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2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)最新文献

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Scaling Millimeter-Wave Phased Arrays: Challenges and Solutions 缩放毫米波相控阵:挑战和解决方案
A. Valdes-Garcia, B. Sadhu, X. Gu, J. Plouchart, M. Yeck, D. Friedman
This paper motivates the need for scaled phased arrays and outlines key challenges for their implementation. Design trade-offs are discussed for important aspects such as beamforming architecture, module-level realization with antennas and packaging, and digital control. Two recently introduced scaled 64-element dual polarized phased array designs are reviewed as implementation examples. (1) A phased array transceiver module operating at 28-GHz supporting 5G applications, and (2) TX and RX phased arrays operating at 94-GHz suitable for backhaul and imaging applications. An outlook for future opportunities with phased array scaling is provided.
本文激发了对缩放相控阵的需求,并概述了其实现的关键挑战。讨论了波束形成架构、天线和封装的模块级实现以及数字控制等重要方面的设计权衡。本文以两种新近推出的64元双极化相控阵设计为实例进行了综述。(1) 28 ghz的相控阵收发模块,支持5G应用;(2)94 ghz的TX和RX相控阵,适用于回程和成像应用。展望了相控阵缩放的未来机会。
{"title":"Scaling Millimeter-Wave Phased Arrays: Challenges and Solutions","authors":"A. Valdes-Garcia, B. Sadhu, X. Gu, J. Plouchart, M. Yeck, D. Friedman","doi":"10.1109/BCICTS.2018.8551062","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551062","url":null,"abstract":"This paper motivates the need for scaled phased arrays and outlines key challenges for their implementation. Design trade-offs are discussed for important aspects such as beamforming architecture, module-level realization with antennas and packaging, and digital control. Two recently introduced scaled 64-element dual polarized phased array designs are reviewed as implementation examples. (1) A phased array transceiver module operating at 28-GHz supporting 5G applications, and (2) TX and RX phased arrays operating at 94-GHz suitable for backhaul and imaging applications. An outlook for future opportunities with phased array scaling is provided.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131709477","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
650 Volt GaN: Highest Quality-Highest Performance Drives Market Ramp 650伏氮化镓:最高质量-最高性能驱动市场斜坡
P. Parikh, YiFeng Wu, Likun Shen, J. Gritters, T. Hosoda, R. Barr, Kurt V. Smith, K. Shono, J. McKay, H. Clement, S. Chowdhury, S. Yea, Peter Smith, L. McCarthy, R. Birkhahn, P. Zuk, Y. Asai
After successful qualification under JEDEC requirements as well as Automotive (Q101) requirements [1], [2], along with the establishment of intrinsic lifetimes with associated failure modes [2], high voltage GaN is now ramping in converter/inverter applications. Among the key applications, compact & high efficiency (including Titanium class) Power supplies for uses such as high performance gaming & cryptocurrency mining as well as data center power are leading the way [3]. Automotive uses including onboard chargers (uni/bi-directional), dc-dc converters and pole chargers are being designed in. Finally industrial users have adopted GaN for compact Servo drives and PV inverters [4]. This paper will review the design, performance and manufacturability of high voltage GaN, establishment of the highest level of quality and reliability standards and key features that led to market ramp.
