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2006 IEEE Asian Solid-State Circuits Conference最新文献

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1000 frame/sec Stereo Matching VLSI Processor with Adaptive Window-Size Control 具有自适应窗口大小控制的1000帧/秒立体声匹配VLSI处理器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357867
M. Hariyama, N. Yokoyama, M. Kameyama
This paper presents a 1000-frame/sec stereo-matching VLSI for adaptive window-size control. To reduce the computational amount, the algorithm uses images divided into non-overlapping regions. The matching result is iteratively refined by reducing a window size. Window-parallel and pixel-parallel architecture is proposed to achieve to exploit the potential parallelism.
提出了一种用于自适应窗口大小控制的1000帧/秒立体匹配VLSI。为了减少计算量,算法将图像划分为不重叠的区域。通过减少窗口大小来迭代地改进匹配结果。为了开发潜在的并行性,提出了窗口并行和像素并行的架构。
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引用次数: 5
A 10-bit 200MS/s Pipeline A/D Converter for High-Speed Video Signal Digitizer 用于高速视频信号数字化仪的10位200MS/s流水线A/D转换器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357844
T. Nezuka, K. Misawa, J. Azami, Y. Majima, J. Okamura
A 10-bit 200MS/s A/D converter (ADC) for highspeed video signal digitizer is presented. The ADC has a 14- bit pipeline ADC core for digital programmable gain control and a reference voltage buffer optimized for high-speed A/D conversion. The ADC is fabricated in a 0.18-mum multiple Vth CMOS process. The area of ADC core is 1.15 mmtimes0.69 mm, and power consumption is 128 mW@200 MS/s. The measured INL and DNL are 1.05 LSB and 0.55 LSB respectively. The measured SNR and SFDR are 54.8 dB and 63.2 dB respectively.
介绍了一种用于高速视频信号数字化仪的10位200MS/s A/D转换器(ADC)。该ADC具有用于数字可编程增益控制的14位流水线ADC核心和用于高速a /D转换优化的参考电压缓冲器。该ADC采用0.18 μ m多Vth CMOS工艺制造。ADC核心面积为1.15 mmtimes0.69 mm,功耗为128 mW@200 MS/s。测得INL和DNL分别为1.05 LSB和0.55 LSB。测量的信噪比和SFDR分别为54.8 dB和63.2 dB。
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引用次数: 27
Delta-Sigma Based CMOS Stress Sensor with RF Output 基于Delta-Sigma的射频输出CMOS应力传感器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357896
Yonggang Chen, R. Jaeger, J. Suhling
A CMOS stress sensor is merged with a delta-sigma modulator to produce a sensor with a low frequency RF output. A PMOS current mirror with two orthogonal transistors is used as the stress sensor. The delta-sigma modulator generates an output signal that can be processed digitally or monitored by a communications receiver. The frequency shift of the DSBSC output of the modulator is directly proportional to the stress induced mismatch in the sensor cell. A test chip demonstrating the sensor has been fabricated using the 1.5 mum MOSIS CMOS process.
将CMOS应力传感器与δ - σ调制器合并,产生具有低频RF输出的传感器。采用两个正交晶体管的PMOS电流反射镜作为应力传感器。δ - σ调制器产生一个输出信号,该信号可以被数字处理或由通信接收器监控。调制器DSBSC输出的频移与传感器单元中应力引起的失配成正比。采用1.5 μ m MOSIS CMOS工艺制作了演示传感器的测试芯片。
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引用次数: 10
A 6-b DAC and Analog DRAM for a Maskiess Lithography Interface in 90 nm CMOS 用于90nm CMOS掩模光刻接口的6b DAC和模拟DRAM
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357941
D. Fang, R. Roberts, B. Nikolić
A parallel, 12 mum-pitch, low-power 6-b segmented digital-to-analog converter (DAC) array drives an array of 3 mum x 3 mum analog DRAM cells in a 2.5/1 V 90 nm CMOS process, with an application in maskless lithography. An innovative self-calibrating compensation circuit limits the effect of charge leakage and capacitive process mismatch to less than 0.5 LSB over 100 ms of data hold time. A 2 mm x 2 mm test chip implements a mixed-signal interface with 32 DACs driving four 32 times 256 analog DRAM arrays.
