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The Fourth International Workshop on Junction Technology, 2004. IWJT '04.最新文献

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The inhomogeneity of Co/p-poly-Si/sub 0.84/Ge/sub 0.16/ Schottky contact Co/p- si /sub 0.84/Ge/sub 0.16/ Schottky接触的非均匀性
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306784
Guang-Wei Wang, G. Ru, X. Qu, Bingzong Li
The Schottky junction Co/p-poly-SiGe was formed by deposition of Co on p-poly-SiGe thin film through ion beam sputtering (IBS) technique. Inhomogeneity of the Co/p-poly-SiGe contact was studied by I-V-T method in a wide temperature range. The parameters of the Schottky structure can be extracted from the thermionic emission model precisely. Our results show that both the Schottky barrier height and ideality factor are strongly temperature dependent and weakly bias dependent. It is ascribed to the spatial inhomogeneity of the Co/p-poly-SiGe interface. And it may be helpful to can explain some observed deviations from the ideal metal-semiconductor contact mode.
采用离子束溅射(IBS)技术将Co沉积在p-poly-SiGe薄膜上,形成Co/p-poly-SiGe肖特基结。采用I-V-T法研究了Co/p-聚sige触点在较宽温度范围内的非均匀性。从热离子发射模型中可以精确地提取肖特基结构的参数。我们的结果表明,肖特基势垒高度和理想因子对温度有很强的依赖性,对偏置有微弱的依赖性。这主要归因于Co/p-poly-SiGe界面的空间非均匀性。这可能有助于解释一些观察到的与理想金属-半导体接触模式的偏差。
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引用次数: 0
Characterization of thin layers in shallow junction technology by quadrupole SIMS 用四极SIMS表征浅结技术中的薄层
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306767
J. Maul, U. Ehrke
This paper reports on routine SIMS applications in SiGe EPI and on Oxynitride process control including the quality control of the SIMS data itself. As an example an advanced SIMS protocol will be discussed for nm-thin high-k layer metrology. This protocol is based on low energy oxygen beam analysis, which provides improved quantification of the N distribution. We will present a new method, which allows accurate location of the interface position and measurement of the SiON layer thickness under this protocol. SiON production process variations have been investigated and will be reported as well.
本文报道了SIMS在SiGe EPI中的常规应用以及氮化氧化过程控制,包括SIMS数据本身的质量控制。作为一个例子,我们将讨论用于纳米薄高k层测量的先进SIMS协议。该方案是基于低能氧束分析,提供了改进的定量氮分布。我们将提出一种新的方法,在此协议下可以精确定位界面位置和测量SiON层厚度。SiON生产工艺的变化已被调查,并将报告。
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引用次数: 0
Self-consistent numerical model and optimization of two-dimensional electron gases for AlGaN/GaN HEMT AlGaN/GaN HEMT二维电子气体自洽数值模型及优化
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306791
Ma Long, Wang Yan, Yu Zhiping, Tian Li-lin
AlGaN/GaN HEMTs, also referred to MODFETs, have been a subject of intense recent investigation and have emerged as attractive candidates for high voltage, high-power operation at microwave frequencies for its high peak electron velocity, saturation velocity, saturation velocity, thermal stability and breakdown fields properties. In this paper, we take account of spontaneous and piezoelectric polarization effect at the hetero-interface in AlGaN/GaN HEMT device and one-dimensional Poisson-Schrodinger equations using nonuniform mesh are solved self-consistently, from which the AlGaN/GaN heterostructure conduction band and the 2DEG density are investigated. The dependences of 2DEG characteristics on the Al mole fraction, the thickness of each layer, the donor concentration and the gate voltage are investigated through simulation, respectively. The influence of spacer layer width on the 2DEG density is calculated for the first time.
AlGaN/GaN hemt,也被称为modfet,近年来一直是研究的热点,并因其峰值电子速度、饱和速度、饱和速度、热稳定性和击穿场特性而成为微波频率下高电压、高功率工作的有吸引力的候选者。本文考虑了AlGaN/GaN HEMT器件中异质界面处的自发极化和压电极化效应,采用非均匀网格自一致地求解一维泊松-薛定谔方程,由此研究了AlGaN/GaN异质结构导带和2DEG密度。通过模拟研究了Al摩尔分数、各层厚度、给体浓度和栅极电压对2DEG特性的影响。首次计算了间隔层宽度对2DEG密度的影响。
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引用次数: 2
Monte Carlo amorphous ion implantation possibility algorithm 蒙特卡罗非晶离子注入可能性算法
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306863
Jinyu Zhang, Shi Xiaokang, K. Suzuki, H. Oka
A novel splitting algorithm called MC-AIPA is proposed for MC (Monte Carlo) ion implantation simulation into amorphous Silicon material. The injection ion is split two virtual ions during each nuclear scattering with target atom. The virtual ions have different energy and weight which is different from other splitting scheme. The high energy virtual ion still runs but the rest position of the low energy virtual ion can be acquired by a pre-calculated database called LERPD (Low Energy Rest Position Database). About 3 orders statistic enhancement can be acquired compared with that of no splitting algorithm in almost the same CPU time.
