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Proceedings of the Fourth IEEE International Caracas Conference on Devices, Circuits and Systems (Cat. No.02TH8611)最新文献

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OAHU - Object Analysis Hake Utility 对象分析Hake实用程序
V. Biolková, D. Biolek, T. Dostál
In the paper, 9 rules are given on which the operation of so-called Object Analysis Hake Utility is based. The basic resource is represented by VERTEX graphs, which describe a set of nonlinear equations between the parameters of circuit elements and the coefficients of circuit functions. Some feasible techniques of transforming these graphs into simpler structures are shown. As a result, the couplings among variations of individual parameters are made obvious that hold the monitored circuit features.
本文给出了对象分析Hake实用程序运行的9条规则。基本资源用顶点图表示,顶点图描述了电路元件参数与电路函数系数之间的一组非线性方程。给出了将这些图转换成更简单结构的一些可行技术。因此,各个参数变化之间的耦合是明显的,保持被监测电路的特征。
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引用次数: 0
Progress in silicon RF Power MOS technologies - current and future trends 硅射频功率MOS技术的进展-当前和未来趋势
M. M. De Souza, G. Cao, E. M. Sankara Narayanan, F. Youming, S. K. Manhas, J. Luo, N. Moguilnaia
In this paper, the current progress and factors limiting the performance of silicon RF Power device technologies are reviewed. Silicon VDMOSFETs have high linearity but the gain is low at frequencies in excess of 1 GHz. LDMOSFETs have higher gain and can operate up to 2.4 GHz. However, the linearity and reliability of LDMOSFETs is poor in comparison to VDMOSFETs. New architectures and evolving trends are discussed.
本文综述了硅射频功率器件技术的发展现状及影响器件性能的因素。硅vdmosfet具有高线性度,但在超过1ghz的频率下增益较低。ldmosfet具有更高的增益,工作频率可达2.4 GHz。然而,与vdmosfet相比,ldmosfet的线性度和可靠性较差。讨论了新的体系结构和发展趋势。
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引用次数: 15
Small-signal model of partially-depleted SOI MOSFETs and its parameter extraction 部分耗尽SOI mosfet的小信号模型及其参数提取
D. Tomaszewski, L. Lukasiak, K. Domanski, A. Jakubowski
A new non-quasi static small-signal model of partially-depleted SOI MOSFETs is presented together with parameter extraction procedure. A method to eliminate parasitic capacitances from experimental data is also shown.
提出了一种新的部分耗尽SOI mosfet的非准静态小信号模型,并给出了参数提取方法。并给出了一种从实验数据中消除寄生电容的方法。
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引用次数: 1
The emerging role of SiGe BiCMOS technology in wired and wireless communications SiGe BiCMOS技术在有线和无线通信中的新兴作用
D. Harame, A. Joseph, D. Coolbaugh, G. Freeman, K. Newton, S. Parker, R. Groves, M. Erturk, K. Stein, R. Volant, C. Dickey, J. Dunn, S. Subbanna, H. Zamat, V.S. Marangos, M. Doherty, O. Schreiber, T. Tanji, D. Herman, B. Meyerson
SiGe BiCMOS technology is well suited for both wired and wireless communication areas. For the wired space, the key requirements are very high speed active devices, extremely accurate interconnect modeling (lumped elements and transmission lines), and the ability to do very highly integrated analog and mixed signal chips. With data rates at 40 Gb/s, the distinction between digital and analog circuits becomes blurred and low frequency models are no longer adequate. RF/Analog layouts and models are needed for all active devices. SiGe BiCMOS satisfies all these requirements.
SiGe BiCMOS技术非常适合于有线和无线通信领域。对于有线空间,关键要求是非常高速的有源器件,极其精确的互连建模(集总元件和传输线),以及能够做非常高度集成的模拟和混合信号芯片。随着数据速率达到40 Gb/s,数字和模拟电路之间的区别变得模糊,低频模型不再适用。所有有源器件都需要RF/Analog布局和模型。SiGe BiCMOS满足所有这些要求。
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引用次数: 7
AlGaN/GaN HEMTs on sapphire
V. Kumar, I. Adesida
This paper presents the recent progress in the development of fabrication processes and device performance of recessed as well as non recessed AlGaN/GaN HEMTs at the University of Illinois. Maximum drain current density as high as 1.31 A/mm, record high extrinsic transconductance of 402 mS/mm, unity gain cut-off frequency (f/sub T/) of 107 GHz, and maximum frequency of oscillation (f/sub max/) of 148 GHz were demonstrated for recessed AlGaN/GaN HEMTs with a gate length of 0.15 /spl mu/m grown by MOCVD. Results for MBE-grown devices are also presented.
