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2006 IEEE Asian Solid-State Circuits Conference最新文献

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The low power MICS band biotelemetry architecture and its LNA design for implantable applications 低功耗MICS波段生物遥测架构及其植入式应用LNA设计
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357944
Chen-Ming Hsu, Chien-Ming Lee, Tzong-Chee Yo, C. Luo
The exclusive biotelemetry system for implantable measurement utilizing a low-power BPSK transmitter, RF terminal chip for signal up-conversion and receiver is presented. The frequency band used in the human body is the un-licensed band at 402-405 MHz allocated to medical implant communication systems (MICS) by FCC and the ISM band at 2.4GHz is used for transmission in the air. This system has following characteristics: 40 channels with 75k bandwidth, low output power in transmitter and easily be full-integrated that are suitable for implantable applications. The low noise amplifier (LNA) with current reuse technique and cascode structure for high gain and low noise figure is implemented in this paper. The chip is designed and fabricated in TSMC 0.18 mum 1P6M CMOS technology.
介绍了一种独特的植入式测量生物遥测系统,该系统利用低功耗BPSK发射机、用于信号上转换的射频终端芯片和接收器。人体使用的频段是FCC分配给医疗植入通信系统(MICS)的未经许可的402-405 MHz频段,2.4GHz的ISM频段用于空中传输。该系统具有40个通道,带宽75k,发射机输出功率低,易于集成,适合植入式应用。采用电流复用技术和级联码结构实现了高增益、低噪声系数的低噪声放大器。该芯片采用台积电0.18 μ m 1P6M CMOS工艺设计制造。
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引用次数: 11
A Fully Digital Low Cost Time Domain Smart Temperature Sensor with Extremely Tiny Size 全数字低成本时域智能温度传感器的极小尺寸
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357873
Poki Chen, Mon-Chau Shie, Zi-Fan Zheng, C. Chu, Mao-Hsing Chiang, Zhi-Yuan Zheng
To explore the possibility of soft IP implementation, a fully digital smart temperature sensor without any full-custom device is proposed for painless VLSI or SOC on-chip integrations. The signal is processed thoroughly in time domain instead of conventional voltage or current domain. A cyclic delay line is used to generate the thermally sensitive pulse with a width proportional to the measured temperature. The timing reference is just the input clock, and a counter instead of voltage or current analog-to-digital converter is utilized for digital output coding. The circuit is realized by FPGA chips for functionality verification and performance evaluation. Implemented with as few as 140 Logic Elements, the proposed smart sensor was measured to have an error of -0.7degC~0.9degC over a wide temperature range of -40degC~130degC. The effective resolution is better than 0.1degC, and the power consumption is 8.42 muW at a sample rate of 2 samples/s. The performance is as good as those of most full-custom predecessors. The longest conversion time is around 260 mus, and a conversion rate of 3 kHz at least is promised.
为了探索软IP实现的可能性,提出了一种全数字智能温度传感器,不需要任何完全定制的器件,用于无痛的VLSI或SOC片上集成。在时域对信号进行了彻底的处理,而不是传统的电压域或电流域。使用循环延迟线产生宽度与被测温度成正比的热敏脉冲。时序参考仅为输入时钟,数字输出编码采用计数器而不是电压或电流模数转换器。该电路采用FPGA芯片实现,进行功能验证和性能评估。该智能传感器仅使用140个逻辑元件,在-40℃~130℃的宽温度范围内测量误差为-0.7℃~0.9℃。有效分辨率优于0.1℃,采样率为2个采样/s时的功耗为8.42 muW。性能与大多数全定制前辈一样好。最长转换时间约260 μ s,保证至少3 kHz的转换率。
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引用次数: 4
A 0.5-6 GHz Improved Linearity, Resistive Feedback 90-nm CMOS LNA 一种0.5-6 GHz改进线性度、阻性反馈的90纳米CMOS LNA
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357901
B. Perumana, J. Zhan, S. S. Taylor, J. Laskar
This paper presents a resistive feedback broadband LNA in 90 nm CMOS which occupies 50 mum times 270 mum of active area. The LNA has 7 GHz 3 dB bandwidth and >24 dB voltage gain. Across 0.5-6 GHz, its input matching is better than -10 dB, noise figure below 2.5 dB, and iIP3 better than -8 dBm. Techniques to improve linearity in resistive feedback LNAs are discussed in detail. The LNA also provides an additional low power mode operation.
本文提出了一种90 nm CMOS电阻式反馈宽带LNA,其有源面积为50 μ m × 270 μ m。LNA具有7 GHz 3db带宽和> 24db电压增益。在0.5-6 GHz范围内,其输入匹配优于-10 dB,噪声系数低于2.5 dB, iIP3优于-8 dBm。详细讨论了提高阻性反馈lna线性度的技术。LNA还提供额外的低功耗模式操作。
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引用次数: 24
A DC-7 GHz Small-Area Distributed Amplifier Using 5-port Inductors in a 180nm Si CMOS Technology 采用180nm Si CMOS技术的5端口电感的dc - 7ghz小面积分布式放大器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357926
T. Ito, D. Kawazoe, K. Okada, K. Masu
This paper proposes a novel small-area distributed amplifler (DA), which utilizes two 5-port inductors to replace eight inductors. The DA is fabricated using a standard 180 nm CMOS process with 6 metal layers. The layout area of DA is 0.33 mm2. It is about 50 % as large as conventional DAs, and it has power gain of 6.3 dB and noise figure of 6 dB at DC-7 GHz.
