Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2044413
B. Han, C. Jang, A. Bar-Cohen, B. Song
Coupled thermal and mechanical design issues in a high power light emitting diode (LED) package platform are investigated using numerical models. A thermal resistance network model and a 3-D finite element model are built for thermal and stress analyses. They are validated with the experimental data and subsequently utilized to study the effect of key parameters on the junction temperature and the thermal strains. An extensive parametric analysis is conducted to assess the effect of design and material parameters on the junction temperature and thermal strains of the high power LED under study. Based on the results, the desired parameters of adhesives for high power LED applications are identified and an example of an LED thermo-mechanical design protocol is presented.
{"title":"Coupled Thermal and Thermo-Mechanical Design Assessment of High Power Light Emitting Diode","authors":"B. Han, C. Jang, A. Bar-Cohen, B. Song","doi":"10.1109/TCAPT.2010.2044413","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2044413","url":null,"abstract":"Coupled thermal and mechanical design issues in a high power light emitting diode (LED) package platform are investigated using numerical models. A thermal resistance network model and a 3-D finite element model are built for thermal and stress analyses. They are validated with the experimental data and subsequently utilized to study the effect of key parameters on the junction temperature and the thermal strains. An extensive parametric analysis is conducted to assess the effect of design and material parameters on the junction temperature and thermal strains of the high power LED under study. Based on the results, the desired parameters of adhesives for high power LED applications are identified and an example of an LED thermo-mechanical design protocol is presented.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"688-697"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2044413","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62519990","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2055565
M. Arik, Rajdeep Sharma, J. Jackson, S. Prabhakaran, Charles Seeley, Y. Utturkar, S. Weaver, G. Kuenzler, B. Han
Light-emitting diode (LED)-based solid-state lighting (SSL) products have been exceeding the predicted performances especially at the chip and package levels. This has led to new SSL-based products for energy savings and long lifetimes. Large amounts of government funding and private investments have been made during the last decade to accelerate and guide the technology. This paper focuses on the development of an LED-based high-lumen luminaire technology. The critical subcomponents of the luminaire are the LED light engine (LED chips and optical system), thermal management, and driver electronics. Each of these subcomponents will be discussed in detail for a 100 W incandescent replacement technology. The paper addresses system integration of each of the subcomponents. While the design of new products evolve, the lack of reliability data poses a risk of premature failure of LED-based products. Premature failures would trigger customer rejection and may delay market penetration. Therefore, luminaire reliability is an important aspect of luminaire design. In cohort with this notion, finally, the luminaire reliability has been discussed.
{"title":"Development of a High-Lumen Solid State Down Light Application","authors":"M. Arik, Rajdeep Sharma, J. Jackson, S. Prabhakaran, Charles Seeley, Y. Utturkar, S. Weaver, G. Kuenzler, B. Han","doi":"10.1109/TCAPT.2010.2055565","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2055565","url":null,"abstract":"Light-emitting diode (LED)-based solid-state lighting (SSL) products have been exceeding the predicted performances especially at the chip and package levels. This has led to new SSL-based products for energy savings and long lifetimes. Large amounts of government funding and private investments have been made during the last decade to accelerate and guide the technology. This paper focuses on the development of an LED-based high-lumen luminaire technology. The critical subcomponents of the luminaire are the LED light engine (LED chips and optical system), thermal management, and driver electronics. Each of these subcomponents will be discussed in detail for a 100 W incandescent replacement technology. The paper addresses system integration of each of the subcomponents. While the design of new products evolve, the lack of reliability data poses a risk of premature failure of LED-based products. Premature failures would trigger customer rejection and may delay market penetration. Therefore, luminaire reliability is an important aspect of luminaire design. In cohort with this notion, finally, the luminaire reliability has been discussed.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"668-679"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2055565","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520608","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2070800
Chih-Chung Chang, Nai-Wen Liang, Sih-Li Chen
This paper experimentally investigated the thermal performance of a miniature vapor compressor refrigeration system using a thermal resistance model for electronic cooling. The evaporator, compressor, expansion valve, and condenser are the four main devices forming the refrigeration system with R-134a as a working fluid. The experimental parameters considered were the openings of the expansion valve and input heating power. The results indicated that the system in this paper had the largest cooling capacity of 150 W and coefficient of performance of 4.25 at the 8th and 9th openings of the expansion valve, respectively. The results also showed that correlations of the thermal resistance of the evaporator and the condenser are developed with experimental data and their precision, compared with the experimental data, was about 4.42% and 12%, respectively. Besides the adjustment of the compressor speed could decrease the possibility of the occurrence of condensation phenomena near the inlet and outlet of the evaporator. Also, the smallest dimension of the combination of the evaporator and condenser is presented at the input heating power of 150 W and the 8th opening of the expansion valve.
