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Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.最新文献

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Characterisation of microfluidic devices 微流体装置的特性
D. Bien, S. Mitchell, H. Gamble
Silicon micromachining techniques have enabled the fabrication of a wide range of microfluidic components and systems. Given the small volumes of liquid and low flow rates involved, the accurate characterisation of such systems presents a challenge. To date many of the measurements have been performed manually; this is both time consuming and prone to inaccuracies. This paper describes an automated measurement technique and presents results for a surface micromachined valve.
硅微加工技术使得制造各种微流体元件和系统成为可能。考虑到液体体积小,流速低,这种系统的准确表征提出了一个挑战。迄今为止,许多测量都是手工进行的;这既耗时又容易出错。本文介绍了一种表面微加工阀门的自动测量技术,并给出了测量结果。
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引用次数: 4
Influence of probing configuration and data set size for bipolar junction capacitance determination 探测结构和数据集大小对双极结电容测定的影响
D. MacSweeney, K. McCarthy, L. Floyd, A. Mathewson, P. Hurley, J. A. Power, S. C. Kelly
In this paper, the on-wafer measurement of junction depletion capacitance is examined. This work provides an in-depth discussion of possible probing configurations which can be used. It outlines a method to consistently measure the junction capacitances accurately. The results from this method compare favourably with those extracted using S-parameter measurements. Additionally a method is formulated to determine the minimum number of data points required to maintain extraction accuracy.
本文研究了在晶片上测量结耗尽电容的方法。这项工作提供了可以使用的可能探测配置的深入讨论。概述了一种连续准确测量结电容的方法。该方法的结果与使用s参数测量提取的结果比较有利。另外,还制定了一种方法来确定维持提取精度所需的最小数据点数。
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引用次数: 1
A comparison of extraction techniques for threshold voltage mismatch 阈值电压失配提取技术的比较
J. A. Croon, Hans Tuinhout, R. Difrenza, J. Knol, A. J. Moonen, Stefaan Decoutere, Herman Maes, Willy Sansen
In this paper commonly used extraction methods of MOSFET threshold voltage mismatch are compared. The V/sub T/ mismatch is extracted on the exact same device population by four independent characterization groups. Significant differences are observed, which are caused by differences in measurement setup and differences in extraction algorithm. The observed differences are analyzed. In addition merits and limitations of the various techniques are evaluated.
本文对MOSFET阈值电压失配的常用提取方法进行了比较。V/sub / T/失配是由四个独立的表征组在完全相同的器件群上提取的。测量设置的不同和提取算法的不同造成了显著的差异。分析了观测到的差异。此外,还对各种技术的优点和局限性进行了评价。
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引用次数: 44
A test structure for the design of thermal flow sensors 一种用于热流传感器测试结构的设计
N. Sabaté, I. Gràcia, J. Santander, C. Cané
A test structure for the design and optimisation of thermal gas flow sensors has been developed. This test structure provides information about the temperature distribution created around a heating element as well as its modification due to a gas flow, thus permitting to obtain information about the thermal conductivity of the membrane material. Data obtained from the characterisation of the structure can be used in the optimisation of a flow sensor designed for any specific application.
研制了一种用于热气体流量传感器设计与优化的测试结构。该测试结构提供了关于在加热元件周围产生的温度分布以及由于气体流动而引起的温度变化的信息,从而允许获得有关膜材料导热性的信息。从结构特征中获得的数据可用于为任何特定应用设计的流量传感器的优化。
{"title":"A test structure for the design of thermal flow sensors","authors":"N. Sabaté, I. Gràcia, J. Santander, C. Cané","doi":"10.1109/ICMTS.2002.1193180","DOIUrl":"https://doi.org/10.1109/ICMTS.2002.1193180","url":null,"abstract":"A test structure for the design and optimisation of thermal gas flow sensors has been developed. This test structure provides information about the temperature distribution created around a heating element as well as its modification due to a gas flow, thus permitting to obtain information about the thermal conductivity of the membrane material. Data obtained from the characterisation of the structure can be used in the optimisation of a flow sensor designed for any specific application.","PeriodicalId":188074,"journal":{"name":"Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127443572","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
CV doping profiling of boron out-diffusion using an abrupt and highly doped arsenic buried epilayer 利用突发性和高掺杂砷埋没涂层的硼向外扩散的CV掺杂分析
C. Ortiz, L. Nanver, W. van Noort, Tlm Scholtes, J. Slotboom
The use of CV measurements to profile the electrically active impurity profile of dopants has long been popular as a fast and non-destructive measurement technique. In this work, an n/sup -/p/sup -/n/sup +/ or ip/sup -/n/sup +/ structure is proposed for CV-doping profiling of the tail of boron-doped regions extending into a lightly doped top layer. The usefulness of this method for the evaluation of boron transient enhanced diffusion (TED) effects in Si and Si/sub 1-x/Ge/sub x/ is demonstrated both experimentally and via simulations.