在成功通过JEDEC要求和汽车(Q101)要求[1],[2],以及建立具有相关失效模式的固有寿命[2]之后,高压GaN现在正在变换器/逆变器应用中迅速发展。在关键应用中,用于高性能游戏和加密货币挖掘以及数据中心电源等用途的紧凑高效(包括钛级)电源处于领先地位[3]。汽车应用包括车载充电器(单/双向),dc-dc转换器和极式充电器正在设计中。最后,工业用户已将氮化镓用于紧凑型伺服驱动器和光伏逆变器[4]。本文将回顾高压氮化镓的设计、性能和可制造性,建立最高水平的质量和可靠性标准,以及导致市场增长的关键特征。
{"title":"650 Volt GaN: Highest Quality-Highest Performance Drives Market Ramp","authors":"P. Parikh, YiFeng Wu, Likun Shen, J. Gritters, T. Hosoda, R. Barr, Kurt V. Smith, K. Shono, J. McKay, H. Clement, S. Chowdhury, S. Yea, Peter Smith, L. McCarthy, R. Birkhahn, P. Zuk, Y. Asai","doi":"10.1109/BCICTS.2018.8550845","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8550845","url":null,"abstract":"After successful qualification under JEDEC requirements as well as Automotive (Q101) requirements [1], [2], along with the establishment of intrinsic lifetimes with associated failure modes [2], high voltage GaN is now ramping in converter/inverter applications. Among the key applications, compact & high efficiency (including Titanium class) Power supplies for uses such as high performance gaming & cryptocurrency mining as well as data center power are leading the way [3]. Automotive uses including onboard chargers (uni/bi-directional), dc-dc converters and pole chargers are being designed in. Finally industrial users have adopted GaN for compact Servo drives and PV inverters [4]. This paper will review the design, performance and manufacturability of high voltage GaN, establishment of the highest level of quality and reliability standards and key features that led to market ramp.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133592730","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Analog Optical RF-Links for Large Radio Telescopes 大型射电望远镜的模拟光学射频链路
J. Weiss
Radio astronomy faces very specific, systematic and environmental challenges regarding signal transport from individual antenna elements to the signal processing station. Here we present how with analog optical links these requirements can be met, specifically for the low-frequency receiver of the Square Kilometre Array (SKA), which will be the world's largest radio telescope when finished. It will comprise more than 100'000 individual antennas, which need to be connected over a distance of up to 10 kilometers.
射电天文学面临着从单个天线元件到信号处理站的信号传输的非常具体的、系统的和环境的挑战。在这里,我们介绍了如何通过模拟光链路来满足这些要求,特别是对于平方公里阵列(SKA)的低频接收器,它将成为世界上最大的射电望远镜。它将由超过10万个单独的天线组成,这些天线需要在长达10公里的距离上连接起来。
{"title":"Analog Optical RF-Links for Large Radio Telescopes","authors":"J. Weiss","doi":"10.1109/BCICTS.2018.8551058","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551058","url":null,"abstract":"Radio astronomy faces very specific, systematic and environmental challenges regarding signal transport from individual antenna elements to the signal processing station. Here we present how with analog optical links these requirements can be met, specifically for the low-frequency receiver of the Square Kilometre Array (SKA), which will be the world's largest radio telescope when finished. It will comprise more than 100'000 individual antennas, which need to be connected over a distance of up to 10 kilometers.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"243 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133748792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Monolithic Attenuator/Limiter Using Nonlinear Resistors 采用非线性电阻的单片衰减/限幅器
S. Schafer, M. Roberg
A novel attenuator/limiter circuit that uses nonlinear GaN epitaxial resistors is presented. The circuit is small, broadband as it does not use any reactive elements, does not use DC bias, and can be integrated on GaN or GaAs with other microwave elements and/or circuits. GaN epitaxial resistors have a saturation current limit which provides a limiting function. Resistive T-and Pi-network attenuators are implemented using GaN epitaxial resistors to limit the total power through the attenuator. A first-order equation of the trade-off between attenuation and flat leakage power is derived. Fabricated circuits show flat leakage powers 0.4 - 10 W with input powers $> mathbf{30 W}$, No noticeable spike-leakage is observed. The limiting attenuator is implemented at the input of an S-band 32 W PA for radar applications, and is shown to protect the input from overdrive while delivering consistent output power after limiter saturation.
