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Compensation mechanism and transport behaviour of semi-insulating GaAs:Cu 半绝缘GaAs:Cu的补偿机制和输运行为
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570931
B.H. Yang, D. Seghier, H. Gíslason
Semi-insulating conditions are obtained by copper diffusion of n-type GaAs in a conventional compensation process accompanied by an apparent transformation of the EL2 donor into another deep donor that pins the Fermi level. The anomalous temperature dependence of the low electron Hall mobility of the GaAs:Cu samples significantly differs from the usual one in undoped semi-insulating samples. It is suggested that potential fluctuations caused by inhomogeneous impurity distribution in the closely compensated samples may be responsible for the anomalous conduction which is similar to that observed in different types of inhomogeneous semi-insulating material.
在传统的补偿过程中,n型GaAs的铜扩散伴随着EL2供体向另一个固定费米能级的深层供体的明显转变,从而获得了半绝缘条件。GaAs:Cu样品的低电子霍尔迁移率的异常温度依赖性与通常未掺杂的半绝缘样品有显著不同。结果表明,与在不同类型的非均匀半绝缘材料中观察到的异常导电现象类似,在紧密补偿样品中杂质分布不均匀引起的电位波动可能是导致异常导电的原因。
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引用次数: 3
Zn diffusion-induced disordering in semi-insulating, p-doped, and n-doped GaAs/AlGaAs multilayered structures: a comparative study 半绝缘、p掺杂和n掺杂GaAs/AlGaAs多层结构中Zn扩散引起的无序:比较研究
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570877
N. H. Ky
Secondary-ion mass spectrometry and photoluminescence measurements are used to study Zn diffusion into undoped, Be-doped and Si-doped identical GaAs/Al/sub 0.2/Ga/sub 0.8/As multilayered structures. The effective Zn diffusivity and the disordering rate in the undoped sample are larger than those in the Si-doped sample containing a high concentration of column-III vacancy (V/sub III/), while they are smaller than those in the Be-doped sample that may contain column-III interstitials (I/sub III/) A reduction of V/sub III/ concentration in the Si-doped sample and an increase of I/sub III/ concentration in the Be-doped sample are observed after Zn diffusion, Our model proposed on the basis of the "kick-out" mechanism explains well the experimental results.
采用二次离子质谱法和光致发光方法研究了Zn在未掺杂、be掺杂和si掺杂的相同GaAs/Al/sub 0.2/Ga/sub 0.8/As多层结构中的扩散。Zn在未掺杂样品中的有效扩散率和无序率大于含有高浓度III列空位(V/sub III/)的si掺杂样品,而小于可能含有III列空位(I/sub III/)的be掺杂样品。Zn扩散后,si掺杂样品中的V/sub III/浓度降低,be掺杂样品中的I/sub III/浓度升高。我们在“踢出”机制的基础上提出的模型很好地解释了实验结果。
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引用次数: 0
Current-voltage and low frequency noise measurements on LT-InAlAs grown by MBE MBE生长的LT-InAlAs的电流-电压和低频噪声测量
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570932
C. Meva'a, P. Rojo-Romeo, X. Letartre
The properties of InAlAs layers grown lattice matched to InP by molecular beam epitaxy (MBE) were investigated. For a large range of growth conditions (temperature, V/III beam equivalent pressure ratio, doping level), we have detected 3 deep electron trap families E1, E2, and E3 in the material bandgap. The presence of these traps give rise to a defect-assisted tunneling current in the space-charge region of Schottky diodes at low forward and reverse biases. The observed low frequency l/fl in reverse bias is interpreted in terms of fluctuations of the Schottky barrier height.
用分子束外延法(MBE)研究了与InP晶格匹配的InAlAs层的性能。对于大范围的生长条件(温度,V/III光束等效压力比,掺杂水平),我们在材料带隙中检测到3个深电子陷阱族E1, E2和E3。这些陷阱的存在会在肖特基二极管的低正向和反向偏置的空间电荷区产生缺陷辅助的隧道电流。用肖特基势垒高度的波动来解释反向偏置下观测到的低频l/fl。
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引用次数: 0
Raman scattering analysis of SiGe annealed and implanted layers SiGe退火和注入层的拉曼散射分析
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.571086
M. Valakh, B. N. Romaniuk, V. Artamonov, N. Klyui, A. Pérez‐Rodríguez, L. Calvo‐Barrio, C. Serre, J. Morante, B. Dietrich
The effect of thermal annealing and C/sup +/ implantation on the Raman spectra of Si/sub 1-x/Ge/sub x/ (x=0.22, 0.29) strained layers grown on Si is investigated. For the annealed samples, relaxation is only observed after annealing at temperatures higher than 800/spl deg/C. However, full relaxation is not achieved even after annealing at 1050/spl deg/C. Samples annealed at this temperature show a residual stress in the range of 8 Kbars. For the implanted samples (with C peak concentration close to 2%), there is not a substantial shift of the Si-Si mode, in spite of the significant stress compensation in the layers. The strong lattice microdistortion near the C atoms is likely the main reason of this effect.
