Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765800
J. Lo, Rong Zhang, S. W. Ricky, Zelin Wang, Hong Kong
In the fabrication of system-in-package (SiP) devices, wafer bonding is a common yet very important process. The technologies widely used nowadays for wafer bonding include direct wafer bonding and intermediate layer bonding. Fusion bonding, one of the direct wafer bonding techniques, requires a processing temperature up to 800–1000°C to create strong covalent bonds between wafers. Some devices, however, cannot withstand such high temperature. Also, the stress generated due to different coefficients of thermal expansion is directly associated with the bonding temperature. Therefore, a low temperature wafer bonding technique is in demand. In this study, an innovative adhesive bonding method is proposed. Patterned trenches are fabricated on one side of the wafer and completely filled with silicone adhesive. The proposed wafer bonding method has several advantages over the traditional adhesive boning method. The trenches provide air escape paths. It also enchances the adhesion strength of the bonded wafers. Test vehicles are fabricated to demonstrate the proposed wafer bonding method with trenches. Shear tests are conducted to measure the mechanical performance of the proposed method. Results show that, when the sample is sheared perpendicularly to the trenches, the shear strength of the sample is 25% higher than that of the sample without trenches.
{"title":"Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches","authors":"J. Lo, Rong Zhang, S. W. Ricky, Zelin Wang, Hong Kong","doi":"10.1109/ESIME.2011.5765800","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765800","url":null,"abstract":"In the fabrication of system-in-package (SiP) devices, wafer bonding is a common yet very important process. The technologies widely used nowadays for wafer bonding include direct wafer bonding and intermediate layer bonding. Fusion bonding, one of the direct wafer bonding techniques, requires a processing temperature up to 800–1000°C to create strong covalent bonds between wafers. Some devices, however, cannot withstand such high temperature. Also, the stress generated due to different coefficients of thermal expansion is directly associated with the bonding temperature. Therefore, a low temperature wafer bonding technique is in demand. In this study, an innovative adhesive bonding method is proposed. Patterned trenches are fabricated on one side of the wafer and completely filled with silicone adhesive. The proposed wafer bonding method has several advantages over the traditional adhesive boning method. The trenches provide air escape paths. It also enchances the adhesion strength of the bonded wafers. Test vehicles are fabricated to demonstrate the proposed wafer bonding method with trenches. Shear tests are conducted to measure the mechanical performance of the proposed method. Results show that, when the sample is sheared perpendicularly to the trenches, the shear strength of the sample is 25% higher than that of the sample without trenches.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"54 6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130313192","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765851
J. Zaal, F. Santagata, W. V. van Driel, G.Q. Zhang, J. Creemer, P. Sarro
An increasing number of semiconductor companies have research programs related to MEMS products. This can be explained by the wide variety of application areas for MEMS, some mechanical MEMS examples are: filters [1], oscillators [2,3], pressure sensors [4], particle detection [5], thermometers [6] and gyroscopes [7].
{"title":"Co-design of Wafer Level Thin Film Package assembly","authors":"J. Zaal, F. Santagata, W. V. van Driel, G.Q. Zhang, J. Creemer, P. Sarro","doi":"10.1109/ESIME.2011.5765851","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765851","url":null,"abstract":"An increasing number of semiconductor companies have research programs related to MEMS products. This can be explained by the wide variety of application areas for MEMS, some mechanical MEMS examples are: filters [1], oscillators [2,3], pressure sensors [4], particle detection [5], thermometers [6] and gyroscopes [7].","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123449235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765857
M. Jungwirth, D. Hofinger, H. Weinzierl
In mechatronic systems basically electromagnetical-, thermal-, mechanical- or fluid -effects and their interactions occur. For the efficient optimal design of those systems it's essential to take into account those effects. This leads to a reduced number of prototypes and shortens the time to market.
{"title":"Simulation based design of mechatronic systems","authors":"M. Jungwirth, D. Hofinger, H. Weinzierl","doi":"10.1109/ESIME.2011.5765857","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765857","url":null,"abstract":"In mechatronic systems basically electromagnetical-, thermal-, mechanical- or fluid -effects and their interactions occur. For the efficient optimal design of those systems it's essential to take into account those effects. This leads to a reduced number of prototypes and shortens the time to market.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124666974","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765767
M. Pustan, S. Paquay, V. Rochus, J. Golinval
The influence of the lower electrode positions on the dynamic response of polysilicon MEMS resonators is studied and presented in this paper. The change in the frequency response of investigated MEMS resonators as function of the lower electrode positions is measured using a vibrometer analyzer. The decrease in the amplitude and velocity of oscillations if the lower electrode is moved from the beam free-end toward to the beam anchor is experimental monitored. The measurements are performed in ambient conditions in order to characterize the forced-response Q-factor of samples. A decrease of the Q- factor if the lower electrode is moved toward to the beam anchor is experimental determined. Different responses of MEMS resonators may be obtained if the position of the lower electrode is modified. Indeed the resonator stiffness, velocity and amplitude of oscillations are changed.
