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Characterization of delta-doped GaAs grown by MOVPE MOVPE生长δ掺杂GaAs的表征
P. Gurník, P. Beno, R. Srnánek, M. Tlaczala, B. Ściana, L. Harmatha
The resolution of the capacitance-voltage (C-V) technique on single- and double-delta (/spl delta/)-doped GaAs is shown to be given by the breadth of dopant distribution. The experimental C-V profiles demonstrate that impurities are spatially localized on the length scale of the lattice constant. The sharp distribution of dopants is assessed by the secondary-ion mass spectroscopy.
电容电压(C-V)技术对单掺杂和双掺杂GaAs (/spl δ /)的分辨是由掺杂剂分布的宽度决定的。实验的C-V谱图表明,杂质在晶格常数的长度尺度上具有空间局域性。用二次离子质谱法评价了掺杂剂的尖锐分布。
{"title":"Characterization of delta-doped GaAs grown by MOVPE","authors":"P. Gurník, P. Beno, R. Srnánek, M. Tlaczala, B. Ściana, L. Harmatha","doi":"10.1109/ASDAM.2002.1088498","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088498","url":null,"abstract":"The resolution of the capacitance-voltage (C-V) technique on single- and double-delta (/spl delta/)-doped GaAs is shown to be given by the breadth of dopant distribution. The experimental C-V profiles demonstrate that impurities are spatially localized on the length scale of the lattice constant. The sharp distribution of dopants is assessed by the secondary-ion mass spectroscopy.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"88 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120861665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Carrier noise in mode-locked fiber grating external cavity lasers 锁模光纤光栅外腔激光器中的载波噪声
N. Dogru, M. Sadettin Ozyazici
The effect of carrier noise on mode-locked hybrid soliton pulse source (HSPS) utilizing linearly chirped Gaussian apodized fiber Bragg grating is described. The model is based on a time domain solution of coupled-mode equations. Relative intensity noise (RIN) is calculated using numerical solution of these equations. It is found that carrier noise affects the operation of device and therefore transform limited pulses are not obtained over a wide frequency range although these pulses are generated over a wide frequency range without noise.
描述了载波噪声对利用线性啁啾高斯apodized光纤布拉格光栅锁模混合孤子脉冲源的影响。该模型基于耦合模方程的时域解。利用这些方程的数值解计算了相对强度噪声(RIN)。研究发现,载波噪声会影响器件的工作,因此在较宽的频率范围内无法获得变换有限脉冲,尽管这些脉冲在较宽的频率范围内产生而没有噪声。
{"title":"Carrier noise in mode-locked fiber grating external cavity lasers","authors":"N. Dogru, M. Sadettin Ozyazici","doi":"10.1109/ASDAM.2002.1088518","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088518","url":null,"abstract":"The effect of carrier noise on mode-locked hybrid soliton pulse source (HSPS) utilizing linearly chirped Gaussian apodized fiber Bragg grating is described. The model is based on a time domain solution of coupled-mode equations. Relative intensity noise (RIN) is calculated using numerical solution of these equations. It is found that carrier noise affects the operation of device and therefore transform limited pulses are not obtained over a wide frequency range although these pulses are generated over a wide frequency range without noise.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125944669","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Formation of YBa/sub 2/Cu/sub 3/O/sub 7-x//MgO and YBa/sub 2/Cu/sub 3/O/sub 7-x//Si thin film structure by laser pulse crystallisation and annealing 激光脉冲结晶和退火制备YBa/sub 2/Cu/sub 3/O/sub 7-x//MgO和YBa/sub 2/Cu/sub 3/O/sub 7-x//Si薄膜结构
B.K. Kotlyarchuk, V. Savchuk
The results of the theoretical and experimental study of laser pulse crystallisation and annealing of the YBa/sub 2/Cu/sub 3/O/sub 7-x/ high-temperature superconducting amorphous layers are presented in the paper. It is determined that for each given film thickness and type of substrate there exists a optimal pressure of oxygen, laser pulse energy density, its duration and wavelength at which the conditions Of thermodynamic stability of the film compound is preserved.