作为一种快速、非破坏性的测量技术,利用CV测量来测量掺杂剂的电活性杂质分布一直很受欢迎。在这项工作中,提出了一个n/sup -/p/sup -/n/sup +/或ip/sup -/n/sup +/结构,用于掺杂硼区尾部延伸到轻掺杂顶层的cv掺杂分析。通过实验和模拟证明了该方法在Si和Si/sub - 1-x/Ge/sub -x/中评价硼瞬态增强扩散(TED)效应的有效性。
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引用次数: 6
A test circuit for measuring standard deviations of MOSFET channel conductance and threshold voltage 用于测量MOSFET通道电导和阈值电压的标准偏差的测试电路
K. Terada, M. Sumida
A new test circuit is proposed for measuring the standard deviations of both MOSFET channel conductance and threshold voltage. This test circuit consists of the matrix-shape MOSFET array in which several switches and wiring are added. DC currents flowing through this array are measured, changing the ON/OFF states of the switches, and then the standard deviations are calculated from them.
提出了一种新的测试电路,用于测量MOSFET沟道电导和阈值电压的标准差。该测试电路由矩阵形MOSFET阵列组成,其中添加了几个开关和接线。测量流过该阵列的直流电流,改变开关的开/关状态,然后从中计算标准差。
{"title":"A test circuit for measuring standard deviations of MOSFET channel conductance and threshold voltage","authors":"K. Terada, M. Sumida","doi":"10.1109/ICMTS.2002.1193172","DOIUrl":"https://doi.org/10.1109/ICMTS.2002.1193172","url":null,"abstract":"A new test circuit is proposed for measuring the standard deviations of both MOSFET channel conductance and threshold voltage. This test circuit consists of the matrix-shape MOSFET array in which several switches and wiring are added. DC currents flowing through this array are measured, changing the ON/OFF states of the switches, and then the standard deviations are calculated from them.","PeriodicalId":188074,"journal":{"name":"Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.","volume":"163 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120898588","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
A new test structure and characterization methodology to identify array leakage path in Mask ROM 一种新的测试结构和表征方法来识别掩模ROM中的阵列泄漏路径
T. Fan, K.Y. Chan, T. Lu, S. Pan
The array leakage is a crucial issue while developing ultra high-density planar Mask ROM memories. However, it is hard to identify this leakage and its mechanism using the conventional cell array test structure. It is because that because the cell surface punch leakage, cell bulk leakage, and surface buried drain to buried drain (BD to BD) leakage beyond cell channel region all contribute to the total leakage at the same time. In order to identify these leakage paths and reduce this leakage, we design a new cell array test structure and the characterization methodology is also proposed. The main mechanism of cell leakage has been attributed to the surface BD to BD leakage outside the cell array. This leakage path occurs beneath the exposed silicon surface, which doping concentration near this region is lower than that inside the cell array due to oxide spacer over-etching issue and our PMOS blank N-type pocket implantation.
阵列泄漏是开发超高密度平面掩模ROM存储器的关键问题。然而,使用传统的电池阵列测试结构很难识别这种泄漏及其机制。这是因为,由于电池表面冲漏、电池体漏和电池通道区域以外的表面地埋漏到地埋漏(BD到BD)漏同时造成了总泄漏。为了识别这些泄漏路径并减少泄漏,我们设计了一种新的电池阵列测试结构,并提出了表征方法。电池泄漏的主要机制是电池阵列表面的BD泄漏到电池阵列外的BD泄漏。该泄漏路径发生在暴露的硅表面下方,由于氧化物间隔层的过度蚀刻问题和我们的PMOS空白n型口袋植入,该区域附近的掺杂浓度低于电池阵列内部的掺杂浓度。
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引用次数: 1
High frequency test structures definition for electromagnetic coupling study between two symmetrical inductors. Electrical modelling of the whole coupling between coils 两对称电感器电磁耦合研究的高频试验结构定义。线圈之间整体耦合的电气建模
C. Clement, B. van Haaren, D. Gloria
High frequency test structures for electromagnetic coupling study between two symmetrical inductors are described. Results from the S/sub 12/ parameter measurement are compared to HP-Momentum electromagnetic (EM) simulations and show that coupling doesn't reach -25dB and is smaller than -40dB for a separation distance between coils higher than 200/spl mu/m. An electrical modelling of the whole coupling between coils is proposed and compared with experimental results.