{"title":"Effects of the electrode positions on the dynamical behaviour of electrostatically actuated MEMS resonators","authors":"M. Pustan, S. Paquay, V. Rochus, J. Golinval","doi":"10.1109/ESIME.2011.5765767","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765767","url":null,"abstract":"The influence of the lower electrode positions on the dynamic response of polysilicon MEMS resonators is studied and presented in this paper. The change in the frequency response of investigated MEMS resonators as function of the lower electrode positions is measured using a vibrometer analyzer. The decrease in the amplitude and velocity of oscillations if the lower electrode is moved from the beam free-end toward to the beam anchor is experimental monitored. The measurements are performed in ambient conditions in order to characterize the forced-response Q-factor of samples. A decrease of the Q- factor if the lower electrode is moved toward to the beam anchor is experimental determined. Different responses of MEMS resonators may be obtained if the position of the lower electrode is modified. Indeed the resonator stiffness, velocity and amplitude of oscillations are changed.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"82 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124670514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765781
M. Guyenot, E. Peter, P. Zerrer, F. Kraemer, S. Wiese
Photovoltaic modules as well as automotive electronics are both designed to perform more than 20 years in the field. They show many similarities, for example the material combinations (Silicon, copper, lead free interconnection), the field loads, qualification tests, etc.
{"title":"Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience","authors":"M. Guyenot, E. Peter, P. Zerrer, F. Kraemer, S. Wiese","doi":"10.1109/ESIME.2011.5765781","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765781","url":null,"abstract":"Photovoltaic modules as well as automotive electronics are both designed to perform more than 20 years in the field. They show many similarities, for example the material combinations (Silicon, copper, lead free interconnection), the field loads, qualification tests, etc.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129827849","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765856
M. Kaltenbacher, H. Kock
The design of modern sensors, actuators as well as sensor-actuators systems, which are often Micro-Electro-Mechanical Systems (MEMS), strongly depends on the availability of appropriate computer aided engineering (CAE) tools, since the fabrication of each prototype is quite costly. We preset such a CAE tool, which solves the underlying system of partial di#erential equations (PDEs) by the Finite Element (FE) method. As a practical example we present investigations for a capacitive micromachined ultrasound transducers (CMUTs) as used for ultrasound imaging. Furthermore, we discuss a homogenization approach for the integrated power electronic structures on such a MEMS transducer to allow for a thermal simulation of the whole device.
{"title":"Simulation environment for MEMS sensors and actuators","authors":"M. Kaltenbacher, H. Kock","doi":"10.1109/ESIME.2011.5765856","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765856","url":null,"abstract":"The design of modern sensors, actuators as well as sensor-actuators systems, which are often Micro-Electro-Mechanical Systems (MEMS), strongly depends on the availability of appropriate computer aided engineering (CAE) tools, since the fabrication of each prototype is quite costly. We preset such a CAE tool, which solves the underlying system of partial di#erential equations (PDEs) by the Finite Element (FE) method. As a practical example we present investigations for a capacitive micromachined ultrasound transducers (CMUTs) as used for ultrasound imaging. Furthermore, we discuss a homogenization approach for the integrated power electronic structures on such a MEMS transducer to allow for a thermal simulation of the whole device.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130353334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765806
Jianghai Gu, L. Liang, Y. Liu
A substructural method is developed to simulate the strip level warpage of a power module in assembly process. The comparison between substructure and non-substructure methods is presented and discussed. Parametric design of experimental (DoE) study on low side (LS) and high side (HS) die thickness, epoxy mold compound (EMC) thicknenss, as well the Young's modulus Ez of prepreg and Young's modulus of EMC is conducted in the simulation.
