Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433112
H. Kitagawa, Wei-heong Tan, S. Takeuchi
This work is motivated by the need for accurate positioning of both adherent and non-adherent cells into arrays that can be integrated with microfluidic channels in high-throughput screening (HTS) for drug discovery. We describe a microfluidic device that allows rapid production of uniform micro hydrogel capsules that can contain cells. Up to 1times104 hydrogel capsules can be simply formed and arrayed simultaneously using microchambers in a 10 mm long microchannel. In this work, alginate was used as the hydrogel capsules that can be dissolved and removed with EDTA; thus samples confined in the capsules are collectable after observation in the array. We demonstrated the microencapsulation of E. coli into alginate capsules, and dissolved the capsules with EDTA successfully.
{"title":"Mass production of uniform alginate capsules for micro cell encapslation using micro chamber array","authors":"H. Kitagawa, Wei-heong Tan, S. Takeuchi","doi":"10.1109/MEMSYS.2007.4433112","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433112","url":null,"abstract":"This work is motivated by the need for accurate positioning of both adherent and non-adherent cells into arrays that can be integrated with microfluidic channels in high-throughput screening (HTS) for drug discovery. We describe a microfluidic device that allows rapid production of uniform micro hydrogel capsules that can contain cells. Up to 1times104 hydrogel capsules can be simply formed and arrayed simultaneously using microchambers in a 10 mm long microchannel. In this work, alginate was used as the hydrogel capsules that can be dissolved and removed with EDTA; thus samples confined in the capsules are collectable after observation in the array. We demonstrated the microencapsulation of E. coli into alginate capsules, and dissolved the capsules with EDTA successfully.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"28 1","pages":"493-496"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81514059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4432994
M. Tani, M. Akamatsu, Y. Yasuda, H. Toshiyoshi
In this paper, we propose a new mechanical design of piezoelectric unimorph actuator that generate large static deflection angle by accumulating angular displacement in a cascaded piezoelectric cantilever formed in a meandering shape. The new actuator design was adopted in a double-gimbal two-dimensional optical scanner of a 4 mm times 6 mm foot print. The scanner delivered a relatively large static angle of mechanical plusmn8.6deg at an applied voltage of 20 Vdc at a non-resonant operation.
在本文中，我们提出了一种新的压电单晶片驱动器的机械设计，该驱动器通过在弯曲形状的级联压电悬臂梁中积累角位移来产生大的静态偏转角。在4 mm × 6 mm脚印的双框架二维光学扫描仪中采用了新的致动器设计。在非谐振操作下，当施加电压为20vdc时，扫描仪提供了相对较大的静态机械角度8.6度。
{"title":"A two-axis piezoelectric tilting micromirror with a newly developed PZT-meandering actuator","authors":"M. Tani, M. Akamatsu, Y. Yasuda, H. Toshiyoshi","doi":"10.1109/MEMSYS.2007.4432994","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4432994","url":null,"abstract":"In this paper, we propose a new mechanical design of piezoelectric unimorph actuator that generate large static deflection angle by accumulating angular displacement in a cascaded piezoelectric cantilever formed in a meandering shape. The new actuator design was adopted in a double-gimbal two-dimensional optical scanner of a 4 mm times 6 mm foot print. The scanner delivered a relatively large static angle of mechanical plusmn8.6deg at an applied voltage of 20 Vdc at a non-resonant operation.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"39 1","pages":"699-702"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80951209","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433105
S. Nagano, T. Shibata, K. Sakoda, M. Inoue, S. Hasaka, T. Takano, T. Ikehara, R. Maeda
Environmental emission volume of green house gases such as SF6 and C4F8, consumed for Si deep etching process in MEMS fabrication, are increasing followed by the MEMS market growth. To reduce the emitted green house gases, alternative C3F6 and IF5 were investigated to be applied for MEMS etching process instead of conventional Bosch process gases. The C3F6 and IF5 gases have very small global warming potential, so that they were useful to reduce over 95% of the green house gases maintaining the good etching performance on both etching rate and etching profile. The reduction of warming gas emission by the new gases is estimated that approximately 43 trees might be conserved during one etching process of a wafer to 300 mum. In addition to this merit, IF5 is found to be applied for anisotropic trench etching without Bosch process.
