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CINE: A 4K-UHD Energy-Efficient Computational Imaging Neural Engine With Overlapped Stripe Inference and Structure-Sparse Kernel CINE: 采用重叠条纹推理和结构解析内核的 4K-UHD 高能效计算成像神经引擎
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-12-18 DOI: 10.1109/LSSC.2023.3343913
Kai-Ping Lin;Yu-Chun Ding;Chun-Yeh Lin;Yong-Tai Chen;Chao-Tsung Huang
Recently, convolutional neural networks have achieved great success in high-resolution computational imaging (CI) applications, such as super-resolution, image denoising, and image style transfer. However, it demands an enormous number of external memory access, i.e., DRAM bandwidth, and intensive computation while inferencing deeper models for high-quality images. In this letter, an energy-efficient CI neural engine, CINE, is proposed with three key features: 1) overlapped stripe inference flow; 2) structure-sparse convolution kernel; and 3) weight-rotated allocation unit. As a result, CINE can provide 4.6-8.3 TOP/W of energy efficiency for high-quality CI applications.
最近,卷积神经网络在超分辨率、图像去噪和图像风格转换等高分辨率计算成像(CI)应用中取得了巨大成功。然而,它需要大量的外部内存访问(即 DRAM 带宽)和密集的计算,同时还要推断出高质量图像的深度模型。在这封信中,我们提出了一种高能效的 CI 神经引擎 CINE,它有三个主要特点:1) 重叠条纹推理流;2) 结构稀疏卷积核;3) 权重旋转分配单元。因此,CINE 可为高质量 CI 应用提供 4.6-8.3 TOP/W 的能效。
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引用次数: 0
Editorial Welcome to the New Editor-in-Chief 社论 欢迎新任主编
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-12-13 DOI: 10.1109/LSSC.2023.3331812
Tony Chan Carusone;Pui-In Mak
My three-year term as the Editor-in-Chief of the IEEE Solid-State Circuits Letters will come to an end on 1 January 2024 and I will step aside. It has been a very rewarding experience to oversee the development of the Letters. The progress we have made has been a collaborative effort, supported by dedicated IEEE staff and over 100 past and present Associate Editors and members of the Editorial Review Board. I am pleased to announce that Prof. Elvis (Pui-In) Mak will take over as the next Editor-in-Chief. With his broad research expertise and leadership qualities, I am confident that the IEEE Solid-State Circuit Letters will maintain its upward trajectory.
我作为IEEE固态电路通讯总编辑的三年任期将于2024年1月1日结束,我将离职。这是一个非常有益的经验,监督信件的发展。我们所取得的进展是由IEEE员工和100多位过去和现在的副编辑以及编辑审查委员会成员共同努力的结果。我很高兴地宣布,麦培仁教授将接任下一任总编辑。凭借他广泛的研究专长和领导才能,我相信IEEE固态电路快报将保持其上升轨迹。
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引用次数: 0
A 1.5-GHz Fully Integrated DC–DC Converter Based on Electromagnetically Coupled Class-D LC Oscillators and Resonant LC Flying Impedance Achieving 4.1-W/mm2 Peak Power Density and 77% Peak Efficiency 基于电磁耦合 D 类 LC 振荡器和谐振 LC 飞行阻抗的 1.5 GHz 全集成 DC-DC 转换器,可实现 4.1-W/mm2 峰值功率密度和 77% 峰值效率
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-12-08 DOI: 10.1109/LSSC.2023.3341049
Alessandro Novello;Gabriele Atzeni;Tim Keller;Taekwang Jang
This letter introduces a fully integrated DC–DC converter based on electromagnetically coupled class-D LC oscillators (EMLC) manufactured in a 22nm FDSOI CMOS process. The proposed converter implements a resonant LC flying impedance that improves the EMLC output resistance by accomplishing a resonant charge transfer between the flying capacitor CFLY and the load capacitor CO. This design achieves 77% peak efficiency and 4.1 W/mm2 peak power density in a total area of 0.33 mm2. The output voltage is regulated with a duty cycling scheme from 0.003 W/mm2 up to 2.1 W/mm2 with < 2% efficiency loss.
