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The effect of surface roughness on the performance of InP MOSFETs 表面粗糙度对InP mosfet性能的影响
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203040
O. Sri, R. E. Owens, C. Wilmsen, S. Goodnick, J. Lary
Results of a Monte Carlo simulation of inversion layer transport in InP devices at both high and low fields are presented. They show that the low-field mobility and the peak electron velocity decrease with increasing surface roughness and interface charge. However, at high fields the average electron velocity for the different surfaces converge and become nearly independent of the surface condition. This suggests that as the MOSFET is scaled down, the device performance will become independent of interface quality. Velocity-field, transit-time-channel-length, and transit-time-surface-roughness curves for InP MIS structures are presented. From these, qualitative estimates of device performance are obtained in terms of the surface roughness.<>
给出了在高场和低场条件下InP器件中反转层输运的蒙特卡罗模拟结果。结果表明,低场迁移率和峰值电子速度随表面粗糙度和界面电荷的增加而降低。然而,在高场下,不同表面的平均电子速度收敛,几乎与表面条件无关。这表明,随着MOSFET的缩小,器件性能将变得独立于接口质量。给出了InP MIS结构的速度场、传递时间通道长度和传递时间表面粗糙度曲线。由此,可以根据表面粗糙度对器件性能进行定性估计。
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引用次数: 1
InP MIS structure with phosphorus-nitride film grown by photo-CVD 用光- cvd法生长氮化磷膜的InP MIS结构
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203046
Y. Jeong, J. Lee, Y. Hong, Y. Bae
Low-temperature (100-200 degrees C) growth of phosphorus nitride (P/sub 3/N/sub 5/) on an InP surface has been achieved using a mixture of PCl/sub 3/ and NH/sub 3/ gases by a direct photo-CVD. The films have a resistivity of 1*10/sup 14/ Omega -cm and a breakdown voltage of 1*10/sup 7/ V/cm. The minimum density of interface trap states for the Al-P/sub 3/N/sub 5/-InP MIS structure after the in-situ pretreatment and postanneal is about 3.6*10/sup 10/ cm/sup -2/ eV/sup -1/ near the midgap of the InP. Depth profiles determined from X-ray photoelectron and Auger spectroscopy data at deposition temperatures of 200 degrees C and 150 degrees C, respectively, show that the O atoms pile up at the P/sub 3/N/sub 5//InP interface and diffuse toward the P/sub 3/N/sub 5/ film. The data are used to evaluate the film and the interface.<>
利用PCl/sub 3/和NH/sub 3/混合气体,用直接光-气相沉积法在InP表面实现了氮化磷(P/sub 3/N/sub 5/)的低温(100-200℃)生长。薄膜的电阻率为1*10/sup 14/ ω -cm,击穿电压为1*10/sup 7/ V/cm。原位预处理后的Al-P/sub - 3/N/sub - 5/-InP MIS结构界面阱态的最小密度约为3.6*10/sup 10/ cm/sup -2/ eV/sup -1/。在200℃和150℃的沉积温度下,x射线光电子和俄歇谱数据测定的深度剖面显示,O原子在P/sub 3/N/sub 5/ InP界面堆积,并向P/sub 3/N/sub 5/薄膜扩散。这些数据被用来评价薄膜和界面。
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引用次数: 1
Growth of large diameter InP single crystals by the phosphorus vapor controlled LEC method 用磷气控LEC法生长大直径InP单晶
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.202983
K. Kohiro, K. Kainosho, H. Shimakura, T. Fukui, O. Oda
