Pub Date : 2023-12-01DOI: 10.1109/MDAT.2023.3307558
Shuo Huai, Hao Kong, Xiangzhong Luo, Di Liu, Ravi Subramaniam, C. Makaya, Qian Lin, Weichen Liu
Editor’s notes: In this article, the authors explore recent efforts in hardware-aware design and optimization for edge intelligence. The article focuses on techniques such as model compression and neural architecture search to enhance system efficiency and effectiveness.—Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India
{"title":"On Hardware-Aware Design and Optimization of Edge Intelligence","authors":"Shuo Huai, Hao Kong, Xiangzhong Luo, Di Liu, Ravi Subramaniam, C. Makaya, Qian Lin, Weichen Liu","doi":"10.1109/MDAT.2023.3307558","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3307558","url":null,"abstract":"Editor’s notes: In this article, the authors explore recent efforts in hardware-aware design and optimization for edge intelligence. The article focuses on techniques such as model compression and neural architecture search to enhance system efficiency and effectiveness.—Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"46 1","pages":"149-162"},"PeriodicalIF":2.0,"publicationDate":"2023-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84571259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-01DOI: 10.1109/MDAT.2023.3309891
Shunichi Nagasaki, J. Kadomoto, H. Irie, S. Sakai
Editor’s notes: This article presents an approach to address challenges in shapechangeable computer systems, offering methods for ad hoc wireless network construction, routing, and dynamic reconfiguration based on nearfield inductive coupling between on-chip coils. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India
{"title":"Dynamically Reconfigurable Network Protocol for Shape-Changeable Computer System","authors":"Shunichi Nagasaki, J. Kadomoto, H. Irie, S. Sakai","doi":"10.1109/MDAT.2023.3309891","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3309891","url":null,"abstract":"Editor’s notes: This article presents an approach to address challenges in shapechangeable computer systems, offering methods for ad hoc wireless network construction, routing, and dynamic reconfiguration based on nearfield inductive coupling between on-chip coils. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"82 1","pages":"18-29"},"PeriodicalIF":2.0,"publicationDate":"2023-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85595530","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-01DOI: 10.1109/MDAT.2023.3309742
Zeyu Chen, Ankur Bindal, Vaidehi Garg, T. Krishna
Editor’s notes: In this article, the authors leverage a probe-based deadlock detection system and propose a deadlock recovery mechanism for interconnection networks. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India
{"title":"SPOCK: Reverse Packet Traversal for Deadlock Recovery","authors":"Zeyu Chen, Ankur Bindal, Vaidehi Garg, T. Krishna","doi":"10.1109/MDAT.2023.3309742","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3309742","url":null,"abstract":"Editor’s notes: In this article, the authors leverage a probe-based deadlock detection system and propose a deadlock recovery mechanism for interconnection networks. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"58 1","pages":"86-99"},"PeriodicalIF":2.0,"publicationDate":"2023-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87836443","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-01DOI: 10.1109/MDAT.2023.3310355
Gabriele Tombesi, Joseph Zuckerman, Paolo Mantovani, Davide Giri, Maico Cassel dos Santos, Tianyu Jia, David Brooks, Gu-Yeon Wei, L. Carloni
Editor’s notes: This article introduces a novel debug unit enabling compositional postsilicon validation of heterogeneous SoCs. The unit’s effectiveness is demonstrated in post-silicon validation by integrating it into a 12-nm complex SoC prototype. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India
{"title":"SoCProbe: Compositional Post-Silicon Validation of Heterogeneous NoC-Based SoCs","authors":"Gabriele Tombesi, Joseph Zuckerman, Paolo Mantovani, Davide Giri, Maico Cassel dos Santos, Tianyu Jia, David Brooks, Gu-Yeon Wei, L. Carloni","doi":"10.1109/MDAT.2023.3310355","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3310355","url":null,"abstract":"Editor’s notes: This article introduces a novel debug unit enabling compositional postsilicon validation of heterogeneous SoCs. The unit’s effectiveness is demonstrated in post-silicon validation by integrating it into a 12-nm complex SoC prototype. —Mahdi Nikdast, Colorado State University, USA —Miquel Moreto, Barcelona Supercomputing Center, Spain —Masoumeh (Azin) Ebrahimi, KTH Royal Institute of Technology, Sweden —Sujay Deb, IIIT Delhi, India","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"30 1","pages":"64-75"},"PeriodicalIF":2.0,"publicationDate":"2023-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75191583","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-28DOI: 10.1109/mdat.2023.3335173
Zhang Zhang, Annan Wang, Hongtao Ren, Guangjun Xie, Xin Cheng
Editor’s notes: Energy-harvesting systems can directly provide power to wearable IoT devices and industrial sensors efficiently. This article presents the design of a voltage–resistance-adaptive (VRA) maximum power point tracking (MPPT) technique for energy-harvesting systems. —Partha Pratim Pande, Washington State University, USA
{"title":"Voltage–Resistance-Adaptive MPPT Circuit for Energy Harvesting","authors":"Zhang Zhang, Annan Wang, Hongtao Ren, Guangjun Xie, Xin Cheng","doi":"10.1109/mdat.2023.3335173","DOIUrl":"https://doi.org/10.1109/mdat.2023.3335173","url":null,"abstract":"Editor’s notes: Energy-harvesting systems can directly provide power to wearable IoT devices and industrial sensors efficiently. This article presents the design of a voltage–resistance-adaptive (VRA) maximum power point tracking (MPPT) technique for energy-harvesting systems. —Partha Pratim Pande, Washington State University, USA","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"25 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2023-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140800723","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-11-20DOI: 10.1109/mdat.2023.3335195