本文介绍了YBa/sub 2/Cu/sub 3/O/sub 7-x/高温超导非晶层激光脉冲结晶和退火的理论和实验研究结果。结果表明,对于给定的薄膜厚度和衬底类型,存在一个最佳的氧压力、激光脉冲能量密度、持续时间和波长,在此条件下,薄膜化合物的热力学稳定性得以保持。
{"title":"Formation of YBa/sub 2/Cu/sub 3/O/sub 7-x//MgO and YBa/sub 2/Cu/sub 3/O/sub 7-x//Si thin film structure by laser pulse crystallisation and annealing","authors":"B.K. Kotlyarchuk, V. Savchuk","doi":"10.1109/ASDAM.2002.1088470","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088470","url":null,"abstract":"The results of the theoretical and experimental study of laser pulse crystallisation and annealing of the YBa/sub 2/Cu/sub 3/O/sub 7-x/ high-temperature superconducting amorphous layers are presented in the paper. It is determined that for each given film thickness and type of substrate there exists a optimal pressure of oxygen, laser pulse energy density, its duration and wavelength at which the conditions Of thermodynamic stability of the film compound is preserved.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"103 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124799386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Liquid phase silylation of Shipley SPR500A-series resists using top surface imaging 采用顶面成像的Shipley spr500a系列抗蚀剂液相硅基化
K. Arshak, M. Mihov, A. Arshak, D. McDonagh, D. Sutton, S. Newcomb
Top Surface Imaging (TSI) is a well established technique to improve resolution of optical lithography, deep UV (248 nm) lithography and 193 nm lithography. The Positive Resist Image by Dry Etching (PRIME) process is a high-resolution single layer lithography scheme incorporating electron-beam exposure, near UV exposure (365 nm), silylation and dry development. In this paper, the liquid-phase silylation process step in PRIME with Shipley SPR500A-series resists is experimentally, investigated, and a new efficient process has been developed The impact of different silylating agents is characterised using FT-IR spectroscopy SIM spectrometry and cross-sectional SEM and TEM. Liquid-phase silylated patterns of SPR505 and SPR510 resist are presented, indicating almost vertical silylation sidewall profiles and high-silylation contrast when using Hexamethylcyclotrisiloxane (HMCTS) silylating agents. Results show that in case of e-beam exposure, a dose of 50 C/cm/sup 2/ at 30 keV is efficient to crosslink the resist and prevent silylation.
顶面成像(TSI)是一种成熟的提高光学光刻、深紫外(248 nm)光刻和193 nm光刻分辨率的技术。干法蚀刻正抗蚀成像(PRIME)工艺是一种高分辨率单层光刻方案,结合了电子束曝光、近紫外曝光(365 nm)、硅基化和干显影。本文对Shipley spr500a系列抗蚀剂在PRIME中的液相硅烷化过程进行了实验研究,开发了一种新的高效工艺,并利用FT-IR光谱、SIM光谱、SEM和TEM表征了不同硅烷化剂对PRIME的影响。SPR505和SPR510抗蚀剂的液相硅基化模式表明,当使用六甲基环三硅氧烷(HMCTS)硅基化剂时,它们的硅基化侧壁几乎是垂直的,硅基化程度很高。结果表明,在电子束照射下,50℃/cm/sup / / 30 keV的剂量可以有效地交联抗蚀剂,防止硅基化。
{"title":"Liquid phase silylation of Shipley SPR500A-series resists using top surface imaging","authors":"K. Arshak, M. Mihov, A. Arshak, D. McDonagh, D. Sutton, S. Newcomb","doi":"10.1109/ASDAM.2002.1088469","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088469","url":null,"abstract":"Top Surface Imaging (TSI) is a well established technique to improve resolution of optical lithography, deep UV (248 nm) lithography and 193 nm lithography. The Positive Resist Image by Dry Etching (PRIME) process is a high-resolution single layer lithography scheme incorporating electron-beam exposure, near UV exposure (365 nm), silylation