{"title":"Miniature Vapor Compressor Refrigeration System for Electronic Cooling","authors":"Chih-Chung Chang, Nai-Wen Liang, Sih-Li Chen","doi":"10.1109/TCAPT.2010.2070800","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070800","url":null,"abstract":"This paper experimentally investigated the thermal performance of a miniature vapor compressor refrigeration system using a thermal resistance model for electronic cooling. The evaporator, compressor, expansion valve, and condenser are the four main devices forming the refrigeration system with R-134a as a working fluid. The experimental parameters considered were the openings of the expansion valve and input heating power. The results indicated that the system in this paper had the largest cooling capacity of 150 W and coefficient of performance of 4.25 at the 8th and 9th openings of the expansion valve, respectively. The results also showed that correlations of the thermal resistance of the evaporator and the condenser are developed with experimental data and their precision, compared with the experimental data, was about 4.42% and 12%, respectively. Besides the adjustment of the compressor speed could decrease the possibility of the occurrence of condensation phenomena near the inlet and outlet of the evaporator. Also, the smallest dimension of the combination of the evaporator and condenser is presented at the input heating power of 150 W and the 8th opening of the expansion valve.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"794-800"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070800","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520761","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2046487
S. Lim, V. S. Rao, W. Y. Hnin, W. L. Ching, V. Kripesh, Charles Lee, J. Lau, J. Milla, A. Fenner
The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip-chip technology are suitability for very fine pitch interconnection and fluxless bonding. Fluxless flip-chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the electroless nickel and gold under bump metallization. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip-chip assembly of stacked silicon module using AuSn microbumps was presented.
{"title":"Process Development and Reliability of Microbumps","authors":"S. Lim, V. S. Rao, W. Y. Hnin, W. L. Ching, V. Kripesh, Charles Lee, J. Lau, J. Milla, A. Fenner","doi":"10.1109/TCAPT.2010.2046487","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2046487","url":null,"abstract":"The use of flip-chip bonding technology on gold-tin (AuSn) microbumps for flip-chip packaging is becoming increasingly important in the electronics industry. Some of the main advantages of AuSn system over solder flip-chip technology are suitability for very fine pitch interconnection and fluxless bonding. Fluxless flip-chip assembly is in demand especially for medical applications and optoelectonics packaging. Here, we report the assembly process development of a silicon stacked module assembled with AuSn microbumps to meet the stringent reliability. The effects of bond pressure distribution, bond temperature and alignment accuracy were found to be critical in this stacked silicon using AuSn microbumps. A three-factor design of experiment was carried out to investigate the effects of assembly parameters such as bonding pressure, temperature and time on contact resistance and AuSn solder wetting on the electroless nickel and gold under bump metallization. Results showed that higher bond force is undesirable and contributes to passivation cracking and deformed AuSn joint with AuSn solder being squeezed out of the joint during bonding. The reliability result of the flip-chip assembly of stacked silicon module using AuSn microbumps was presented.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"747-753"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2046487","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520457","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2070799
Hailei Wang, R. Peterson
Flow boiling is an important process in energy conversion applications such as power generation and heating, ventilating, and air conditioning systems. Recently, it has drawn interest in the high heat flux electronics cooling community. Flow boiling enhancement, in addition, has the benefit of early onset of nucleate boiling, potentially lowering wall superheat, and increasing the heat transfer coefficient and critical heat flux (CHF). The objective of this paper was to investigate the use of fine metal wire mesh screens to enhance nucleate boiling in microchannels. Contact resistance between the wire mesh and channel heating surface was essentially eliminated by employing a diffusion brazing process to attach the screen to the wall. The parallel microchannels were 1000 μm in width and 510 μm in depth. A dielectric working fluid, HFE 7000, was investigated during this paper. Flow boiling results were compared for channels with and without wire mesh. According to the flow boiling curves obtained in this investigation for the bare and mesh channels, the amount of wall superheat was substantially reduced for the mesh channels at all four stream-wise locations. This indicated that nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. The mesh channels also displayed a higher flow boiling heat transfer coefficient. Both the nucleate boiling dominated regime and convective evaporation dominated regime were identified, with the overall trend of increasing the flow boiling heat transfer coefficient with respect to vapor quality until this quantity reached approximately 0.4. The CHF for the mesh channel was also significantly higher than that for the bare channel. The flow boiling enhancement was achieved with no apparent pressure drop penalty. The results presented here provide a practical means to implement this surface enhancement technique.
