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[Proceedings 1991] Third International Conference Indium Phosphide and Related Materials最新文献

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On the current transport across isotype heterojunctions investigated on InP-based BRS-lasers 基于inp的brs激光器跨同型异质结的电流输运研究
H. Bach, F. Fidorra
An evaluation of the temperature resolved I-V characteristics in connection with corresponding I-V simulations of homojunction and heterojunction test diodes in the high current regime (>1000 A cm/sup -2/), where the minimization of the additional series resistances for the heterodiode is of crucial importance, is presented. Proper design of layer sequence, composition, and growth provides low series resistance for the heterodiode and high turn-on voltage for the homodiode. A detailed analysis is presented of the intrinsic series resistance of the laser heterodiode, which results from two regions: the transition between the upper p-GaInAs contact and the p-InP cladding layers (also valid for the homojunctions), and the transition between the updoped GaInAsP (1.55 mu m) active and lower n-InP buffer layers. In both isotype junctions the inherent band edge discontinuities for the majority carriers are detrimental at high current densities.<>
在高电流条件下(>1000 A cm/sup -2/),异质结和异质结测试二极管的相应I-V模拟中,对温度分辨I-V特性进行了评估,其中异质结的附加串联电阻的最小化是至关重要的。适当的层序、组成和生长设计可以为异质二极管提供低串联电阻和高导通电压。详细分析了激光异质二极管的本征串联电阻,该电阻来自两个区域:上层p-GaInAs接触层与p-InP包层之间的过渡(也适用于同质结),以及上掺杂的GaInAsP (1.55 μ m)有源层与下层n-InP缓冲层之间的过渡。在这两种同型结中,大多数载流子固有的带边缘不连续在高电流密度下是有害的。
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引用次数: 0
InGaAsP diode lasers with high intrinsic bandwidth 具有高固有带宽的InGaAsP二极管激光器
J. Schlafer, E. Meland, R. Lauer, R. Holmstrom, J. Lacourse, C. Su
The intrinsic frequency response and the maximum modulation bandwidths of lasers with extremely large intrinsic resonance frequencies and thus with very high 3 dB modulation bandwidth potential are discussed. It is shown that in the absence of electrical parasitics. the modulation bandwidths approach 50 GHz and that the lasers, characterized by a large differential gain, are capable of achieving very high bandwidths at relatively low operating powers.<>
讨论了具有极大本征共振频率的激光器的固有频率响应和最大调制带宽,从而具有非常高的3db调制带宽电位。结果表明,在没有电寄生的情况下。调制带宽接近50 GHz,并且具有大差分增益的激光器能够在相对较低的工作功率下实现非常高的带宽。
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引用次数: 1
A high speed low capacitance laser structure for integration 一种用于集成的高速低电容激光器结构
R. Ash, D. Robbins, P. Charles, G. Jones, P. Fell, A. Wood, N. Carr
A laser structure for use at microwave frequencies that has reduced parasitic capacitance and resistance and is suitable for integration with other optoelectronic components is described. The fabrication of two devices is discussed: a 1.3- mu m bulk device with a liquid-phase epitaxy (LPE)-grown active region and an all metalorganic vapor phase epitaxy (MOVPE) 1.55- mu m multiple-quantum-well distributed feedback (DFB) laser. The devices were bonded active side up onto metal carriers for assessment with connections being made using short bond wires to a microstrip line terminated in a 50- Omega load and fed by a shape memory alloy (SMA) launcher. Measurements of light-current characteristics showed threshold currents of 15 mA for 250- mu m-long uncoated lasers and external differential quantum efficiencies up to 25% facet at 25 degrees C for the 1.3- mu m devices. The results of large- and small-signal measurements of the lasers are presented.<>