and dry development. In this paper, the liquid-phase silylation process step in PRIME with Shipley SPR500A-series resists is experimentally, investigated, and a new efficient process has been developed The impact of different silylating agents is characterised using FT-IR spectroscopy SIM spectrometry and cross-sectional SEM and TEM. Liquid-phase silylated patterns of SPR505 and SPR510 resist are presented, indicating almost vertical silylation sidewall profiles and high-silylation contrast when using Hexamethylcyclotrisiloxane (HMCTS) silylating agents. Results show that in case of e-beam exposure, a dose of 50 C/cm/sup 2/ at 30 keV is efficient to crosslink the resist and prevent silylation.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"3018 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127464252","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Resonant tunnelling diodes for digital circuit applications 用于数字电路的谐振隧穿二极管
W. Prost
The application of quantum tunnelling devices namely resonant tunnelling diodes for high-performance digital circuitry is presented. The reliability of devices based on III/V semiconductor heterostructures is demonstrated and the applicability of emerging Si/SiGe heterostructures is discussed. The potential breakthrough of this approach is attributed to a very successful implementation in advanced circuit architectures. The applicability of Linear Threshold Gate logic based on the monostable-bistable transition logic element (MOBILE) is discussed here as the presently most promising candidate.
介绍了量子隧穿器件即谐振隧穿二极管在高性能数字电路中的应用。论证了基于III/V半导体异质结构器件的可靠性,并讨论了新兴Si/SiGe异质结构的适用性。这种方法的潜在突破归功于在先进电路架构中非常成功的实现。本文讨论了基于单稳-双稳转换逻辑元件(MOBILE)的线性门限逻辑的适用性,认为这是目前最有前途的候选逻辑。
{"title":"Resonant tunnelling diodes for digital circuit applications","authors":"W. Prost","doi":"10.1109/ASDAM.2002.1088489","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088489","url":null,"abstract":"The application of quantum tunnelling devices namely resonant tunnelling diodes for high-performance digital circuitry is presented. The reliability of devices based on III/V semiconductor heterostructures is demonstrated and the applicability of emerging Si/SiGe heterostructures is discussed. The potential breakthrough of this approach is attributed to a very successful implementation in advanced circuit architectures. The applicability of Linear Threshold Gate logic based on the monostable-bistable transition logic element (MOBILE) is discussed here as the presently most promising candidate.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127485111","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Raman spectroscopy of Si/sub x/Ge/sub 1-x/ compositional and temperature dependence Si/sub -x/ Ge/sub - 1-x/组分和温度依赖性的拉曼光谱
M. Lorenc, J. Šik
Raman spectroscopy is employed to study the compositional and temperature dependence of optical phonon modes in Si/sub x/Ge/sub 1-x/(0.0037/spl les/./spl times//spl les/1) alloy. Czochralski grown samples are doped in the range from nominally undoped to heavily boron doped, with the highest concentration of free holes of 10/sup 20/ cm/sup -3/. Three observed bands can be attributed to local Si-Si, Ge-Ge and Si-Ge vibrational modes. We present compositional dependence and temperature shift of the Si-Si band.