本文介绍了伊利诺伊大学在嵌入式和非嵌入式AlGaN/GaN hemt的制造工艺和器件性能方面的最新进展。通过MOCVD生长的栅极长度为0.15 /spl mu/m的嵌入式AlGaN/GaN HEMTs,最大漏极电流密度高达1.31 A/mm,创纪录的高外在跨导率为402 mS/mm,单位增益截止频率(f/sub - T/)为107 GHz,最大振荡频率(f/sub - max/)为148 GHz。本文还介绍了mbe生长器件的实验结果。
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引用次数: 1
A comparison between some control algorithms of parallel active filtering 几种并行有源滤波控制算法的比较
G. Brando, A. Del Pizzo, E. Faccenda
This paper deals with parallel active filtering by means of IGBT-Voltage Source Inverters. The control algorithm is based on the evaluation of active and reactive power by detecting line voltages and load currents. Then these powers are split in their average and alternative components using proper low-pass filters. The features linked to some different techniques of current control are investigated with reference to time behaviour and frequency spectrum of the resultant line current. Simulation results are discussed and compared with reference to a specific case-study.
本文研究了利用igbt电压源型逆变器进行并联有源滤波的方法。该控制算法通过检测线路电压和负载电流来评估有功和无功功率。然后使用适当的低通滤波器将这些功率拆分为其平均和替代分量。根据时间行为和所产生的线路电流的频谱,研究了与一些不同的电流控制技术有关的特征。结合具体实例,对仿真结果进行了讨论和比较。
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引用次数: 20
Active compensator to improve transient response delay for future generation of microprocessor 有源补偿器,用于改进下一代微处理器的瞬态响应延迟
Jia Luo, Xiaofang Gao, I. Batarseh
Normally, socket inductance is very small and it seldom influences the performance of chips. However, for new generation of microprocessor, the slew rate of load change is so large that the socket inductance response delay is dominant in transient response. The existing of a socket generates large voltage spike under such a load-change transient due to the current response delay of inductance. A novel active compensator is presented to minimize total voltage variation within 2.5% when microprocessor operates at 1V, 100A and 2A/ns of current slew rate with the package capacitance decreasing to less than one-half of Pentium 4 level.
通常情况下,插座电感很小,很少影响芯片的性能。然而,对于新一代微处理器来说,负载变化的摆变率非常大,使得插座电感响应延迟在瞬态响应中占主导地位。在这种负载变化瞬态下,由于电感的电流响应延迟,插座的存在会产生较大的电压尖峰。提出了一种新颖的有源补偿器,当微处理器工作在1V、100A和2A/ns的电流转换速率下,使总电压变化减小到2.5%以内,封装电容降至Pentium 4水平的一半以下。
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引用次数: 1
Power semiconductor devices: design and manufacturing for improved field reliability (invited) 功率半导体器件:提高现场可靠性的设计和制造(诚邀)
K. Shenai
In the information age, power electronic systems need to demonstrate, "nine 9's" of field reliability. The current reliability performance of most power converters is at best is in the range of "six 9's." A dramatic improvement in device robustness is needed to successfully address the emerging market demand. In this paper, we discuss a new "top-down" system-level approach to identify and correct excessive field failures in compact high-frequency computer and telecom power supplies. We outline approaches to design and manufacture robust power semiconductor switches that guarantee "built-in" field reliability.
在信息时代,电力电子系统需要验证现场可靠性的“9个9”。目前大多数电源转换器的可靠性性能充其量是在“6个9”的范围内。为了成功地满足新兴市场的需求,需要大幅提高设备的稳健性。在本文中,我们讨论了一种新的“自上而下”的系统级方法来识别和纠正紧凑型高频计算机和电信电源中的过量现场故障。我们概述了设计和制造保证“内置”现场可靠性的强大功率半导体开关的方法。
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引用次数: 0
Real measures, virtual instruments 真实测量,虚拟仪器
M. Billaud, T. Zimmer, D. Geoffroy, Y. Danto, H. Effinger, W. Seifert, J. Martinez, F. Gomez
This paper presents the realisation of a remote lab on a European scale. The involved countries are France, Germany, and Spain. The architecture of the lab is described and the functionality has been tested. It concerns the instrumentation in the field of microelectronics. It has been applied to the characterisation of MOS transistors.
本文介绍了一个欧洲规模的远程实验室的实现。涉及的国家是法国、德国和西班牙。描述了实验室的体系结构,并对其功能进行了测试。它涉及微电子领域的仪器仪表。它已被应用于MOS晶体管的表征。
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引用次数: 20
A physically-based continuous analytical graded-channel SOI nMOSFET model for analog applications 模拟应用的基于物理的连续分析梯度通道SOI nMOSFET模型
M. Pavanello, B. Iñíguez, J. Martino, D. Flandre
In this work a continuous model for analog simulation of long-channel Graded-Channel (GC) Silicon-On-Insulator (SOI) nMOSFETs is presented. The model is based in a series association of two conventional fully-depleted (FD) SOI nMOSFETs with different characteristics, representing each part of the GC nMOSFET channel region. MEDICI numerical bidimensional simulations and experimental results are used to validate the proposed model.
本文提出了一种用于长沟道梯度沟道(GC)绝缘子上硅(SOI) nmosfet模拟仿真的连续模型。该模型基于两个具有不同特性的传统全耗尽(FD) SOI nMOSFET的一系列关联,代表GC nMOSFET通道区域的每个部分。MEDICI二维数值模拟和实验结果验证了该模型的有效性。
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引用次数: 7
期刊
Proceedings of the Fourth IEEE International Caracas Conference on Devices, Circuits and Systems (Cat. No.02TH8611)
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