Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765833
S. Tesarski, A. Wymyslowski, O. Holck
Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.
{"title":"Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results","authors":"S. Tesarski, A. Wymyslowski, O. Holck","doi":"10.1109/ESIME.2011.5765833","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765833","url":null,"abstract":"Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114759775","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765827
S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter
The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.
{"title":"The creep behaviour and microstructure of ultra small solder joints","authors":"S. Wiese, M. Mueller, I. Panchenko, R. Metasch, K. Wolter","doi":"10.1109/ESIME.2011.5765827","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765827","url":null,"abstract":"The creep behavior of Sn-based solders undergoes a significant scaling effect. Therefore this paper compares creep data that was gained on bulky samples and on small solder joints. Optical microscopy techniques and SEM-microprobe analysis were used to examine the microstructural properties of the bulk specimens and real solder joints were after metallographic sectioning. The results of these microstructural analysis were related to the investigated mechanical properties of the solders.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"28 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129725398","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765824
Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, D. Edwards
Absorption and desorption tests were conducted on five distinct commercial epoxy mold compounds (EMCs) used in electronic packaging. For absorption, the samples were subjected to 85°C /85% relative humidity and 60°C /85% relative humidity soaking. Desorption conditions were above glass transition temperature at 140°C and 160°C. A dual stage model is developed in this paper for both absorption and desorption processes. Both stages in moisture absorption and desorption, i.e., Fickian diffusion and relaxation process, are described mathematically using a combination of Fickian terms. The models generated reasonable results for the diffusive properties and displayed outstanding experimental fits. All five compounds have shown strong non-Fickian diffusion behaviors, which were further demonstrated by experiments with different thicknesses. For absorption, results show Fickian diffusion is significantly faster than non-Fickian diffusion. Saturated moisture concentration associated with Fickian-stage diffusion is independent of temperature if it is below glass transition temperature. Sample thickness played a major role in diffusive behavior in the second stage where non-Fickian diffusion occurs. For desorption, higher temperature corresponds to less percentage of the permanent residual moisture content. At 160°C, 90% of the initial moisture for all samples could be diffused out within 24 hours, following a modified Fickian diffusion process. The dual stage model developed in this paper provides a foundation for modeling anomalous moisture diffusion behavior using commercial finite elemental method software.
{"title":"A dual stage model of anomalous moisture diffusion and desorption in epoxy mold compounds","authors":"Mark D. Placette, Xuejun Fan, Jie-Hua Zhao, D. Edwards","doi":"10.1109/ESIME.2011.5765824","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765824","url":null,"abstract":"Absorption and desorption tests were conducted on five distinct commercial epoxy mold compounds (EMCs) used in electronic packaging. For absorption, the samples were subjected to 85°C /85% relative humidity and 60°C /85% relative humidity soaking. Desorption conditions were above glass transition temperature at 140°C and 160°C. A dual stage model is developed in this paper for both absorption and desorption processes. Both stages in moisture absorption and desorption, i.e., Fickian diffusion and relaxation process, are described mathematically using a combination of Fickian terms. The models generated reasonable results for the diffusive properties and displayed outstanding experimental fits. All five compounds have shown strong non-Fickian diffusion behaviors, which were further demonstrated by experiments with different thicknesses. For absorption, results show Fickian diffusion is significantly faster than non-Fickian diffusion. Saturated moisture concentration associated with Fickian-stage diffusion is independent of temperature if it is below glass transition temperature. Sample thickness played a major role in diffusive behavior in the second stage where non-Fickian diffusion occurs. For desorption, higher temperature corresponds to less percentage of the permanent residual moisture content. At 160°C, 90% of the initial moisture for all samples could be diffused out within 24 hours, following a modified Fickian diffusion process. The dual stage model developed in this paper provides a foundation for modeling anomalous moisture diffusion behavior using commercial finite elemental method software.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129853408","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765756
T. Bechtold, E. Rudnyi, D. Hohlfeld
In this paper we demonstrate a system-level simulation of a temperature controlled microsystem which is based on a reduced order model of a micro hotplate. Together with the electro-thermal microstructure we have implemented a control scheme, which allows the hotplate to operate either at a defined setpoint independent of ambient temperature or to follow defined temperature sweeps. An optimization algorithm was employed to identify suitable parameters for a PI-controller.
