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International Semiconductor Device Research Symposium, 2003最新文献

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Breakdown voltage enhancement of AlGaN/GaN high electron mobility transistors using annealing technique 利用退火技术提高AlGaN/GaN高电子迁移率晶体管的击穿电压
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272020
Jaesun Lee, Dongmin Liu, Wu Lu
A method to enhance the breakdown voltage performance of AlGaN/GaN HEMTs using post-annealing technique is reported in this paper. The transistors were annealed at 900 /spl deg/C for 30 seconds in a rapid thermal annealing system. After metallization, devices were annealed at 700 /spl deg/C in a furnace to improve breakdown voltages. The typical drain current-voltage characteristics of HEMTdevice with 0.3 /spl mu/m gate length and 100 /spl mu/m gate width is studied by experimental results.
本文报道了一种利用后退火技术提高AlGaN/GaN hemt击穿电压性能的方法。在快速热退火系统中,将晶体管在900 /spl度/C下退火30秒。金属化后,器件在炉中以700 /spl℃退火以提高击穿电压。通过实验研究了栅极长度为0.3 /spl mu/m、栅极宽度为100 /spl mu/m的hemt器件的漏极电流-电压特性。
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引用次数: 0
Characterization of tunnel oxides for non-volatile memory (NVM) applications 用于非易失性存储器(NVM)应用的隧道氧化物的表征
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1271982
J. Ackaert, T. Vermeulen, A. Lowe, S. Boonen, T. Yao, J. Prasad, M. Thomason, J. van Houdt, R. Degraeve, L. Haspeslagh, P. Hendrickx
The purpose of this paper is to characterize, to compare different types of tunnel oxides and to determine the impact on the MB (Moving Bit measurement) issues. The measurements and comparison carried out for the following tunnel oxide thickness in the range of 8 to 10 nm is used. They are: (1) Dry oxidation at 900 C which gives acceptable oxide quality in the thickness range of 100 /spl Aring/ (2) 5% O/sub 2/ diluted oxidation at 900 C, (3) 5% O/sub 2/ diluted oxidation at 960 C and (4) Wet oxidation at 750 C which gives superior results even for a minimal oxide thickness of 88.9 /spl Aring/.
本文的目的是表征,比较不同类型的隧道氧化物,并确定对MB(移动钻头测量)问题的影响。下面的隧道氧化物厚度在8到10纳米的范围内进行了测量和比较。它们是:(1)900℃下的干氧化,在100 /spl Aring/厚度范围内提供可接受的氧化物质量;(2)900℃下的5% O/ sub2 /稀释氧化;(3)960℃下的5% O/ sub2 /稀释氧化;(4)750℃下的湿氧化,即使最小的氧化物厚度为88.9 /spl Aring/,也能提供优异的结果。
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引用次数: 0
A novel interband-resonant-tunneling-diode(I-RTD) based high-frequency oscillator 一种新型带间共振隧道二极管(I-RTD)高频振荡器
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272142
D. Woolard, Weidong Zhang, B. Gelmont
A novel type of interband-RTD (I-RTD) based upon staggered-bandgap heterostructures was investigated. A detailed theoretical analysis of the time-dependent characteristics of an I-RTD based upon a type-II resonant tunneling heterostructure is presented. Specifically, an AlGaSb/InAs/AlGaSb double-barrier structure was considered to determine the influence of multi-band transport effects on the static and dynamic behavior of the I-RTD device.
研究了一种基于交错带隙异质结构的新型带间rtd (I-RTD)。对基于ii型谐振隧穿异质结构的I-RTD的时变特性进行了详细的理论分析。具体来说,我们考虑了AlGaSb/InAs/AlGaSb双势垒结构,以确定多波段输运效应对I-RTD器件静态和动态行为的影响。
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引用次数: 4
A low-cost Horizontal Current Bipolar Transistor (HCBT) technology for the BiCMOS integration with FinFETs 一种低成本水平电流双极晶体管(HCBT)技术,用于BiCMOS与finfet的集成
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272372
T. Suligoj, Haitao Liu, J. Sin, K. Tsui, K.J. Chen, P. Biljanovic, K. Wang
In this paper, we present a scaled transistor processed with the improved technology, resulting in the enhancement of its electrical performance. The electrical characteristics such as collector-emitter breakdown, charge sharing of the processed transistor is presented. The electrical properties of HCBTs are compared with the existing LBTs (Lateral Bipolar Transistors). This HCBT technology was applied in the BiCMOS integration with FinFETs.