{"title":"Environment friendly MEMS fabrication: Proposal of new D-RIE process gases for reduction of green house effect","authors":"S. Nagano, T. Shibata, K. Sakoda, M. Inoue, S. Hasaka, T. Takano, T. Ikehara, R. Maeda","doi":"10.1109/MEMSYS.2007.4433105","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433105","url":null,"abstract":"Environmental emission volume of green house gases such as SF<sub>6</sub> and C<sub>4</sub>F<sub>8</sub>, consumed for Si deep etching process in MEMS fabrication, are increasing followed by the MEMS market growth. To reduce the emitted green house gases, alternative C<sub>3</sub>F<sub>6</sub> and IF<sub>5</sub> were investigated to be applied for MEMS etching process instead of conventional Bosch process gases. The C<sub>3</sub>F<sub>6</sub> and IF<sub>5</sub> gases have very small global warming potential, so that they were useful to reduce over 95% of the green house gases maintaining the good etching performance on both etching rate and etching profile. The reduction of warming gas emission by the new gases is estimated that approximately 43 trees might be conserved during one etching process of a wafer to 300 mum. In addition to this merit, IF<sub>5</sub> is found to be applied for anisotropic trench etching without Bosch process.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"75 1","pages":"341-344"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91493813","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4432964
J. Gaspar, Y. Nurcahyo, P. Ruther, O. Paul
This paper reports on the mechanical characterization of microtensile specimens made of silicon nitride (SiNx) thin-films with integrated 2D reflective gratings. By applying an axial force, the structures respond mechanically with an elongation and contraction in the longitudinal and transversal directions, respectively. The corresponding variations of both periods of the grating are monitored in real time by measuring the diffraction pattern resulting from the illumination of the grating with monochromatic light. The strain components are thus evaluated locally in the structure. By integrating such an optical technique with an efficient test structure previously developed, the extraction of materials' Young's modulus E, Poisson's ratio nu, residual strain epsivres and stress sigmares and fracture strength sigma0 is in principle made possible from the measurement of a single test structure. Here we demonstrate the extraction of E, epsivres, sigmares and sigma0 of the nitride films.
{"title":"Mechanical characterization of silicon nitride thin-films using microtensile specimens with integrated 2D diffraction gratings","authors":"J. Gaspar, Y. Nurcahyo, P. Ruther, O. Paul","doi":"10.1109/MEMSYS.2007.4432964","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4432964","url":null,"abstract":"This paper reports on the mechanical characterization of microtensile specimens made of silicon nitride (SiNx) thin-films with integrated 2D reflective gratings. By applying an axial force, the structures respond mechanically with an elongation and contraction in the longitudinal and transversal directions, respectively. The corresponding variations of both periods of the grating are monitored in real time by measuring the diffraction pattern resulting from the illumination of the grating with monochromatic light. The strain components are thus evaluated locally in the structure. By integrating such an optical technique with an efficient test structure previously developed, the extraction of materials' Young's modulus E, Poisson's ratio nu, residual strain epsivres and stress sigmares and fracture strength sigma0 is in principle made possible from the measurement of a single test structure. Here we demonstrate the extraction of E, epsivres, sigmares and sigma0 of the nitride films.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"69 1","pages":"223-226"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77910115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433096
B. D. Sosnowchik, Liwei Lin
In this work, we report a rapid yet simple methodology for the synthesis of carbon nanotubes (CNTs) in a room temperature environment using an inductive heating system with either a) bulk synthesis on silicon chips, or b) local synthesis on suspended MEMS structures. This setup enables growth and integration of CNTs with MEMS structures in a matter of 1-2 minutes. For bulk synthesis, high growth rates of up to 200 mum/min were obtained, resulting in growth of vertically aligned CNTs with an average diameter of 6.8nm. Integration from bulk- grown CNTs on MEMS structures resulted in lower resistances from larger diameter CNTs. Localized synthesis and integration was also obtained on suspended copper microstructures, illustrating an ohmic CNT response with a resistance of 110 kOmega. The breadth of synthesis and integration capabilities enabled by inductive heating illustrates a new class of rapid synthesis for vapor-liquid-solid-grown nanostructures.