利用拉曼光谱研究了Si/sub -x/ Ge/sub - 1-x/(0.0037/spl les/)中光学声子模的组成和温度依赖关系。/spl times//spl les/1) alloy。Czochralski生长样品的掺杂范围从名义上未掺杂到重度掺杂,自由空穴的最高浓度为10/sup 20/ cm/sup -3/。观测到的三个波段可归因于局域Si-Si、Ge-Ge和Si-Ge振动模式。我们研究了Si-Si波段的组分依赖性和温度变化。
{"title":"Raman spectroscopy of Si/sub x/Ge/sub 1-x/ compositional and temperature dependence","authors":"M. Lorenc, J. Šik","doi":"10.1109/ASDAM.2002.1088486","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088486","url":null,"abstract":"Raman spectroscopy is employed to study the compositional and temperature dependence of optical phonon modes in Si/sub x/Ge/sub 1-x/(0.0037/spl les/./spl times//spl les/1) alloy. Czochralski grown samples are doped in the range from nominally undoped to heavily boron doped, with the highest concentration of free holes of 10/sup 20/ cm/sup -3/. Three observed bands can be attributed to local Si-Si, Ge-Ge and Si-Ge vibrational modes. We present compositional dependence and temperature shift of the Si-Si band.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121448075","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Investigation of 4H-SiC diode with RuO/sub 2/ Schottky contact by DLTS DLTS对具有RuO/sub / Schottky触点的4H-SiC二极管的研究
L. Stuchlíková, L. Harmatha, D. Buc, U. Helmersson, Q. Wahab
Deep level transient spectroscopy measurements were performed on silicon carbide (4H-SiC) Schottky diodes with RuO/sub 2/ Schottky contacts in order to investigate electrical properties of a new type of Schottky diode. Two electron deep energy levels were detected on this Schottky diode. Their thermal activation energies are 0.56 eV and 0.85 eV, respectively, referred to the conductance band. The origin of these deep levels is still under investigation.
为了研究新型肖特基二极管的电学特性,对具有RuO/ sub2 / Schottky触点的碳化硅(4H-SiC)肖特基二极管进行了深能级瞬态光谱测量。在肖特基二极管上检测到两个电子深能级。它们的热活化能分别为0.56 eV和0.85 eV,指的是电导带。这些深层的起源仍在调查中。
{"title":"Investigation of 4H-SiC diode with RuO/sub 2/ Schottky contact by DLTS","authors":"L. Stuchlíková, L. Harmatha, D. Buc, U. Helmersson, Q. Wahab","doi":"10.1109/ASDAM.2002.1088497","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088497","url":null,"abstract":"Deep level transient spectroscopy measurements were performed on silicon carbide (4H-SiC) Schottky diodes with RuO/sub 2/ Schottky contacts in order to investigate electrical properties of a new type of Schottky diode. Two electron deep energy levels were detected on this Schottky diode. Their thermal activation energies are 0.56 eV and 0.85 eV, respectively, referred to the conductance band. The origin of these deep levels is still under investigation.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122221916","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Impedance measurements of chemical gas sensors 化学气体传感器的阻抗测量
F. Vysloužil, M. Vrňata, V. Myslík, M. Kovanda, R. Fryček, M. Jelínek
This contribution deals with impedance measurements of gas sensors with active layers prepared by pulsed laser deposition (PLD) technology. The deposition was carried out from tin dioxide (SnO/sub 2/) and tin acetylacetonate (SnAcAc) - based targets by a KrF (wavelength 248 nm) excimer laser. The following systems were investigated (basic material/dopant/catalyst): SnO/sub 2/, SnAcAc, SnAcAc/Pd,SnAcAc/FeAcAc/Pd and SnAcAc/PdAcAc/Pd. These systems were applied as they exhibit an excellent S/sub dc/ sensitivity. The main interest was focused to following problems: measurement of real and imaginary part of complex impedance for frequencies ranging from 100 Hz to 10 MHz, construction of Nyquist diagrams, definition of an alternative phase-angle sensitivity S/sub pa/ (based on phase shift). The influences of S/sub pa/ vs. temperature and S/sub pa/ vs. frequency are also discussed.