提出了一种采用非线性氮化镓外延电阻的新型衰减/限幅电路。电路很小,宽带,因为它不使用任何无功元件,不使用直流偏置,并且可以与其他微波元件和/或电路集成在GaN或GaAs上。氮化镓外延电阻具有饱和限流,它提供了一个限制功能。电阻t和pi网络衰减器使用GaN外延电阻来限制通过衰减器的总功率。导出了衰减与平坦泄漏功率之间的一阶权衡方程。当输入功率为$> mathbf{30 W}$时,制备电路的漏功率为0.4 ~ 10w,无明显的尖峰漏。限制衰减器在雷达应用的s波段32w PA输入端实现,并被证明可以保护输入免于超速,同时在限制器饱和后提供一致的输出功率。
{"title":"Monolithic Attenuator/Limiter Using Nonlinear Resistors","authors":"S. Schafer, M. Roberg","doi":"10.1109/BCICTS.2018.8551095","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551095","url":null,"abstract":"A novel attenuator/limiter circuit that uses nonlinear GaN epitaxial resistors is presented. The circuit is small, broadband as it does not use any reactive elements, does not use DC bias, and can be integrated on GaN or GaAs with other microwave elements and/or circuits. GaN epitaxial resistors have a saturation current limit which provides a limiting function. Resistive T-and Pi-network attenuators are implemented using GaN epitaxial resistors to limit the total power through the attenuator. A first-order equation of the trade-off between attenuation and flat leakage power is derived. Fabricated circuits show flat leakage powers 0.4 - 10 W with input powers $> mathbf{30 W}$, No noticeable spike-leakage is observed. The limiting attenuator is implemented at the input of an S-band 32 W PA for radar applications, and is shown to protect the input from overdrive while delivering consistent output power after limiter saturation.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130646967","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
GaN HEMT for Space Applications 用于空间应用的GaN HEMT
T. Satoh, Ken Osawa, Atsushi Nitta
This paper describes GaN HEMT which was qualified for space applications. For P/L/S-band applications, we have developed high power and high efficiency GaN HEMT which can be used for communication satellite or navigation satellite. The highest power of them is 200W under CW conditions. We also developed high power/gain GaN IM HEMT for X-band applications such as deep space probe satellites or earth observation satellites. These GaN HEMT devices were submitted to space qualification tests that comply with the MIL standard and were confirmed to have sufficient reliability for space applications. We also conducted radiation hardness tests. Radiation resistance is of concern in space applications. Our GaN HEMT was confirmed to have enough robustness for radiation hardness.
本文介绍了适合空间应用的氮化镓HEMT。针对P/L/ s波段的应用,我们开发了高功率,高效率的GaN HEMT,可用于通信卫星或导航卫星。在连续波条件下,其最高功率为200W。我们还开发了用于x波段应用的高功率/增益GaN IM HEMT,如深空探测卫星或地球观测卫星。这些GaN HEMT装置已提交进行符合MIL标准的空间资格测试,并被确认具有足够的空间应用可靠性。我们还进行了辐射硬度测试。在空间应用中,抗辐射是一个值得关注的问题。我们的GaN HEMT被证实具有足够的辐射硬度稳健性。
{"title":"GaN HEMT for Space Applications","authors":"T. Satoh, Ken Osawa, Atsushi Nitta","doi":"10.1109/BCICTS.2018.8551070","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551070","url":null,"abstract":"This paper describes GaN HEMT which was qualified for space applications. For P/L/S-band applications, we have developed high power and high efficiency GaN HEMT which can be used for communication satellite or navigation satellite. The highest power of them is 200W under CW conditions. We also developed high power/gain GaN IM HEMT for X-band applications such as deep space probe satellites or earth observation satellites. These GaN HEMT devices were submitted to space qualification tests that comply with the MIL standard and were confirmed to have sufficient reliability for space applications. We also conducted radiation hardness tests. Radiation resistance is of concern in space applications. Our GaN HEMT was confirmed to have enough robustness for radiation hardness.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"67 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134054494","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
40V High Side PSI5 Transceiver with $65text{dB}mu text{V}$ Conducted Emission Level in a BiCMOS Process BiCMOS工艺中传导发射电平为$65text{dB}mu text{V}$的40V高压PSI5收发器
Sri Navaneeth Easwaran, A. Chen, T. Duryea, D. Rollman
Controlling ElectroMagnetic Interference (EMI) is critical in analog circuits. Specifically in transceivers high slew rates of voltages and currents can interfere with other nearby electronics. On one such emerging automotive standard viz. the Peripheral Sensor Interface (PSI5), the electromagnetic emission from the SYNC pulse generated by the PSI5 transceiver can interfere during communication with the sensor. Known techniques of adding external filters or using Spread Spectrum methods to reduce EMI are not applicable due to cost over head and strict timing requirements. Hence a digitally assisted pulse shaping technique to generate a SYNC pulse with different slopes along with an induced analog ramp at the start of the SYNC pulse to meet timing requirement is proposed in order to reduce the EMI. BiCMOS process is the best choice for speed, accuracy and protection at 40V. This design is implemented and successfully validated on a 40V BiCMOS process. The conducted emission limit is $65text{dB}mu text{V}$ at 200KHz, fully operational for 6V to 40V battery and 100mA current limitation during short to ground conditions at the output.
