash memory device is characterized. The oxide breakdown due to cumulative electron tunneling, viz. repeated erasure is investigated with the use of current injection experiments. The results are correlated with the observed device cycling behaviour. Also data for the gate disturbance, programming efficiency and capacitive coupling coefficients are presented and discussed.
分栅闪存器件的特征。利用电流注入实验研究了由于累积电子隧穿即重复擦除引起的氧化物击穿。结果与观察到的器件循环行为相关。同时给出了栅极干扰、编程效率和电容耦合系数的数据并进行了讨论。
{"title":"Characterization of split-gate flash memory devices: reliability, gate-disturbance and capacitive coupling coefficients","authors":"D.M. Kim, Y. Jun, Y. Sohn, J. Kim, I. Choi","doi":"10.1109/TENCON.1995.496439","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496439","url":null,"abstract":"The split-gate flash memory device is characterized. The oxide breakdown due to cumulative electron tunneling, viz. repeated erasure is investigated with the use of current injection experiments. The results are correlated with the observed device cycling behaviour. Also data for the gate disturbance, programming efficiency and capacitive coupling coefficients are presented and discussed.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"167 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132436512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Perspective of silicon-based IC technology 硅基集成电路技术展望
Y. Nishi
Summary form only given, as follows. This paper discusses the past, present and the foreseeable future of silicon-based IC technology, placing the focus on the factors that have driven IC technology and the industry until today, and how they could change in the future. The role of consortia in the United States and Japan on the IC industry; technology drivers and their contributions to characterize technological features; and the trends of technology, R&D and manufacturing are the central theme.
仅给出摘要形式,如下。本文讨论了硅基集成电路技术的过去、现在和可预见的未来,将重点放在推动集成电路技术和行业发展到今天的因素上,以及它们在未来如何变化。美国和日本财团对集成电路产业的作用;技术驱动因素及其对技术特征的贡献技术、研发和制造的趋势是中心主题。
{"title":"Perspective of silicon-based IC technology","authors":"Y. Nishi","doi":"10.1109/TENCON.1995.496320","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496320","url":null,"abstract":"Summary form only given, as follows. This paper discusses the past, present and the foreseeable future of silicon-based IC technology, placing the focus on the factors that have driven IC technology and the industry until today, and how they could change in the future. The role of consortia in the United States and Japan on the IC industry; technology drivers and their contributions to characterize technological features; and the trends of technology, R&D and manufacturing are the central theme.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134301813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Voltage-controlled micromechanical SOI optical waveguides 电压控制微机械SOI光波导
T. Eng, S. Kan, G. Wong
We demonstrate the fabrication and the operation of voltage-controlled movable SOI optical waveguides. The fabrication process is based on surface micromachining the SOI substrates. The dynamic response is studied. Our results indicate that a switching voltage of only a few volts is enough to produce a useful deflection amplitude of the guided light for typical fiber optic switching applications. A deflection amplitude of 290 /spl mu/m for the guided light is demonstrated with voltage-controlled electrostatic actuation.
我们演示了压控可移动SOI光波导的制作和工作。制造工艺是基于表面微加工的SOI衬底。对其动力响应进行了研究。我们的结果表明,在典型的光纤开关应用中,仅几伏特的开关电压就足以产生有用的导光偏转幅度。在电压控制的静电驱动下,导光的偏转幅度为290 /spl mu/m。
{"title":"Voltage-controlled micromechanical SOI optical waveguides","authors":"T. Eng, S. Kan, G. Wong","doi":"10.1109/TENCON.1995.496371","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496371","url":null,"abstract":"We demonstrate the fabrication and the operation of voltage-controlled movable SOI optical waveguides. The fabrication process is based on surface micromachining the SOI substrates. The dynamic response is studied. Our results indicate that a switching voltage of only a few volts is enough to produce a useful deflection amplitude of the guided light for typical fiber optic switching applications. A deflection amplitude of 290 /spl mu/m for the guided light is demonstrated with voltage-controlled electrostatic actuation.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131019360","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Selectivity enhancement of tin dioxide gas sensor with polymer membrane 聚合物膜增强二氧化锡气体传感器的选择性
Kk Wong, Zhenan Tang, J. Sin, P. Chan, P. Cheung, H. Hiraoka
The application of a polymer to enhance the selectivity of a tin dioxide gas sensor is presented. Commercial polymer, XU218 of Ciba-Geigy company, is coated on the sensing film of a tin dioxide gas sensor FIGARO TGS842 which was designed to detect methane. The polymer coated sensor is calibrated in a high accuracy testing chamber that is controlled by PC with GPIB and mass flow controllers (MFCs). Three gases, hydrogen, methane, and ammonia, are used to investigate the response of the sensor. It is found that the sensor shows a characteristic change in response to ammonia and almost negligible change in response to hydrogen and methane.