该贡献涉及脉冲激光沉积(PLD)技术制备的有源层气体传感器的阻抗测量。利用KrF(波长248 nm)准分子激光,以二氧化锡(SnO/ sub2 /)和乙酰丙酮锡(SnAcAc)为基材进行了沉积。研究了SnO/ sub2 /、SnAcAc、SnAcAc/Pd、SnAcAc/FeAcAc/Pd和SnAcAc/PdAcAc/Pd体系(基础材料/掺杂剂/催化剂)。这些系统的应用是因为它们具有优异的S/sub / dc/灵敏度。主要兴趣集中在以下问题上:测量频率范围为100 Hz至10 MHz的复杂阻抗的实部和虚部,Nyquist图的构造,定义替代相角灵敏度S/sub / pa/(基于相移)。还讨论了S/sub pa/对温度和S/sub pa/对频率的影响。
{"title":"Impedance measurements of chemical gas sensors","authors":"F. Vysloužil, M. Vrňata, V. Myslík, M. Kovanda, R. Fryček, M. Jelínek","doi":"10.1109/ASDAM.2002.1088532","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088532","url":null,"abstract":"This contribution deals with impedance measurements of gas sensors with active layers prepared by pulsed laser deposition (PLD) technology. The deposition was carried out from tin dioxide (SnO/sub 2/) and tin acetylacetonate (SnAcAc) - based targets by a KrF (wavelength 248 nm) excimer laser. The following systems were investigated (basic material/dopant/catalyst): SnO/sub 2/, SnAcAc, SnAcAc/Pd,SnAcAc/FeAcAc/Pd and SnAcAc/PdAcAc/Pd. These systems were applied as they exhibit an excellent S/sub dc/ sensitivity. The main interest was focused to following problems: measurement of real and imaginary part of complex impedance for frequencies ranging from 100 Hz to 10 MHz, construction of Nyquist diagrams, definition of an alternative phase-angle sensitivity S/sub pa/ (based on phase shift). The influences of S/sub pa/ vs. temperature and S/sub pa/ vs. frequency are also discussed.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126803274","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Breakdown mechanisms limiting the operation of double doped PHEMTs scaled into sub-100 nm dimensions 限制双掺杂PHEMTs在亚100纳米尺度下运行的击穿机制
K. Kalna, A. Asenov
The breakdown limit of pseudomorphic high electron mobility transistors (PHEMTs) with double delta-doping structure scaled down into sub-100 nm dimensions is extensively investigated by Monte Carlo device simulations. The two mechanisms responsible for breakdown are channel impact ionization and tunnelling from the gate. The double doped PHEMTs may have two possible placements of the second delta doping layer: either below the channel or between the gate and the first delta doping layer. Quantum mechanical tunnelling starts at very low drain voltages but quickly saturates, having a greater effect on those PHEMTs with the second doping layer placed above the original doping. The threshold for impact ionization occurs at larger drain voltages which should assure the reliable operation voltage scale of double doped PHEMTs. Those double doped PHEMTs with the second delta doping layer placed below the channel deteriorate faster with the reduction of the channel length due to impact ionization than those devices with the second doping layer above the original doping.