Large-diameter InP Single crystals (60 mm and 3 in) have been grown by a phosphorus-vapor-controlled liquid-encapsulated-Czochralski (PC-LEC) method in which the pulling rod is not sealed by an encapsulant but by a mechanical seal. The advantage of this technology is that the crystal growth can be performed in an industrial setting because of the ease of instrumentation. Both S-doped and Fe-doped single crystals have been grown. In the case of S-doped crystals, the dislocation free area was greatly increased compared with the conventional LEC method. A 3-in Fe-doped InP crystal with a dislocation density lower than 5*10/sup 4/ cm/sup -2/ was also grown.<>
大直径InP单晶(60毫米和3英寸)已通过磷蒸汽控制液体封装的czochralski (PC-LEC)方法生长,其中拉杆不是由封装剂密封,而是由机械密封密封。该技术的优点是,由于仪器方便,晶体生长可以在工业环境中进行。掺杂s和掺杂fe的单晶均已生长。在s掺杂晶体的情况下,与传统的LEC方法相比,位错自由面积大大增加。还生长出了位错密度小于5*10/sup 4/ cm/sup -2/的3 in掺铁InP晶体
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引用次数: 2
Chemical etching of InP InP的化学蚀刻
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203022
C. Sundararaman, A. Mouton, J. Currie
The chemical etching of InP by iodic acid (HIO/sub 3/) solutions of varying weight percentage has been characterized in detail. The concentration dependence of etch rate of activation energies, and of etch profile has been evaluated. Solutions below 20 wt.% concentration are reaction-rate limited and are found to be useful for InP processing. The chemical state of the surface has been studied by X-ray photoelectron spectroscopy (XPS). These solutions oxidize the surface resulting in the formation of InPO/sub 4/:xH/sub 2/O, which could be useful for Schottky and MIS device applications. The use of a 20 wt.% solution for mesa type etching applications and a 5-10 wt.% solution for cleaning purposes is suggested.<>
研究了不同质量百分比的碘酸(HIO/sub 3/)溶液对InP的化学腐蚀。评价了刻蚀速率、活化能和刻蚀轮廓的浓度依赖性。浓度低于20wt .%的溶液反应速率有限,可用于InP处理。用x射线光电子能谱(XPS)研究了材料表面的化学状态。这些溶液氧化表面,形成InPO/sub 4/:xH/sub 2/O,可用于Schottky和MIS器件应用。建议在台面型蚀刻应用中使用20%的溶液,在清洁应用中使用5- 10%的溶液
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引用次数: 4
Evaluation of lattice mismatched InGaAs layers and photodiode arrays by scanning photoluminescence 用扫描光致发光评价晶格不匹配InGaAs层和光电二极管阵列
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203029
S. Krawczyk, K. Schohe, C. Klingelhofer, B. Vilotitch, C. Lenoble, M. Villard, X. Hugon, D. Regaud, F. Ducroquet
Scanning photoluminescence (SPL) measurements were used to characterize lattice-mismatched InGaAs/InP heterostructures and to study the correlation between the results of the SPL measurements and the electrical characteristics of the completed p-i-n photodiodes made with this material. Mismatch dislocations, isolated dislocations, and short- and long-range nonuniformities were revealed. Correlations between the results obtained by SPL and the reverse current of the fabricated photodiodes were observed. The defect creation in the epitaxial layers is extremely sensitive to small variations of the process conditions.<>
利用扫描光致发光(SPL)测量方法表征了InGaAs/InP晶格错配异质结构,并研究了SPL测量结果与用该材料制成的p-i-n光电二极管电学特性之间的相关性。错配位错,孤立位错,以及短期和长期的不均匀性。观察了SPL得到的结果与所制备的光电二极管的反向电流之间的相关性。外延层的缺陷产生对工艺条件的微小变化极为敏感。
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引用次数: 2
High performance long wavelength strained layer InGaAs/InP quantum well lasers 高性能长波应变层InGaAs/InP量子阱激光器
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203008
T. Tanbun-ek, R. Logan, N. Olsson, H. Temkin, A. Sergent, K. Wecht