介绍了聚合物在提高二氧化锡气体传感器选择性中的应用。Ciba-Geigy公司的商用聚合物XU218被涂在用于检测甲烷的二氧化锡气体传感器FIGARO TGS842的传感膜上。聚合物涂层传感器在高精度测试室中进行校准,该测试室由带有GPIB和质量流量控制器(mfc)的PC控制。三种气体,氢气,甲烷和氨气,被用来研究传感器的响应。结果表明,该传感器对氨的响应表现出特征变化,对氢和甲烷的响应变化几乎可以忽略不计。
{"title":"Selectivity enhancement of tin dioxide gas sensor with polymer membrane","authors":"Kk Wong, Zhenan Tang, J. Sin, P. Chan, P. Cheung, H. Hiraoka","doi":"10.1109/TENCON.1995.496367","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496367","url":null,"abstract":"The application of a polymer to enhance the selectivity of a tin dioxide gas sensor is presented. Commercial polymer, XU218 of Ciba-Geigy company, is coated on the sensing film of a tin dioxide gas sensor FIGARO TGS842 which was designed to detect methane. The polymer coated sensor is calibrated in a high accuracy testing chamber that is controlled by PC with GPIB and mass flow controllers (MFCs). Three gases, hydrogen, methane, and ammonia, are used to investigate the response of the sensor. It is found that the sensor shows a characteristic change in response to ammonia and almost negligible change in response to hydrogen and methane.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131998051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Design study of passivation ledge in AlGaAs/GaAs heterojunction bipolar transistors AlGaAs/GaAs异质结双极晶体管钝化边缘设计研究
Yang-Hua Chang
A thin AlGaAs passivation ledge on the extrinsic base surfaces of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is widely used to reduce the extrinsic base surface recombination current and increase the common emitter current gain. However, the design of the ledge and its effectiveness on base current reduction need to be further investigated. In this paper, HBTs with different ledge structures are analyzed with 2-dimensional simulation. The results indicate that a thinner ledge provides better suppression of electron lateral (horizontal) diffusion in the base, and therefore reduces the electron component in base current. Optimization of the ledge design and GaAs surface passivation process is essential for device reliability, too. A new device structure with heavily doped extrinsic base layers is proposed to further improve the base current.
在AlGaAs/GaAs异质结双极晶体管(HBTs)的外源基极表面上加薄的AlGaAs钝化壁被广泛用于减小外源基极表面复合电流和增加共发射极电流增益。然而,平台的设计及其对基极电流的抑制效果还有待进一步研究。本文采用二维仿真的方法对不同岩架结构的HBTs进行了分析。结果表明,较薄的壁板可以更好地抑制电子在基极中的横向(水平)扩散,从而降低基极电流中的电子成分。平台设计和GaAs表面钝化工艺的优化对器件可靠性也至关重要。为了进一步提高基极电流,提出了一种重掺杂外源基极层的器件结构。
{"title":"Design study of passivation ledge in AlGaAs/GaAs heterojunction bipolar transistors","authors":"Yang-Hua Chang","doi":"10.1109/TENCON.1995.496351","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496351","url":null,"abstract":"A thin AlGaAs passivation ledge on the extrinsic base surfaces of AlGaAs/GaAs heterojunction bipolar transistors (HBTs) is widely used to reduce the extrinsic base surface recombination current and increase the common emitter current gain. However, the design of the ledge and its effectiveness on base current reduction need to be further investigated. In this paper, HBTs with different ledge structures are analyzed with 2-dimensional simulation. The results indicate that a thinner ledge provides better suppression of electron lateral (horizontal) diffusion in the base, and therefore reduces the electron component in base current. Optimization of the ledge design and GaAs surface passivation process is essential for device reliability, too. A new device structure with heavily doped extrinsic base layers is proposed to further improve the base current.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122068326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Circuit theoretical approach for one-dimensional quantum mechanics problems 一维量子力学问题的电路理论方法
H. Sanada, N. Nagai
This paper presents a simple, general and accurate analytic-numerical method to solve one-dimensional quantum mechanics problems. The method is based on the analogy of wave propagation between the transmission-line and the potential structure, and is applicable to potential barriers, wells, and superlattices. A guideline for designing new quantum effect devices can be easily obtained.