{"title":"Rapid synthesis of carbon nanotubes by bulk and localized inductive heating","authors":"B. D. Sosnowchik, Liwei Lin","doi":"10.1109/MEMSYS.2007.4433096","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433096","url":null,"abstract":"In this work, we report a rapid yet simple methodology for the synthesis of carbon nanotubes (CNTs) in a room temperature environment using an inductive heating system with either a) bulk synthesis on silicon chips, or b) local synthesis on suspended MEMS structures. This setup enables growth and integration of CNTs with MEMS structures in a matter of 1-2 minutes. For bulk synthesis, high growth rates of up to 200 mum/min were obtained, resulting in growth of vertically aligned CNTs with an average diameter of 6.8nm. Integration from bulk- grown CNTs on MEMS structures resulted in lower resistances from larger diameter CNTs. Localized synthesis and integration was also obtained on suspended copper microstructures, illustrating an ohmic CNT response with a resistance of 110 kOmega. The breadth of synthesis and integration capabilities enabled by inductive heating illustrates a new class of rapid synthesis for vapor-liquid-solid-grown nanostructures.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"143 1","pages":"835-838"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80313966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433135
J. Tong, M. Priebe, Yu Sun
This paper presents the design, fabrication, and testing results of silicon cantilevers with carbon nanotubes (CNTs) as active strain sensing elements. A batch microfabrication process was developed for device construction and packaging. Multi-walled carbon nanotubes (MWNTs) were dielectrophoretically assembled between electrodes. Based on the characterization results of 12 devices, the CNT-based cantilevers demonstrated a linear relationship between resistance changes and externally applied strain. The gauge factor ranged from 78.84 to 134.40 for four different microelectrode configurations.
{"title":"Carbon nanotube-based strain sensing cantilevers","authors":"J. Tong, M. Priebe, Yu Sun","doi":"10.1109/MEMSYS.2007.4433135","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433135","url":null,"abstract":"This paper presents the design, fabrication, and testing results of silicon cantilevers with carbon nanotubes (CNTs) as active strain sensing elements. A batch microfabrication process was developed for device construction and packaging. Multi-walled carbon nanotubes (MWNTs) were dielectrophoretically assembled between electrodes. Based on the characterization results of 12 devices, the CNT-based cantilevers demonstrated a linear relationship between resistance changes and externally applied strain. The gauge factor ranged from 78.84 to 134.40 for four different microelectrode configurations.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"33 1","pages":"843-846"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76166025","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433149
Ming-Yuan Cheng, W.-Y. Chang, L. Tsao, S.-A. Yang, Y. Yang, W. Shih, F. Chang, S. Chang, K. Fan
This paper presents the design, fabrication and measurement of a flexible 8 times 8 temperature and tactile sensing array which will be used as the artificial skin for robot applications. The temperature and pressure sensing elements are heterogeneously integrated on a flexible copper-PI film using micromachining techniques. The tactile sensing elements are fabricated by dispensing conductive polymer on the pre-defined inter-digital copper electrodes. Discrete temperature sensor chips are employed as the temperature sensing elements. Scanning circuits are implemented and experimental results are also provided.
{"title":"Design and fabrication of an artificial skin using PI-copper films","authors":"Ming-Yuan Cheng, W.-Y. Chang, L. Tsao, S.-A. Yang, Y. Yang, W. Shih, F. Chang, S. Chang, K. Fan","doi":"10.1109/MEMSYS.2007.4433149","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433149","url":null,"abstract":"This paper presents the design, fabrication and measurement of a flexible 8 times 8 temperature and tactile sensing array which will be used as the artificial skin for robot applications. The temperature and pressure sensing elements are heterogeneously integrated on a flexible copper-PI film using micromachining techniques. The tactile sensing elements are fabricated by dispensing conductive polymer on the pre-defined inter-digital copper electrodes. Discrete temperature sensor chips are employed as the temperature sensing elements. Scanning circuits are implemented and experimental results are also provided.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"8 1","pages":"389-392"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79509343","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433083
Yusaku Watanabe, Masanori Maeda, N. Yaji, R. Nakamura, H. Iseki, M. Yamato, T. Okano, Sadao Hori, Satoshi Konishi
This paper proposes a novel surgical tool for the retinal pigment epithelium (RPE) sheet transplantation. The proposed tool employs the principle of pneumatic balloon actuator (PBA). It is possible to design small, soft and safe surgical tool by using PBA because PBA is made of PDMS and driven by pneumatic pressure. These distinctive characteristics of PBA are attractive for such a challenging surgery as the RPE sheet transplantation in an eyeball. The designed head size of tool is 3 mm times 3 mm times 100 mum by taking account of the size of the RPE sheet (3 mm times 3 mm). The developed tool can perform sequential motions through independent control of different PBA so as to introduce and transplant the RPE sheet to an eyeball. Generated force by the movement of the transplantation tool is measured around 3 mN, which is allowable in an eyeball. Experimental results of both in vitro and in vivo test by using the developed tool will be reported to demonstrate feasibility of our strategy.
