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RADECS 97. Fourth European Conference on Radiation and its Effects on Components and Systems (Cat. No.97TH8294)最新文献

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Digital circuit susceptibility characterization to RF and microwave disturbances 数字电路对射频和微波干扰的敏感性表征
O. Maurice, J. Pigneret
The functional susceptibility of electronic circuits to radio-radar-type bursts is controlled by two factors: the energy coupling and propagation on interconnecting elements, cables and PCB's tracks on one hand, the intrinsic susceptibility of ICs, on the other hand. This paper addresses the problem of the upset threshold measurement in modern digital circuits stressed by conducted out-of-band signals. The results establish and quantify the variability associated with the injection circuit, the packaging and its interface with the PCB, the excitation shape and its position in the functional time sequence. An optimized characterization method is proposed to collect reproducible and useful data.
电子电路对无线电雷达型突发的功能易感性受两个因素的控制:一方面是能量在互连元件、电缆和PCB履带上的耦合和传播,另一方面是集成电路的固有易感性。本文研究了现代数字电路在带外传导信号作用下的扰动阈值测量问题。结果建立并量化了与注射电路、封装及其与PCB的接口、激励形状及其在功能时间序列中的位置相关的可变性。提出了一种优化的表征方法,以收集可重复性和有用的数据。
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引用次数: 5
Ionizing dose hardness assurance methodology for qualification of a BiCMOS technology dedicated to high dose level applications 用于高剂量应用的BiCMOS技术鉴定的电离剂量硬度保证方法
O. Flament, O. Musseau, J. Leray, E. Dutisseuil, T. Corbiere
This work concerns the development of a radiation hardness assurance methodology specially devoted to CMOS, JFET and bipolar transistors used in high total dose level environments. On the basis of recent studies, high temperature, high dose rate irradiations were performed. We propose a test procedure which combines high temperature irradiations and isochronal anneals for the qualification.
这项工作涉及开发一种辐射硬度保证方法,专门用于高总剂量水平环境中使用的CMOS, JFET和双极晶体管。在最近研究的基础上,进行了高温、高剂量率辐照。我们提出了一种结合高温辐照和等时退火的测试方法。
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引用次数: 7
Radiation hardness of pseudomorphic HEMT and dual-gate GaAs MES-FET MMICs 伪晶HEMT和双栅GaAs MES-FET mmic的辐射硬度
K. Matsuzaki, N. Nemoto, E. Nakamura, T. Akutsu, S. Matsuda, K. Yajima, H. Sasaki, M. Komaru, T. Katoh, T. Kashiwa, T. Asano, K. Mizuguchi
The effects of Co-60 /spl gamma/-ray irradiation under DC operation for two types of monolithic microwave integrated circuits (MMICs), Pseudomorphic HEMT (PHEMT) and Dual-Gate GaAs MES-FET, were investigated. These two types of MMICs have an excellent radiation hardness exceeding 10/sup 7/ rad(Si). We considered that degradation mechanisms of P-HEMT and MES-FET were the decrease of two dimensional electron gas (2DEG) carrier density and increase of electron traps near the Schottky gate electrode.
研究了Co-60 /spl γ射线辐照对两种单片微波集成电路(mmic)伪晶HEMT (PHEMT)和双栅GaAs MES-FET的影响。这两种类型的mmic具有优异的辐射硬度,超过10/sup / rad(Si)。我们认为P-HEMT和MES-FET的降解机制是二维电子气体(2DEG)载流子密度的降低和肖特基栅电极附近电子陷阱的增加。
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引用次数: 6
Radiation response of MOSFET's parameters as a function of measurement temperature MOSFET参数的辐射响应随测量温度的变化
V. Belyakov, G. Zebrev, I. N. Shvetzov-Shilovsky, R. G. Useinov
The postirradiation response of the MOSFET's transconductance and logarithmic slope has been studied as a function of measurement temperatures. It is found that the temperature dependence of the postirradiation change in transconductance cannot be accounted for by the occurrence of additional scattering centers. These results suggest that mainly an additional recharging through the radiation-induced interface traps rather than a change in microscopic mobility determine the postirradiation variation of transconductance. An analysis of the effect and a convenient procedure for parameter extraction are presented.
研究了MOSFET的跨导和对数斜率的辐射后响应与测量温度的关系。研究发现,辐射后跨导变化的温度依赖性不能用附加散射中心的出现来解释。这些结果表明,主要是通过辐射诱导的界面阱的额外充电而不是微观迁移率的变化决定了辐射后跨电导的变化。分析了影响因素,提出了一种方便的参数提取方法。
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引用次数: 0
Comparison of elementary bipolar transistor degradations: Dose rate and combined experimental parameters effects 基本双极晶体管退化的比较:剂量率和组合实验参数的影响
L. Bonora, J. David, M. Calvet, R. Ecoffet, C. Barillot, P. Calvel
In this paper, are investigated the influences of experimental parameters such as dose rate, irradiation temperature and base-emitter bias upon the degradation of elementary NPN and lateral PNP transistors. Very low dose rate results (3 mrad(Si)/s) are included and compared with several sets of experimental conditions for high dose rate irradiations. A specific configuration, combining an elevated temperature and a moderate reverse bias applied to the emitter-base junction, was found to be reasonably consistent with the room-temperature, low dose-rate response.