本文介绍了一种基于电磁耦合 D 类 LC 振荡器 (EMLC) 的全集成 DC-DC 转换器,该器件采用 22 纳米 FDSOI CMOS 工艺制造。该转换器采用谐振 LC 飞行阻抗,通过在飞行电容器 CFLY 和负载电容器 CO 之间实现谐振电荷转移来提高 EMLC 输出电阻。该设计的峰值效率为 77%,峰值功率密度为 4.1 W/mm2,总面积为 0.33 mm2。输出电压通过占空比循环方案调节,从 0.003 W/mm2 到 2.1 W/mm2,效率损失小于 2%。
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引用次数: 0
A BiCMOS Active Quencher Using an Inverter-Based Differential Amplifier in the Comparator 在比较器中使用基于反相器的差分放大器的 BiCMOS 有源淬火器
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-12-04 DOI: 10.1109/LSSC.2023.3338660
B. Goll;M. Hofbauer;H. Zimmermann
For fast switching off of a firing single-photon avalanche diode (SPAD), an active quenching circuit in 0.35- $mu text{m}$ BiCMOS technology with a very fast quenching slew rate is introduced. Quenching transients measured at an integrated small prober pad are shown. An NPN transistor as quenching switch leads to an active quenching time of 250 ps and a quenching slew rate of 21.1 V/ns. A self-biased two-inverter differential amplifier used in the comparator makes this fast quenching possible. By the implementation of cascoding, the excess bias voltage of the integrated SPAD can be doubled to 6.6 V with respect to the nominal supply voltage of 3.3 V of the BiCMOS process used. Active resetting of the SPAD is achieved in 725 ps. The power consumption of the BiCMOS quenching circuit is 16.3 mW at 40 Mcounts/s and 3 mW in the idle state.
为实现点火单光子雪崩二极管(SPAD)的快速关断,介绍了一种采用 0.35- $mu text{m}$ BiCMOS 技术、具有极快淬火回转率的有源淬火电路。图中显示了在一个集成的小型探针焊盘上测量到的淬火瞬态。采用 NPN 晶体管作为淬火开关,可实现 250 ps 的有效淬火时间和 21.1 V/ns 的淬火回转率。比较器中使用的自偏压双反相器差分放大器使这种快速淬火成为可能。通过级联,集成 SPAD 的过量偏置电压可增加一倍,达到 6.6 V,而所用 BiCMOS 工艺的标称电源电压为 3.3 V。SPAD 的主动复位可在 725 ps 内实现。BiCMOS 淬火电路在 40 Mcounts/s 时的功耗为 16.3 mW,空闲状态下的功耗为 3 mW。
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引用次数: 0
A 40-nm Compute-in-Memory Macro With RRAM Addressing IR Drop and Off-State Current 采用 RRAM 寻址的 40 纳米内存计算宏程序 IR 下降和关态电流
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-12-01 DOI: 10.1109/LSSC.2023.3338212
Samuel D. Spetalnick;Muya Chang;Shota Konno;Brian Crafton;Ashwin Sanjay Lele;Win-San Khwa;Yu-Der Chih;Meng-Fan Chang;Arijit Raychowdhury
This letter describes an analog current-summing compute-in-memory macro using resistive random-access memory (RRAM). The readout transimpedance amplifiers use offset canceling with differential inputs from added sensing paths for the bitline (BL) and sourceline (SL) to minimize channel-to-channel (ch./ch.) gain error while mitigating IR drop in the BL, SL, and multiplexors (MUXes). The analog-to-digital converters (ADCs) use dynamic offset cancelation to remove ch./ch. ADC intrinsic offset and error due to RRAM off-state current. The 64Kb macro implemented with foundry RRAM in 40-nm CMOS has an area of 0.0263 mm2, ch./ch. gain std. dev. of 1.9%, IR drop per-wordline of 0.004%, and 1.1 V efficiency of 7.8–58.8 TOPS/W.