在模拟电路中,控制电磁干扰(EMI)至关重要。特别是在收发器中,电压和电流的高转换率会干扰附近的其他电子设备。在一种新兴的汽车标准,即外围传感器接口(PSI5)上,PSI5收发器产生的同步脉冲的电磁发射会干扰与传感器的通信。由于成本和严格的时序要求,已知的增加外部滤波器或使用扩频方法来减少EMI的技术并不适用。因此,提出了一种数字辅助脉冲整形技术,以产生具有不同斜率的同步脉冲,并在同步脉冲开始处设置感应模拟斜坡以满足定时要求,以减少电磁干扰。BiCMOS工艺是速度、精度和40V保护的最佳选择。该设计已在40V BiCMOS工艺上实现并成功验证。在200KHz时,传导发射限值为$65text{dB}mu text{V}$,在输出短路至接地条件下,6V至40V电池和100mA电流限制完全工作。
{"title":"40V High Side PSI5 Transceiver with $65text{dB}mu text{V}$ Conducted Emission Level in a BiCMOS Process","authors":"Sri Navaneeth Easwaran, A. Chen, T. Duryea, D. Rollman","doi":"10.1109/BCICTS.2018.8551102","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551102","url":null,"abstract":"Controlling ElectroMagnetic Interference (EMI) is critical in analog circuits. Specifically in transceivers high slew rates of voltages and currents can interfere with other nearby electronics. On one such emerging automotive standard viz. the Peripheral Sensor Interface (PSI5), the electromagnetic emission from the SYNC pulse generated by the PSI5 transceiver can interfere during communication with the sensor. Known techniques of adding external filters or using Spread Spectrum methods to reduce EMI are not applicable due to cost over head and strict timing requirements. Hence a digitally assisted pulse shaping technique to generate a SYNC pulse with different slopes along with an induced analog ramp at the start of the SYNC pulse to meet timing requirement is proposed in order to reduce the EMI. BiCMOS process is the best choice for speed, accuracy and protection at 40V. This design is implemented and successfully validated on a 40V BiCMOS process. The conducted emission limit is $65text{dB}mu text{V}$ at 200KHz, fully operational for 6V to 40V battery and 100mA current limitation during short to ground conditions at the output.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115363406","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
450 GHz $f_{text{T}}$ SiGe:C HBT Featuring an Implanted Collector in a 55-nm CMOS Node $f_{text{T}}$ SiGe:C HBT在55nm CMOS节点上植入集电极
A. Gauthier, J. Borrel, P. Chevalier, G. Avenier, A. Montagne, M. Juhel, R. Duru, L. Clément, C. Borowiak, M. Buczko, C. Gaquière
This paper deals with the optimization of a Si/SiGe HBT featuring an implanted collector and a DPSA-SEG emitter-base architecture. Arsenic and phosphorous doping species are studied. On the one hand, both silicon defects and dopants profiles control are evaluated and on the other hand, hf performances are presented. Carbon-phosphorous co-implantation is also investigated and a state-of-the-art 450 GHz $f_{text{T}}$ HBT compatible with 55-nm MOSFETs is demonstrated through a device layout study.
本文研究了一种具有植入集电极和DPSA-SEG发射基结构的Si/SiGe HBT的优化设计。研究了砷和磷的掺杂种类。一方面对硅缺陷和掺杂物的分布控制进行了评价,另一方面给出了hf的性能。碳磷共植入也进行了研究,并通过器件布局研究展示了兼容55纳米mosfet的最先进的450 GHz $f_{text{T}}$ HBT。
{"title":"450 GHz $f_{text{T}}$ SiGe:C HBT Featuring an Implanted Collector in a 55-nm CMOS Node","authors":"A. Gauthier, J. Borrel, P. Chevalier, G. Avenier, A. Montagne, M. Juhel, R. Duru, L. Clément, C. Borowiak, M. Buczko, C. Gaquière","doi":"10.1109/BCICTS.2018.8551057","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551057","url":null,"abstract":"This paper deals with the optimization of a Si/SiGe HBT featuring an implanted collector and a DPSA-SEG emitter-base architecture. Arsenic and phosphorous doping species are studied. On the one hand, both silicon defects and dopants profiles control are evaluated and on the other hand, hf performances are presented. Carbon-phosphorous co-implantation is also investigated and a state-of-the-art 450 GHz $f_{text{T}}$ HBT compatible with 55-nm MOSFETs is demonstrated through a device layout study.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123879297","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A 2x-Oversampling, 128-GS/s 5-bit Flash ADC for 64-GBaud Applications 一个2倍过采样,128-GS/s 5位Flash ADC,用于64-GBaud应用
Alireza Zandieh, P. Schvan, S. Voinigescu
We report the highest sampling-rate single-chip ADC in any semiconductor technology. The circuit uses a 2x time-interleaved architecture integrating two track-and-hold amplifiers, each driving a 5-bit flash sub-ADC sampled at 64 GHz in antiphase. The digital outputs of the two sub-ADCs feed an on-die 128-GS/s thermometer-coded DAC whose sole purpose is for testing the ADC. The performance of the ADC-DAC combo, including the SFDR, and the ENOB of 4.1 bits up to 32-GHz input signals, was characterized on die and includes the impact of the DAC. The power consumption and layout footprint of the ADC, critical for operation at 128-GS/s, were minimized by employing novel 1-mA Cherry-Hooper comparators and quasi-CML MOS-HBT latches with active peaking, which reduced the footprint of each of the 64 ADC-lanes to $mathbf{10}mumathbf{m 70}mumathbf{m}$. The total power consumption of the ADC is 1.25 W and the total die area of the ADC-DAC chip is $mathbf{1.1}mathbf{mm}timesmathbf{1.9}mathbf{mm}$.