{"title":"Small, soft, and safe microactuator for retinal pigment epithelium transplantation","authors":"Yusaku Watanabe, Masanori Maeda, N. Yaji, R. Nakamura, H. Iseki, M. Yamato, T. Okano, Sadao Hori, Satoshi Konishi","doi":"10.1109/MEMSYS.2007.4433083","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433083","url":null,"abstract":"This paper proposes a novel surgical tool for the retinal pigment epithelium (RPE) sheet transplantation. The proposed tool employs the principle of pneumatic balloon actuator (PBA). It is possible to design small, soft and safe surgical tool by using PBA because PBA is made of PDMS and driven by pneumatic pressure. These distinctive characteristics of PBA are attractive for such a challenging surgery as the RPE sheet transplantation in an eyeball. The designed head size of tool is 3 mm times 3 mm times 100 mum by taking account of the size of the RPE sheet (3 mm times 3 mm). The developed tool can perform sequential motions through independent control of different PBA so as to introduce and transplant the RPE sheet to an eyeball. Generated force by the movement of the transplantation tool is measured around 3 mN, which is allowable in an eyeball. Experimental results of both in vitro and in vivo test by using the developed tool will be reported to demonstrate feasibility of our strategy.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"100 1","pages":"659-662"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78014345","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433153
Yuejun Zhao, U. Yi, S. Cho
This paper describes highly efficient in-droplet particle concentrations/separations (over 92% efficiency), where target particles are concentrated/separated within a droplet by traveling wave dielectrophoresis (twDEP) and a subsequent EWOD (electrowetting-on-dielectric) actuation physically splits target-rich regions into individual droplets. This in-droplet method will provide a new functionality of separation/concentration for digital (droplet-based) microfluidics [1], thereby possibly eliminating the necessity of adopting the conventional continuous-flow-based separation methods.
{"title":"Highly efficient in-droplet particle concentration and separation by twDEP and EWOD for digital microfluidics","authors":"Yuejun Zhao, U. Yi, S. Cho","doi":"10.1109/MEMSYS.2007.4433153","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433153","url":null,"abstract":"This paper describes highly efficient in-droplet particle concentrations/separations (over 92% efficiency), where target particles are concentrated/separated within a droplet by traveling wave dielectrophoresis (twDEP) and a subsequent EWOD (electrowetting-on-dielectric) actuation physically splits target-rich regions into individual droplets. This in-droplet method will provide a new functionality of separation/concentration for digital (droplet-based) microfluidics [1], thereby possibly eliminating the necessity of adopting the conventional continuous-flow-based separation methods.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"59 1","pages":"537-540"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76819659","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2007-01-01DOI: 10.1109/MEMSYS.2007.4433150
C. Iliescu, Bangtao Chen, J. Miao
This paper addresses the main issues related to wet micromachining of one of the mostly used BioMEMS materials - glass - and proposes two optimized solutions for deep wet etching. As a result, 500 mum-thick Pyrex glass wafer was etched using an etching mask consisting of low stress amorphous silicon (a: Si) and photoresist. Moreover we report the successful through etching of 1 mm Pyrex glass wafer using a combination of low stress a: Si/SiC/photoresist mask.
{"title":"Deep wet etching-through 1mm pyrex glass wafer for microfluidic applications","authors":"C. Iliescu, Bangtao Chen, J. Miao","doi":"10.1109/MEMSYS.2007.4433150","DOIUrl":"https://doi.org/10.1109/MEMSYS.2007.4433150","url":null,"abstract":"This paper addresses the main issues related to wet micromachining of one of the mostly used BioMEMS materials - glass - and proposes two optimized solutions for deep wet etching. As a result, 500 mum-thick Pyrex glass wafer was etched using an etching mask consisting of low stress amorphous silicon (a: Si) and photoresist. Moreover we report the successful through etching of 1 mm Pyrex glass wafer using a combination of low stress a: Si/SiC/photoresist mask.","PeriodicalId":6388,"journal":{"name":"2007 IEEE 20th International Conference on Micro Electro Mechanical Systems (MEMS)","volume":"98 3 1","pages":"393-396"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72709419","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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