针对非晶硅材料中MC (Monte Carlo)离子注入模拟,提出了一种新的分裂算法MC- aipa。注入离子在每次与目标原子的核散射过程中分裂成两个虚离子。虚离子具有不同的能量和质量,这与其他分裂方案不同。高能虚离子仍然运行,但低能虚离子的静止位置可以通过预先计算的数据库LERPD (low energy rest position database)获得。在几乎相同的CPU时间内,与不分割算法相比,统计量提高了约3个数量级。
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引用次数: 0
Recent development of nitride semiconductor electronic devices for next generation wireless communications 下一代无线通信用氮化半导体电子器件的最新发展
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306747
Y. Nanishi
This paper reviews potential and present status of AlGaN/GaN HFETs. High potential of these devices for high-power and high-frequency operation are explained from the physical properties of GaN and AlGaN/GaN hetero-structures. Present status of theses device performances are briefly introduced. Over 150 W operation at 2 GHz and 3.2 W operation at 30 GHz has been already achieved so far, verifying high-potential of this :material system. Issues for further improvements of these device performances as well as issues for production level technology are discussed.
本文综述了AlGaN/GaN hfet的潜力和现状。从GaN和AlGaN/GaN异质结构的物理性质解释了这些器件具有高功率和高频工作的高潜力。简要介绍了这些器件的性能现状。到目前为止,已经在2ghz下实现了超过150w的工作功率,在30ghz下实现了3.2 W的工作功率,验证了该材料系统的高潜力。讨论了进一步提高这些装置性能的问题以及生产水平的技术问题。
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引用次数: 1
Device linearity enhancement of InGaP/InGaAs/GaAs camel-gate p-channel pseudomorphic high electron mobility transistor InGaP/InGaAs/GaAs骆驼栅p沟道伪晶高电子迁移率晶体管器件线性度的增强
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306798
J. Tsai, S. Chiu, Ying-Cheng Chu, King-Poul Zhu
A high-performance InGaP/InGaAs/GaAs p-channel pseudomorphic modulation-doped field effect transistor based on p/sup +/-GaAs/n/sup +/-InGaP/p-InGaP camel-like gate structure is demonstrated. Due to the p-n depletion of the camel-like gate and the presence of relatively large /spl Delta/Ev at InGaP/InGaAs heterostructure, an extremely large gate turn-on voltage than 2 V is measured. For a 1/spl times/100 /spl mu/m/sup 2/ device, the experimental results show a maximum saturation current density of -345 mA/mm and a widely broad gate voltage swing than 4 V with 80 % maximum transconductance. Furthermore, the f/sub T/ and f/sub max/ values are 3.1 and 4.8 GHz, respectively.
提出了一种基于p/sup +/-GaAs/n/sup +/-InGaP/p-InGaP骆驼状栅极结构的高性能InGaP/InGaAs/GaAs p沟道伪晶调制掺杂场效应晶体管。由于骆驼状栅极的p-n损耗以及InGaP/InGaAs异质结构中存在较大的δ /Ev,测量到的栅极导通电压大于2 V。对于1/spl倍/100 /spl mu/m/sup 2/器件,实验结果表明,最大饱和电流密度为-345 mA/mm,栅极电压摆幅大于4 V,最大跨导率为80%。f/sub T/和f/sub max/分别为3.1 GHz和4.8 GHz。
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引用次数: 0
Research for SiGe HBT
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306846
Rongkan Liu, D. Liu, U. Koenig, A. Gruhle, Jing Zhang, Kaicheng Li, Luncai Liu, H. Kibbel, U. Zeiler, Yukui Liu, Shiliu Xu, G. Hu
In this paper, a SiGe HBT was described, which was based on a unique process technology. To characterize the SiGe HBT, HP8510C network analyzer, HP83650A synthetic signal sources, HP8517b S parameter measuring systems etc. have been used for radio frequency performances. The measurements showed the satisfactory results. The SiGe HBT cutoff frequency f/sub T/ is 108GHz, and the maximum oscillation frequency f/sub Max/ is 157GHz.
