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International Semiconductor Device Research Symposium, 2003最新文献

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Noise in metamorphic AlGaAsSb/InGaAs/AlGaAsSb HEMTs
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272053
R. Webster, A. Anwar
In this paper, we presents the first measurement of minimum noise figure in AlGaAsSb/InGaAs/AlGaAsSb metamorphic quantum well HEMTs (MHEMTs). MHEMTs allow the development of InGaAs-based HEMTs on inexpensive GaAs substrates in contrast to the rather expensive InP-substrates. A measured low noise figure, F/sub min/ is a function of frequency at different gate biases. This provides an attractive alternative technology for the realization of low noise millimeter wave devices.
在本文中,我们首次测量了AlGaAsSb/InGaAs/AlGaAsSb变质量子阱HEMTs (MHEMTs)的最小噪声系数。与相当昂贵的inp衬底相比,mhemt允许在廉价的GaAs衬底上开发基于ingaas的hemt。测量的低噪声系数F/sub min/是不同门偏置下频率的函数。这为实现低噪声毫米波器件提供了一种有吸引力的替代技术。
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引用次数: 3
Low-frequency noise characteristics of AlSb/InAsSb HEMTs as a function of temperature and illumination AlSb/InAsSb hemt低频噪声特性随温度和光照的变化
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272057
W. Kruppa, J. B. Boos, B. R. Bennett, B. Tinkham
Measurements of the low-frequency noise characteristics of AlSb/InAsSb HEMTs as a function of temperature and illumination are reported in this paper. The primary focus in this paper is on devices in which a digital alloy superlattice of InAs/InSb was used to form an InAsSb channel. This appears to be related to the lower stress in this channel, which is matched to AlSb.
本文报道了AlSb/InAsSb hemt的低频噪声特性随温度和光照的变化。本文主要关注的是使用InAs/InSb的数字合金超晶格来形成InAsSb通道的器件。这似乎与该通道中较低的应力有关,这与AlSb相匹配。
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引用次数: 2
Breakdown voltage enhancement of AlGaN/GaN high electron mobility transistors using annealing technique 利用退火技术提高AlGaN/GaN高电子迁移率晶体管的击穿电压
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272020
Jaesun Lee, Dongmin Liu, Wu Lu
A method to enhance the breakdown voltage performance of AlGaN/GaN HEMTs using post-annealing technique is reported in this paper. The transistors were annealed at 900 /spl deg/C for 30 seconds in a rapid thermal annealing system. After metallization, devices were annealed at 700 /spl deg/C in a furnace to improve breakdown voltages. The typical drain current-voltage characteristics of HEMTdevice with 0.3 /spl mu/m gate length and 100 /spl mu/m gate width is studied by experimental results.
本文报道了一种利用后退火技术提高AlGaN/GaN hemt击穿电压性能的方法。在快速热退火系统中,将晶体管在900 /spl度/C下退火30秒。金属化后,器件在炉中以700 /spl℃退火以提高击穿电压。通过实验研究了栅极长度为0.3 /spl mu/m、栅极宽度为100 /spl mu/m的hemt器件的漏极电流-电压特性。
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引用次数: 0
InP heterojunction bipolar transistor with a selectively implanted collector pedestal 具有选择性植入集电极基座的InP异质结双极晶体管
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272127
Yingda Dong, Yun Wei, Z. Griffith, M. Urteaga, M. Dahlstrom, M. Rodwell
In a mesa structured HBT, a large portion of C/sub bc/originates from the extrinsic base-collector region under the base contact. To reduce extrinsic C/sub bc/, an HBT structure with a selectively implanted collector pedestal and MBE growth, under the HBT intrinsic region is reported. The fabrication steps of the device are implant window and Si ion implant, implant mask removal and HT annealing, HBT structure regrowth and triple-mesa HBT fabrication. The results exhibit low I/sub cbo/ and hence high junction quality can be obtained in a collector pedestal process incorporating regrowth.