我们报告了在任何半导体技术中采样率最高的单芯片ADC。该电路采用2倍时间交错结构,集成了两个跟踪保持放大器,每个放大器驱动一个5位闪存子adc,采样频率为64 GHz,反相位。两个子ADC的数字输出馈送一个片上128-GS/s温度计编码的DAC,其唯一目的是测试ADC。ADC-DAC组合的性能,包括SFDR和高达32ghz输入信号的4.1位ENOB,在芯片上进行了表征,并包括DAC的影响。通过采用新颖的1-mA Cherry-Hooper比较器和具有有源峰值的准cml MOS-HBT锁存器,最大限度地降低了ADC的功耗和布局占用,从而将64个ADC通道中的每个通道的占用减少到$mathbf{10}mumathbf{m 70}mumathbf{m}$。ADC的总功耗为1.25 W, ADC- dac芯片的总晶片面积为$mathbf{1.1}mathbf{mm}乘以mathbf{1.9}mathbf{mm}$。
{"title":"A 2x-Oversampling, 128-GS/s 5-bit Flash ADC for 64-GBaud Applications","authors":"Alireza Zandieh, P. Schvan, S. Voinigescu","doi":"10.1109/BCICTS.2018.8550990","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8550990","url":null,"abstract":"We report the highest sampling-rate single-chip ADC in any semiconductor technology. The circuit uses a 2x time-interleaved architecture integrating two track-and-hold amplifiers, each driving a 5-bit flash sub-ADC sampled at 64 GHz in antiphase. The digital outputs of the two sub-ADCs feed an on-die 128-GS/s thermometer-coded DAC whose sole purpose is for testing the ADC. The performance of the ADC-DAC combo, including the SFDR, and the ENOB of 4.1 bits up to 32-GHz input signals, was characterized on die and includes the impact of the DAC. The power consumption and layout footprint of the ADC, critical for operation at 128-GS/s, were minimized by employing novel 1-mA Cherry-Hooper comparators and quasi-CML MOS-HBT latches with active peaking, which reduced the footprint of each of the 64 ADC-lanes to $mathbf{10}mumathbf{m 70}mumathbf{m}$. The total power consumption of the ADC is 1.25 W and the total die area of the ADC-DAC chip is $mathbf{1.1}mathbf{mm}timesmathbf{1.9}mathbf{mm}$.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"25 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127680330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
FinFET for mm Wave - Technology and Circuit Design Challenges 用于毫米波的FinFET -技术和电路设计挑战
Steven Callender, W. Shin, Hyung-Jin Lee, S. Pellerano, C. Hull
As next-generation communication systems continue to push to higher operating frequencies, one thing that has grown more uncertain is the technology node which is most suitable for implementing these systems. FinFET CMOS is a viable candidate, offering high-density and low-leakage digital transistors. However, the millimeter-wave (mmWave) capabilities of these devices remain relatively unknown by many. In this paper, we assess the mmWave performance of a FinFET process and discuss the key challenges to mmWave design in deeply-scaled technologies along with design techniques and insight to overcome such challenges. We also demonstrate the suitability of modern FinFET devices for the design of energy-efficient mmWave systems as demonstrated by a 75GHz LNA and PA implemented in Intel's 22FFL process which achieve state-of-art performance.