本文提出了一种简单、通用、准确的一维量子力学问题的解析数值求解方法。该方法基于传输线与势结构之间的波传播类比,适用于势垒、井和超晶格。这为设计新的量子效应器件提供了指导。
{"title":"Circuit theoretical approach for one-dimensional quantum mechanics problems","authors":"H. Sanada, N. Nagai","doi":"10.1109/TENCON.1995.496379","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496379","url":null,"abstract":"This paper presents a simple, general and accurate analytic-numerical method to solve one-dimensional quantum mechanics problems. The method is based on the analogy of wave propagation between the transmission-line and the potential structure, and is applicable to potential barriers, wells, and superlattices. A guideline for designing new quantum effect devices can be easily obtained.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121802750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Atmospheric pressure CVD-grown SiGe base HBT with the highest value of current gain-Early voltage product 常压cvd生长SiGe基极HBT具有最高的电流增益-早期电压积
T. Han, D. Cho, S.-M. Lee, B.R. Ryum
A low thermal-budget SiGe base heterojunction bipolar transistor (HBT) with a record current gain-Early voltage product (/spl beta//spl middot/Va) has been fabricated using atmospheric pressure (AP) CVD. After growing the SiGe layer on the wafer patterned by local oxidation of silicon (LOCOS), the HBT received thermal annealing only one time for drive-in and activation of arsenic (As) dopant in the polysilicon-emitter. For the 1/spl times/4 /spl mu/m/sup 2/ emitter, typical value of /spl beta//spl middot/Va is 200,000 V (/spl beta/=2,000 and Va=100 V) at the collector current of 0.9 mA.
利用常压(AP) CVD技术制备了一种低热收支SiGe基极异质结双极晶体管(HBT),该晶体管具有创纪录的电流增益-早期电压积(/spl beta//spl middot/Va)。在硅局部氧化(LOCOS)的硅片上生长SiGe层后,HBT只进行一次热退火,以驱动和激活多晶硅发射极中的砷(As)掺杂剂。对于1/spl倍/4 /spl mu/m/sup 2/发射极,在集电极电流为0.9 mA时,/spl beta//spl中点/Va的典型值为200000 V (/spl beta/= 2000, Va= 100v)。
{"title":"Atmospheric pressure CVD-grown SiGe base HBT with the highest value of current gain-Early voltage product","authors":"T. Han, D. Cho, S.-M. Lee, B.R. Ryum","doi":"10.1109/TENCON.1995.496426","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496426","url":null,"abstract":"A low thermal-budget SiGe base heterojunction bipolar transistor (HBT) with a record current gain-Early voltage product (/spl beta//spl middot/Va) has been fabricated using atmospheric pressure (AP) CVD. After growing the SiGe layer on the wafer patterned by local oxidation of silicon (LOCOS), the HBT received thermal annealing only one time for drive-in and activation of arsenic (As) dopant in the polysilicon-emitter. For the 1/spl times/4 /spl mu/m/sup 2/ emitter, typical value of /spl beta//spl middot/Va is 200,000 V (/spl beta/=2,000 and Va=100 V) at the collector current of 0.9 mA.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126084036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
An energy balance equation based 0.1 /spl mu/m MOSFET model including velocity overshoot behavior 基于0.1 /spl mu/m MOSFET模型的能量平衡方程,包括速度超调行为
J. Sim
In order to evaluate the velocity overshoot phenomenon in the deep submicron MOS devices, the energy balance equation should be incorporated with the drift-diffusion equation that includes thermoelectric diffusion. This paper presents an analytical current model for deep submicron MOS devices by solving the energy balance equation. Our model results show good agreement with experimental results. We have successfully derived the drain current model composed of drift and thermoelectric currents.
为了评价深亚微米MOS器件中的速度超调现象,应将能量平衡方程与包含热电扩散的漂移扩散方程相结合。本文通过求解能量平衡方程,建立了深亚微米MOS器件的解析电流模型。模型计算结果与实验结果吻合较好。我们成功地推导了由漂移电流和热电电流组成的漏极电流模型。
{"title":"An energy balance equation based 0.1 /spl mu/m MOSFET model including velocity overshoot behavior","authors":"J. Sim","doi":"10.1109/TENCON.1995.496376","DOIUrl":"https://doi.org/10.1109/TENCON.1995.496376","url":null,"abstract":"In order to evaluate the velocity overshoot phenomenon in the deep submicron MOS devices, the energy balance equation should be incorporated with the drift-diffusion equation that includes thermoelectric diffusion. This paper presents an analytical current model for deep submicron MOS devices by solving the energy balance equation. Our model results show good agreement with experimental results. We have successfully derived the drain current model composed of drift and thermoelectric currents.","PeriodicalId":425138,"journal":{"name":"1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings","volume":"145 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1995-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116356968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
1995 IEEE TENCON. IEEE Region 10 International Conference on Microelectronics and VLSI. 'Asia-Pacific Microelectronics 2000'. Proceedings
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