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2006 IEEE International Conference on Semiconductor Electronics最新文献

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Characterization of Strained Silicon MOSFET Using Semiconductor TCAD Tools 利用半导体TCAD工具表征应变硅MOSFET
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380774
Wong Yah Jin, I. Saad, R. Ismail
The paper is looking into the enhancement of conventional PMOS by incorporating a strained silicon within the channel and bulk of semiconductor. A detailed 2D process simulation of strained silicon PMOS (SSPMos) and its electrical characterization was done using TCAD tool. With the oxide thickness, Tox of 16 nm and germanium concentration of 35%, the threshold voltage Vt for the strained Si and conventional PMOS is -0.5067V and -0.9290V respectively. This indicates that the strained silicon had lower power consumption. Beside that, the drain induced barrier lowering (DIBL) value for the strained PMOS is 0.3034V and the conventional PMOS is 0.4747V, which shows a better performance for strained silicon as compared to conventional PMOS. In addition, the output characteristics were also obtained for SSPMos which showed an improvement of drain current compared with conventional PMOS.
本文研究了通过在通道和半导体体中加入应变硅来增强传统PMOS的方法。利用TCAD工具对应变硅PMOS (SSPMos)进行了详细的二维工艺模拟和电学表征。当氧化层厚度为16 nm、锗浓度为35%时,应变Si和常规PMOS的阈值电压Vt分别为-0.5067V和-0.9290V。这表明应变硅具有较低的功耗。此外,应变PMOS的漏极诱导势垒降低(DIBL)值为0.3034V,而传统PMOS为0.4747V,与传统PMOS相比,应变硅表现出更好的性能。此外,还获得了SSPMos的输出特性,与传统PMOS相比,SSPMos的漏极电流有所改善。
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引用次数: 9
Design and Simulation of a High Performance Lateral BJTs on TFSOI 基于TFSOI的高性能横向bjt设计与仿真
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380692
I. Saad, R. Ismail
Lateral BJT's have received renewed interest with the advent of BiCMOS and Silicon on Insulator (SOI) technology. It's been reported in [1] that a 67 GHz fmax novel lateral BJT's on TFSOI has been fabricated with a simplified process. This paper presents an investigation of this high performance transistor by using 2D process and device numerical simulation. Accurate geometrical structure and reasonably good doping profiles with a simple fabrication process are successfully achieved in the process simulation. However, a careful attention is required to define the mesh for the device to obtain an accurate measurement of device characteristics. With a base, low-doped collector, emitter and high-doped collector concentrations of 3 times 1017 cm-3, 1.0 times 1017 cm-3, 5 times 1020 cm-3 and 3 times 1020 cm-3 respectively, a variation of 0.1-0.13 mum base width is observed. I-V and frequency performance of these transistors are simulated and analyzed. Y-parameter measurement at frequency 10 MHz - 1000 GHz shows a 21 GHz fmax was successfully achieved at VBE=0.7 V, VCE=2.0 V and ICE=6.0 muA.
随着BiCMOS和绝缘体上硅(SOI)技术的出现,横向BJT重新引起了人们的兴趣。b[1]报道用一种简化的工艺在TFSOI上制备了67 GHz fmax的新型横向BJT。本文采用二维工艺和器件数值模拟的方法对该高性能晶体管进行了研究。在工艺模拟中,以简单的制备工艺成功地获得了精确的几何结构和良好的掺杂分布。然而,需要仔细注意定义设备的网格,以获得设备特性的准确测量。当基极、低掺杂集电极、发射极和高掺杂集电极浓度分别为3倍1017 cm-3、1.0倍1017 cm-3、5倍1020 cm-3和3倍1020 cm-3时,基极宽度的变化范围为0.1-0.13 μ m。仿真分析了这些晶体管的I-V和频率性能。在10 MHz - 1000 GHz频率下的y参数测量表明,在VBE=0.7 V, VCE=2.0 V和ICE=6.0 muA时,成功实现了21 GHz的fmax。
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引用次数: 0
Design and Analysis of an Ultra Wideband Matrix Mixer 超宽带矩阵混频器的设计与分析
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.381109
R. Hallaji, A. Abdipour, G. Moradi
Ultra wideband matrix mixer using well known harmonic balance (HB) technique is analyzed. Matrix structure gives a suitable conversion gain. The proposed structure contains FET elements in each row and column, and causes an improved performance including conversion gain and output power. Mixer performance is analyzed in ultra wide band (UWB). The structure is used in UWB circuits and systems such as RFID cards.