采用蒙特卡罗模拟方法,对双δ掺杂伪晶高电子迁移率晶体管(PHEMTs)的击穿极限进行了研究。导致击穿的两种机制是通道冲击电离和从栅极穿隧。双掺杂phemt可以具有第二δ掺杂层的两种可能位置:在沟道下方或在栅和第一δ掺杂层之间。量子力学隧穿从极低的漏极电压开始,但很快饱和,对那些在原始掺杂之上放置第二掺杂层的phemt有更大的影响。冲击电离的阈值出现在较大的漏极电压下,这将保证双掺杂phemt可靠的工作电压范围。在通道下方放置第二δ掺杂层的双掺杂phemt,由于冲击电离导致通道长度的减小,其劣化速度比在原掺杂之上放置第二δ掺杂层的phemt更快。
{"title":"Breakdown mechanisms limiting the operation of double doped PHEMTs scaled into sub-100 nm dimensions","authors":"K. Kalna, A. Asenov","doi":"10.1109/ASDAM.2002.1088494","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088494","url":null,"abstract":"The breakdown limit of pseudomorphic high electron mobility transistors (PHEMTs) with double delta-doping structure scaled down into sub-100 nm dimensions is extensively investigated by Monte Carlo device simulations. The two mechanisms responsible for breakdown are channel impact ionization and tunnelling from the gate. The double doped PHEMTs may have two possible placements of the second delta doping layer: either below the channel or between the gate and the first delta doping layer. Quantum mechanical tunnelling starts at very low drain voltages but quickly saturates, having a greater effect on those PHEMTs with the second doping layer placed above the original doping. The threshold for impact ionization occurs at larger drain voltages which should assure the reliable operation voltage scale of double doped PHEMTs. Those double doped PHEMTs with the second delta doping layer placed below the channel deteriorate faster with the reduction of the channel length due to impact ionization than those devices with the second doping layer above the original doping.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126833427","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Process steps for a double gate MOSFET with vertical layout 垂直布局双栅MOSFET的工艺步骤
S. Trellenkamp, J. Moers, A. van der Hart, P. Kordos, H. Luth
In addition to the high demands on lithography, short channel behaviour is a problem for miniaturisation of devices. Double gate MOSFETs are known to improve the short channel effect and are traded in the ITRS roadmap as a part of non-classical CMOS, which can provide a path to scaling MOSFETs below the 65 nm node. For the centre of a special vertical layout a silicon web with 300 nm height and 20 nm width is required. The web lines are made by electron beam lithography with hydrogen silsesquioxane (HSQ) as negative tone resist. 23 nm wide and 100 nm high lines in HSQ were attained. The transfer of the structures to substrate by dry etching results in 30 nm wide and 300 nm high silicon lines. First transistors with a channel length of 100 nm and gate oxide thickness of 6 nm were fabricated. These first transistors show transconductances of up to 40 /spl mu/S//spl mu/m.
除了对光刻技术的高要求外,短通道行为也是器件小型化的一个问题。众所周知,双栅mosfet可以改善短通道效应,并且在ITRS路线图中作为非经典CMOS的一部分进行交易,这可以提供缩放mosfet低于65 nm节点的路径。对于特殊垂直布局的中心,需要一个高度为300纳米,宽度为20纳米的硅网。以氢硅氧烷(HSQ)为负色调抗蚀剂,采用电子束光刻技术制作网纹。在HSQ中获得了23 nm宽和100 nm高的谱线。通过干蚀刻将结构转移到衬底上,得到宽30 nm、高300 nm的硅线。首次制备了沟道长度为100 nm、栅极氧化层厚度为6 nm的晶体管。这些第一批晶体管显示出高达40 /spl μ /S//spl μ /m的跨导。
{"title":"Process steps for a double gate MOSFET with vertical layout","authors":"S. Trellenkamp, J. Moers, A. van der Hart, P. Kordos, H. Luth","doi":"10.1109/ASDAM.2002.1088522","DOIUrl":"https://doi.org/10.1109/ASDAM.2002.1088522","url":null,"abstract":"In addition to the high demands on lithography, short channel behaviour is a problem for miniaturisation of devices. Double gate MOSFETs are known to improve the short channel effect and are traded in the ITRS roadmap as a part of non-classical CMOS, which can provide a path to scaling MOSFETs below the 65 nm node. For the centre of a special vertical layout a silicon web with 300 nm height and 20 nm width is required. The web lines are made by electron beam lithography with hydrogen silsesquioxane (HSQ) as negative tone resist. 23 nm wide and 100 nm high lines in HSQ were attained. The transfer of the structures to substrate by dry etching results in 30 nm wide and 300 nm high silicon lines. First transistors with a channel length of 100 nm and gate oxide thickness of 6 nm were fabricated. These first transistors show transconductances of up to 40 /spl mu/S//spl mu/m.","PeriodicalId":179900,"journal":{"name":"The Fourth International Conference on Advanced Semiconductor Devices and Microsystem","volume":"60 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121063560","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
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The Fourth International Conference on Advanced Semiconductor Devices and Microsystem
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