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[Proceedings 1991] Third International Conference Indium Phosphide and Related Materials最新文献

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The growth and characterization of epitaxial single crystal LaF/sub 3/ on InP InP上外延单晶LaF/ sub3 /的生长与表征
C. L. Griffiths, R. Williams
The growth of crack-free single crystal layers of the insulator LaF/sub 3/ on the
绝缘子LaF/sub 3/上无裂纹单晶层的生长
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引用次数: 0
Temperature dependence of the electrical characteristics and radiation damage in MOCVD grown n/sup +/p InP solar cells MOCVD生长n/sup +/p InP太阳能电池电学特性和辐射损伤的温度依赖性
R. Walters, R.L. Statler, G. Summers
I-V curve measurements of high efficiency InP solar cells that were illuminated in a deep level transient spectrometer (DLTS) cryostat which allowed precise control of the cell temperature from 90 to 400 K are discussed. A set of temperature variation coefficients for the photovoltaic parameters consistent over all the cells and a clear characterization of the damage induced in the cells by proton irradiation are described. The radiation induced defects were first measured by DLTS on the actual solar cells, and then I-V measurements were done at 90 K. It is shown that, at this low temperature, the I-V measurement did not induce injection annealing. The measurements were repeated following forward bias injection annealing of the solar cell. The results show the actual DLTS spectrum corresponding to the changes in the solar cell performance.<>
本文讨论了在深能级瞬态光谱仪(DLTS)低温恒温器照射下,电池温度精确控制在90 ~ 400k范围内的高效InP太阳能电池的I-V曲线测量。一组温度变化系数的光伏参数一致,在所有的细胞和质子辐照诱导的细胞损伤的明确表征描述。首先在实际太阳能电池上用DLTS测量辐射诱导缺陷,然后在90 K下进行I-V测量。结果表明,在此低温下,I-V测量没有引起注射退火。在太阳能电池正偏压注入退火后,重复测量。结果显示了与太阳能电池性能变化相对应的实际DLTS光谱。
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引用次数: 0
Growth of 的增长
T. I. Ejim
The growth of large diameter twin-free InP single crystals in the
大直径无双晶InP单晶的生长
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引用次数: 10
Semi-insulating behavior of Cu doped InP Cu掺杂InP的半绝缘性能
R. Leon, M. Kamińska, Z. Liliental-Weber, K. Yu, M. Chandramouli, E. Weber
Results from electrical measurements, as well as lattice site determination, structural, and X-ray energy dispersive studies of Cu doping on InP, are presented. Hall measurements of carrier concentration as a function of inverse temperature show that InP:Cu exhibits semi-insulating behavior after diffusion with Cu at temperatures exceeding 700 degrees C. Similar measurements of carrier concentration and mobility show that samples exhibited properties typical of hopping conductivity when diffused at temperatures below 700 degrees C. Particle induced X-ray emission (PIXE) performed with channeling in the <110>, <100>, and <111> directions shows a random distribution of Cu, which is typically seen when precipitates are present. Transmission electron microscopy (TEM) indicates the presence of numerous small spherical crystalline precipitates in the samples, and microdiffraction and energy dispersion spectroscopy (EDS) analysis indicates that the most probable phase of these precipitates is In/sub x/Cu.<>