这封信介绍了一种使用电阻式随机存取存储器(RRAM)的模拟电流求和内存计算宏。读出跨阻抗放大器利用位线(BL)和源线(SL)新增传感路径的差分输入进行偏移抵消,以最大限度地减小通道到通道(ch./ch.)增益误差,同时减轻 BL、SL 和多路复用器(MUX)中的 IR 下降。模数转换器 (ADC) 采用动态偏移抵消技术来消除通道/通道之间的增益误差。模数转换器(ADC)采用动态偏移抵消技术,以消除由 RRAM 关态电流引起的 ADC 本征偏移和误差。使用代工 RRAM 在 40 纳米 CMOS 中实现的 64KB 宏面积为 0.0263 平方毫米,通道/通道增益标准偏差为 1.9%,每字线 IR 降为 0.004%,1.1 V 效率为 7.8-58.8 TOPS/W。
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引用次数: 0
A 6.7–3.6-pJ/b 0.63–7.5-Gb/s Rapid On/Off Clock and Data Recovery With <55-ns Turn-On Time 6.7-3.6-pJ/b 0.63-7.5-Gb/s 快速开启/关闭时钟和数据恢复,开启时间 <55-ns
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-11-28 DOI: 10.1109/LSSC.2023.3337045
Jaya Deepthi Bandarupalli;Saurabh Saxena
In this letter, we present a rapid on/off 0.63–7.5-Gb/s digital clock and data recovery with a low-turn-on time and recovered clock jitter. The clock and data recovery (CDR) employs a fast-on 1.875–3.75-GHz digitally controlled oscillator followed by a $2times $ integer-N PLL. The DCO incorporates an 8-bit digitally controlled phase interpolator embedded in a $6times $ $12times $ injection-locked clock multiplier for fast turn-on and low-output jitter. DCO’s output is filtered using the fast-on PLL while generating the sampling clock phases for the half-rate CDR. Fabricated in the TSMC 65-nm process, the CDR recovers the clock with $rm < $ 1.3-ps RMS jitter while dissipating 26.6 mW at 7.5 Gb/s and 14.4 mW at 3.75 Gb/s. Duty cycling the CDR operation lowers the average data rates to 0.63 Gb/s with less than 55-ns turn-on time and 1.6- $rm mu {mathrm{ s}}$ on/off period.
在这封信中,我们介绍了一种具有低接通时间和恢复时钟抖动的 0.63-7.5-Gb/s 快速接通/关断数字时钟和数据恢复技术。时钟和数据恢复(CDR)采用了一个快速接通的 1.875-3.75-GHz 数字控制振荡器,随后是一个 2 美元/次的整数 N PLL。DCO 集成了一个 8 位数字控制相位细分器,嵌入到一个 6 美元-12 美元注入锁定时钟乘法器中,以实现快速接通和低输出抖动。在为半速率 CDR 生成采样时钟相位时,DCO 的输出通过快速接通 PLL 进行滤波。CDR 采用 TSMC 65-nm 工艺制造,以 1.3 ps RMS 抖动恢复时钟,7.5 Gb/s 时功耗为 26.6 mW,3.75 Gb/s 时功耗为 14.4 mW。CDR 工作的占空比将平均数据速率降至 0.63 Gb/s,开启时间小于 55-ns ,开/关周期为 1.6- $rm mu {mathrm{ s}}$ 。
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引用次数: 0
A 4.24-GHz 128×256 SRAM Operating Double Pump Read Write Same Cycle in 5-nm Technology 在 5 纳米技术中实现 4.24-GHz 128×256 SRAM 双泵读写同周期运行
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-11-27 DOI: 10.1109/LSSC.2023.3336773
Nick Zhang;Young Suk Kim;Peter Hsu;Samsoo Kim;Derek Tao;Hung-Jen Liao;P. W. Wang;Geoffrey Yeap;Quincy Li;Tsung-Yung Jonathan Chang
A High-Speed High-Density 1R1W two port 32Kbit ( $128times 256$ ) SRAM with single port 6T bitcell macro is proposed. A read-then-write (RTW) double pump CLK generation circuit with tracking bitline (TRKBL) bypassing is proposed to boost read and write performance. A local interlock circuit (LIC) is introduced in Sense-Amp to reduce active power and push Fmax further. To mitigate metal RC degradation, double metal scheme is applied to improve signal integrity and enhance overall operating cycle time. The silicon results show that the slow corner wafer was able to achieve 4.24 GHz at 1.0 V/100 °C in 5-nm FinFET technology.
