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2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)最新文献

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From quasi-static to transient system level ESD simulation: Extraction of turn-on elements 从准静态到瞬态系统级ESD仿真:导通元件的提取
Pub Date : 2016-09-11 DOI: 10.1109/EOSESD.2016.7592563
F. Escudié, F. Caignet, N. Nolhier, M. Bafleur
Transient simulation is a main challenge to achieve system level ESD failure prediction. During the turn-on of the protections, complex phenomena introduce complex transient behaviors. In this paper we investigate the parameters that have to be added to perform accurate transient simulations and we propose a methodology to extract them by measurements.
暂态仿真是实现系统级ESD故障预测的主要挑战。在保护导通过程中,复杂的现象导致了复杂的暂态行为。在本文中,我们研究了为进行精确的瞬态模拟而必须添加的参数,并提出了一种通过测量提取参数的方法。
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引用次数: 10
Spice modelling flow for ESD simulation of CMOS ICs CMOS集成电路ESD仿真的Spice建模流程
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592553
G. Langguth, A. Ille
A SPICE based simulation flow is proposed for ESD verification in standard analog simulation environment. Models contain ESD specific sub-circuits and failure thresholds which are activated on demand. Good agreement with experimental data is proven including bipolar operation and the triggering of parasitic paths. The flow has been successfully tested on real designs.
提出了一种基于SPICE的标准模拟仿真环境下ESD验证的仿真流程。模型包含ESD特定的子电路和故障阈值,可根据需要激活。双极操作和寄生路径的触发与实验数据吻合良好。该流程已成功地在实际设计中进行了测试。
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引用次数: 7
Unique current conduction mechanism through multi wall CNT interconnects under ESD conditions 独特的电流传导机制,通过多壁碳纳米管互连在ESD条件下
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592528
A. Mishra, M. Shrivastava
We present unique physics of ESD current transport through Multi-wall Carbon Nanotubes. Role of substrate, CNT shells and sub-bands in ESD current conduction is highlighted. The quantum electron-phonon transport under non-equilibrium (ESD) conditions is explained using CNT band structure and interplay between electrical and thermal transport along the nanotube.
我们提出了通过多壁碳纳米管传输ESD电流的独特物理特性。强调了衬底、碳纳米管壳和子带在ESD电流传导中的作用。利用碳纳米管的能带结构和沿纳米管的电和热输运之间的相互作用来解释非平衡(ESD)条件下的量子电子-声子输运。
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引用次数: 2
Physics of SOA degradation phenomena in power transistors under ESD conditions 静电放电条件下功率晶体管中SOA退化现象的物理学研究
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592561
Jian-Hsing Lee, N. M. Iyer, Haojun Zhang, M. Prabhu, Patrick Cao Li, Guowei Zhang, T. Tsai
The fundamental physical mechanism decreasing transistor SOA boundary and ID with the increasing transistor total width is identified and reported for the first time. The skin effect, proximity and Hall-effect arising from the large varying-current are attributed to transistor SOA degradation.
首次发现并报道了晶体管SOA边界和ID随晶体管总宽度增加而减小的基本物理机制。由大变电流引起的趋肤效应、接近效应和霍尔效应归因于晶体管SOA退化。
{"title":"Physics of SOA degradation phenomena in power transistors under ESD conditions","authors":"Jian-Hsing Lee, N. M. Iyer, Haojun Zhang, M. Prabhu, Patrick Cao Li, Guowei Zhang, T. Tsai","doi":"10.1109/EOSESD.2016.7592561","DOIUrl":"https://doi.org/10.1109/EOSESD.2016.7592561","url":null,"abstract":"The fundamental physical mechanism decreasing transistor SOA boundary and ID with the increasing transistor total width is identified and reported for the first time. The skin effect, proximity and Hall-effect arising from the large varying-current are attributed to transistor SOA degradation.","PeriodicalId":239756,"journal":{"name":"2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131132643","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Mirrored power distribution network noise injection for soft failure root cause analysis 镜像配电网噪声注入软故障根本原因分析
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592564
Suyu Yang, Benjamin J. Orr, D. Pommerenke, H. Shumiya, J. Maeshima, Taketoshi Sekine, Y. Takita, K. Araki
In this paper a method for separating local soft-failures from distant errors related to noise on the power distribution network (PDN) is demonstrated. Two approaches are used which duplicate the noise on a PDN caused by some intentional injection onto a second system where the intentional injection is not present.