对采用谐波平衡技术的超宽带矩阵混频器进行了分析。矩阵结构给出了合适的转换增益。所提出的结构在每一行和每一列中都包含场效应管元件,从而提高了包括转换增益和输出功率在内的性能。分析了超宽带(UWB)下混频器的性能。该结构用于超宽带电路和RFID卡等系统。
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引用次数: 0
The Energy Band Gap of AlxGa1-xN Thin Films as a Function of Al-Mole Fraction AlxGa1-xN薄膜能带隙与al摩尔分数的关系
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380776
S. Ng, F. Yam, Z. Hassan, H. Abu Hassan
In this work, the effects of Al mole fraction on energy band gap (Eg) of AlxGa1-xN epilayers grown on sapphire substrate are investigated. Attention is focused on the Ga- rich composition samples (0 les x < 0.10). The Al-mole fraction is determined by high- resolution X-ray diffraction (HR-XRD) spectroscopy. Ultraviolet-visible (UV-VIS) transmission and micro-photoluminescence (mu-PL) spectroscopy are employed to determine the energy band gap of the samples. The XRD results revealed that the Bragg angle of the rocking curve (RC) peak gradually increases as the Al-mole fraction increases, indicating the reductions in the lattice constant c of the alloys. By the application of Vegard's law, the Al-mole fractions of AlxGa1-xN samples have been calculated. Overall, the UV-VIS transmission and mu-PL results showed that as the Al-mole fraction increases, blue shifts of the absorption edge and band edge emission are observed in all samples. These indicate the strong dependence of the band gap energy of AlxGa1-xN on the Al-mole fraction. Finally, the band gap energy of the AlxGa1-xN as a function of Al-mole fraction have been plotted and the energy band gap bowing parameter of 14.62 eV is obtained from the best fit of the non-linear interpolation of the UV-VIS transmission and the PL data.
本文研究了Al摩尔分数对蓝宝石衬底生长的AlxGa1-xN薄膜能带隙(Eg)的影响。重点关注富Ga成分样品(0 les x < 0.10)。采用高分辨率x射线衍射(HR-XRD)光谱法测定了铝摩尔分数。采用紫外-可见(UV-VIS)透射光谱和微光致发光(mu-PL)光谱测定样品的能带隙。XRD结果表明,随着al摩尔分数的增加,摇摆曲线(RC)峰的Bragg角逐渐增大,表明合金的晶格常数c降低。应用维加德定律,计算了AlxGa1-xN样品的al -摩尔分数。综上所述,UV-VIS透射和mu-PL结果表明,随着al摩尔分数的增加,所有样品的吸收边和带边发射都发生了蓝移。这表明AlxGa1-xN的带隙能与al摩尔分数有很强的相关性。最后,绘制了AlxGa1-xN的带隙能量随al摩尔分数的函数图,并将紫外-可见透射率的非线性插值与PL数据进行最佳拟合,得到带隙弯曲参数为14.62 eV。
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引用次数: 1
Integrated LC VCO Compatible with Memory Process for Gigahertz Clock Generation 集成LC VCO兼容内存进程的千兆赫时钟生成
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380718
Minseok Choi, Youngho Jung, Y. J. Yoon, Young-Wug Kim, Hyungcheol Shin
This work presents the design and fabrication of the LC voltage-controlled oscillator (VCO) using 1-poly 3-metal CMOS process aimed for use in current memory manufacturing process. Poor characteristics of highly-resistive and immune to substrate-coupling metal-3 inductor in LC resonator were overcome by dual metal structure and patterned-ground shield (PGS) strategy. Fabricated VCO operated from 2.48 GHz to 2.73 GHz tuned by accumulation-mode MOS varactor. The corresponding tuning range was 250 MHz. The measured phase noise was - 113.5 dBc/Hz at 1 MHz offset at 2.48 GHz carrier frequency. The current consumption and corresponding power consumption were about 1.04 mA and 1.87 mW respectively.
本文介绍了一种基于1-poly - 3-metal CMOS工艺的LC压控振荡器(VCO)的设计和制造,旨在应用于当前存储器制造工艺。采用双金属结构和图案接地屏蔽(PGS)策略克服了LC谐振器中金属-3电感的高阻性和抗衬底耦合的缺点。自制的VCO工作频率为2.48 GHz至2.73 GHz,由累加模式MOS变容管调谐。相应的调谐范围为250 MHz。在2.48 GHz载波频率下,在1 MHz偏移时测量到的相位噪声为- 113.5 dBc/Hz。电流消耗约为1.04 mA,功率消耗约为1.87 mW。
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引用次数: 0
Analysis of Poly Resistor Mismatch 多电阻失配分析
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380795
P. Beow Yew Tan, A. Victor Kordesch, O. Sidek
In this paper we analyzed the mismatch characteristics of poly resistors. We found that the P+ poly resistor mismatch characteristics do not follow the linear inverse square root dependence. Instead, the P+ poly resistor mismatch follows the quadratic of inverse square root (or a simple inverse area) dependence. N+ poly resistor mismatch, however does obey the expected standard inverse square root dependence.