一种并联、12 μ m间距、低功耗6-b分段数模转换器(DAC)阵列在2.5/1 V 90nm CMOS工艺中驱动3 μ m x 3 μ m模拟DRAM单元阵列,应用于无掩模光刻。创新的自校准补偿电路将电荷泄漏和电容过程失配的影响限制在100 ms数据保持时间内小于0.5 LSB。一个2mm × 2mm的测试芯片实现了一个混合信号接口,32个dac驱动4个32 × 256模拟DRAM阵列。
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引用次数: 5
77 and 94-GHz Downconversion Mixers in SiGe BiCMOS SiGe BiCMOS中的77 ghz和94 ghz下变频混频器
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357883
S. Reynolds, J. Powell
Double-conversion superheterodyne downconverter blocks operating around 77 GHz and 94 GHz have been realized in 0.13-mum SiGe BiCMOS technology. Both use a single-balanced RF mixer to downconvert the signal to an 8.8 GHz IF, which is amplified and downconverted a second time to baseband. The 77-GHz circuit achieves an upper SSB NF of 12.8 dB at 77 GHz and <12 dB at 76 GHz, with 20 dB of conversion gain and an input-referred 1-dB compression point of -14.7 dBm. The 94-GHz circuit achieves an upper SSB NF of 17.2 dB at 94 GHz, with 15 dB of conversion gain and an input-referred 1-dB compression point of -10.7 dBm. Both circuits use a bias current of 3.2 mA in the RF mixer core, with total testsite power consumption of 120 mA from a 3-V supply.
在0.13 μ m SiGe BiCMOS技术下,实现了工作在77 GHz和94 GHz左右的双转换超外差下变频模块。两者都使用单平衡射频混频器将信号下转换为8.8 GHz中频,然后将其放大并第二次下转换到基带。77 GHz电路在77 GHz时实现了12.8 dB的最高SSB NF,在76 GHz时实现了<12 dB,转换增益为20 dB,输入参考1 dB压缩点为-14.7 dBm。94 GHz电路在94 GHz时实现17.2 dB的最高SSB NF,转换增益为15 dB,输入参考1 dB压缩点为-10.7 dBm。两种电路在RF混频器核心中都使用3.2 mA的偏置电流,来自3-V电源的总测试场功耗为120 mA。
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引用次数: 21
1.5-V Linear CMOS OTA with -60dB IM3 for High Frequency Applications 1.5 v线性CMOS OTA与-60dB IM3高频应用
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357877
Tien-Yu Lo, C. Hung
A novel configuration of linearized Operational Transconductance Amplifier (OTA) for low-voltage and high frequency applications is proposed. By using double differential pairs and the source degeneration structure under nano-scale CMOS technology, the nonlinearity caused by short channel effect from small feature size can be minimized. A robust common-mode control system is designed for input and output common-mode stability, and thus reduces distortion caused by common-mode voltage variation. Tuning ability can be achieved by using MOS transistors in the linear region. The linearity of the OTA is about -60dB third-order inter- modulation (IM3) distortion for up to 0.9 VPP at 40 MHz. Ths OTA was fabricated by the TSMC 180-nm Deep N-WELL CMOS process. It occupies a small area of 15.1 x 10-3 mm2 and the power consumption is 9.5 mW under a 1.5-V supply voltage.
提出了一种适用于低压高频应用的线性化跨导运算放大器(OTA)的新结构。在纳米级CMOS技术下,采用双差分对和源退化结构,可以最大限度地降低小特征尺寸引起的短通道效应引起的非线性。设计了鲁棒共模控制系统,保证了输入输出共模的稳定性,从而减小了共模电压变化引起的畸变。在线性区域使用MOS晶体管可以实现调谐能力。OTA的线性度约为- 60db三阶互调(IM3)失真,在40 MHz时高达0.9 VPP。该OTA采用TSMC 180 nm Deep N-WELL CMOS工艺制备。它占地面积很小,为15.1 × 10- 3mm2,在1.5 v供电电压下功耗为9.5 mW。
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引用次数: 12
An 1.4Gbps/ch LVDS Receiver with Jitter-Boundary-Based Digital De-skew Algorithm 基于抖动边界的数字去斜算法的1.4Gbps/ch LVDS接收机
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357931
Youngdon Choi, D. Jeong, Wonchan Kim, Jung-Bae Lee, Changhyun Kim
This paper introduces jitter-boundary-based (JBB) digitally controlled de-skewing algorithm for high-speed link such as flat panel display (FPD) and memory system. It tracks data sampling points by way of finding the boundaries of jitter probability density function (JPDF). This boundary-based tracking algorithm offers lower bit error rate (BER) under the asymmetric jitter distribution as well as symmetric one. In addition, it lowers the accumulated jitter through the delay adjustment of data path. Test chip was fabricated with 0.25 mum 5-metal CMOS technology. When 87.9 ps rms jitter is applied with the data rate of 1.4 Gbps as an input data, it recovers data with the BER of less than 10-11. When the transition maximized pattern is applied, the receiver dissipates 381 mW.