介绍了用于两对称电感器电磁耦合研究的高频测试结构。将S/sub - 12/参数测量结果与hp -动量电磁(EM)仿真结果进行了比较,结果表明,当线圈间距大于200/spl mu/m时,耦合不会达到-25dB,耦合小于-40dB。提出了线圈间整体耦合的电学模型,并与实验结果进行了比较。
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引用次数: 4
Novel charge pumping method without using MOS transistor for SOI wafer inspection 不使用MOS晶体管的新型电荷泵送方法用于SOI晶圆检测
T. Takami, H. Yoshida, T. Uchihashi, S. Kishino
A novel charge pumping method without using MOS transistors is proposed for obtaining a spatial distribution of interface traps in an SOI wafer. The proposed method can be performed without fabrication processes for the source/drain of MOS transistors that are essential for conventional charge pumping methods. In this method, Schottky contacts are used instead of the normal source/drain diffused layer. The results demonstrate that the proposed method is effective in applying to SOI wafer inspection.
提出了一种不使用MOS晶体管的电荷泵送方法,用于获得SOI晶圆中界面阱的空间分布。所提出的方法可以在没有传统电荷泵浦方法所必需的MOS晶体管源/漏极制造工艺的情况下进行。在这种方法中,使用肖特基触点代替传统的源/漏扩散层。结果表明,该方法在SOI晶圆检测中是有效的。
{"title":"Novel charge pumping method without using MOS transistor for SOI wafer inspection","authors":"T. Takami, H. Yoshida, T. Uchihashi, S. Kishino","doi":"10.1109/ICMTS.2002.1193194","DOIUrl":"https://doi.org/10.1109/ICMTS.2002.1193194","url":null,"abstract":"A novel charge pumping method without using MOS transistors is proposed for obtaining a spatial distribution of interface traps in an SOI wafer. The proposed method can be performed without fabrication processes for the source/drain of MOS transistors that are essential for conventional charge pumping methods. In this method, Schottky contacts are used instead of the normal source/drain diffused layer. The results demonstrate that the proposed method is effective in applying to SOI wafer inspection.","PeriodicalId":188074,"journal":{"name":"Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122895236","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Wafer-level characterization of EEPROM tunnel oxide using a fast floating-gate technique and a realistic memory cell-based test structure 利用快速浮栅技术和基于真实记忆单元的测试结构,对EEPROM隧道氧化物进行晶片级表征
S. Renard, P. Boivin, J. Autran
We report on the development of a fast characterization technique of EEPROM tunnel oxides based on the floating-gate technique and using a realistic memory cell-based test structure. A sequential measurement procedure and data analysis have been successfully implemented to perform automatic wafer screening of leakage currents in terms of charge retention and tunnel oxide defectivity.
我们报告了一种基于浮栅技术的EEPROM隧道氧化物的快速表征技术的发展,并使用了一个真实的基于存储单元的测试结构。一个连续的测量程序和数据分析已经成功地实现了在电荷保留和隧道氧化物缺陷方面对泄漏电流进行自动晶圆筛选。
{"title":"Wafer-level characterization of EEPROM tunnel oxide using a fast floating-gate technique and a realistic memory cell-based test structure","authors":"S. Renard, P. Boivin, J. Autran","doi":"10.1109/ICMTS.2002.1193187","DOIUrl":"https://doi.org/10.1109/ICMTS.2002.1193187","url":null,"abstract":"We report on the development of a fast characterization technique of EEPROM tunnel oxides based on the floating-gate technique and using a realistic memory cell-based test structure. A sequential measurement procedure and data analysis have been successfully implemented to perform automatic wafer screening of leakage currents in terms of charge retention and tunnel oxide defectivity.","PeriodicalId":188074,"journal":{"name":"Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122532145","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Proceedings of the 2002 International Conference on Microelectronic Test Structures, 2002. ICMTS 2002.
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