本文提出了一种从配电网络噪声引起的远端错误中分离局部软故障的方法。使用了两种方法,将PDN上由故意注入引起的噪声复制到不存在故意注入的第二个系统上。
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引用次数: 3
ESD robust 800V SCR-JFET with p+ ballast structure ESD稳健800V SCR-JFET, p+镇流器结构
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592524
S. Fujiwara, R. Burton
ESD robustness enhancement study of an 800V JFET including the SCR structure is conducted. A p+ ballast structure is introduced in the device and ESD robustness improvement is demonstrated with 3D TCAD simulations. Based on the TCAD study results, a ballasted device is fabricated and improved ESD performance is successfully obtained.
对包含可控硅结构的800V JFET进行了ESD鲁棒性增强研究。在器件中引入了p+镇流器结构,并通过三维TCAD仿真验证了其ESD稳健性的提高。基于TCAD的研究结果,制作了一个有碴器件,并成功地提高了ESD性能。
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引用次数: 3
Measurement of discharging currents through an IC due to the charged board event using a shielded Rogowski coil 使用屏蔽Rogowski线圈测量由于带电电路板事件而通过IC的放电电流
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592537
Junsik Park, Jong-Sung Lee, Seongmoo Kim, Cheolgu Jo, Byongsu Seol, Jingook Kim
The discharging currents through an IC induced by the charged board event (CBE) is measured using a shielded Rogowski coil. Several shielding techniques are applied in the measurement to reduce the common mode noise and the unexpected electric field coupling. The measured results are validated with the CBE circuit simulations.
使用屏蔽Rogowski线圈测量由带电板事件(CBE)引起的通过IC的放电电流。在测量中采用了几种屏蔽技术来降低共模噪声和意外电场耦合。通过CBE电路仿真验证了测量结果。
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引用次数: 2
TLP IV characterization of a 40 nm CMOS IO protection concept in the powered state 有电状态下40nm CMOS IO保护概念的TLP IV表征
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592566
Benjamin J. Orr, K. Domanski, H. Gossner, D. Pommerenke
In this paper, the interaction between the ESD protection concept and a powered output driver in a 40 nm CMOS process are investigated and characterized by TLP. By using IO test chips designed for HBM and CDM validation, the IV behavior of the pin is measured with the driver placed into various states.
本文研究了40 nm CMOS工艺中ESD保护概念与功率输出驱动器之间的相互作用,并用TLP对其进行了表征。通过使用为HBM和CDM验证设计的IO测试芯片,在驱动器处于不同状态时测量引脚的IV行为。
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引用次数: 3
Case study of DPI robustness of a MOS-SCR structure for automotive applications 汽车用MOS-SCR结构DPI鲁棒性的实例研究
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592538
Yang Xiu, F. Farbiz, A. Salman, Y. Zu, M. Dissegna, G. Boselli, E. Rosenbaum
This paper presents a case study to demonstrate that transient-triggered ESD protection circuits may fail the DPI automotive requirement. A novel scheme is devised to improve the DPI performance of a MOSSCR protection device while maintaining the system-level ESD performance.
本文提出了一个案例研究,以证明瞬态触发ESD保护电路可能无法满足汽车DPI的要求。设计了一种新的方案来提高MOSSCR保护器件的DPI性能,同时保持系统级ESD性能。
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引用次数: 3
EDA approaches in identifying latchup risks 识别锁定风险的EDA方法
Pub Date : 2016-09-01 DOI: 10.1109/EOSESD.2016.7592552
M. Khazhinsky, K. Domanski, Guido Quax, Scott Ruth, F. Farbiz, N. Trivedi, H. Gossner
In this paper we review latchup protection verification methods and EDA challenges. We demonstrate complex static and transient latchup scenarios requiring advanced connectivity analysis. Using various EDA verification flows and tools we study latchup problems associated with grounded n-wells, biased n-wells and parasitic thyristors formed during ESD events.
本文综述了闭锁保护的验证方法和EDA面临的挑战。我们演示了需要高级连接性分析的复杂静态和瞬态闭锁场景。利用各种EDA验证流程和工具,我们研究了与接地n井、偏置n井和在ESD事件中形成的寄生晶闸管相关的锁存问题。
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引用次数: 5
期刊
2016 38th Electrical Overstress/Electrostatic Discharge Symposium (EOS/ESD)
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