Janusz Rajski, Vivek Chickermane, Jean-François Côté, Stephan Eggersglüß, Nilanjan Mukherjee, Jerzy Tyszer
Editor’s notes: Safety-critical applications, such as automotive electronics and data centers, demand high reliability. Integrating design-for-test (DFT) across silicon lifecycle addresses challenges for in-system and in-field operations, which are reviewed in this article. — Mehdi B. Tahoori, Karlsruhe Institute of Technology, Germany
编者按汽车电子和数据中心等安全关键型应用需要高可靠性。在硅片生命周期中整合测试设计（DFT）可应对系统内和现场操作的挑战，本文对此进行了综述。- Mehdi B. Tahoori，德国卡尔斯鲁厄理工学院
{"title":"The Future of Design for Test and Silicon Lifecycle Management","authors":"Janusz Rajski, Vivek Chickermane, Jean-François Côté, Stephan Eggersglüß, Nilanjan Mukherjee, Jerzy Tyszer","doi":"10.1109/mdat.2023.3335195","DOIUrl":"https://doi.org/10.1109/mdat.2023.3335195","url":null,"abstract":"Editor’s notes: Safety-critical applications, such as automotive electronics and data centers, demand high reliability. Integrating design-for-test (DFT) across silicon lifecycle addresses challenges for in-system and in-field operations, which are reviewed in this article. — Mehdi B. Tahoori, Karlsruhe Institute of Technology, Germany","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"71 1","pages":""},"PeriodicalIF":2.0,"publicationDate":"2023-11-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141507574","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-10-20DOI: 10.1109/mdat.2023.3313970
Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb
The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.
{"title":"Special Issue on the 2023 International Symposium on Networks-on-Chip (NOCS 2023)","authors":"Mahdi Nikdast, Miquel Moreto, Masoumeh Azin Ebrahimi, Sujay Deb","doi":"10.1109/mdat.2023.3313970","DOIUrl":"https://doi.org/10.1109/mdat.2023.3313970","url":null,"abstract":"The International Symposium on networks-on-chip (NOCS) serves as the premier interdisciplinary meeting for research on NoC architecture, implementation, analysis, optimization, and verification, encompassing various aspects of NoCs for embedded high-performance computing systems, un-core and system-level NoCs, inter/intrachip, and rack-scale networks. Similar to previous years, this event has been held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person conference after virtual and hybrid editions during the pandemic.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"1 4","pages":""},"PeriodicalIF":2.0,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138514382","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-10-20DOI: 10.1109/mdat.2023.3316128
Partha Pratim Pande
The highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the IEEE Design&Test submission system for further processing. This special issue consists of 15 papers.
{"title":"The 2023 Networks-on-Chip (NOCS) Symposium","authors":"Partha Pratim Pande","doi":"10.1109/mdat.2023.3316128","DOIUrl":"https://doi.org/10.1109/mdat.2023.3316128","url":null,"abstract":"<fig orientation=\"portrait\" position=\"float\" xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\"> <graphic orientation=\"portrait\" position=\"float\" xlink:href=\"pande-3316128.tif\"/> </fig>\u0000The highlight of this issue is the journal-first model adopted for the articles accepted in the 17th edition of the Networks-on-Chip (NOCS) Symposium. NOCS is held in conjunction with the Embedded Systems Week (ESWEEK). This year, NOCS was held in Hamburg, Germany, on 21–22 September 2023, marking its return to a fully in-person symposium after virtual and hybrid editions during the pandemic. NOCS is the premier event dedicated to interdisciplinary research on on-chip, package-scale, chip-to-chip, and datacenter rack-scale communication technology as well as architectures, design methods, applications, and systems. NOCS brings together scientists and engineers working on NoC innovations and applications from interdisciplinary research communities and areas, including discrete optimization and algorithms, computer architecture, networking, circuits and systems, packaging, embedded systems, and design automation. We thank the Technical Program Chairs of NOCS 2023, Masoumeh (Azin) Ebrahimi and Sujay Deb, along with the General Chairs Mahdi Nikdast and Miquel Moreto, for the timely delivery of all the accepted NOCS papers to the <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Design&Test</i> submission system for further processing. This special issue consists of 15 papers.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"11 ","pages":""},"PeriodicalIF":2.0,"publicationDate":"2023-10-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138514367","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-10-01DOI: 10.1109/MDAT.2023.3276936
H. Pham, T. Tran, Vu Trung Duong Le, Nakashima Yasuhiko
This article proposes a flexible and scalable BLAKE/BLAKE2 coprocessor aiming for high flexibility, high performance, and low power for blockchain-based IoT applications.
{"title":"Flexible and Scalable BLAKE/BLAKE2 Coprocessor for Blockchain-Based IoT Applications","authors":"H. Pham, T. Tran, Vu Trung Duong Le, Nakashima Yasuhiko","doi":"10.1109/MDAT.2023.3276936","DOIUrl":"https://doi.org/10.1109/MDAT.2023.3276936","url":null,"abstract":"This article proposes a flexible and scalable BLAKE/BLAKE2 coprocessor aiming for high flexibility, high performance, and low power for blockchain-based IoT applications.","PeriodicalId":48917,"journal":{"name":"IEEE Design & Test","volume":"40 1","pages":"15-25"},"PeriodicalIF":2.0,"publicationDate":"2023-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"42990021","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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