提出了一种高速高密度1R1W双端口32Kbit ($128 × 256$)单端口6T位元宏SRAM。为了提高读写性能,提出了一种采用跟踪位线(TRKBL)旁路的RTW双泵CLK产生电路。在感应放大器中引入了局部联锁电路(LIC),以降低有功功率并进一步提高Fmax。为了减轻金属RC的退化,采用了双金属方案来提高信号的完整性和提高整体运行周期时间。结果表明,在5纳米FinFET技术中,慢角晶片能够在1.0 V/100°C下实现4.24 GHz。
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引用次数: 0
A Low-Power 6–9-GHz IEEE 802.15.4a/4z Compliant IR-UWB Transceiver With Pulse Pre-Emphasis Achieving High ToA Precision 符合 IEEE 802.15.4a/4z 标准的 6-9-GHz 低功耗红外无线收发器,具有脉冲预加重功能,可实现高 ToA 精度
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-11-22 DOI: 10.1109/LSSC.2023.3335596
Minyoung Song;Erwin Allebes;Chris Marshall;Anoop Narayan Bhat;Elbert Bechthum;Johan Dijkhuis;Stefano Traferro;Evgenii Tiurin;Peter Vis;Johan van den Heuvel;Mohieddine El Soussi;Pepijn Boer;Alireza Sheikh;Bernard Meyer;Jiang Liu;Stan van der Ven;Nick Winkel;Martijn Hijdra;Gururaja Kasanadi Ramachandra;Yunus Baykal;Huib Visser;Amirashkan Farsaei;Peng Zhang;Arjan Breeschoten;Yao-Hong Liu;Christian Bachmann
This letter presents an IEEE 802.15.4a/4z compliant IR-UWB transceiver for high-precision ranging. By virtue of the proposed digital deserialization–serialization, the TX can generate the intersymbol-interference (ISI)-free IEEE 802.15.4a/4z packet. The proposed analog finite impulse response (FIR)-based TX pre-emphasis improves $3.5times $ time-of-arrival (ToA) measurement precision without substantial power overhead and fulfills the spectrum requirement of the standard and the worldwide UWB regulations. The presented transceiver consumes 8.7 mW in TX mode and 21 mW in RX mode.
