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Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)最新文献

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Process, voltage and temperature compensation of off-chip-driver circuits for sub-0.25-/spl mu/m CMOS technology 低于0.25-/spl μ m CMOS技术的片外驱动电路的工艺、电压和温度补偿
H. Chi, D. Stout, J. Chickanosky
A control circuit that compensates for variations in process, voltage and temperature (PVT) has been developed to control off-chip-driver circuits used for sub-0.25-/spl mu/m technology. The off-chip-driver (OCD), alone with a simple control scheme, delivers a tight impedance tolerance at the output, improving the output signal waveforms. Across-chip length variation (ACLV), the controlled-circuit design and off-chip-driver performance are also discussed.
一种补偿过程、电压和温度(PVT)变化的控制电路已经开发出来,用于控制芯片外驱动电路,用于低于0.25-/spl mu/m的技术。片外驱动器(OCD)单独使用简单的控制方案,在输出端提供紧密的阻抗容限,改善输出信号波形。讨论了跨片长度变化(ACLV)、控制电路设计和片外驱动性能。
{"title":"Process, voltage and temperature compensation of off-chip-driver circuits for sub-0.25-/spl mu/m CMOS technology","authors":"H. Chi, D. Stout, J. Chickanosky","doi":"10.1109/ASIC.1997.617021","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617021","url":null,"abstract":"A control circuit that compensates for variations in process, voltage and temperature (PVT) has been developed to control off-chip-driver circuits used for sub-0.25-/spl mu/m technology. The off-chip-driver (OCD), alone with a simple control scheme, delivers a tight impedance tolerance at the output, improving the output signal waveforms. Across-chip length variation (ACLV), the controlled-circuit design and off-chip-driver performance are also discussed.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133618033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Mixed-signal considerations when integrating systems 集成系统时的混合信号考虑
R. Franzo, M. Diamondstein, L. Rigge, Steve Vandris
Companies such as Lucent Technologies, which was involved in pioneering efforts such as the AT&T DSP16C in 1989, have been integrating mixed-signal and DSP for close to ten years. New techniques and expertise support integration earlier in the product life-cycle with minimal risk. In fact, many mixed-signal integrated solutions implemented by Lucent's technical staff achieved fully functional first silicon. Techniques such as those described in this paper are necessary steps along the way to achieving fully integrated digital communication ultrachips.
朗讯科技(Lucent Technologies)等公司在近十年的时间里一直在整合混合信号和DSP,该公司在1989年参与了AT&T DSP16C等开创性工作。新技术和专业知识支持在产品生命周期的早期以最小的风险进行集成。事实上,朗讯技术人员实施的许多混合信号集成解决方案都实现了全功能的第一硅片。本文中描述的这些技术是实现完全集成的数字通信超级芯片的必要步骤。
{"title":"Mixed-signal considerations when integrating systems","authors":"R. Franzo, M. Diamondstein, L. Rigge, Steve Vandris","doi":"10.1109/ASIC.1997.617009","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617009","url":null,"abstract":"Companies such as Lucent Technologies, which was involved in pioneering efforts such as the AT&T DSP16C in 1989, have been integrating mixed-signal and DSP for close to ten years. New techniques and expertise support integration earlier in the product life-cycle with minimal risk. In fact, many mixed-signal integrated solutions implemented by Lucent's technical staff achieved fully functional first silicon. Techniques such as those described in this paper are necessary steps along the way to achieving fully integrated digital communication ultrachips.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123740036","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An easy approach to formal verification 一种简单的形式验证方法
T. Schlipf, T. Buchner, R. Fritz, M. Helms
Formal verification suffers from the image that it is complicated and requires a lot of mathematical background to be applied successfully. In this paper a methodology is described that adds formal verification (FV) to the verification process without requiring any knowledge of FV languages. It solely uses the finite state machine notation, which is familiar and intuitive to designers. Another problem of FV is state space explosion. If this occurs we can switch to random simulation within an hour without losing any effort. The results show that FV is at least as fast as random simulation and it is superior in terms of verification quality because it is exhaustive.