{"title":"System-level model of electrothermal microsystem with temperature control circuit","authors":"T. Bechtold, E. Rudnyi, D. Hohlfeld","doi":"10.1109/ESIME.2011.5765756","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765756","url":null,"abstract":"In this paper we demonstrate a system-level simulation of a temperature controlled microsystem which is based on a reduced order model of a micro hotplate. Together with the electro-thermal microstructure we have implemented a control scheme, which allows the hotplate to operate either at a defined setpoint independent of ambient temperature or to follow defined temperature sweeps. An optimization algorithm was employed to identify suitable parameters for a PI-controller.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129372451","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765837
H. Fridhi, G. Duchamp, V. Vigneras
This paper deals with the influence of humidity and temperature stresses on a microstrip line. These aging factors induce degradation on the dielectric and geometric properties. So the aim of this study is the evaluation of the influence of such variations on the radiated emission of a microstrip line using electromagnetic simulator. Due to the difficulty to interpret and analyze the results because of the correlation between the parameters, we have established a Design Of Experiments (DOE) to optimize the simulation procedure. The result coupled to ANOVA method gives better knowledge on the influence's factors. The study's conclusions lead to simplify the experiment's tests.
{"title":"Simulation of aging effects on radiated emission of microstrip line","authors":"H. Fridhi, G. Duchamp, V. Vigneras","doi":"10.1109/ESIME.2011.5765837","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765837","url":null,"abstract":"This paper deals with the influence of humidity and temperature stresses on a microstrip line. These aging factors induce degradation on the dielectric and geometric properties. So the aim of this study is the evaluation of the influence of such variations on the radiated emission of a microstrip line using electromagnetic simulator. Due to the difficulty to interpret and analyze the results because of the correlation between the parameters, we have established a Design Of Experiments (DOE) to optimize the simulation procedure. The result coupled to ANOVA method gives better knowledge on the influence's factors. The study's conclusions lead to simplify the experiment's tests.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129678924","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765772
K. Brinkfeldt, R. Amen, E. Adolfsson, P. Tegehall, P. Johander, D. Andersson
In order to place sensors or electronics in very high temperature environments, new materials and methods for interconnection are required. A comparative study between different electrical interconnection methods for very high operation temperatures (500 °C – 800 °C) is presented. Thermo-mechanical simulations and characterization of samples of the interconnection types during high temperature exposure are presented. The results of the thermo-mechanical simulations showed that stresses are low in a connection system based on liquid interconnection. This system, however, proved to be difficult to realize due to problems with oxides and sealing of the metallic liquid. Modeling of an interconnection based purely on mechanical pressure without any solder or metallic bond showed high stress. This was also confirmed during high temperature exposure where the connection failed. High stress was also predicted for an interconnection based on nano-Ag paste. The high temperature tests, however, showed promising results at 800 °C for over 100 hours.
{"title":"Thermo-mechanical simulations and measurements on high temperature interconnections","authors":"K. Brinkfeldt, R. Amen, E. Adolfsson, P. Tegehall, P. Johander, D. Andersson","doi":"10.1109/ESIME.2011.5765772","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765772","url":null,"abstract":"In order to place sensors or electronics in very high temperature environments, new materials and methods for interconnection are required. A comparative study between different electrical interconnection methods for very high operation temperatures (500 °C – 800 °C) is presented. Thermo-mechanical simulations and characterization of samples of the interconnection types during high temperature exposure are presented. The results of the thermo-mechanical simulations showed that stresses are low in a connection system based on liquid interconnection. This system, however, proved to be difficult to realize due to problems with oxides and sealing of the metallic liquid. Modeling of an interconnection based purely on mechanical pressure without any solder or metallic bond showed high stress. This was also confirmed during high temperature exposure where the connection failed. High stress was also predicted for an interconnection based on nano-Ag paste. The high temperature tests, however, showed promising results at 800 °C for over 100 hours.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130028852","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765771
W. Kanert, R. Pufall, O. Wittler, R. Dudek, M. Bouazza
Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads [1, 2]. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model has to go beyond a simple Coffin-Manson type model to capture the essential influencing parameters.