{"title":"A substructure method for strip level warpage simulation of a power module in assembly process","authors":"Jianghai Gu, L. Liang, Y. Liu","doi":"10.1109/ESIME.2011.5765806","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765806","url":null,"abstract":"A substructural method is developed to simulate the strip level warpage of a power module in assembly process. The comparison between substructure and non-substructure methods is presented and discussed. Parametric design of experimental (DoE) study on low side (LS) and high side (HS) die thickness, epoxy mold compound (EMC) thicknenss, as well the Young's modulus Ez of prepreg and Young's modulus of EMC is conducted in the simulation.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128079857","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765790
R. Kregting, C. Yuan, A. Xiao, F. de Bruijn
In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is preferred and wedge-wedge wire bonding is widely used. As a result of poor wire shape design, wedge break can be found. Additionally, for the in-shin wires, which are typically very high and can reach high temperatures, failure by wire melting can be reached.
{"title":"Modelling aluminium wire bond reliability in high power OMP devices","authors":"R. Kregting, C. Yuan, A. Xiao, F. de Bruijn","doi":"10.1109/ESIME.2011.5765790","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765790","url":null,"abstract":"In a RF power application such as the OMP, the wires are subjected to high current (because of the high power) and high temperature (because of the heat from IC and joule-heating from the wire itself). Moreover, the wire shape is essential to the RF performance. Hence, the aluminium wire is preferred and wedge-wedge wire bonding is widely used. As a result of poor wire shape design, wedge break can be found. Additionally, for the in-shin wires, which are typically very high and can reach high temperatures, failure by wire melting can be reached.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128423216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765763
F. Braghin, E. Leo, F. Resta, Stefano Cerra
The verification phase (Final Test) of inertial MEMS gyroscopes design properties takes a basic role in the sensors production. It's during this phase that devices are tested to reveal their effectiveness in the survey of the angular rate. The verification phase is based on a set of several tests able to evaluate the gyroscope characteristic properties, such as the resonance frequency, the quality factor, the quadrature error, and the gyroscope sensitivity. The main goal of the Final Test is to identify characteristic parameters as far as possible in order to save money: actually each gyroscope has to be tested before putting it on the market. The test bench used during the Final Test phase will be proposed as well as a new experimental procedure able to fast identify characteristic parameters. This new testing procedure has been applied both for single-axis and double-axis gyroscopes. The results achieved has been compared with a more accurate (but slower) experimental procedure.
{"title":"Mechanical model of a MEMS inertial rotational gyroscope","authors":"F. Braghin, E. Leo, F. Resta, Stefano Cerra","doi":"10.1109/ESIME.2011.5765763","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765763","url":null,"abstract":"The verification phase (Final Test) of inertial MEMS gyroscopes design properties takes a basic role in the sensors production. It's during this phase that devices are tested to reveal their effectiveness in the survey of the angular rate. The verification phase is based on a set of several tests able to evaluate the gyroscope characteristic properties, such as the resonance frequency, the quality factor, the quadrature error, and the gyroscope sensitivity. The main goal of the Final Test is to identify characteristic parameters as far as possible in order to save money: actually each gyroscope has to be tested before putting it on the market. The test bench used during the Final Test phase will be proposed as well as a new experimental procedure able to fast identify characteristic parameters. This new testing procedure has been applied both for single-axis and double-axis gyroscopes. The results achieved has been compared with a more accurate (but slower) experimental procedure.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127866041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2011-04-18DOI: 10.1109/ESIME.2011.5765784
B. Yang, W. Belkhir, R. Dhara, M. Lenczner, A. Giorgetti
We are currently developing software dedicated to multiscale and multiphysics modeling of arrays of micro and nanosystems. Unlike traditional software that is based on models built once and for all, here this is the software that constructs models. It is based on the mathematical Two-Scale Transform, a technique for asymptotic methods, together with formal specification and verification techniques in computer science, combining formal transformations and term rewriting and type theory. We aim at taking into account a wide range of geometries combining thin structures, periodic structures with the possibility of multiple nested scales and any combination of these features. In this paper we present the principle of our methods and our first results.
{"title":"Computer-aided multiscale model derivation for MEMS arrays","authors":"B. Yang, W. Belkhir, R. Dhara, M. Lenczner, A. Giorgetti","doi":"10.1109/ESIME.2011.5765784","DOIUrl":"https://doi.org/10.1109/ESIME.2011.5765784","url":null,"abstract":"We are currently developing software dedicated to multiscale and multiphysics modeling of arrays of micro and nanosystems. Unlike traditional software that is based on models built once and for all, here this is the software that constructs models. It is based on the mathematical Two-Scale Transform, a technique for asymptotic methods, together with formal specification and verification techniques in computer science, combining formal transformations and term rewriting and type theory. We aim at taking into account a wide range of geometries combining thin structures, periodic structures with the possibility of multiple nested scales and any combination of these features. In this paper we present the principle of our methods and our first results.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124132934","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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