形式验证被认为是复杂的,需要大量的数学背景才能成功应用。本文描述了一种将形式验证(FV)添加到验证过程的方法,而不需要任何形式验证语言的知识。它只使用有限状态机符号,这对设计人员来说是熟悉和直观的。FV的另一个问题是状态空间爆炸。如果发生这种情况,我们可以在一个小时内切换到随机模拟,而不会失去任何努力。结果表明,FV至少与随机模拟一样快,并且由于它是穷举的,在验证质量方面具有优越性。
{"title":"An easy approach to formal verification","authors":"T. Schlipf, T. Buchner, R. Fritz, M. Helms","doi":"10.1109/ASIC.1997.616990","DOIUrl":"https://doi.org/10.1109/ASIC.1997.616990","url":null,"abstract":"Formal verification suffers from the image that it is complicated and requires a lot of mathematical background to be applied successfully. In this paper a methodology is described that adds formal verification (FV) to the verification process without requiring any knowledge of FV languages. It solely uses the finite state machine notation, which is familiar and intuitive to designers. Another problem of FV is state space explosion. If this occurs we can switch to random simulation within an hour without losing any effort. The results show that FV is at least as fast as random simulation and it is superior in terms of verification quality because it is exhaustive.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121203054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
An improved silicon retina chip with optical input and optical output 一种改进的带有光输入和光输出的硅视网膜芯片
A. Titus, T. Drabik
This paper describes a unique implementation of an optical-in/optical-out focal-plane processor with improved performance and increased control over the output that uses differential difference amplifiers and a clocked-analog scheme. This is accomplished on a single chip and represents a step toward creating a low-power, compact, visual processing system.
本文描述了一种独特的光输入/光输出焦平面处理器的实现,该处理器使用差分放大器和时钟模拟方案,提高了性能并增加了对输出的控制。这是在一个单一的芯片上完成的,代表着朝着创造一个低功耗,紧凑,视觉处理系统的一步。
{"title":"An improved silicon retina chip with optical input and optical output","authors":"A. Titus, T. Drabik","doi":"10.1109/ASIC.1997.616984","DOIUrl":"https://doi.org/10.1109/ASIC.1997.616984","url":null,"abstract":"This paper describes a unique implementation of an optical-in/optical-out focal-plane processor with improved performance and increased control over the output that uses differential difference amplifiers and a clocked-analog scheme. This is accomplished on a single chip and represents a step toward creating a low-power, compact, visual processing system.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"87 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126069600","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Low-voltage floating-gate current mirrors 低压浮栅电流反射镜
Y. Berg, T. Lande, S. Naess
In this paper we propose a novel design of low-voltage current mirrors using floating gates. Floating gate UV-light programmable MOS transistors (FGUVMOS) are used to design current mirrors in low-voltage/low-power analog applications. The capacitive divider inputs to the floating gates can he utilized to reduce current mismatch due to Early effect.
本文提出了一种利用浮栅设计的新型低压电流反射镜。浮栅紫外光可编程MOS晶体管(FGUVMOS)用于设计低压/低功耗模拟应用中的电流反射镜。浮栅的电容分压器输入可以用来减少由于早期效应引起的电流失配。
{"title":"Low-voltage floating-gate current mirrors","authors":"Y. Berg, T. Lande, S. Naess","doi":"10.1109/ASIC.1997.616971","DOIUrl":"https://doi.org/10.1109/ASIC.1997.616971","url":null,"abstract":"In this paper we propose a novel design of low-voltage current mirrors using floating gates. Floating gate UV-light programmable MOS transistors (FGUVMOS) are used to design current mirrors in low-voltage/low-power analog applications. The capacitive divider inputs to the floating gates can he utilized to reduce current mismatch due to Early effect.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116655187","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 24
Substrate coupling in mixed-mode and RF integrated circuits 混合模式和射频集成电路中的衬底耦合
N. Verghese, D. Allstot
This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.
