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2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)最新文献

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InAs/InP QDs broadband LED using selective MOVPE growth and double-cap procedure 使用选择性MOVPE生长和双帽程序的InAs/InP量子点宽带LED
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516168
K. Shimomura, Y. Suzuki, Y. Saito, F. Kawashima
InAs/InP QDs broadband LED more than 450 nm spectrum width was successfully demonstrated. The broadband spectrum was obtained from the height controlled double-cap procedure and strain controlled buffer layer fabricated by the selective MOVPE technique.
成功演示了光谱宽度超过450 nm的InAs/InP量子点宽带LED。利用选择性MOVPE技术制备的高度控制双帽工艺和应变控制缓冲层获得了宽带频谱。
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引用次数: 3
Selective area growth of III-V semiconductors: From fundamental aspects to device structures III-V型半导体的选择性面积生长:从基本方面到器件结构
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5515910
M. Sugiyama
Fundamental aspects in the selective-area metal-organic vapor-phase epitaxy (MOVPE) of III-V semiconductors are presented in this paper, with an emphasis on the role of vapor-phase diffusion of a group-III precursor, which plays the dominant role for substantial modulation of an effective bandgap around wider (>100 μm) masks and is a characteristic of MOVPE that is operated close to atmospheric pressure. A single parameter, D/ks (vapor-phase mass diffusivity / surface incorporation rate coefficient), determines modulation of both thickness and composition of a layer. The value of D/ks can be regarded as an effective lateral diffusion length of a group-III precursor, and the value of ks can be decoupled from D/ks, providing insight to surface reaction kinetics of MOVPE. Coupling with reactor-scale distributions provides unique basis for the discussion of comprehensive reaction mechanism. The values of ks will be presented for basic materials composing InGaAsP system. Luminescence wavelength from multiple quantum wells (MQWs) around a given mask pattern can be simulated precisely based on a simple diffusion/reaction model and it is applicable to monolithic integration of devices using selective-area growth of InGaAsP-related materials. The same framework can be applied to III-nitride materials, and ks values for GaN growth have been obtained. Visible luminescence from InGaN/GaN MQWs on a patterned GaN template was red-shifted according to the mask width, for which only the thickness modulation of the InGaN wells has been suggested to be the governing mechanism.
本文介绍了III-V型半导体的选择性区金属-有机气相外延(MOVPE)的基本方面,重点介绍了iii族前驱体的气相扩散的作用,它在更宽(>100 μm)掩膜周围的有效带隙的实质调制中起主导作用,并且是MOVPE在接近大气压下工作的一个特征。一个参数D/ks(气相质量扩散系数/表面掺入率系数)决定了层的厚度和组成的调制。D/ks值可以看作是iii族前驱体的有效横向扩散长度,ks值可以与D/ks解耦,为研究MOVPE的表面反应动力学提供依据。与反应器尺度分布的耦合为综合反应机理的讨论提供了独特的依据。对于组成InGaAsP系统的基本材料,将给出k的值。基于简单的扩散/反应模型,可以精确地模拟给定掩模图案周围的多个量子阱(mqw)的发光波长,并且适用于使用ingaasp相关材料的选择性面积生长的单片集成器件。同样的框架可以应用于iii -氮化物材料,并获得了GaN生长的ks值。在有图案的GaN模板上,InGaN/GaN mqw发出的可见光根据掩膜宽度发生红移,其中只有InGaN阱的厚度调制被认为是控制机制。
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引用次数: 4
TCAD optimization of field-plated InAlAs-InGaAs HEMTs 场镀InAlAs-InGaAs hemt的TCAD优化
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516397
D. Saguatti, A. Chini, G. Verzellesi, M. Isa, K. Ian, M. Missous
High-voltage InGaAs-InAlAs HEMTs featuring optimized field-plate structures are being developed. A TCAD approach has been adopted for their design. Two-dimensional device simulations have preliminarily been calibrated by comparison with DC and RF measurements from the baseline InP HEMT technology into which the field plate is being incorporated. Simulations have then been used to design field-plate structures with optimal length and passivation thickness.