研究了热退火和C/sup +/注入对Si/sub 1-x/Ge/sub x/ (x=0.22, 0.29)应变层拉曼光谱的影响。对于退火后的样品,只有在高于800/spl℃的温度下退火后才观察到弛豫。然而,即使在1050/spl℃退火后,也不能实现完全弛豫。在此温度下退火的样品显示残余应力在8kbar范围内。对于植入的样品(C峰浓度接近2%),尽管层内存在明显的应力补偿,但Si-Si模式并未发生实质性的转变。C原子附近强烈的晶格微畸变可能是造成这种效应的主要原因。
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引用次数: 1
Noise performance of Si/Si/sub 1-x/Ge/sub x/ n-channel HEMTs and p-channel FETs Si/Si/sub - 1-x/Ge/sub -x/ n沟道hemt和p沟道fet的噪声性能
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.571084
Kuo-Wei Liu, A. Anwar
Noise characteristics are evaluated for SiGe/Si based n-channel HEMTs and p-channel MOSFETs. The analysis is based on a self-consistent solution of Schroedinger and Poisson's equations. The model predicts a superior minimum noise figure for an n-channel HEMT at 77 K. p-channel MOSFETs behave similar to n-channel devices operating at 300 K. The minimum noise figure decreases with increasing quantum well (QW) width for both n- and p-channel devices. However, the p-channel devices are less sensitive to QW width variation. Minimum noise temperature behaves similarly. As observed, a range of doped epilayer thickness exists where the minimum noise figure is a minimum for both n- and p-channel FETs.
对基于SiGe/Si的n沟道hemt和p沟道mosfet的噪声特性进行了评估。分析是基于薛定谔方程和泊松方程的自洽解。该模型预测了77 K时n沟道HEMT的最小噪声系数,p沟道mosfet的性能与工作在300 K时的n沟道器件相似。对于n通道和p通道器件,最小噪声系数随量子阱宽度的增加而减小。然而,p通道器件对QW宽度变化不太敏感。最小噪声温度表现类似。观察到,对于n沟道和p沟道场效应管,存在一个最小噪声系数最小的掺杂薄膜厚度范围。
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引用次数: 0
Be diffusion in InGaAs epitaxial layers during rapid thermal annealing: an effective diffusivity approach and a nonequilibrium model 快速退火过程中InGaAs外延层中的Be扩散:有效扩散率方法和非平衡模型
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570937
J. Marcon, S. Koumetz, K. Ketata, M. Ketata, P. Launay
Be diffusion during post-growth annealing has been studied in InGaAs epitaxial layers. To explain the observed concentration profiles, two models have been proposed. A good agreement has been obtained between experimental and calculated data. The point defect concentration in epitaxial layers during diffusion in InGaAs is also discussed.
在InGaAs外延层中研究了生长后退火过程中Be的扩散。为了解释观测到的浓度分布,提出了两个模型。实验结果与计算结果吻合较好。讨论了InGaAs扩散过程中外延层中的点缺陷浓度。
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引用次数: 0
Ultrafast carrier trapping and high resistivity of MeV energy ion implanted GaAs MeV能量离子注入GaAs的超快载流子俘获和高电阻率
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570873
C. Jagadish, H. Tan, A. Krotkus, S. Marcinkevičius, K. Korona, J. Jasiński, M. Kamińska
The lifetime and resistivity of semi-insulating GaAs implanted with various ions at MeV energies and doses and subsequently annealed at 600/spl deg/C are studied and correlated with the structural and strain field properties. Very short lifetimes were achievable in all samples implanted with As, Ga, Si or O ions. However, high resistivity was only achievable in cases where the implanted ions were not electrically activated as dopants after annealing. In the case of O implants, extremely high resistivity was obtained, presumably due to the additional deep levels associated with O.