在本文中,我们提出了一个用改进的技术加工的晶体管,从而提高了它的电性能。给出了该晶体管的集电极-发射极击穿、电荷共享等特性。将HCBTs的电学性能与现有的lbt (Lateral Bipolar transistor)进行了比较。该HCBT技术应用于BiCMOS与finfet的集成。
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引用次数: 5
Temperature variation of nonradiative electron transitions in GaInNAs/GaAs SQW investigated by a piezoelectric photothermal spectroscopy 用压电光热光谱法研究了GaInNAs/GaAs SQW中非辐射电子跃迁的温度变化
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272072
T. Ikari, K. Imai, S. Fukushima, M. Kondow
In this paper, we report on the temperature variation of the piezoelectric photothermal spectroscopy (PPTS) of GaInNAs SQW structure with 5 m thickness and discuss the electron transition mechanism in the well from the viewpoint of nonradiative recombination.
本文报道了5 m厚度GaInNAs SQW结构的压电光热光谱(PPTS)的温度变化,并从非辐射复合的角度讨论了井中的电子跃迁机制。
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引用次数: 0
Compositional pulling effect in high Al-content AlGaN films grown on (0001) sapphire substrates 蓝宝石衬底上生长的高al含量AlGaN薄膜的组分拉扯效应
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272013
Yu-Li Tsai, Cheng-Liang Wang, Po-Hung Lin, W. Liao, J. Gong
In this presentation, we report strain induced compositional pulling phenomenon in high Al content AlGaN films grown on AlN-coated sapphire substrates. It was found that Al constituent in a high Al content AlGaN film was expelled out of the film in the initial stage of the growth followed by the growth of a AlGaN film having higher Al content. The AlGaN films were characterized by X-ray diffractometry (XRD) for composition evaluation. Absorption spectroscopy was employed for the measurements of absorption spectra of the AlGaN films.
在本报告中,我们报道了在镀铝蓝宝石衬底上生长的高铝含量AlGaN薄膜中应变诱导的成分拉扯现象。研究发现,在生长初期,高Al含量的AlGaN膜中的Al成分被排出膜外,随后生长出高Al含量的AlGaN膜。采用x射线衍射(XRD)对制备的AlGaN膜进行了表征,并对其成分进行了评价。采用吸收光谱法测定了海藻酸盐膜的吸收光谱。
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引用次数: 0
Silicon nano-devices and single-electron devices 硅纳米器件和单电子器件
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272179
Y. Takahashi, Y. Ono, A. Fujiwara, K. Nishiguchi, H. Inokawa
Recent progress in CMOS LSI fabrication technology made possible to achieve nanometre-size silicon device. The devices should operate with CMOS transistors to efficiently use high sophisticated CMOS technologies. To achieve high functionality, especially using silicon as a base the difficulty arises in making the coherent length sufficiently longer than the device size. Another candidate is a single-electron transistor (SET), which does not use coherency. The device manipulates a single electron by means of a Coulomb blockade. Fabricating SETs using Si MOS process has been useful in overcoming because SETs were combined with MOSFET. This allows to emphasize the special functionality of SETs like multiple-valued operation, and high voltage gain.