Strained-layer quantum-well InGaAsP/InP lasers emitting at wavelengths between 1.47 and 1.55 mu m are reported. The lasing wavelength could be adjusted by introducing either tensile or compressive strain as well as by changing the layer thickness of the quantum wells. To obtain a lasing wavelength as short as 1.47 mu m, tensile strain is preferable due to the relaxed constraints in layer thickness of the quantum wells. Both tensile and compressive strain were found to improve the performance of the lasers as compared to the lattice-matched ones. A sample with compressive strain showed a CW threshold current as low as 4 mA. Maximum CW output power as high as 206 mW with a lasing wavelength of 1.47 mu m was obtained from a quantum-well active layer with tensile strain.<>
报道了发射波长在1.47 ~ 1.55 μ m之间的应变层量子阱InGaAsP/InP激光器。激光波长可以通过引入拉伸或压缩应变以及改变量子阱的层厚来调节。为了获得短至1.47 μ m的激光波长,由于量子阱层厚度的限制放宽,拉伸应变是优选的。与晶格匹配的激光器相比,拉伸应变和压缩应变都提高了激光器的性能。压缩应变样品的连续波阈值电流低至4 mA。在具有拉伸应变的量子阱有源层上获得了最大连续波输出功率高达206 mW,激光波长为1.47 μ m。
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引用次数: 0
VPE growth of high purity and high uniformity InGaAs/InP epitaxial layers on 2-inch diameter InP substrate 在2英寸直径的InP衬底上生长高纯度和高均匀性的InGaAs/InP外延层
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.202995
Y. Miura, K. Takemoto, T. Iwasaki, N. Yamabayashi, M. Kaji, S. Murai, K. Tada, S. Akai
An epitaxial InP/InGaAs/InP structure was grown on 2-in-diameter InP substrates by the chloride vapor-phase epitaxy (VPE) method. The undoped carrier concentration of both the InP and InGaAs layers was less than 1*10/sup 15/ cm/sup -3/. Hall mobility at 77 K was 85000 cm/sup 2//V-s. The variation of epi-layer thickness, carrier concentration and lattice mismatch across the wafer was less than 2%, 4% and 0.8%, respectively. The reproducibility of growth rate, carrier concentration, and lattice mismatch from run to run was less than 5%.<>
采用氯气相外延法(VPE)在直径为2英寸的InP衬底上生长出了InP/InGaAs/InP外延结构。InP和InGaAs层的未掺杂载流子浓度均小于1*10/sup 15/ cm/sup -3/ sup。77 K时霍尔迁移率为85000 cm/sup 2//V-s。外延层厚度、载流子浓度和晶格错配的变化分别小于2%、4%和0.8%。每次运行的生长率、载流子浓度和晶格错配的重现性小于5%
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引用次数: 1
High rate growth of Ga/sub 0.47/In/sub 0.53/As/InP by chemical beam epitaxy 化学束外延法高速生长Ga/sub 0.47/In/sub 0.53/As/InP
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203005
T. Uchida, T. Uchida, K. Mise, N. Yokouchi, F. Koyama, K. Iga
High growth rates have been obtained for Ga/sub 0.47/In/sub 0.53/As and InP using chemical beam epitaxy. The GaInAs growth rate was controlled over the range from 1.2 to 6 mu m/h, the latter being the highest growth rate obtained without sacrificing the optical and electrical properties of the crystal. Good thickness controllability was demonstrated by growing multi-quantum-wells at growth rates of 5.15 and 2.5 mu m/h. An emission wavelength shift from 1.56 mu m to 1.1 mu m was observed in room temperature photoluminescence measurements. Based on X-ray spectra satellite peaks, well widths associated with these wavelength ranged from 80 AA to 10 AA. The results agree with theoretical calculations and show good thickness controllability and wavelength tunability at high growth rates.<>