描述了一种用于微波频率的激光器结构,该结构具有降低的寄生电容和电阻,并且适合与其他光电元件集成。讨论了两种器件的制作方法:一种是1.3 μ m的具有液相外延(LPE)生长有源区的体器件,另一种是全金属有机气相外延(MOVPE) 1.55 μ m的多量子阱分布反馈(DFB)激光器。设备主动侧朝上连接到金属载体上进行评估,使用短键合线连接到微带线,微带线端接在50 ω负载上,并由形状记忆合金(SMA)发射器馈电。光电流特性的测量表明,250 μ m长无涂层激光器的阈值电流为15 mA, 1.3 μ m器件的外部差分量子效率在25℃时高达25%。给出了激光器的大信号和小信号测量结果
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引用次数: 2
An InAlAs/InAs MODFET InAlAs/InAs MODFET
C. C. Eugster, T.P.E. Broekaert, J. A. D. Alamo, Clifton G. Fonstad
The fabrication and testing of an InAs modulation-doped field-effect transistor (MODFET) using an epitaxial heterostructure based entirely on arsenides are discussed. The heterostructure was grown by molecular beam epitaxy (MBE) on InP and contains a 30 A InAs channel. An L/sub G/=2 mu m device displays well behaved characteristics, showing sharp pinch-off (V/sub th/=-0.8 V) and small output conductance (5 mS/mm) at 300 K. The maximum transconductance is 170 mS/mm with a maximum drain current of 312 mA/mm. Strong channel quantization results in breakdown voltage of -9.6 V, a severalfold improvement over previous InAs MODFETs based on antimonides. Low-temperature magnetic field measurements show strong Shubnikov-de Haas oscillations from which the electron channel is confirmed to be the InAs layer.<>
讨论了一种完全基于砷化物的外延异质结构的掺砷化铟调制场效应晶体管(MODFET)的制备和测试。该异质结构通过分子束外延(MBE)在InP上生长,并包含一个30 a的InAs通道。L/sub / G =2 μ m器件在300 K时表现出尖锐的断路(V/sub /=-0.8 V)和小的输出电导(5 mS/mm)。最大跨导为170 mS/mm,最大漏极电流为312 mA/mm。强通道量化导致击穿电压为-9.6 V,比以前基于锑化物的InAs modfet提高了几倍。低温磁场测量显示出强烈的舒布尼科夫-德哈斯振荡,由此电子通道被确认为InAs层。
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引用次数: 19
Contribution to the growth of InP and InGaAsP optoelectronic device materials by atmospheric- and low-pressure MOVPE using tertiarybutylphosphine 利用叔丁基膦常压和低压MOVPE生长InP和InGaAsP光电器件材料的贡献
A. Ougazzaden, R. Mellet, Y. Gao, E. Rao, A. Mircea
The realization of 1.3- mu m laser devices with active light-emitting layers grown from the alternative phosphorous precursor tertiary butylphosphine (TBP) instead of phosphine is discussed. In addition to better safety, an advantage of TBP is easier achievement of high composition uniformity due to a smaller influence of the growth temperature. The main drawback of TBP is its price, which is much higher than for phosphine.<>
讨论了用替代磷前驱体叔丁基膦(TBP)代替磷化氢生长有源发光层的1.3 μ m激光器件的实现。除了更好的安全性外,TBP的优点是由于生长温度的影响较小,更容易实现高成分均匀性。TBP的主要缺点是价格,比磷化氢高得多。
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引用次数: 1
EC-V profiling of InP InP的EC-V谱分析
M. Faur, C. Vargas, M. Goradia
The electrochemical current-voltage profiling of p, n, p/sup +/, and n/sup +/ liquid encapsulated Czochralski (LEC) or VGE grown InP substrates. thermally diffused n/sup +/p and p/sup +/n, and epitaxially grown n/sup +/p InP structures using an electrolyte called FAP is described. It found that the FAP electrolyte is inherently superior to previously reported electrolytes (0.5 M HCl and the Pear etch) for performing accurate EC-V profiling of InP at current densities of up to 0.3 mA/cm/sup 2/.<>
p, n, p/sup +/和n/sup +/液体封装的chzochralski (LEC)或VGE生长在p衬底的电化学电流-电压谱。本文描述了热扩散的n/sup +/p和p/sup +/n,以及使用一种称为FAP的电解质外延生长的n/sup +/p InP结构。研究发现,在高达0.3 mA/cm/sup /的电流密度下,FAP电解质在执行InP的精确EC-V分析方面,本质上优于先前报道的电解质(0.5 M HCl和Pear蚀刻液)。
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引用次数: 2
RTA study of thermal stability and interdiffusion of InGaAs/InP quantum wells-the influence of InGaAs cap layers InGaAs/InP量子阱热稳定性和互扩散的RTA研究——InGaAs帽层的影响
J. Oshinowo, A. Forchel, D. Grutzmacher, M. Stollenwerk