具有优化场极板结构的高电压InGaAs-InAlAs hemt正在开发中。它们的设计采用了TCAD方法。二维器件模拟已经初步校准,通过比较来自基线InP HEMT技术的直流和射频测量,其中场板被纳入。然后利用模拟设计了具有最佳长度和钝化厚度的场板结构。
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引用次数: 1
Sub 50 nm InP HEMT with fT = 586 GHz and amplifier circuit gain at 390 GHz for sub-millimeter wave applications Sub 50 nm InP HEMT, fT = 586 GHz,放大器电路增益为390 GHz,适用于亚毫米波应用
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516002
R. Lai, X. Mei, S. Sarkozy, W. Yoshida, P. Liu, J. Lee, M. Lange, V. Radisic, K. Leong, W. Deal
In this paper, we report recent advances on sub-50 nm InP HEMT have achieved new benchmarks of 586 GHz fT and 7 dB amplifier circuit gain at 390 GHz
在本文中,我们报告了sub-50 nm InP HEMT的最新进展,已经实现了586ghz fT和7db放大器电路增益在390 GHz的新基准
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引用次数: 15
DC and RF characteristics of InAs-channel MOS-MODFETs using PECVD SiO2 as gate dielectrics 使用PECVD SiO2作为栅极介质的inas沟道mos - modfet的直流和射频特性
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516253
H. Ho, Ta Fan, Geng-Ying Liau, Heng-Kuang Lin, P. Chiu, J. Chyi, C. Ko, T. Kuan, Meng-Kuei Hsieh, Wen-Chin Lee, C. Wann
Small-bandgap InAs channel materials are potential candidates for high-speed and low-power applications and have been demonstrated in AlSb/InAs/AlSb QWFETs. Taking advantage of their excellent transport properties, we successfully develop an InAs-channel metal-oxide-semiconductor modulation-doped field-effect transistor (MOS-MODFET) using 100-nm PECVD-deposited SiO2 dielectrics for gate dielectrics. A 2µm-gate-length depletion-mode InAs n-channel MOS-MODFET shows a maximum drain current of 270 mA/mm, a peak transconductance of 189 mS/mm, and a low output conductance of 18 mS/mm in dc characteristics, and a maximum current-gain cut-off frequency of 14.5 GHz and a maximum oscillation frequency of 24.0 GHz in rf performances. The InAs-channel MOS-MODFET presents potentials for further developing complementary circuit devices.
小带隙InAs通道材料是高速和低功耗应用的潜在候选者,并已在AlSb/InAs/AlSb qwfet中得到证明。利用其优异的输运特性,我们成功地开发了一种inas通道金属氧化物半导体调制掺杂场效应晶体管(MOS-MODFET),使用100 nm pecvd沉积的SiO2介电材料作为栅极介电材料。2µm栅长耗尽型InAs n沟道MOS-MODFET的最大漏极电流为270 mA/mm,峰值跨导为189 mS/mm,直流特性的低输出导率为18 mS/mm,射频性能的最大电流增益截止频率为14.5 GHz,最大振荡频率为24.0 GHz。inas通道MOS-MODFET具有进一步开发互补电路器件的潜力。
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引用次数: 0
High gain InAs electron-avalanche photodiodes for optical communication 光通信用高增益InAs电子雪崩光电二极管
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516221
A. Marshall, P. Vines, S. Xie, J. David, C. H. Tan
We report the avalanche properties of InAs avalanche photodiodes (APDs), extracted from avalanche gain and excess noise measurements performed under pure electron and pure hole injections, and from Monte Carlo simulations. For a given avalanche width electron initiated gain was found to be significantly higher than conventional InP and Si APDs. Hole initiated multiplication was negligible confirming the electron only multiplication process within the field range covered. Excess noise measurements showed the excess noise factors of less than 2, providing further evidence of the ideal avalanche properties in InAs. Monte Carlo simulations performed provided good agreement to experimental results.
我们报道了InAs雪崩光电二极管(APDs)的雪崩特性,这些特性是从纯电子和纯空穴注入下的雪崩增益和过量噪声测量中提取的,以及从蒙特卡罗模拟中提取的。对于给定的雪崩宽度,发现电子引发增益明显高于传统的InP和Si apd。空穴引发的倍增可以忽略不计,证实了在所涵盖的场范围内的电子倍增过程。过量噪声测量显示过量噪声因子小于2,进一步证明了InAs的理想雪崩特性。蒙特卡罗模拟与实验结果吻合较好。
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引用次数: 1
Optical coupling of planar III-V pin photodiodes and SOI waveguides using an integrated BCB prism 基于集成BCB棱镜的平面III-V管脚光电二极管与SOI波导的光耦合
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516229
L. Moerl, W. Passenberg, M. Ferstl, D. Schmidt, Ruiyong Zhang, T. Aalto, M. Harjanne, M. Kapulainen, S. Ylinen
Vertical hybrid integration of photodiodes (PD) and silicon-on-insulator (SOI) waveguides has been investigated. To this end, InP-based planar detectors were used onto which a polymer prism was formed to turn the light beam into the vertical direction. The photodiodes were flip-chip mounted onto a SOI waveguide platform using thermo-compression bonding. Comparable high responsivity of around 0.75 A/W was obtained when light was coupled directly into the prism as well as via a SOI waveguide. The responsivity for SOI integrated PDs was found to depend only to a minor extent on input wavelength and polarization. PD bandwidth of up to 10 GHz was measured. The investigated optical coupling scheme proved to work well also when integrating a PD with an array of ten SOI waveguides which are combined with a star coupler.