本文分析了多电阻的失配特性。我们发现P+多电阻失配特性不遵循线性反平方根依赖。相反,P+多电阻失配遵循逆平方根的二次(或简单的逆面积)依赖。N+多电阻失配,但不服从预期的标准反平方根依赖。
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引用次数: 1
A Novel DC-Coupled, Single-Ended to Differential, Transimpedance Amplifier Architecture Based on gm-boosting Technique 一种基于gm升压技术的新型直流耦合单端对差分跨阻放大器结构
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.380719
M. Jalali, M. Moravvej-Farshi, A. Nabavi
In this paper, the authors present a new DC-coupled single-ended to differential method suitable for transimpedance amplifier in low-voltage optical communication system applications. The single-ended to differential operation is realized using gm-boosting technique. As an example for applying this method, gm-boosting technique is implemented by capacitor cross coupling of two basic common-gate stage. Also a method for achieving DC-coupled operation, despite capacitor coupling, is presented and discussed.
本文提出了一种适用于低压光通信系统中跨阻放大器的新型直流单端耦合差分方法。采用转基因助推技术实现了单端对差分操作。作为应用该方法的实例,通过两个基本共栅级的电容交叉耦合实现了gm升压技术。此外,一种方法,实现直流耦合操作,尽管电容器耦合,提出和讨论。
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引用次数: 0
Calculation of Quantum Efficiency for Resonant Cavity Photodiodes using the FDTD Method 用时域有限差分法计算谐振腔光电二极管的量子效率
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.381056
M. Soroosh, M. Jalali, M. Moravvej-Farshi
Using the finite difference time domain method (FDTD), we solve the Maxwell equations in resonant cavity photodetector. Then we obtain the optical field density and quantum efficiency. Also, the effect of bragg space and reflector are calculated.
利用时域有限差分法(FDTD)求解了谐振腔光电探测器的Maxwell方程。得到了光场密度和量子效率。同时,还计算了布喇格空间和反射器的影响。
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引用次数: 0
A 10-Bit 50-MSPS Pipelined CMOS ADC 一个10位50 msps流水线CMOS ADC
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.381103
M. Hashim, Y. Yusoff, Mohd Rais Ahmad
This paper presents a 10-bit 50-MSPS pipelined ADC targeted to 0.35 um CMOS technology. The main characteristics of pipelined ADC such as signal to noise and distortion ratio (SNDR), spurious free dynamic range (SFDR), differential non-linearity (DNL), integral non-linearity (INL) and power consumption are simulated in HSPICEreg. In this simulation, a full-scale of Nyquist-frequency sine-wave input is used. The results show the designed pipelined ADC achieves a SNDR of 58 dB, SFDR of 70 dB, maximum differential nonlinearity (DNL) and integral nonlinearity (INL) are less than 0.5 least significant bit (LSB) and a power consumption of 350-mW.
本文提出了一种针对0.35 um CMOS技术的10位50 msps流水线ADC。在HSPICEreg中模拟了管道ADC的主要特性,如信噪比(SNDR)、无杂散动态范围(SFDR)、微分非线性(DNL)、积分非线性(INL)和功耗。在这个模拟中,使用了一个满量程的奈奎斯特频率正弦波输入。结果表明,所设计的流水线ADC的SNDR为58 dB, SFDR为70 dB,最大差分非线性(DNL)和积分非线性(INL)均小于0.5最低有效位(LSB),功耗为350 mw。
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引用次数: 2
Electrical Properties of p-Type Al - N Codoped ZnO Thin Films p型Al - N共掺杂ZnO薄膜的电学性能
Pub Date : 2006-11-01 DOI: 10.1109/SMELEC.2006.381113
H. A. Hamid, M. Abdullah, A. Aziz, S. A. Rosli
Aluminium doped zinc thin films were deposited on silicon substrates using direct current (DC) magnetron sputtering in argon atmosphere. These films were then annealed in nitrogen-oxygen mixed gases for 1 hour at temperature range of 200degC to 500degC. P-type conduction of Al - N codoped ZnO thin films were obtained for all temperatures with a high hole concentration of 1.85 times 1022 cm-3.
采用直流磁控溅射技术在硅衬底上制备了掺杂铝锌薄膜。然后在200℃至500℃的温度范围内,将这些薄膜在氮气-氧气混合气体中退火1小时。Al - N共掺杂ZnO薄膜在所有温度下均可获得p型导电性,空穴浓度高达1.85倍1022 cm-3。
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引用次数: 1
期刊
2006 IEEE International Conference on Semiconductor Electronics
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