本文提出了一种新型的小面积分布式放大器(DA),它采用两个5端口电感器来代替八个电感器。DA采用标准的180纳米CMOS工艺制造,有6层金属层。DA的布局面积为0.33 mm2。它的功率增益为6.3 dB,在DC-7 GHz频段噪声系数为6 dB。
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引用次数: 8
A Full-Digital Multi-Channel CMOS Capacitive Sensor 全数字多通道CMOS电容式传感器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357897
B. Moon, D. Jung, J. Chung, C. Joung, J. Hong, S. Lee, Y. Shin, C. Yoo
A full-digital 12-channel, 100-step capacitive sensor is described. The capacitance to be sensed forms an RC-delay line whose delay is compared with that of a reference RC-delay line. The difference of the RC delays is sensed by a simple full-digital time-to-digital converter (TDC). By compensating the parasitic capacitance at power up, the capacitive sensor implemented in a 0.35 mum standard digital CMOS technology shows 30fF sensing resolution. The capacitive sensor consumes 5 muA per channel under 3.3V supply voltage.
介绍了一种全数字12通道100步电容式传感器。待测电容形成一条rc延迟线,其延迟与参考rc延迟线的延迟进行比较。通过一个简单的全数字时间-数字转换器(TDC)检测RC延迟的差异。通过补偿上电时的寄生电容,采用0.35 μ m标准数字CMOS技术实现的电容式传感器显示出30fF的传感分辨率。电容式传感器在3.3V供电电压下每通道消耗5mua。
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引用次数: 2
Improving Multi-Context Execution Speed on DRFPGAs 提高drfpga的多上下文执行速度
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357904
M.A. Khan, N. Miyamoto, R. Pantonial, K. Kotani, S. Sugawa, T. Ohmi
To implement a user circuit on a Dynamically Reconflgurable FPGA (DRFPGA) the circuit needs to be temporally partitioned into several sub-circuits such that their sequential execution on the DRFPGA yields the same result as that of the user circuit. In devices where interconnect delay is far dominating than logic delay, such implementation has the prospect of executing user circuits faster than traditional FPGA implementation, since temporal partitioning divides a long spatial wire of a circuit into several short temporal wires, thus converting interconnect delay into logic delay. To realize such prospect, reconfiguration delay and temporal communication delay of a DRFPGA must be kept as low as possible. This paper studies these issues and reports the architecture and performance of Flexible Processor III (FP3), a newly proposed DRFPGA. FP3 employs a new shift register type temporal interconnect and Nearest Neighbor (NN) type spatial interconnect to reduce the delay mentioned above. Correct behavior of FP3, designed and fabricated in 0.35 um CMOS technology, has been confirmed and our experimental results show that there exist cases where the best user circuit speed is achieved when two or more contexts are in use.
为了在动态可重构FPGA (DRFPGA)上实现用户电路,需要将电路暂时划分为几个子电路,以便它们在DRFPGA上的顺序执行产生与用户电路相同的结果。在互连延迟远比逻辑延迟占主导地位的设备中,这种实现有望比传统的FPGA实现更快地执行用户电路,因为时间划分将电路的长空间线划分为几个短时间线,从而将互连延迟转换为逻辑延迟。为了实现这一前景,DRFPGA的重构延迟和瞬时通信延迟必须尽可能低。本文对这些问题进行了研究,并报道了柔性处理器III (FP3)的结构和性能。FP3采用一种新的移位寄存器型时间互连和最近邻(NN)型空间互连来减少上述延迟。采用0.35 um CMOS技术设计和制造的FP3的正确行为已经得到证实,我们的实验结果表明,当使用两种或多种环境时,存在最佳用户电路速度的情况。
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引用次数: 8
An Alternative Cyclic Synchronous Mirror Delay for Versatility in Highly Integrated SoC 一种用于高集成SoC多功能性的可选循环同步镜像延迟
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357905
H. Nakaya, Y. Sasaki, N. Kato, F. Arakawa, T. Shimizu
We describe an alternative cyclic synchronous mirror delay (ACSMD) for highly integrated SoCs of mobile application processors. ACSMD provides the following advantages: wide operational frequency range from 0.5 to 400 MHz, 0.08 mm2 chip area, and 6.13 mW power consumption @ 400 MHz operation. The chip area and power consumption are reduced by 95% of those of a conventional hierarchical SMD with the same operational frequency and resolution. Key circuit technologies are cyclic delay line, alternating use of three delay lines, and a new loop counter.
