Recently, convolutional neural networks have achieved great success in high-resolution computational imaging (CI) applications, such as super-resolution, image denoising, and image style transfer. However, it demands an enormous number of external memory access, i.e., DRAM bandwidth, and intensive computation while inferencing deeper models for high-quality images. In this letter, an energy-efficient CI neural engine, CINE, is proposed with three key features: 1) overlapped stripe inference flow; 2) structure-sparse convolution kernel; and 3) weight-rotated allocation unit. As a result, CINE can provide 4.6-8.3 TOP/W of energy efficiency for high-quality CI applications.
最近,卷积神经网络在超分辨率、图像去噪和图像风格转换等高分辨率计算成像(CI)应用中取得了巨大成功。然而,它需要大量的外部内存访问(即 DRAM 带宽)和密集的计算,同时还要推断出高质量图像的深度模型。在这封信中,我们提出了一种高能效的 CI 神经引擎 CINE,它有三个主要特点:1) 重叠条纹推理流;2) 结构稀疏卷积核;3) 权重旋转分配单元。因此,CINE 可为高质量 CI 应用提供 4.6-8.3 TOP/W 的能效。
{"title":"CINE: A 4K-UHD Energy-Efficient Computational Imaging Neural Engine With Overlapped Stripe Inference and Structure-Sparse Kernel","authors":"Kai-Ping Lin;Yu-Chun Ding;Chun-Yeh Lin;Yong-Tai Chen;Chao-Tsung Huang","doi":"10.1109/LSSC.2023.3343913","DOIUrl":"https://doi.org/10.1109/LSSC.2023.3343913","url":null,"abstract":"Recently, convolutional neural networks have achieved great success in high-resolution computational imaging (CI) applications, such as super-resolution, image denoising, and image style transfer. However, it demands an enormous number of external memory access, i.e., DRAM bandwidth, and intensive computation while inferencing deeper models for high-quality images. In this letter, an energy-efficient CI neural engine, CINE, is proposed with three key features: 1) overlapped stripe inference flow; 2) structure-sparse convolution kernel; and 3) weight-rotated allocation unit. As a result, CINE can provide 4.6-8.3 TOP/W of energy efficiency for high-quality CI applications.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"7 ","pages":"26-29"},"PeriodicalIF":2.7,"publicationDate":"2023-12-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139434682","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-13DOI: 10.1109/LSSC.2023.3331812
Tony Chan Carusone;Pui-In Mak
My three-year term as the Editor-in-Chief of the IEEE Solid-State Circuits Letters will come to an end on 1 January 2024 and I will step aside. It has been a very rewarding experience to oversee the development of the Letters. The progress we have made has been a collaborative effort, supported by dedicated IEEE staff and over 100 past and present Associate Editors and members of the Editorial Review Board. I am pleased to announce that Prof. Elvis (Pui-In) Mak will take over as the next Editor-in-Chief. With his broad research expertise and leadership qualities, I am confident that the IEEE Solid-State Circuit Letters will maintain its upward trajectory.
{"title":"Editorial Welcome to the New Editor-in-Chief","authors":"Tony Chan Carusone;Pui-In Mak","doi":"10.1109/LSSC.2023.3331812","DOIUrl":"https://doi.org/10.1109/LSSC.2023.3331812","url":null,"abstract":"My three-year term as the Editor-in-Chief of the IEEE Solid-State Circuits Letters will come to an end on 1 January 2024 and I will step aside. It has been a very rewarding experience to oversee the development of the Letters. The progress we have made has been a collaborative effort, supported by dedicated IEEE staff and over 100 past and present Associate Editors and members of the Editorial Review Board. I am pleased to announce that Prof. Elvis (Pui-In) Mak will take over as the next Editor-in-Chief. With his broad research expertise and leadership qualities, I am confident that the IEEE Solid-State Circuit Letters will maintain its upward trajectory.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"7 ","pages":"1-1"},"PeriodicalIF":2.7,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10359147","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138633859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-08DOI: 10.1109/LSSC.2023.3341049
Alessandro Novello;Gabriele Atzeni;Tim Keller;Taekwang Jang
This letter introduces a fully integrated DC–DC converter based on electromagnetically coupled class-D LC oscillators (EMLC) manufactured in a 22nm FDSOI CMOS process. The proposed converter implements a resonant LC flying impedance that improves the EMLC output resistance by accomplishing a resonant charge transfer between the flying capacitor CFLY and the load capacitor CO. This design achieves 77% peak efficiency and 4.1 W/mm2 peak power density in a total area of 0.33 mm2. The output voltage is regulated with a duty cycling scheme from 0.003 W/mm2 up to 2.1 W/mm2 with < 2% efficiency loss.
{"title":"A 1.5-GHz Fully Integrated DC–DC Converter Based on Electromagnetically Coupled Class-D LC Oscillators and Resonant LC Flying Impedance Achieving 4.1-W/mm2 Peak Power Density and 77% Peak Efficiency","authors":"Alessandro Novello;Gabriele Atzeni;Tim Keller;Taekwang Jang","doi":"10.1109/LSSC.2023.3341049","DOIUrl":"https://doi.org/10.1109/LSSC.2023.3341049","url":null,"abstract":"This letter introduces a fully integrated DC–DC converter based on electromagnetically coupled class-D LC oscillators (EMLC) manufactured in a 22nm FDSOI CMOS process. The proposed converter implements a resonant LC flying impedance that improves the EMLC output resistance by accomplishing a resonant charge transfer between the flying capacitor CFLY and the load capacitor CO. This design achieves 77% peak efficiency and 4.1 W/mm2 peak power density in a total area of 0.33 mm2. The output voltage is regulated with a duty cycling scheme from 0.003 W/mm2 up to 2.1 W/mm2 with < 2% efficiency loss.","PeriodicalId":13032,"journal":{"name":"IEEE Solid-State Circuits Letters","volume":"7 ","pages":"38-41"},"PeriodicalIF":2.7,"publicationDate":"2023-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139488219","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}