Pub Date : 2023-08-27DOI: 10.1007/s13391-023-00451-2
Tae-Gyun Kwon, Younghoon Kim
Conductive paste inks have received considerable attention as facile conductive materials for the formation of electrode layers. However, conventional paste inks result in films with poor surface morphology. In addition, they require a high thermal annealing temperature for achieving high electrical conductivity because of their organic/inorganic composite structure, in which nanosized metal particles and polymeric organic binders are mixed in solvents. In this work, we prepare solvent-free and polymeric-binder-free metal nanoparticle (NP) fluids, which can be used as facile conductive pastes for forming an electrode layer after sintering at a considerably low temperature. We employ thiol-terminated imidazolium-type ionic liquid (IL-SH) molecules with a small molecular weight and fluidic behavior as the surface ligands of Ag NPs. IL-SH-stabilized Ag NPs exhibit fluidic behavior and metallic conducting properties at a considerably low sintering temperature of 250 °C.
{"title":"Conductive Paste Inks Prepared Using Ionic-Liquid-Stabilized Metal Nanoparticle Fluids and their Sintering Effect","authors":"Tae-Gyun Kwon, Younghoon Kim","doi":"10.1007/s13391-023-00451-2","DOIUrl":"10.1007/s13391-023-00451-2","url":null,"abstract":"<div><p>Conductive paste inks have received considerable attention as facile conductive materials for the formation of electrode layers. However, conventional paste inks result in films with poor surface morphology. In addition, they require a high thermal annealing temperature for achieving high electrical conductivity because of their organic/inorganic composite structure, in which nanosized metal particles and polymeric organic binders are mixed in solvents. In this work, we prepare solvent-free and polymeric-binder-free metal nanoparticle (NP) fluids, which can be used as facile conductive pastes for forming an electrode layer after sintering at a considerably low temperature. We employ thiol-terminated imidazolium-type ionic liquid (IL-SH) molecules with a small molecular weight and fluidic behavior as the surface ligands of Ag NPs. IL-SH-stabilized Ag NPs exhibit fluidic behavior and metallic conducting properties at a considerably low sintering temperature of 250 °C.</p><h3>Graphical Abstract</h3><div><figure><div><div><picture><source><img></source></picture></div></div></figure></div></div>","PeriodicalId":536,"journal":{"name":"Electronic Materials Letters","volume":"20 3","pages":"337 - 344"},"PeriodicalIF":2.1,"publicationDate":"2023-08-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"44583471","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-08-24DOI: 10.1007/s13391-023-00453-0
Eunyeong Yang, Seoin Kang, Sanghyun Jeong, Kihyun Shin, Jung-Sub Wi, Joon Sik Park, Sangyeob Lee, Choong-Heui Chung
Mechanically flexible transparent conductive electrodes (TCEs) with high optoelectronic performance are essential for flexible or wearable optoelectronic devices, which are currently receiving a considerable amount of attention. In this study, we investigate the structural, electrical, optical and mechanical properties of electrodeposited hierarchical silver network TCEs consisting of two layers of silver nanowires (AgNWs) and a silver micromesh. Hierarchical structures are known to improve the optoelectronic properties of network-type TCEs. To fabricate an electrodeposited hierarchical network, a AgNW solution is first spun onto a substrate to form randomly distributed AgNWs, and a silver micromesh is then formed on the AgNWs. Subsequently, silver is electrodeposited onto the hierarchical network. As a result of the electrodeposition, AgNW-AgNW and AgNW-silver micromesh contacts are effectively welded, and the dimensions of the AgNWs and the silver micromesh are optimized to maximize the figure of merit of the TCE. Furthermore, the electrodeposited hierarchical silver network shows excellent mechanical flexibility and much less degradation of its sheet resistance than that experienced by ITO upon repeated convex and concave bending. Its resulting optoelectronic and mechanically flexible performance is superior to that of commercialized ITO.