A study of the thermal stability of InGaAs/InP quantum wells with different top barrier compositions that used rapid thermal annealing at temperatures between 600 degrees C and 950 degrees C (annealing time 1 min) is discussed. The thermal interdiffusion effects were evaluated by photoluminescence spectroscopy. From the temperature dependence of the luminescence energy shifts the interdiffusion coefficients and activation energies are determined.<>
研究了不同顶势垒组成的InGaAs/InP量子阱在600 ~ 950℃(退火时间1 min)条件下的热稳定性。用光致发光光谱法评价了热互扩散效应。根据发光能位移的温度依赖性,确定了相互扩散系数和活化能
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引用次数: 3
High performance diffused InGaAs JFETs in OEICs oeic中高性能扩散InGaAs jfet
C. Mansfield, D. Newson, P. Birdsall, J. Quayle
The development of highly uniform diffused InGaAs JFETs for use in vertically integrated optoelectronic integrated circuits (OEICs) is discussed. The devices have been integrated with both PIN diodes and ridge-waveguide lasers. OEIC fabrication and OEIC receiver performance are discussed.<>
讨论了用于垂直集成光电集成电路(OEICs)的高均匀扩散InGaAs jfet的发展。该器件已经集成了PIN二极管和脊波导激光器。讨论了OEIC的制造和OEIC接收机的性能。
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引用次数: 0
A very wide spectrum superluminescent diode at 1.3 mu m 一个非常宽的光谱超发光二极管在1.3 μ m
O. Mikami, Y. Noguchi, H. Yasaka
An approach that broadens the emission spectral width of superluminescent diodes (SLDs) is proposed. The fabrication of 1.3- mu m InGaAsP/InP SLDs incorporating a structure of tandem active layers is described. For this device, the spectral width is broadened over 100 nm, achieving a short coherence length of 9.2 mu m, one-fourth that of conventional 1.3- mu m SLDs.<>
提出了一种提高超发光二极管(SLDs)发射光谱宽度的方法。介绍了采用串联有源层结构的1.3 μ m InGaAsP/InP sld的制备方法。对于该器件,光谱宽度加宽超过100 nm,实现了9.2 μ m的短相干长度,是传统1.3 μ m sld的四分之一。
{"title":"A very wide spectrum superluminescent diode at 1.3 mu m","authors":"O. Mikami, Y. Noguchi, H. Yasaka","doi":"10.1109/ICIPRM.1991.147339","DOIUrl":"https://doi.org/10.1109/ICIPRM.1991.147339","url":null,"abstract":"An approach that broadens the emission spectral width of superluminescent diodes (SLDs) is proposed. The fabrication of 1.3- mu m InGaAsP/InP SLDs incorporating a structure of tandem active layers is described. For this device, the spectral width is broadened over 100 nm, achieving a short coherence length of 9.2 mu m, one-fourth that of conventional 1.3- mu m SLDs.<<ETX>>","PeriodicalId":6444,"journal":{"name":"[Proceedings 1991] Third International Conference Indium Phosphide and Related Materials","volume":"1 1","pages":"212-215"},"PeriodicalIF":0.0,"publicationDate":"1991-04-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73658511","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fabrication of long wavelength QEICs using GaAs on InP epitaxial lift-off technology 利用InP外延发射技术制备长波长QEICs
I. Pollentier, P. Demeester, P. van Daele, D. Rondi, G. Glastre, A. Enard, R. Blondeau
The integration of GaAs MESFET circuits with InP components using epitaxial lift-off (ELO) technology is discussed. Specific ELO problems (film-substrate isolation, alignment) and solutions as well as the various ways to integrate MESFETs on InP are described. The fabrication of a long wavelength OEIC, in which a GaAs ELO MESFET is integrated with an InP 2*2 buried waveguide optical switch (fully interconnected oil chip), is presented.<>
讨论了利用外延提升(ELO)技术将GaAs MESFET电路与InP元件集成。描述了特定的ELO问题(薄膜-衬底隔离、对准)和解决方案,以及在InP上集成mesfet的各种方法。提出了一种将GaAs ELO MESFET与inp2 *2埋地波导光开关(全互连油芯片)集成在一起的长波OEIC的制造方法。
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引用次数: 2
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[Proceedings 1991] Third International Conference Indium Phosphide and Related Materials
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