本文介绍了一种用于高精度测距的符合 IEEE 802.15.4a/4z 标准的 IR-UWB 收发器。通过所提出的数字解串-序列化,发射机可以生成无符号间干扰(ISI)的 IEEE 802.15.4a/4z 数据包。所提出的基于模拟有限脉冲响应(FIR)的发射机预加重技术可提高到达时间(ToA)测量精度 3.5 倍,而无需大量的功率开销,并能满足标准和全球 UWB 法规的频谱要求。该收发器在发送模式下的功耗为 8.7 mW,在接收模式下的功耗为 21 mW。
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引用次数: 0
A183.4-nJ/Inference 152.8-μW 35-Voice Commands Recognition Wired-Logic Processor Using Algorithm-Circuit Co-Optimization Technique 采用算法-电路协同优化技术的 A183.4-nJ/Inference 152.8-μW 35 语音命令识别有线逻辑处理器
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-11-21 DOI: 10.1109/LSSC.2023.3334625
Rei Sumikawa;Atsutake Kosuge;Yao-Chung Hsu;Kota Shiba;Mototsugu Hamada;Tadahiro Kuroda
A 183.4-nJ/inference single-chip wired-logic DNN processor that is capable of recognizing all 35 commands defined in the industrial standard voice recognition data set (Google speech command dataset) is developed. The algorithm-circuit co-optimized processor recognizes 3.5 times more commands with 1.6 times better-energy efficiency than the state-of-the-art analog processor while keeping design cost low. By implementing all the processing circuits and wiring required for the 16-layer DNN onto a single chip ( $7.63 {mathrm{ mm}}^{2}$ in 40 nm), the need to store weight coefficients and intermediate data in DRAM/SRAM is eliminated. Owing to the proposed architecture, a low-power consumption of $152.8 mu text{W}$ is achieved, which is low enough for always-on applications on battery-powered IoT devices.
我们开发了一个 183.4-nJ/inference 的单芯片有线逻辑 DNN 处理器,它能够识别工业标准语音识别数据集(谷歌语音命令数据集)中定义的所有 35 个命令。与最先进的模拟处理器相比,经过算法和电路共同优化的处理器可识别的命令数量增加了 3.5 倍,能效提高了 1.6 倍,同时保持了较低的设计成本。通过在单个芯片上实现 16 层 DNN 所需的所有处理电路和布线(7.63 {mathrm{ mm}}^{2}$,40 纳米),无需在 DRAM/SRAM 中存储权重系数和中间数据。由于采用了所提出的架构,实现了 152.8 mu text{W}$的低功耗,这对于电池供电的物联网设备上的始终在线应用来说已经足够低了。
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引用次数: 0
SiGe BiCMOS D-Band Heterodyne Power Mixer With Back-Off Efficiency Enhanced by Current Clamping 通过电流钳位提高退激效率的 SiGe BiCMOS D 波段异频功率混频器
IF 2.7 Q3 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2023-11-15 DOI: 10.1109/LSSC.2023.3332766
Andrea Bilato;Ibrahim Petricli;Andrea Mazzanti
A D-band power upconverter in a 55-nm SiGe BiCMOS is presented. The low-output resistance of a switching quad is identified as a limiting factor to mixer power generation in D-band, and common-base transistors are stacked for output power enhancement. Moreover, the current clamping mechanism is exploited to scale the average supply current with output power, improving the efficiency in back-off. Experimental results demonstrate $ {P_{mathrm{ sat}}},,{=}$ 6.3 dBm and ${oP_{mathrm{ 1dB}}},,{=}$ 4.5 dBm at 140 GHz, with efficiency of 3.05% and 2.47%, respectively. The power consumption, from a 2-V supply, rises from 70 mW at the quiescent point to 140 mW at $ {P_{mathrm{ sat}}}$ . The measured output power and efficiency compare favorably against previous works.
提出了一种55纳米SiGe BiCMOS的d波段功率上转换器。将开关四极体的低输出电阻确定为d波段混频器功率产生的限制因素,并将共基晶体管堆叠以增强输出功率。此外,利用电流箝位机构来缩放电源的平均电流与输出功率,提高了回退效率。实验结果表明,${P_{mathrm{sat}}},,{=}$ 6.3 dBm和${oP_{mathrm{1dB}}},,{=}$ 4.5 dBm在140 GHz下的效率分别为3.05%和2.47%。2v电源的功耗从静态点的70mw上升到$ {P_{ mathm {sat}} $的140mw。测量的输出功率和效率与以前的工作相比是良好的。
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引用次数: 0
期刊
IEEE Solid-State Circuits Letters
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