研究了以MeV能量和剂量注入不同离子的半绝缘GaAs材料的寿命和电阻率,并对其进行了600/spl℃退火。在所有注入As、Ga、Si或O离子的样品中,寿命都很短。然而,只有在注入的离子在退火后没有作为掺杂剂被电激活的情况下,才能实现高电阻率。在O植入物的情况下,获得了极高的电阻率,可能是由于与O相关的额外深电平。
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引用次数: 3
Temperature dependence of the radiative recombination in GaN 氮化镓辐射复合的温度依赖性
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570887
J. Bergman, B. Monemar, H. Amano, I. Akasaki
We have studied the radiative recombination from two different type of GaN samples using photoluminescence and time resolved photoluminescence, in the temperature range from 2 K to room temperature. The emission at low temperatures is dominated by the recombination of donor bound excitons, with decay time of about 250 ps. At temperatures from 40 K and up to room temperature the free exciton recombination is dominating. In the bulk sample we observe an increase of the measured decay time at temperatures up to 15 K, interpreted as the presence of a dominating radiative recombination for the free exciton. The decay time of the free exciton at higher temperatures is dominated by non-radiative recombination.
我们利用光致发光和时间分辨光致发光技术研究了两种不同类型GaN样品在2 K至室温范围内的辐射复合。低温下的发射主要是供体束缚激子的复合,衰变时间约为250 ps。从40 K到室温,主要是自由激子的复合。在体样品中,我们观察到在温度高达15 K时测量到的衰变时间增加,这被解释为自由激子的主要辐射复合的存在。在较高温度下,自由激子的衰变时间主要由非辐射复合决定。
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引用次数: 1
Conductance properties of as-grown and annealed MBE GaAs layers grown at temperatures between 200 and 420/spl deg/C 在200 ~ 420℃/spl温度下生长和退火的MBE GaAs层的电导特性
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.570872
P. Kordos, J. Betkó, M. Morvic, J. Novák, A. Forster
Precise temperature dependent conductivity measurements are carried out and the room temperature band and hopping components of the conductivity are determined for as-grown and annealed (590/spl deg/C, 10 min) MBE GaAs layers grown at various temperatures between 200 and 420/spl deg/C. It is found that the hopping conductivity strongly decreases and the band conductivity slightly changes with increasing growth temperature. The /spl sigma//sub hop/ to /spl sigma//sub band/ ratio decreases from 1/spl times/10/sup 6/ to 2/spl times/10/sup -2/ in as-grown layers and from 2/spl times/10/sup 2/ to 2/spl times/10/sup -3/ in annealed layers with increased growth temperature from 200 to 420/spl deg/C. The band and hopping components are comparable for unannealed layer grown at 400/spl deg/C and annealed layer grown at 350/spl deg/C. Layers grown at <350/spl deg/C are lattice mismatched in as-grown state. Further it is found that layers with dominating hopping show different electrical breakdown properties than layers with dominating band conductance.
进行了精确的温度相关电导率测量,并确定了电导率的室温带和跳变分量,用于生长和退火(590/spl℃,10分钟)在200至420/spl℃之间的不同温度下生长的MBE GaAs层。随着生长温度的升高,跳变电导率显著降低,能带电导率略有变化。随着生长温度从200 /spl℃升高到420/spl℃,未生长层的/spl sigma//sub hop/与/spl sigma//sub band/比值从1/spl倍/10/sup 6/降低到2/spl倍/10/sup -2/,退火层的/spl倍/10/sup -3/从2/spl倍/10/sup 2/降低到2/spl倍/10/sup -3/。在400/spl℃下生长的未退火层和在350/spl℃下生长的退火层的能带和跳波分量相当。在<350/spl℃条件下生长的层在生长状态下晶格失配。进一步发现,占主导跳变的层与占主导带电导的层表现出不同的电击穿特性。
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引用次数: 4
Computer simulation of the growth of silicon ridges and wires 硅脊和硅线生长的计算机模拟
Pub Date : 1996-04-29 DOI: 10.1109/SIM.1996.571108
S. Keršulis, V. Mitin, R. Malek, M. Djafari Rouhani
We have investigated the growth of heterostructures on the patterned substrates leading to the formation of semiconductor quantum wires (QWRs) using Monte Carlo simulation technique. Our simulation model includes real tetrahedral lattice structure of semiconductor materials, atom-atom interactions out to second nearest neighbors, and surface reconstruction effects. The growth of QWR with the top (001) surface and (111) sidewalls has been shown. The formation of (111) sidewalls with higher quality than that of top (001) surface has been obtained due to higher mobility of atoms on (111) surface.
我们利用蒙特卡罗模拟技术研究了异质结构在图像化衬底上的生长导致半导体量子线(qws)的形成。我们的模拟模型包括半导体材料的真实四面体晶格结构,原子与原子之间的相互作用以及表面重建效应。显示了QWR在(001)表面和(111)侧壁下的生长情况。由于(111)表面原子的迁移率较高,形成的(111)侧壁比顶(001)表面质量更高。
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引用次数: 0
期刊
Proceedings of Semiconducting and Semi-Insulating Materials Conference
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