{"title":"Enhanced Boiling Heat Transfer in Parallel Microchannels With Diffusion Brazed Wire Mesh","authors":"Hailei Wang, R. Peterson","doi":"10.1109/TCAPT.2010.2070799","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070799","url":null,"abstract":"Flow boiling is an important process in energy conversion applications such as power generation and heating, ventilating, and air conditioning systems. Recently, it has drawn interest in the high heat flux electronics cooling community. Flow boiling enhancement, in addition, has the benefit of early onset of nucleate boiling, potentially lowering wall superheat, and increasing the heat transfer coefficient and critical heat flux (CHF). The objective of this paper was to investigate the use of fine metal wire mesh screens to enhance nucleate boiling in microchannels. Contact resistance between the wire mesh and channel heating surface was essentially eliminated by employing a diffusion brazing process to attach the screen to the wall. The parallel microchannels were 1000 μm in width and 510 μm in depth. A dielectric working fluid, HFE 7000, was investigated during this paper. Flow boiling results were compared for channels with and without wire mesh. According to the flow boiling curves obtained in this investigation for the bare and mesh channels, the amount of wall superheat was substantially reduced for the mesh channels at all four stream-wise locations. This indicated that nucleate boiling in the mesh channel was enhanced due to the increase of nucleation sites the mesh introduced. The mesh channels also displayed a higher flow boiling heat transfer coefficient. Both the nucleate boiling dominated regime and convective evaporation dominated regime were identified, with the overall trend of increasing the flow boiling heat transfer coefficient with respect to vapor quality until this quantity reached approximately 0.4. The CHF for the mesh channel was also significantly higher than that for the bare channel. The flow boiling enhancement was achieved with no apparent pressure drop penalty. The results presented here provide a practical means to implement this surface enhancement technique.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"784-793"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070799","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520512","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2064313
M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma
Die-bonding for a nitride light-emitting diode (LED) by sintering of micrometer size Ag particles in air at 200°C was investigated. Micrometer size Ag particles absorb oxygen remarkably well at 200°C and above, and on sintering, they form a porous layer. The activating temperature of the sintering is in good agreement with the oxygen adsorption temperature. Sintering does not progress in the absence of oxygen. A reduction of thermal resistance and an improvement of reliability are achieved by the sintered layer as a die attach to a surface-mount-type LED. This mounting method is useful in the die bonding of electronic components, and is an alternative technique to high-temperature lead soldering.
{"title":"Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles","authors":"M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma","doi":"10.1109/TCAPT.2010.2064313","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2064313","url":null,"abstract":"Die-bonding for a nitride light-emitting diode (LED) by sintering of micrometer size Ag particles in air at 200°C was investigated. Micrometer size Ag particles absorb oxygen remarkably well at 200°C and above, and on sintering, they form a porous layer. The activating temperature of the sintering is in good agreement with the oxygen adsorption temperature. Sintering does not progress in the absence of oxygen. A reduction of thermal resistance and an improvement of reliability are achieved by the sintered layer as a die attach to a surface-mount-type LED. This mounting method is useful in the die bonding of electronic components, and is an alternative technique to high-temperature lead soldering.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"7 1","pages":"801-808"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2064313","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2063430
C. Jang, B. Han, Samson Yoon
We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100°C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.