本文介绍了铜在InP上掺杂的电测量结果、晶格位置测定、结构和x射线能量色散研究。载流子浓度随温度变化的霍尔测量结果表明,InP:Cu在超过700℃的温度下与Cu扩散后表现出半绝缘行为。载流子浓度和迁移率的类似测量结果表明,样品在低于700℃的温度下扩散时表现出典型的跳变电导率特性。方向显示铜的随机分布,这是沉淀存在时的典型特征。透射电镜(TEM)分析表明,样品中存在大量细小的球形结晶相,微衍射和能谱分析(EDS)表明,这些析出相最有可能是in /sub x/Cu。
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引用次数: 1
Passivation technology using an ultrathin Si interface control layer for air-exposed InGaAs surfaces 使用超薄硅界面控制层的钝化技术用于空气暴露的InGaAs表面
H. Hasegawa, M. Akazawa, E. Ohue
The growth of a surface passivation structure for In/sub 0.53/Ga/sub 0.47/As that utilizes an ultrathin molecular beam epitaxial (MBE) Si interface control layer (ICL) is discussed. The structure was realized by growing all the layers, including the MBE InGaAs layer, the MBE-Si ICL, and the outer photo-CVD SiO/sub 2/ layer, in a UHV-based system without air exposure. It is shown that by utilizing a suitable surface treatment technique prior to the growth of the Si ICL, the surface passivation technology becomes applicable to air-exposed InGaAs surfaces.<>
讨论了利用超薄分子束外延(MBE) Si界面控制层(ICL)的In/sub 0.53/Ga/sub 0.47/As表面钝化结构的生长。该结构是通过在基于uhv的系统中生长所有层来实现的,包括MBE InGaAs层、MBE- si ICL层和外部光- cvd SiO/sub 2/层。结果表明,通过在Si ICL生长之前采用合适的表面处理技术,表面钝化技术可以适用于空气暴露的InGaAs表面
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引用次数: 0
High barrier height Schottky diodes on n-InP by low temperature deposition n-InP上低温沉积高势垒肖特基二极管
Z. Shi, R. Wallace, W. Anderson
The formation of ultra-high barrier height ( phi /sub B/=0.96 eV) Schottky contacts to n-InP, without an intentionally grown interfacial oxide, using metal deposition on a substrate cooled to as low as 77 K is discussed. Values of phi /sub B/=0.46-0.52 eV for diodes deposited at room temperature (RT=300 K) agree and give an ideality factor near unity. For diodes deposited at a low temperature (LT) of 77 K, the leakage current density (J/sub 0/) is reduced by more than 6-7 orders of magnitude with respect to the RT diodes. The phi /sub B/ for the LT diodes is increased from 0.48 to 0.96 eV for Pd metal and from 0.51 to 0.85 eV for Au metal, respectively. The conduction mechanisms for the LT and RT diodes are found to be controlled by thermionic-field emission (TFE) and thermionic emission (TE), respectively. It is shown that an alteration of the metal-induced interface states, inhibition of surface segregation of the released In and P atoms, and very uniform metal coverage may be responsible for the distinct differences between the RT and LT diodes.<>
本文讨论了在冷却至77k的衬底上使用金属沉积,在没有有意生长界面氧化物的情况下,与n-InP形成超高势垒高度(phi /sub B/=0.96 eV)的肖特基触点。在室温下(RT=300 K)沉积的二极管的phi /sub B/=0.46-0.52 eV值一致,并给出了接近统一的理想因子。对于在77 K低温下沉积的二极管,泄漏电流密度(J/sub 0/)相对于RT二极管降低了6-7个数量级以上。对于钯金属,LT二极管的phi /sub B/分别从0.48 eV增加到0.96 eV,而对于金金属,则从0.51 eV增加到0.85 eV。热离子场发射(TFE)和热离子发射(TE)分别控制了LT和RT二极管的传导机制。结果表明,金属诱导的界面态的改变、释放的In和P原子的表面偏析的抑制以及非常均匀的金属覆盖可能是造成RT和LT二极管之间明显差异的原因。
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引用次数: 0
Annealing and bulk crystal growth of undoped InP under controlled P-pressure: a perspective for the preparation of undoped SI InP? 可控p压下未掺杂InP的退火和体晶生长:制备未掺杂SI InP的前景?