在台地结构HBT中,大部分C/sub - bc/来自基底接触下的外部基底集电极区。为了减少外源C/亚bc/,报道了一种HBT结构,该结构具有选择性植入集电极基座和MBE生长,位于HBT本征区域。该器件的制作步骤为植入体窗口和硅离子植入、植入体掩膜去除和高温退火、HBT结构再生和三台面HBT制作。结果显示低I/sub cbo/,因此在结合再生的集电极基座工艺中可以获得高结质量。
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引用次数: 4
Telecom-wavelength electroluminescence from processible quantum dot nanocrystals 可加工量子点纳米晶体的电信波长电致发光
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1271983
E. Sargent
We review light production from quantum dot nanocrystals embedded in a semiconducting polymer. Integrable optoelectronics is facilitated in this processible material system - one which may conveniently be combined with silicon electronics, passive optics, and RF platforms. Synthetic conditions determine nanocrystal diameter and thereby tune, through the quantum size effect, the spectrum of optical emissions from the quantum dots. We show that it is possible to span across and beyond the 1.3-1.6 /spl mu/m spectrum of optical communications. Nonradiative recombination from the nanocrystals' surface is addressed by choosing stabilizing, passivating organic ligands which nevertheless permit energy transfer from polymer to nanocrystals.
我们回顾了嵌入半导体聚合物中的量子点纳米晶体产生的光。在这种可加工材料系统中促进了可积光电子学-可以方便地与硅电子,无源光学和射频平台相结合。合成条件决定了纳米晶体的直径,从而通过量子尺寸效应来调整量子点的光发射光谱。我们表明,跨越和超越光通信的1.3-1.6 /spl mu/m频谱是可能的。通过选择稳定、钝化的有机配体来解决纳米晶体表面的非辐射重组,同时允许能量从聚合物转移到纳米晶体。
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引用次数: 0
The evolution of silicon-on-insulator MOSFETs 绝缘体上硅mosfet的发展
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272131
J. Colinge
This paper deals with evolution of silicon-on-insulator MOSFET. In 1964 partially depleted devices fabricated on silicon-on-sapphire substrates was developed and was successfully used in numerous military and civilian applications and still used to realize commercial HF circuits in fully depleted CMOS. The first fully depleted SOI MOSFET was established in early 1980 with superior transconductance, current drive and subthreshold swing. Double-gate SOI MOSFET was established in 1984 with resemblance of the XMOS structure and good short-channel characteristics. Later vertical-channel MOSFET, triangular-wire SOI MOSFET and /spl Delta/-channel MOSFET was established. Practical implementation of planar double-gate MOSFET was observed in 1990. The evolution of SOI MOSFET seems ineluctable as high drive with short-channel immunity becomes a problem and can no longer be solved by classical approach.
本文讨论了绝缘体上硅MOSFET的发展。1964年,在蓝宝石上硅衬底上制造的部分耗尽器件被开发出来,并成功地用于许多军事和民用应用,并且仍然用于在完全耗尽的CMOS中实现商业高频电路。第一个完全耗尽的SOI MOSFET于1980年初建立,具有优异的跨导性,电流驱动和亚阈值摆幅。双栅SOI MOSFET于1984年问世,具有类似XMOS结构和良好的短沟道特性。后来建立了垂直沟道MOSFET,三角线SOI MOSFET和/spl Delta/沟道MOSFET。1990年观察到平面双栅MOSFET的实际实现。SOI MOSFET的发展似乎不可避免,因为具有短通道抗扰度的高驱动已成为经典方法无法解决的问题。
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引用次数: 9
The analysis, design, and simulation of molecular electronic devices using ab initio based methods: the negative differential resistance 分子电子器件的分析,设计和模拟使用从头算为基础的方法:负差分电阻
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272160
J. Seminario, Roy A. Araujo, Liuming Yan, Yu Ma
Negative differential resistance (NDR) is a characteristics typical of atomistic systems most likely observed in small organic molecules having electronegative groups, which allow trapping electrons and thus changing the electrical characteristics of the molecule. Here we report high level calculations on small wires of gold atoms that shows the existence of NDR. The analysis of molecular electronic devices using ab initio based methods is presented.