本文介绍了一种基于独特工艺的SiGe HBT。为了对SiGe HBT进行表征,采用了HP8510C网络分析仪、HP83650A合成信号源、HP8517b S参数测量系统等进行射频性能测试。测量结果令人满意。SiGe HBT截止频率f/sub T/为108GHz,最大振荡频率f/sub Max/为157GHz。
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引用次数: 3
I-V-T studies on ternary silicide Co/sub 1-x/Ni/sub x/Si/sub 2//n-Si Schottky contacts 三元硅化物Co/sub - 1-x/Ni/sub -x/ Si/sub - 2/ n-Si肖特基触点的I-V-T研究
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306782
Shiyang Zhu, G. Ru, X. Qu, R. Van Meirhaeghe, S. Forment, Bingzong Li
Ternary silicide Co/sub 1-x/Ni/sub x/Si/sub 2//n-Si(100) contacts with different x value were formed by solid phase reaction of Co/Ni bilayer and substrate Si. Their Schottky barrier properties were studied using the current voltage-temperature (I-V-T) measurements range from 100 to 300K. The I-V-T curves show three typical types, which can be related to the barrier height inhomogeneity. A clean trend is found that the barrier height inhomogeneity increases with increasing the annealing temperature. Ni incorporation reduces not only the silicidation temperature, but also the temperature at which the contact becomes inhomogeneity.
Co/Ni双分子层与衬底Si固相反应形成不同x值的Co/sub - 1-x/Ni/sub -x/ Si/sub - 2/ n-Si三元硅化物(100)。他们的肖特基势垒特性研究使用电流电压-温度(I-V-T)测量范围从100到300K。I-V-T曲线表现出三种典型类型,这与势垒高度的不均匀性有关。随着退火温度的升高,势垒高度不均匀性有明显的增加趋势。镍的掺入不仅降低了硅化温度,而且降低了接触变得不均匀的温度。
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引用次数: 0
Multiple-pulse laser annealing of boron-implanted preamorphized silicon and the process optimization 硼注入预非晶硅的多脉冲激光退火及工艺优化
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306749
B. Cho, D. Poon, L. Tan, M. Bhat, A. See
Advantages of multiple-pulse Laser Thermal Annealing (LTA) with a moderate energy fluence on preamorphized silicon are described. Re-distribution of laser annealed boron junction during subsequent RTA is also studied. A method to optimize the multiple-pulse LTA condition is proposed. It is also demonstrated that Hall analysis can be used as a quick evaluation tool of the integrity of the junctions.
介绍了能量适中的多脉冲激光热退火(LTA)对预非晶硅的优点。研究了激光退火硼结在后续RTA过程中的再分布。提出了一种优化多脉冲LTA条件的方法。结果表明,霍尔分析可以作为一种快速评估连接完整性的工具。
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引用次数: 1
Infusion doping for USJ formation 输注兴奋剂用于USJ的形成
Pub Date : 2004-03-15 DOI: 10.1109/IWJT.2004.1306756
J. Hautala, J. Borland, M. Tabat, W. Skinner
We report for the first time results on infusion doping of boron for ultra shallow junctions (USJ). Using B/sub 2/H/sub 6/ or BF/sub 3/ source gas, the resulting USJ boron dopant profile measured by SIMS shows no evidence of channeling with extreme abruptness of <2.5nm/decade for a 12 nm shallow junction. Infusion doping shows a power log to the 1/3 relationship between energy to junction depth in contrast to the traditional linear fit observed with ion implantation due to nuclear stopping power effects. Boron surface doping levels of 1-2E22/cm/sup 3/ for 2E16/cm/sup 2/ doses were achieved. Dopant activation using low temperature furnace annealing from 450/spl deg/C to 950/spl deg/C were compared using standard 4PP and non-penetrating elastic material 4PP for sheet resistance measurements,on these USJ structures. Also, electrically active dopant profiling was conducted using spreading resistance profile (SRP) for USJ junction depth (Xj) comparison to SIMS. Use of amorphizing implantation resulted in lower Rs values after low temperature SPE annealing.
我们首次报道了硼在超浅结(USJ)中灌注掺杂的结果。使用B/sub 2/H/sub 6/或BF/sub 3/源气体,SIMS测量得到的USJ硼掺杂谱没有通道的证据,在12 nm的浅结处,其极端陡度<2.5nm/ 10年。注入掺杂表现出能量与结深之间的幂对数到1/3的关系,而传统的离子注入由于核停止功率效应而观察到的线性拟合。硼的表面掺杂水平为1-2E22/cm/sup 3/,剂量为2E16/cm/sup 2/。使用标准4PP和非穿透性弹性材料4PP对这些USJ结构的薄片电阻进行测量,比较了在450/spl℃至950/spl℃的低温炉退火下掺杂剂的活化。此外,利用扩展电阻谱(SRP)对USJ结深(Xj)与SIMS进行了电活性掺杂谱分析。采用非晶化注入使低温固相萃取退火后的Rs值降低。
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引用次数: 4
期刊
The Fourth International Workshop on Junction Technology, 2004. IWJT '04.
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