Applied Microscopy最新文献

Structural evolution of copper oxide nanoparticles is examined, especially with respect to Ostwald ripening under electron beam irradiation. Dissolution of the smaller particles into the larger one was clearly observed at the atomic scale using advanced transmission electron microscope.

Fluorescence imaging of nucleic acids is a very important technique necessary to understand gene expression and the resulting changes in cell function. This mini-review focuses on sequence-specific fluorescence imaging of intracellular RNA and methylated DNA using fluorescent nucleic acid probes. A couple of functional fluorescent nucleic acid probes developed by our laboratory are introduced and the examples of their application to fluorescence imaging of intracellular nucleic acids are described.

As more W replaced Mo in alumina-forming austenitic stainless steels, weight gain by oxidation decreased after 336?h at 1053?K. Electron microscopy revealed slower growth of scale in the presence of more numerous second phases by W addition. The retardation of oxidation was attributed to the necessary partitioning of W in front of the metal-oxide interface. The W-rich second phases interacted with growing oxides and finally transformed to fine particles of metallic W alloy within the scale.

Herein, we synthesize a core/shell Pt/a-CoO_x nanocomposite via one-step synthesis using a strong reaction agent of borane t-butylamine(BBA) at 200?°C. Transmission electron microscopy study shows that the morphology of nanocomposites is controlled by the stirring time and perfect core/shell structure is formed with over 7?days stirring time.

Autophagy, a highly conserved process of eukaryotic cellular recycling, plays an important role in cell survival and maintenance. Dysfunctional autophagy contributes to the pathologies of many human diseases. Many studies have attempted to clarify the process of autophagy. Here, we review morphological studies of autophagy involving electron microscopy.

Two-dimensional materials such as transition metal dichalcogenide and graphene are of great interest due to their intriguing electronic and optical properties such as metal-insulator transition based on structural variation. Accordingly, detailed analyses of structural tunability with transmission electron microscopy have become increasingly important for understanding atomic configurations. This review presents a few analyses that can be applied to two-dimensional materials using transmission electron microscopy.

Contemporary microscopic imaging at near-atomic resolution of diverse embodiments in liquid environment has gained keen interest. In particular, Electron Microscopy (EM) can provide comprehensive framework on the structural and functional characterization of samples in liquid phase. In the past few decades, liquid based electron microscopic modalities have developed tremendously to provide insights into various backgrounds like biological, chemical, nanoparticle and material researches. It serves to be a promising analytical tool in deciphering unique insights from solvated systems. Here, the basics of liquid electron microscopy with few examples of its applications are summarized in brief. The technical developments made so far and its preference over other approaches is shortly presented. Finally, the experimental limitations and an outlook on the future technical advancement for liquid EM have been discussed.

We examined the morphology and ultrastructures of fertilized egg envelopes of glowlight tetra (Hemigrammus erythrozonus) belong to Characidae using light and electron microscopes.

The fertilized eggs were spherical, transparent, demersal, adhesive, and have no oil droplet. The perivitelline space was well-developed and the micropyle was surrounded by 15–20 uplifted lines of egg envelope in a spoke like pattern. The outer surface of egg envelope was rough side with grooves. Also, the total thickness of the fertilized egg envelope was about 2.1–2.3?μm, and the fertilized egg envelope consisted of two layers, an outer adhesive electron-dense layer with grooves and three feather-like lamellae layers. Collectively, these morphological characteristics of fertilized egg and micropyle with spoke-like structure showed family Characidae specificity, and ultrastructures of outer surface and section of fertilized egg envelope showed species specificity.

The present paper gives an overview of surface failures, internal nonconformities and solders joint failures detected by microscopic analysis of electronic assemblies. Optical microscopy (stereomicroscopy) and Fourier-Transform-Infrared (FTIR) microscopy is used for documentation and failure localization on electronic samples surface. For internal observable conditions a metallographic cross-section analysis of the sample is required. The aim of this work is to present some internal and external observable nonconformities which frequently appear in electronic assemblies. In order to detect these nonconformities, optical microscopy, cross section analysis, FTIR-microscopy and scanning electron microscopy with energy dispersive spectrometry (SEM-EDS) were used as analytical techniques.

Focused ion beam method, which has excellent capabilities such as local deposition and selective etching, is widely used for micro-electromechanical system (MEMS)-based in situ transmission electron microscopy (TEM) sample fabrication. Among the MEMS chips in which one can apply various external stimuli, the electrical MEMS chips require connection between the TEM sample and the electrodes in MEMS chip, and a connected deposition material with low electrical resistance is required to apply the electrical signal. Therefore, in this study, we introduce an optimized condition by comparing the electrical resistance for C-, Pt-, and W- ion beam induced deposition (IBID) at 30?kV and electron beam induced deposition (EBID) at 1 and 5?kV. The W-IBID at 30?kV with the lowest electrical resistance of about 30?Ω shows better electrical properties than C- and Pt-IBID electrodes. The W-EBID at 1?kV has lower electrical resistance than that at 5?kV; thus, confirming its potential as an electrode. Therefore, for the materials that are susceptible to ion beam damage, it is recommended to fabricate electrical connections using W-EBID at 1?kV.