近年来CMOS LSI制造技术的进步使纳米级硅器件的实现成为可能。该器件应与CMOS晶体管一起工作,以有效地利用高精密的CMOS技术。为了实现高功能,特别是使用硅作为基底,困难在于使相干长度足够长于器件尺寸。另一个候选是单电子晶体管(SET),它不使用相干性。该装置通过库仑封锁来操纵单个电子。利用Si MOS工艺制造集态晶体管是一种有效的方法,因为它与MOSFET相结合。这可以强调set的特殊功能,如多值操作和高电压增益。
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引用次数: 2
Heating in multi-emitter SiGe HBTs 多发射极SiGe HBTs的加热
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272048
S. Mcalister, W. Mckinnon, S. Kovacic, H. Lafontaine
Bipolar transistors with multiple emitters are used to achieve high currents and the maximum utilization of emitter area. The multi-emitter SiGe HBTs fabricated in a modified Si BiCMOS technology is studied in this paper. The heating and thermal coupling between the emitters of a multiple emitter SiGe HBT were measured along the emitter length. This measurement provides useful information about the temperature increases in multi-emitter devices and the emitter-emitter thermal coupling. Temperature dependence of the normalized emitter currents and power dependence of the monitored emitter currents were studied through experiments.
采用具有多个发射极的双极晶体管来实现大电流和最大限度地利用发射极面积。研究了采用改进的Si BiCMOS技术制备多发射极SiGe HBTs。测量了多发射极SiGe HBT发射极之间沿发射极长度方向的加热和热耦合。该测量提供了有关多发射极器件温度升高和发射极-发射极热耦合的有用信息。通过实验研究了归一化发射极电流的温度依赖性和被监测发射极电流的功率依赖性。
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引用次数: 0
Heteroepitaxial growth of GaN, AlN, and AlGaN layers on SiC substrates by HVPE HVPE在SiC衬底上异质外延生长GaN、AlN和AlGaN层
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272119
Y. Melnik, O. Kovalenkov, V. Soukhoveev, V. Ivantsov, Y. V. Shapovalova, A. Usikov, V. Dmitriev
Heteroepitaxial growth of group III nitride layers on SiC substrates by hydride vapour phase epitaxy (HVPE) is described in this paper. AlN, GaN, and AlGaN epitaxial layers were grown on 2-inch SiC substrates with a growth rate ranging from 0.2 to 1.5 /spl ges/m/min. The reciprocal space maps for the thin and thick AlN layers grown on SiC substrates is presented. Dependence of etch pit density in AlN layers on layer thickness is illustrated. X-ray theta-omega scan for GaN/AlN/SiC heterostructure was showed.
本文介绍了利用氢化物气相外延(HVPE)在SiC衬底上生长III族氮化物层的异质外延。在2英寸SiC衬底上生长AlN, GaN和AlGaN外延层,生长速率为0.2至1.5 /spl ges/m/min。给出了在SiC衬底上生长的AlN薄层和厚层的互易空间图。说明了AlN层中蚀刻坑密度与层厚的关系。对GaN/AlN/SiC异质结构进行了x射线扫描。
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引用次数: 0
Dependence of film morphology on growth rate in ITO/TPD/Alq/sub 3//Al organic luminescent diodes ITO/TPD/Alq/ sub3 /Al有机发光二极管中薄膜形态对生长速率的影响
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272007
H. Mu, H. Shen, D. Klotzkin
In this paper, we study about the effect of growth kinetics, governed by deposition conditions, on the formation of pinholes is studied in order to optimize the film growth conditions. The morphology of the resultant film observed under an SEM and AFM. Surface morphology of thermal evaporated TPD/Alq/sub 3/double layer show strong dependence on the evaporation rate, and the high evaporation rate, which result in dense and texture films, is more for the illumination of organic luminescent diode.
本文研究了沉积条件下的生长动力学对针孔形成的影响,以优化薄膜的生长条件。在扫描电镜和原子力显微镜下观察所得薄膜的形貌。热蒸发TPD/Alq/sub - 3/双层的表面形貌对蒸发速率有较强的依赖性,高蒸发速率导致薄膜致密且有织构,更有利于有机发光二极管的照明。
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引用次数: 4
期刊
International Semiconductor Device Research Symposium, 2003
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