本文综述了混合模式下衬底耦合和射频集成电路。对验证方法进行了回顾,重点介绍了基板的建模技术。提出了一种利用电路、衬底和封装宏观模型的高效衬底耦合仿真方法,并给出了设计实例。
{"title":"Substrate coupling in mixed-mode and RF integrated circuits","authors":"N. Verghese, D. Allstot","doi":"10.1109/ASIC.1997.617025","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617025","url":null,"abstract":"This paper overviews substrate coupling in mixed mode and RF integrated circuits. Verification methods are reviewed with emphasis on modeling techniques for the substrate. An efficient substrate coupling simulation methodology is presented that utilizes macromodels of the circuit, substrate and package, and a design example is illustrated.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114924742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Projections for high performance, minimum power CMOS ASIC technologies: 1998-2010 预测高性能,最低功耗CMOS ASIC技术:1998-2010
A. Bhavnagarwala, B. Austin, J. Meindl
Circuit design techniques minimizing total power drain of a static CMOS gate for a prescribed performance and an operating range of temperatures are employed to project supply voltages, power densities, device threshold voltages and critical path device channel widths for CMOS ASIC technology generations listed in the 1994 NTRS (National Technology Roadmap for Semiconductors) up to the year 2010. These projections are consistent with 1994 NTRS technology and cycle time forecasts and use physical and stochastic models that tightly couple together the device, circuit and system levels of the CMOS ASIC design hierarchy. Verified by HSPICE and actual microprocessor implementations, these models project optimal supply voltages for 0.25-0.07 /spl mu/m generations to scale from 900 mV to 500 mV and power densities to increase from 3 W/cm/sup 2/ to 10 W/cm/sup 2/ in wire limited high performance CMOS ASIC systems.
在规定的性能和工作温度范围内,电路设计技术最大限度地减少静态CMOS栅极的总功率损耗,用于规划1994年NTRS(国家半导体技术路线图)中列出的CMOS ASIC技术世代的电源电压,功率密度,器件阈值电压和关键路径器件通道宽度,直至2010年。这些预测与1994年NTRS技术和周期时间预测一致,并使用物理和随机模型,将CMOS ASIC设计层次的器件,电路和系统级别紧密耦合在一起。经过HSPICE和实际微处理器实现的验证,这些模型预测0.25-0.07 /spl mu/m代的最佳电源电压,从900 mV扩展到500 mV,功率密度从3 W/cm/sup 2/增加到10 W/cm/sup 2/,线限制高性能CMOS ASIC系统。
{"title":"Projections for high performance, minimum power CMOS ASIC technologies: 1998-2010","authors":"A. Bhavnagarwala, B. Austin, J. Meindl","doi":"10.1109/ASIC.1997.617002","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617002","url":null,"abstract":"Circuit design techniques minimizing total power drain of a static CMOS gate for a prescribed performance and an operating range of temperatures are employed to project supply voltages, power densities, device threshold voltages and critical path device channel widths for CMOS ASIC technology generations listed in the 1994 NTRS (National Technology Roadmap for Semiconductors) up to the year 2010. These projections are consistent with 1994 NTRS technology and cycle time forecasts and use physical and stochastic models that tightly couple together the device, circuit and system levels of the CMOS ASIC design hierarchy. Verified by HSPICE and actual microprocessor implementations, these models project optimal supply voltages for 0.25-0.07 /spl mu/m generations to scale from 900 mV to 500 mV and power densities to increase from 3 W/cm/sup 2/ to 10 W/cm/sup 2/ in wire limited high performance CMOS ASIC systems.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"77 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131074547","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
A new digital to analog converter resistor string architecture 一种新的数模转换电阻串结构
P.K. Oborn, D. Comer
This paper introduces a resistor string architecture for implementing a digital to analog converter on a CMOS circuit process. The proposed circuit maintains the advantages of guaranteed monotonicity inherent in previous resistor string architectures but provides a higher efficiency of resistor usage. Using "virtual resistance coding" it is possible to obtain a very high integral and differential linearities (/spl sim/0% LSB). Likewise, this DAC architecture requires only one buffer amplifier, offering potential high-speed operation.
本文介绍了一种在CMOS电路上实现数模转换器的电阻串结构。所提出的电路保持了先前电阻串结构固有的保证单调性的优点,但提供了更高的电阻使用效率。使用“虚拟电阻编码”可以获得非常高的积分和微分线性(/spl sim/0% LSB)。同样,这种DAC架构只需要一个缓冲放大器,提供潜在的高速操作。
{"title":"A new digital to analog converter resistor string architecture","authors":"P.K. Oborn, D. Comer","doi":"10.1109/ASIC.1997.617026","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617026","url":null,"abstract":"This paper introduces a resistor string architecture for implementing a digital to analog converter on a CMOS circuit process. The proposed circuit maintains the advantages of guaranteed monotonicity inherent in previous resistor string architectures but provides a higher efficiency of resistor usage. Using \"virtual resistance coding\" it is possible to obtain a very high integral and differential linearities (/spl sim/0% LSB). Likewise, this DAC architecture requires only one buffer amplifier, offering potential high-speed operation.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"33 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128530422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Design issues for flip-chip ICs in multilayer packages 多层封装倒装ic的设计问题
R. Frye
Flip-chip area array attachment, originally developed for MCM offers IC size reduction and improved operating speed, especially for high-end ASICs with large numbers of I/O. It is also proving to be well-suited for use in single-chip BGA packages. A key problem for most designers having limited experience with the technology, however, is the lack of a widely accepted design methodology. This paper examines the advantages of the flip-chip structure discusses emerging physical design methodologies and points out some of the remaining challenges in flip-chip ASIC design.