采用化学束外延法对Ga/sub 0.47/In/sub 0.53/As和InP获得了较高的生长速率。GaInAs的生长速率控制在1.2 ~ 6 μ m/h之间,后者是在不牺牲晶体光学和电学性能的情况下获得的最高生长速率。以5.15和2.5 μ m/h的生长速率生长多量子阱,证明了良好的厚度可控性。在室温光致发光测量中观察到发射波长从1.56 μ m到1.1 μ m。根据x射线光谱卫星峰,与这些波长相关的井宽范围为80 AA至10 AA。结果与理论计算一致,在高生长速率下具有良好的厚度可控性和波长可调性。
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引用次数: 1
Remote plasma etching of InP in Cl2 and HCl 在Cl2和HCl中等离子体刻蚀InP
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.203054
D. Lishan, E. Hu
An attempt is made to add insight into the expectation that in the dry etching of InP, increased temperatures should assist etching even in ion enhanced systems, both in regard to rate and profile. Results for InP and GaAs are compared with each other and results in the literature. At >150 degrees C, the InP etch rate is approximately twice as fast with the plasma on as with the plasma off. The rapid etch rate in molecular Cl/sub 2/ alone, i.e. with the plasma off, confirms that plasma generated radicals are not necessary for etching to occur. This is also observed for GaAs etching in Cl/sub 2/. Thus, molecular Cl/sub 2/ can crack on the surface to form the etch products. At lower temperatures the etch rate enhancement with the plasma on is not as apparent, and a much larger scatter in the data is observed.<>
试图增加对InP的干式蚀刻的期望,即使在离子增强系统中,在速率和剖面方面,升高的温度也应该有助于蚀刻。将InP和GaAs的结果与文献中的结果进行了比较。在>150℃时,等离子体打开时的InP蚀刻速率大约是等离子体关闭时的两倍。仅在分子Cl/sub 2/中,即在等离子体关闭的情况下,快速蚀刻速率证实了等离子体产生的自由基不是蚀刻发生所必需的。在Cl/sub /中也观察到这种现象。因此,分子Cl/sub 2/可以在表面开裂形成蚀刻产物。在较低的温度下,等离子体的腐蚀速率增强并不明显,并且观察到数据中的散射更大。
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引用次数: 1
Improvement of large area homogeneity of InP based III-V layers by using the gas foil rotation concept 利用气箔旋转概念改善InP基III-V层大面积均匀性
Pub Date : 1990-04-23 DOI: 10.1109/ICIPRM.1990.202997
G. Strauch, D. Schmitz, H. Jurgensen, M. Heyen
Further improvement of thickness and compositional homogeneity was sought in order to increase the usable wafer area for sophisticated device production and thus reduce the manufacturing costs in low-pressure metalorganic vapor-phase epitaxy processes. The gas-foil concept for wafer rotation was used to achieve these goals. In this technique the substrate is placed on a graphite carrier floating on a gas foil (high-purity H/sub 2/). The same gas flow also forces the carrier to rotate. The thickness uniformities of InP, GaInAs and GaInAsP layers grown with the gas-foil rotation susceptor in a single-wafer reactor were better than +or-1.5%. The variation of lattice mismatch of ternary and quaternary layers was below 2.5*10/sup -4/. The GaInAsP wavelength variation was smaller than 4 nm over the entire wafer area (a rim of 5 mm excluded).<>
为了增加精密器件生产的可用晶圆面积,从而降低低压金属有机气相外延工艺的制造成本,需要进一步改善厚度和成分均匀性。晶圆旋转的气箔概念被用来实现这些目标。在这种技术中,衬底被放置在漂浮在气体箔(高纯度H/sub / 2/)上的石墨载体上。同样的气流也迫使载体旋转。在单晶片反应器中使用气箔旋转电感生长的InP、GaInAs和GaInAsP层的厚度均匀性均优于+或1.5%。三元层和四元层晶格失配的变化小于2.5*10/sup -4/。在整个晶圆区域(不包括5mm的边缘),GaInAsP波长变化小于4 nm。
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引用次数: 2
期刊
International Conference on Indium Phosphide and Related Materials
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