我们描述了一种用于移动应用处理器高度集成的soc的替代循环同步镜像延迟(ACSMD)。ACSMD具有以下优点:工作频率范围为0.5 ~ 400mhz,芯片面积为0.08 mm2, 400mhz时功耗为6.13 mW。在相同的工作频率和分辨率下,芯片面积和功耗比传统的分层SMD减少了95%。关键的电路技术是循环延迟线,交替使用三个延迟线,和一个新的环路计数器。
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引用次数: 0
Flexible Signal Processing Platform Chip for Software Defined Radio with 103 GOPS Dynamic Reconf1gurable Logic Cores 具有103个GOPS动态可重构逻辑核的软件无线电灵活信号处理平台芯片
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357853
H. Fujisawa, M. Saito, S. Nishijima, N. Odate, Y. Sakai, K. Yoda, I. Sugiyama, T. Ishihara, Y. Hirose, H. Yoshizawa
Software defined radio (SDR) is expected to be a progressive technology for wireless communications under multi-communication systems. SDR requires high performance, low power consumption, and short latency hardware. We have developed a single-chip baseband processing LSI for SDR based on a hybrid architecture of coarse-grain reconfigurable logic cores and flexible accelerator modules to achieve the required features. The maximum performance is 103 GOPS. Moreover, we implemented IEEE 802.11a and IEEE 802.11b, and show the effectiveness in latency.
软件定义无线电(SDR)有望成为多通信系统下无线通信的一项进步技术。SDR需要高性能、低功耗、短时延的硬件。我们开发了一种基于粗粒度可重构逻辑内核和灵活加速器模块混合架构的SDR单芯片基带处理LSI,以实现所需的功能。最高性能为103 GOPS。此外,我们还实现了IEEE 802.11a和IEEE 802.11b,并显示了延迟方面的有效性。
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引用次数: 5
A 0.18=μm Probabilistic-Based Noise-Tolerate Circuit Design and Implementation with 28.7dB Noise-Immunity Improvement 基于0.18=μm概率的容噪电路设计与实现,抗噪能力提高28.7dB
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357908
I-Chyn Wey, You-Gang Chen, Changhong Yu, Jie Chen, A. Wu
As the size of CMOS devices is scaled down to the nanoscale level, noise interferences start to significantly affect the VLSI circuit performance. Because the injected noise is random and dynamic in nature, a probabilistic-based approach is more suitable to handle signal errors than the conventional deterministic circuit designs. In this paper, we design and implement an 8-bit Markov random field carry lookahead adder (MRFCLA) probabilistic-based noise-tolerant circuit in 0.18μm CMOS process technology. This is the first working silicon design to prove the design concept of the noise-tolerant MRF circuits. The measurement results show that the proposed of the MRF adder can provide 28.7dB of noise-immunity as compared with its conventional CMOS design, when both circuits are facing the same server SNR environment. The MRF adder circuit can also achieve 10-6 BER when the supply voltage is only 0.45 V and SNR is only 10 dB.
随着CMOS器件的尺寸缩小到纳米级,噪声干扰开始显著影响VLSI电路的性能。由于注入的噪声具有随机性和动态性,因此基于概率的方法比传统的确定性电路设计更适合处理信号误差。本文采用0.18μm CMOS工艺,设计并实现了一种基于概率的8位马尔科夫随机场进位前馈加法器(MRFCLA)容噪电路。这是第一个证明耐噪声磁流变电路设计概念的工作硅设计。测试结果表明,当两种电路面对相同的服务器信噪比环境时,与传统CMOS设计相比,所提出的MRF加频器可提供28.7dB的抗噪能力。当电源电压仅为0.45 V,信噪比仅为10 dB时,MRF加频电路也可以达到10-6误码率。
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引用次数: 21
Optimization of Active Substrate Noise Cancelling Technique using Power Line di/dt Detector 电力线di/dt检测器有源衬底降噪技术的优化
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357895
T. Kazama, T. Nakura, M. Ikeda, K. Asada
This paper demonstrates optimization of a feedforward active substrate noise canceling technique using a power supply di/dt detector. Our past study realized substrate noise canceling using a di/dt detector. For further substrate noise reduction, this study analyzes the parameters which constitute a di/dt canceller and develops the effective di/dt noise canceling scheme. As a result, we realized 62% substrate noise reduction. Compared with effect of guard ring, our multiple di/dt canceller suppressed about five times as much substrate noise as that of guard ring.
本文演示了一种使用电源di/dt检测器的前馈有源衬底噪声消除技术的优化。我们过去的研究使用di/dt检测器实现了衬底噪声消除。为了进一步降低衬底噪声,本研究分析了构成di/dt消噪器的参数,并开发了有效的di/dt消噪方案。结果,我们实现了62%的衬底噪声降低。与保护环的效果相比,我们的多重di/dt对消器对衬底噪声的抑制效果是保护环的5倍。
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引用次数: 2
期刊
2006 IEEE Asian Solid-State Circuits Conference
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