G. Hirt, D. Hofmann, F. Mosel, N. Schafer, G. Muller
Nominally undoped semi-insulating InP is prepared reproducibly. The electrical properties of a large series of undoped InP samples, before and after annealing under controlled phosphorus pressure, are presented. Spectroscopic investigations show that iron is incorporated during annealing, but native defects have to be taken into consideration in order to explain the electrical data. Based on a survey of intrinsic defects in InP and on PL measurements of crystals with different stoichiometries, a perspective is given for the growth of undoped semi-insulating InP under controlled phosphorus pressure.<>
可重复制备名义上未掺杂的半绝缘InP。研究了大量未掺杂InP样品在可控磷压下退火前后的电学性能。光谱研究表明,铁在退火过程中被掺入,但为了解释电数据,必须考虑到天然缺陷。通过对InP中固有缺陷的研究和不同化学计量晶体的PL测量,给出了控制磷压下未掺杂半绝缘InP生长的前景。
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引用次数: 0
Effects of PCl/sub 3/ addition on ECR CH/sub 4//H/sub 2//Ar plasma etching of InP and InGaAs PCl/ sub3 /加入对InP和InGaAs ECR CH/ sub4 //H/ sub2 //Ar等离子体刻蚀的影响
S. Pearton, A. Katz, U. Chakrabarti
A hybrid electron cyclotron resonance (ECR)/radiofrequency (RF) plasma etching system used to study the etching characteristics of InP and InGaAs in CH/sub 4/H/sub 2/-based discharges is described. It was found that the materials retain smooth surface morphologies for microwave powers below 150 W. At higher microwave powers the surface becomes rough due to preferential removal of the group V species. The quality of Au Schottky diode contacts on InP degrades for high-bias etching, but the addition of PCl/sub 3/ to the discharge retards this degradation by providing an overpressure of P. The room-temperature photoluminescence intensity of InP is preserved by the PCl/sub 3/ addition. The use of CH/sub 3/Cl in preference to CH/sub 4/ to increase the etch rate of InGaAs was investigated and this appears to have few advantages since the etch rates are comparable to those with CH/sub 4//H/sub 2/. The degree of polymer deposition during CH/sub 4//H/sub 2/Ar etching on the type of mask used (photoresist, W, or SiO/sub 2/) is discussed.<>
描述了一种电子回旋共振/射频等离子体混合刻蚀系统,用于研究InP和InGaAs在CH/sub - 4/H/sub - 2/基放电中的刻蚀特性。结果表明,当微波功率低于150w时,材料表面形貌保持光滑。在较高的微波功率下,由于优先去除V族物质,表面变得粗糙。在高偏置蚀刻中,铟磷上的Au - Schottky二极管触点的质量会下降,但在放电中加入PCl/sub - 3/可以通过提供p的超压来延缓这种下降,PCl/sub - 3/可以保持铟磷的室温光致发光强度。研究了使用CH/sub 3/Cl而不是CH/sub 4/ Cl来提高InGaAs的蚀刻速率,这似乎没有什么优势,因为其蚀刻速率与CH/sub 4//H/sub 2/的蚀刻速率相当。讨论了CH/sub 4/ H/sub 2/Ar刻蚀过程中聚合物沉积的程度对所用掩膜类型(光刻胶、W或SiO/sub 2/)的影响。
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引用次数: 0
RF and noise characterization of a monolithically integrated receiver on InP InP上单片集成接收机的射频和噪声特性
U. Feiste, R. Kaiser, G. Mekonnen, C. Schramm, D. Trommer, G. Unterborsch
A comprehensive characterization of an optoelectronic integrated circuit (OEIC) receiver that uses an optical waveguide is given. Bias dependent signal and noise measurements show that the gain-bandwidth product increases from 1.4 GHz at zero bias operation to 2.7 GHz at the optimum bias voltages. The receiver input noise is dominated by the JFET channel noise. Using an equivalent circuit model for the receiver, agreement between the calculated and the measured data was found. From the measured input noise, an optical sensitivity of -29 dBm was evaluated at a bit rate of 576 Mb/s (BER=10/sup -9/).<>
给出了一种使用光波导的光电集成电路(OEIC)接收器的综合特性。偏置相关的信号和噪声测量表明,增益带宽积从零偏置工作时的1.4 GHz增加到最佳偏置电压下的2.7 GHz。接收端输入噪声主要由JFET通道噪声控制。利用等效电路模型对接收机进行了计算,结果与实测数据吻合。根据测量的输入噪声,在比特率为576mb /s (BER=10/sup -9/)时,评估了- 29dbm的光学灵敏度。
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引用次数: 0
Recent advances in dry etching processes for InP-based materials 铟磷基材料干蚀刻工艺研究进展
U. Niggebrugge
The advances towards high-quality dry etching techniques for InP-based materials are reviewed, including recent results on process induced damage. Methods of in situ etch depth control are discussed, and examples of devices advantageously fabricated by dry etching techniques are presented.<>
综述了铟磷基材料高质量干法蚀刻技术的进展,包括工艺损伤方面的最新研究成果。讨论了原位刻蚀深度控制的方法,并列举了采用干刻蚀技术制备器件的实例。
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引用次数: 4
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[Proceedings 1991] Third International Conference Indium Phosphide and Related Materials
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