{"title":"Modelling of metal degradation in power devices under active cycling conditions","authors":"W. Kanert, R. Pufall, O. Wittler, R. Dudek, M. Bouazza","doi":"10.1109/ESIME.2011.5765771","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765771","url":null,"abstract":"Metal degradation has recently received increased attention as a failure mechanism in power devices under active cycling conditions, i.e. under repeated pulsed voltage/current loads [1, 2]. Both electro-thermal and thermo-mechanical simulation are indispensable for understanding this mechanisms. The paper presents experimental and simulation data for a dedicated test structure. A suitable lifetime model has to go beyond a simple Coffin-Manson type model to capture the essential influencing parameters.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127846958","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765773
A. Menk, C. Pearce, O. Lanier, R. Simpson, S. Bordas
Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.
{"title":"Lifetime prediction for solder joints with the extended finite element method","authors":"A. Menk, C. Pearce, O. Lanier, R. Simpson, S. Bordas","doi":"10.1109/ESIME.2011.5765773","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765773","url":null,"abstract":"Predicting the lifetime of solder joints undergoing thermal cycling is crucial for the electronics industry in order to guarantee a certain performance of their products in the field. Semi-empirical methods are often used to predict the average lifetime of the critical joints. However, to get a reliable failure probability the standard deviation must also be addressed. The deviation of the lifetime from the mean value is a consequence of the variation in microstructure found in actual joints. We therefore propose a new methodology that calculates crack growth based on microstructural features of the joint. A series of random microstructures is generated. Crack growth calculations are performed for each of these structures. The structural problem is solved numerically with the extended finite element method which allows a complete automation of the process. The mean crack length and standard deviation are calculated from the crack growth simulations and the result is compared to experimental data.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"325 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122215487","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765826
V. Kolchuzhin, M. Naumann, J. Mehner
The paper is focused on advanced reduced order modeling (ROM) methods for MEMS using mode superposition technique and finite element solvers for data extraction for the governing equations. Dynamically accurate behavior representations can be achieved for microstructures with flexible components and their most important interactions with thermal, electrostatic and fluid fields. Results are macromodel based on analytical terms which can be transferred to electronic and system simulators for virtual prototyping and device analyses.
{"title":"Recent developments in reduced order modeling based on mode superposition technique","authors":"V. Kolchuzhin, M. Naumann, J. Mehner","doi":"10.1109/ESIME.2011.5765826","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765826","url":null,"abstract":"The paper is focused on advanced reduced order modeling (ROM) methods for MEMS using mode superposition technique and finite element solvers for data extraction for the governing equations. Dynamically accurate behavior representations can be achieved for microstructures with flexible components and their most important interactions with thermal, electrostatic and fluid fields. Results are macromodel based on analytical terms which can be transferred to electronic and system simulators for virtual prototyping and device analyses.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"81 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116229521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765846
A. Ivankovic, Kris Vanstreels, Yung-Yu Hsu, Mireia Bargallo Gonzalez, G. Brizar, D. Vanderstraeten, E. Blansaer, Renaud Gillon, M. Defloor, K. Vandaele, D. Degryse, B. Vandevelde
This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature of 175°C, or sometimes even 200°C. At these high temperatures, it can be expected that the overmould material and its interfaces degrade. In order to select the right overmould materials, ageing tests have been performed on different commercially available materials. Static bending experiments are used to measure the elastic modulus, the ultimate strength and the interface strength. The impact of the materials properties changed by thermal ageing, are implemented in Finite Element Models. For a particular package, the study shows after how many hours of ageing, the stresses can lead to overmould cracking.
{"title":"Impact of thermal ageing on cohesive and adhesive strengths of overmould materials: Characterisation methods and implementation in FEM","authors":"A. Ivankovic, Kris Vanstreels, Yung-Yu Hsu, Mireia Bargallo Gonzalez, G. Brizar, D. Vanderstraeten, E. Blansaer, Renaud Gillon, M. Defloor, K. Vandaele, D. Degryse, B. Vandevelde","doi":"10.1109/ESIME.2011.5765846","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765846","url":null,"abstract":"This paper reports the impact of ageing on the cohesive and adhesive strength of overmould materials used in electronic packages. For so-called harsh environment applications, the overmoulded package operates in an ambient at a continuous temperature of 175°C, or sometimes even 200°C. At these high temperatures, it can be expected that the overmould material and its interfaces degrade. In order to select the right overmould materials, ageing tests have been performed on different commercially available materials. Static bending experiments are used to measure the elastic modulus, the ultimate strength and the interface strength. The impact of the materials properties changed by thermal ageing, are implemented in Finite Element Models. For a particular package, the study shows after how many hours of ageing, the stresses can lead to overmould cracking.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"183 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121057534","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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