最初为MCM开发的倒装片区域阵列附件可减小IC尺寸并提高操作速度,特别是用于具有大量I/O的高端asic。它也被证明非常适合在单芯片BGA封装中使用。然而,对于大多数对该技术经验有限的设计师来说,一个关键问题是缺乏被广泛接受的设计方法。本文探讨了倒装芯片结构的优点,讨论了新兴的物理设计方法,并指出了倒装芯片ASIC设计中存在的一些挑战。
{"title":"Design issues for flip-chip ICs in multilayer packages","authors":"R. Frye","doi":"10.1109/ASIC.1997.617017","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617017","url":null,"abstract":"Flip-chip area array attachment, originally developed for MCM offers IC size reduction and improved operating speed, especially for high-end ASICs with large numbers of I/O. It is also proving to be well-suited for use in single-chip BGA packages. A key problem for most designers having limited experience with the technology, however, is the lack of a widely accepted design methodology. This paper examines the advantages of the flip-chip structure discusses emerging physical design methodologies and points out some of the remaining challenges in flip-chip ASIC design.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130961996","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-power CMOS on-chip voltage reference using MOS PTAT: an EP approach 使用MOS PTAT的低功耗CMOS片上电压基准:一种EP方法
Yoon-Deuk Seo, D. Nam, Byoung-Jin Yoon, I. Choi, Beomsup Kim
This paper presents a new low-power on-chip voltage reference less sensitive to the process variation in an 0.5 /spl mu/m DRAM process where neither reliable BJT nor depletion MOS are available. The proposed voltage reference uses the MOS threshold voltage and a PTAT (proportional to the absolute temperature) voltage generated only from MOS transistors, and achieves considerably good performance at the total current of less than 8 /spl mu/A with an external power supply voltage ranging from 2.8 to 4 V. The measured temperature coefficient is about 360 ppm//spl deg/C at temperatures ranging from 0/spl deg/C to 100/spl deg/C. In addition, an optimization technique is proposed to find a set of optimal parameters in designing circuits.
本文提出了一种新的低功耗片上电压基准,对0.5 /spl mu/m DRAM工艺变化不敏感,既没有可靠的BJT,也没有耗尽MOS。所提出的基准电压使用MOS阈值电压和仅由MOS晶体管产生的PTAT(与绝对温度成正比)电压,并且在外部电源电压范围为2.8至4 V的情况下,在总电流小于8 /spl mu/ a的情况下获得相当好的性能。在0/spl℃至100/spl℃的温度范围内,测量的温度系数约为360 ppm//spl℃。此外,还提出了一种优化技术,在电路设计中找到一组最优参数。
{"title":"Low-power CMOS on-chip voltage reference using MOS PTAT: an EP approach","authors":"Yoon-Deuk Seo, D. Nam, Byoung-Jin Yoon, I. Choi, Beomsup Kim","doi":"10.1109/ASIC.1997.617029","DOIUrl":"https://doi.org/10.1109/ASIC.1997.617029","url":null,"abstract":"This paper presents a new low-power on-chip voltage reference less sensitive to the process variation in an 0.5 /spl mu/m DRAM process where neither reliable BJT nor depletion MOS are available. The proposed voltage reference uses the MOS threshold voltage and a PTAT (proportional to the absolute temperature) voltage generated only from MOS transistors, and achieves considerably good performance at the total current of less than 8 /spl mu/A with an external power supply voltage ranging from 2.8 to 4 V. The measured temperature coefficient is about 360 ppm//spl deg/C at temperatures ranging from 0/spl deg/C to 100/spl deg/C. In addition, an optimization technique is proposed to find a set of optimal parameters in designing circuits.","PeriodicalId":300310,"journal":{"name":"Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)","volume":"120 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1997-09-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122474528","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
期刊
Proceedings. Tenth Annual IEEE International ASIC Conference and Exhibit (Cat. No.97TH8334)
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