研究了光电二极管(PD)和绝缘体上硅(SOI)波导的垂直混合集成。为此,使用了基于inp的平面探测器,在其上形成聚合物棱镜使光束转向垂直方向。利用热压缩键合将光电二极管倒装到SOI波导平台上。当光直接耦合到棱镜以及通过SOI波导时,获得了大约0.75 A/W的相当高的响应率。发现SOI集成pd的响应性仅在很小程度上取决于输入波长和极化。测得PD带宽高达10ghz。所研究的光耦合方案在将PD与由十个SOI波导组成的阵列结合星形耦合器进行集成时也证明了良好的效果。
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引用次数: 2
Growth of large platy InGaAs crystals and fabrication of semiconductor laser diodes 大片InGaAs晶体的生长和半导体激光二极管的制造
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5515938
K. Kinoshita, S. Yoda, H. Aoki, T. Hosokawa, S. Yamamoto, M. Matsushima, M. Arai, Y. Kawaguchi, Y. Kondo, F. Kano
We have succeeded in increasing size of InxGa1−xAs (x: 0.1–0.13) platy single crystals to 30 ×30 mm2 in surface area for mass production of laser diodes. Key points are to suppress convection in a melt and to keep constant temperature gradient for obtaining homogeneous crystals. Grown crystals have enough quality as substrates for 1.3 μm laser diodes. Fabricated laser diodes on these substrates were evaluated by measuring lasing characteristics at various temperatures and by measuring bit error rate for transmission through a single mode fiber up to 20 km. Lasers showed high temperature stability and error free transmission and showed the merit of ternary substrates.
我们已经成功地将InxGa1−xAs (x: 0.1-0.13)平板单晶的表面积增加到30 ×30 mm2,用于大规模生产激光二极管。关键是要抑制熔体中的对流,并保持恒定的温度梯度,以获得均匀的晶体。生长的晶体具有足够的质量作为1.3 μm激光二极管的衬底。通过测量不同温度下的激光特性和通过单模光纤传输至20公里的误码率,对在这些衬底上制造的激光二极管进行了评估。激光器具有高温稳定性和无误差传输,显示出三元衬底的优点。
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引用次数: 2
Ammonothermal technology for bulk gallium nitride crystals 块状氮化镓晶体的氨热技术
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516027
D. Ehrentraut, T. Fukuda
The growth of bulk gallium nitride crystals can only be made from the vapor or liquid phase. The ammonothermal method is emerging as a potential alternative to the hydride vapor phase growth method. A short outline over the technology and some of the recent results from the acidic ammonothermal growth of GaN are presented.
块状氮化镓晶体的生长只能在气相或液相中进行。氨热法正在成为氢化物气相生长法的潜在替代品。简要介绍了氮化镓的酸性氨热生长技术和一些最新的研究成果。
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引用次数: 0
A new low-power RTD-based 4:1 multiplexer IC using an InP RTD/HBT MMIC technoligy 采用InP RTD/HBT MMIC技术的新型低功耗RTD-based 4:1多路复用器IC
Pub Date : 2010-07-23 DOI: 10.1109/ICIPRM.2010.5516385
Jongwon Lee, Sunkyu Choi, Kyounghoon Yang
A low-power 4:1 multiplexer (MUX) IC using Resonant Tunneling Diodes (RTDs) is proposed and fabricated. The proposed 4:1 MUX topology consists of two RTD-based 2:1 MUX ICs and a 2:1 selector IC. By using the unique NDR (Negative Differential Resistance) characteristics of the RTD, the proposed IC has achieved a significantly reduced dc power consumption compared to the conventional III-V transistor-based topology. The fabricated IC shows 15 Gb/s operation with dc power consumption of 80 mW.
提出并制作了一种采用谐振隧道二极管(rtd)的低功耗4:1多路复用器(MUX)集成电路。提出的4:1 MUX拓扑由两个基于RTD的2:1 MUX IC和一个2:1选择IC组成。通过使用RTD独特的NDR(负差分电阻)特性,与传统的基于III-V晶体管的拓扑相比,提出的IC实现了显著降低的直流功耗。该集成电路运行速度为15gb /s,直流功耗为80mw。
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引用次数: 3
期刊
2010 22nd International Conference on Indium Phosphide and Related Materials (IPRM)
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