负微分电阻(NDR)是原子系统的典型特征,最有可能在具有电负性基团的小有机分子中观察到,这允许捕获电子,从而改变分子的电特性。在这里,我们报告了对金原子小线的高水平计算,显示了NDR的存在。提出了基于从头算的分子电子器件分析方法。
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引用次数: 0
Numerical modeling study of organic pentacene-based MOSFETs 有机五苯基mosfet的数值模拟研究
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272065
D. Prentice, K. Roenker
The operation and performance of the organic, pentacene-based MOSFETs has been studied using a two dimensional, drift-diffusion approach utilizing a commercial numerical device simulator. Organic semiconductors have been proposed as a replacement for amorphous or polycrystalline-based silicon devices for low cost applications such as RF tags and display drivers. While extensive experimental development of these devices has proceeded, their study using device modeling has received comparatively little attention. In this work, the results of device modeling using a commercial simulator will be compared with the experimental reports for pentacene-based, p-channel MOSFETs for both bottom and top contact geometries. The results demonstrate that commercial simulators can be used to model these devices in spite of the nontraditional nature of the hole transport in organic semiconductors.
利用商业数值器件模拟器,采用二维漂移扩散方法研究了有机五苯基mosfet的工作和性能。有机半导体已被提议作为非晶或多晶硅器件的替代品,用于低成本应用,如射频标签和显示驱动器。虽然这些设备的广泛实验开发已经进行,但他们使用设备建模的研究相对较少受到关注。在这项工作中,使用商业模拟器的器件建模结果将与基于五苯的p沟道mosfet的底部和顶部接触几何形状的实验报告进行比较。结果表明,尽管有机半导体中的空穴输运具有非传统的性质,但商用模拟器可以用于模拟这些器件。
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引用次数: 1
Negative differential resistance in silicon-molecule heterostructure 硅分子异质结构中的负微分电阻
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1272064
T. Rakshit, G. Liang, Avik W. Ghosh, S. Datta
This paper demonstrates the negative differential resistance in silicon-molecule heterostructure. The NDR is expected to occur in the positive bias direction for molecules on degenerately doped p-type silicon substrates and in the negative bias direction for degenerately doped n-type substrates.
本文论证了硅分子异质结构中的负微分电阻。对于简并掺杂的p型硅衬底上的分子,NDR将发生在正偏置方向上,而对于简并掺杂的n型衬底,NDR将发生在负偏置方向上。
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引用次数: 1
Strained Si/SiGe technology: status and opportunities 应变Si/SiGe技术:现状与机遇
Pub Date : 2003-12-10 DOI: 10.1109/ISDRS.2003.1271989
W. Haensch
Fabrication of sub-100 nm strained Si/SiGe MOSFETs using CMOS technology have been demonstrated, with current drives enhancements in both NFET and PFET. Material properties of strained Si and SiGe require careful modifications in CMOS process flow. Band offset induced shift in threshold voltages need to be compensated by device design and the difference in dopant diffusion properties also need to be taken into account. SGOI substrates can be fabricated by SIMOX, thermal diffusion of Ge and layer transfer techniques.
利用CMOS技术制造sub- 100nm应变Si/SiGe mosfet已经被证明,在NFET和fet中都有电流驱动增强。应变Si和SiGe的材料特性需要在CMOS工艺流程中仔细修改。带偏引起的阈值电压偏移需要通过器件设计进行补偿,同时还需要考虑掺杂物扩散特性的差异。SGOI衬底可以通过SIMOX、Ge热扩散和层转移技术制备。
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引用次数: 0
期刊
International Semiconductor Device Research Symposium, 2003
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