本文研究了剂量率、辐照温度、基极偏置等实验参数对基本NPN和横向PNP晶体管退化的影响。包括极低剂量率结果(3mrad (Si)/s),并与高剂量率辐照的几组实验条件进行比较。一种特殊的结构,结合了升高的温度和适度的反向偏置,应用于发射极-基极结,被发现与室温下的低剂量率响应相当一致。
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引用次数: 2
Stability of mechanical properties of silica based optical fibres under /spl gamma/-radiation /spl γ /-辐射下二氧化硅基光纤力学性能的稳定性
S. Semjonov, M. Bubnov, N.B. Kurinov, A.G. Schebuniaev
Silica fibres protected by different coatings were tested under /spl gamma/-irradiation (1.7 MGy (Si)). In contrast to the previous works the samples were irradiated both in air and in distilled water to observe whether there is a combined effect of /spl gamma/-rays and water. New types of protective coatings-namely, hermetic metal coatings (Al and Sn) were tested for the first time. A set of coatings which might be used under /spl gamma/-irradiation in combination with other possible harsh factors was characterised.
在/spl γ /-辐射(1.7 MGy (Si))下测试了不同涂层保护的二氧化硅纤维。与以前的工作不同,样品在空气和蒸馏水中辐照,以观察是否有/spl伽马射线和水的联合效应。新型保护涂层——即密封金属涂层(Al和Sn)首次进行了测试。在/spl γ /-辐照和其他可能的恶劣因素的联合作用下,对一组可能使用的涂层进行了表征。
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引用次数: 2
Effects of irradiation temperature on MOS radiation response 辐照温度对MOS辐射响应的影响
M. Shaneyfelt, J. Schwank, D. Fleetwood, P. Winokur
Effects of irradiation and annealing temperature on radiation-induced charge trapping are explored for MOS transistors. Transistors were irradiated with 10-keV x rays at temperatures from -25 to 100/spl deg/C and annealed at 100/spl deg/C for times up to 3.6/spl times/10/sup 6/ s. Transistor data were analyzed for the contributions of radiation-induced charge due to oxide traps, border traps, and interface traps. Increased irradiation temperature resulted in increased interface-trap and border-trap buildup and decreased oxide-trapped charge buildup during irradiation. Interface-trap buildup immediately following irradiation for transistors irradiated at 100/spl deg/C was equivalent to the buildup of interface traps in transistors irradiated at 27/spl deg/C and annealed for one week at 100/spl deg/C (standard rebound test). For the p-channel transistors, a one-to-one correlation was observed between the increase in interface-trap charge and the decrease in oxide-trapped charge during irradiation. This may imply a link between increased interface-trap buildup and the annealing of oxide-trapped charge in these devices. The observed data can be explained in terms of increased hydrogen ion transport rates to the Si/SiO/sub 2/ interface during elevated temperature irradiations. These results have implications on hardness assurance testing and potentially may be used to reduce costs associated with rebound qualification.
探讨了辐照和退火温度对MOS晶体管辐射诱导电荷俘获的影响。用10 kev x射线在-25 ~ 100/spl℃的温度下照射晶体管,并在100/spl℃的温度下退火3.6/spl次/10/sup 6/s。对晶体管数据进行了氧化陷阱、边界陷阱和界面陷阱对辐射诱导电荷的贡献分析。随着辐照温度的升高,界面陷阱和边界陷阱的积累增加,氧化陷阱电荷的积累减少。在100/spl度/C下辐照的晶体管在辐照后立即形成的界面陷阱相当于在27/spl度/C下辐照并在100/spl度/C下退火一周的晶体管的界面陷阱的形成(标准回弹试验)。对于p沟道晶体管,在辐照过程中,界面陷阱电荷的增加与氧化物陷阱电荷的减少呈一对一的相关关系。这可能意味着在这些器件中增加的界面陷阱积累和氧化捕获电荷的退火之间存在联系。观测到的数据可以解释为在高温辐照过程中氢离子向Si/SiO/sub - 2/界面的输运速率增加。这些结果对硬度保证测试具有重要意义,并可能用于降低与回弹鉴定相关的成本。
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引用次数: 43
Calculation of fast neutron dose in plastic-coated optical fibres 塑料包覆光纤快中子剂量的计算
B. Siebert, H. Henschel
The dose of fast neutrons in optical fibres with hydrogen-containing coating materials is considerably increased by energetic recoil protons. Their contribution to the dose in a SiO/sub 2/ fibre core is calculated by the Monte Carlo method for different fibre geometries and a fibre optic cable. With 14 MeV neutrons the dose in a single fibre is increased by about 21%, whereas in fibre bundles the dose increase can reach about 170%. Maximum dose enhancement in fibre bundles (about 610%) occurs at neutron energies around 5.5 MeV. The dose increase caused by 14 MeV neutrons in the fibre of a typical laboratory cable is about 124%.