介绍了基于抖动边界(JBB)的高速链路(如平板显示器和存储系统)数控去斜算法。它通过寻找抖动概率密度函数(JPDF)的边界来跟踪数据采样点。这种基于边界的跟踪算法在不对称抖动分布和对称抖动分布下具有较低的误码率。此外,它还通过调整数据路径的延迟来降低累积抖动。采用0.25 μ m五金属CMOS工艺制作测试芯片。当输入数据速率为1.4 Gbps,施加87.9 ps的rms抖动时,恢复的数据误码率小于10-11。当应用跃迁最大化模式时,接收器耗散381 mW。
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引用次数: 3
A 1.2V Fully Differential Amplifier with Buffered Reverse Nested Miller and Feedforward Compensations 一个1.2V全差分放大器与缓冲反向嵌套米勒和前馈补偿
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357878
M. Shen, Li-Han Hung, Po-Chiun Huang
This paper presents a low voltage CMOS fully differential operational amplifier. It comprises three gain stages with two compensation schemes, buffered reverse nested Miller compensation (B-RNMC) and feedforward transconductance compensation (FFTC). In B-RNMC, a transconductance stage is inserted in the feedback path to eliminate the right half plane (RHP) zero which may degrade phase margin. In FFTC, a feedforward transconductance helps to enhance output large signal response. Using standard 0.35-mum CMOS technology, measurement results demonstrate that DC gain greater than 90 dB, gain-bandwidth product of 8.9 MHz, and phase margin of 86deg is achieved with lOOpF output loads. The settling time for a 1.2 Vpp step is 2.4 mus. All the circuits dissipate 342 muW under a single 1.2V power supply.
本文介绍了一种低压CMOS全差分运算放大器。它包括三个增益级和两种补偿方案,缓冲反向嵌套米勒补偿(B-RNMC)和前馈跨导补偿(FFTC)。在B-RNMC中,在反馈路径中插入一个跨导级,以消除可能降低相位裕度的右半平面(RHP)零点。在FFTC中,前馈跨导有助于增强输出大信号响应。采用标准的0.35 μ m CMOS技术,测量结果表明,在环路输出负载下,直流增益大于90 dB,增益带宽积为8.9 MHz,相位裕度为86度。1.2 Vpp步骤的稳定时间为2.4 mus。在单个1.2V电源下,所有电路的功耗为342 muW。
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引用次数: 11
PAC DSP Core and Its Applications PAC DSP核心及其应用
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357841
D. Chih-Wei Chang, I-Tao Liao, S. Tseng, Chein-Wen Jen
PAC DSP is a 32-bit programmable DSP solution which is ideal for next-generation media-rich and multifunction portable devices, such as portable media player (PMP), personal digital assistant (PDA), and smart phones. It provides high computation power from its parallel processing of multiple signal processing instructions and achieves efficient energy consumption form its unique architecture/micro-architecture design. Also, it maintains high application flexibility with general programmability.
PAC DSP是一种32位可编程DSP解决方案,是下一代富媒体和多功能便携式设备的理想选择,如便携式媒体播放器(PMP)、个人数字助理(PDA)和智能手机。它通过对多个信号处理指令的并行处理提供了高计算能力,并通过独特的体系结构/微体系结构设计实现了高效的能耗。同时,它具有较高的应用灵活性和通用的可编程性。
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引用次数: 10
A 1/f-Noise Reduction Architecture for an Operational Amplifier in a 0.13 μm Standard digital CMOS technology 基于0.13 μm标准数字CMOS技术的运算放大器1/f降噪架构
Pub Date : 2006-11-01 DOI: 10.1109/ASSCC.2006.357880
J. Koh, Jungeun Lee, Chun-Deok Suh, Hoon-Tae Kim
We present new circuit architecture for the 1/f noise reduction in a CMOS Miller operational amplifier. Compared to a reference circuit, the 1/f noise reduction of 7 dB is achieved for a CMOS Miller operational amplifier implemented in a 0.13 μm 1.5 V standard CMOS technology. This architecture successfully reduces the 1/f noise and is applicable to a continuous signal processing analog IC's.
我们提出了一种新的电路结构,用于CMOS米勒运算放大器的1/f降噪。与参考电路相比,采用0.13 μm 1.5 V标准CMOS技术实现的CMOS Miller运算放大器实现了7 dB的1/f降噪。该结构成功地降低了1/f噪声,适用于连续信号处理模拟集成电路。
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引用次数: 6
期刊
2006 IEEE Asian Solid-State Circuits Conference
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