随着下一代通信系统不断向更高的工作频率推进,越来越不确定的是最适合实现这些系统的技术节点。FinFET CMOS是一个可行的候选,提供高密度和低漏的数字晶体管。然而,这些设备的毫米波(mmWave)功能仍然相对未知。在本文中,我们评估了FinFET工艺的毫米波性能,并讨论了在深度缩放技术中毫米波设计的主要挑战,以及克服这些挑战的设计技术和见解。我们还展示了现代FinFET器件对节能毫米波系统设计的适用性,如在英特尔22FFL工艺中实现的75GHz LNA和PA,其性能达到了最先进的水平。
{"title":"FinFET for mm Wave - Technology and Circuit Design Challenges","authors":"Steven Callender, W. Shin, Hyung-Jin Lee, S. Pellerano, C. Hull","doi":"10.1109/BCICTS.2018.8551125","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8551125","url":null,"abstract":"As next-generation communication systems continue to push to higher operating frequencies, one thing that has grown more uncertain is the technology node which is most suitable for implementing these systems. FinFET CMOS is a viable candidate, offering high-density and low-leakage digital transistors. However, the millimeter-wave (mmWave) capabilities of these devices remain relatively unknown by many. In this paper, we assess the mmWave performance of a FinFET process and discuss the key challenges to mmWave design in deeply-scaled technologies along with design techniques and insight to overcome such challenges. We also demonstrate the suitability of modern FinFET devices for the design of energy-efficient mmWave systems as demonstrated by a 75GHz LNA and PA implemented in Intel's 22FFL process which achieve state-of-art performance.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"89 23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129780160","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 19
Wideband Amplifier with Integrated Power Detector for 100 GHz to 200 GHz mm-Wave Applications 带集成功率检测器的宽带放大器,适用于100ghz至200ghz毫米波应用
Paul Stärke, V. Riess, C. Carta, F. Ellinger
This work presents an amplifier for mm-wave applications reaching a peak gain of 26 dB with a usable bandwidth of up to 98 GHz. The design is optimized for an operating frequency between 100 GHz to 200 GHz and can deliver medium output power levels up to 3 dBm. The total dc power consumption is 70mW. To allow the use in ultra wideband communication systems the group delay variation is kept below 5 ps. As additional feature a power detector with a large dynamic range, covering the linear region of the amplifier, is integrated at the output to allow a direct measurement of the outgoing signal levels. The circuit is fabricated in a 130 nm SiGe BiCMOS process with $mathbf{f}_{max}$ of 500 GHz and covers a core area of only 0.15 mm2.
这项工作提出了一种毫米波应用放大器,峰值增益为26 dB,可用带宽高达98 GHz。该设计针对100 GHz至200 GHz的工作频率进行了优化,可提供高达3 dBm的中等输出功率水平。直流总功耗为70mW。为了允许在超宽带通信系统中使用,组延迟变化保持在5ps以下。作为附加功能,一个具有大动态范围的功率检测器,覆盖放大器的线性区域,集成在输出端,允许直接测量输出信号电平。该电路采用130 nm SiGe BiCMOS工艺制造,$mathbf{f}_{max}$为500 GHz,核心面积仅为0.15 mm2。
{"title":"Wideband Amplifier with Integrated Power Detector for 100 GHz to 200 GHz mm-Wave Applications","authors":"Paul Stärke, V. Riess, C. Carta, F. Ellinger","doi":"10.1109/BCICTS.2018.8550856","DOIUrl":"https://doi.org/10.1109/BCICTS.2018.8550856","url":null,"abstract":"This work presents an amplifier for mm-wave applications reaching a peak gain of 26 dB with a usable bandwidth of up to 98 GHz. The design is optimized for an operating frequency between 100 GHz to 200 GHz and can deliver medium output power levels up to 3 dBm. The total dc power consumption is 70mW. To allow the use in ultra wideband communication systems the group delay variation is kept below 5 ps. As additional feature a power detector with a large dynamic range, covering the linear region of the amplifier, is integrated at the output to allow a direct measurement of the outgoing signal levels. The circuit is fabricated in a 130 nm SiGe BiCMOS process with $mathbf{f}_{max}$ of 500 GHz and covers a core area of only 0.15 mm2.","PeriodicalId":272808,"journal":{"name":"2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129957393","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
期刊
2018 IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)
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