高能反冲质子大大增加了含氢涂层光纤中快中子的剂量。它们对SiO/sub - 2/光纤芯中剂量的贡献是用蒙特卡罗方法计算不同光纤几何形状和光纤电缆的。对于14兆电子伏的中子,单个纤维中的剂量增加约21%,而在纤维束中,剂量增加可达到约170%。纤维束的最大剂量增强(约610%)发生在中子能量约5.5 MeV时。在典型的实验室电缆中,14mev中子引起的剂量增加约为124%。
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引用次数: 10
Charge-enhancement mechanisms of GaAs field-effect transistors: experiment and simulation 砷化镓场效应晶体管的电荷增强机制:实验与模拟
D. McMorrow, J. Melinger, A. Knudson, S. Buchner, L. Tran, A. Campbell, W. Curtice
The charge-collection processes of GaAs field-effect transistors are investigated as a function of the incident laser pulse energy via time-resolved charge-collection measurements and by two-dimensional computer simulation. The measurements and simulations reveal a feature that persists on a time scale of 100 ps, the amplitude of which varies strongly with the injected carrier density (pulse energy). The appearance of this feature is associated with a barrier lowering effect at the source/substrate junction, coupled with the drift-assisted transport of electrons through the substrate to the drain contact. This behavior is similar, but not identical to bipolar-gain models that have been suggested previously. We introduce the concept of ion-track segments and illustrate their utility in interrogating the complex mechanisms of charge collection and enhancement in GaAs FETs.
通过时间分辨电荷收集测量和二维计算机模拟,研究了砷化镓场效应晶体管的电荷收集过程与入射激光脉冲能量的关系。测量和模拟揭示了在100ps的时间尺度上持续存在的特征,其振幅随注入的载流子密度(脉冲能量)而强烈变化。这种特性的出现与源/衬底结的势垒降低效应有关,与电子通过衬底到漏极接触的漂移辅助传输有关。这种行为与先前提出的双极增益模型相似,但不完全相同。我们介绍了离子轨道段的概念,并说明了它们在研究GaAs场效应管中电荷收集和增强的复杂机制中的作用。
{"title":"Charge-enhancement mechanisms of GaAs field-effect transistors: experiment and simulation","authors":"D. McMorrow, J. Melinger, A. Knudson, S. Buchner, L. Tran, A. Campbell, W. Curtice","doi":"10.1109/RADECS.1997.698932","DOIUrl":"https://doi.org/10.1109/RADECS.1997.698932","url":null,"abstract":"The charge-collection processes of GaAs field-effect transistors are investigated as a function of the incident laser pulse energy via time-resolved charge-collection measurements and by two-dimensional computer simulation. The measurements and simulations reveal a feature that persists on a time scale of 100 ps, the amplitude of which varies strongly with the injected carrier density (pulse energy). The appearance of this feature is associated with a barrier lowering effect at the source/substrate junction, coupled with the drift-assisted transport of electrons through the substrate to the drain contact. This behavior is similar, but not identical to bipolar-gain models that have been suggested previously. We introduce the concept of ion-track segments and illustrate their utility in interrogating the complex mechanisms of charge collection and enhancement in GaAs FETs.","PeriodicalId":106774,"journal":{"name":"RADECS 97. Fourth European Conference on Radiation and its Effects on Components and Systems (Cat. No.97TH8294)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133999546","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 23
Design issues for a radiation-tolerant digital-to-analog converter in a commercial 2.0-/spl mu/m BiCMOS process 商业2.0-/spl mu/m BiCMOS工艺中耐辐射数模转换器的设计问题
J. Ahn, W. T. Holman, peixiong zhao, K. Galloway, D. A. Bryant, P. Calvel, M. Calvet
This paper introduces a methodology for using standard commercial processes to design analog integrated circuits that can tolerate the adverse effects of ionizing radiation. First, several devices of various types and sizes were exposed to ionizing radiation and characterized under worst-case biasing conditions with dose rates and maximum total doses as stipulated in circuit specifications. Second, a determination was made as to what types of devices and circuit topologies were best suited for a desired application, given worst-case component parameters. Finally, taking into account the circuit specifications and the expected shifts in device performance, the circuit was designed, simulated, fabricated, and tested. This paper focuses on the design example of a radiation-tolerant 6-bit R-2R ladder digital-to-analog converter (DAC) in a commercial 2.0-/spl mu/m BiCMOS process.
本文介绍了一种使用标准商业流程来设计能够承受电离辐射不利影响的模拟集成电路的方法。首先,将几种不同类型和尺寸的器件暴露在电离辐射下,并在电路规范中规定的剂量率和最大总剂量的最坏偏置条件下进行了表征。其次,在给定最坏情况下的元件参数,确定哪种类型的器件和电路拓扑最适合所需的应用。最后,考虑电路规格和器件性能的预期变化,对电路进行了设计、模拟、制造和测试。本文重点介绍了商用2.0-/spl mu/m BiCMOS工艺中耐辐射6位R-2R梯形数模转换器(DAC)的设计实例。
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引用次数: 3
期刊
RADECS 97. Fourth European Conference on Radiation and its Effects on Components and Systems (Cat. No.97TH8294)
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