{"title":"Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds Over Solder Reflow Process Temperature","authors":"C. Jang, B. Han, Samson Yoon","doi":"10.1109/TCAPT.2010.2063430","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2063430","url":null,"abstract":"We address moisture diffusion in epoxy molding compounds (EMCs) at temperatures higher than 100°C. The objectives of this paper are thus: 1) to obtain diffusion properties of EMCs in both absorption and desorption modes at a wide range of temperatures; 2) to establish a non-Fickian correlation for diffusivity; and 3) to assess moisture diffusion behaviors during a solder reflow process, described by two different Fickian diffusivities of absorption and desorption and the non-Fickian diffusivity. An experimental procedure is established to measure the diffusivity and solubility of selected EMC materials. The results are utilized in a numerical simulation to analyze the effect of the non-Fickian diffusion characteristics on the moisture distribution during the reflow process.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"809-818"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2063430","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520383","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2070874
D. Ansari, A. Husain, Kwang‐Yong Kim
The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.
{"title":"Multiobjective Optimization of a Grooved Micro-Channel Heat Sink","authors":"D. Ansari, A. Husain, Kwang‐Yong Kim","doi":"10.1109/TCAPT.2010.2070874","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2070874","url":null,"abstract":"The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"767-776"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070874","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-11-22DOI: 10.1109/TCAPT.2010.2060198
W. Christiaens, E. Bosman, J. Vanfleteren
Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.
{"title":"UTCP: A Novel Polyimide-Based Ultra-Thin Chip Packaging Technology","authors":"W. Christiaens, E. Bosman, J. Vanfleteren","doi":"10.1109/TCAPT.2010.2060198","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2060198","url":null,"abstract":"Flexible materials, today, are being used already as base substrates for electronic assembly. A lot of mounted components could be integrated in flexible polyimide (PI) substrates. Very interesting advantages of integrating components into the flex are compactness and enhanced flexibility; not only the interconnection but also the components themselves can be mechanically flexible. This paper describes a PI-based embedding technology for integrating very thin silicon chips in between two spin-on PI layers, the ultra-thin chip package (UTCP). This paper discusses the different process steps in the UTCP production and also presents the interconnection test results realized with this technology.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"754-760"},"PeriodicalIF":0.0,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2060198","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2010-10-04DOI: 10.1109/TCAPT.2010.2058113
Jiantao Zheng, G. Ostrowicki, S. Sitaraman
An innovative fixtureless test technique to study interfacial fatigue fracture in thin film stacks is proposed and implemented. Cyclic noncontact magnetic actuation is employed to supply the fatigue crack driving force along the interface between a released metal thin film cantilever and the supporting substrate. In-situ crack growth measurements with nanometer resolution are possible through electrical resistance monitoring of nanoscale metal traces that are located along the edge of the delaminating interface. Ti/Au nano metal traces are fabricated using electron-beam lithography and characterized to show stable electrical behavior. The fatigue test results were then used to assess the reliability of micro contact springs under fatigue loading for wafer probing applications.
{"title":"Cyclic Magnetic Actuation for Potential Characterization of Interfacial Fatigue Fracture","authors":"Jiantao Zheng, G. Ostrowicki, S. Sitaraman","doi":"10.1109/TCAPT.2010.2058113","DOIUrl":"https://doi.org/10.1109/TCAPT.2010.2058113","url":null,"abstract":"An innovative fixtureless test technique to study interfacial fatigue fracture in thin film stacks is proposed and implemented. Cyclic noncontact magnetic actuation is employed to supply the fatigue crack driving force along the interface between a released metal thin film cantilever and the supporting substrate. In-situ crack growth measurements with nanometer resolution are possible through electrical resistance monitoring of nanoscale metal traces that are located along the edge of the delaminating interface. Ti/Au nano metal traces are fabricated using electron-beam lithography and characterized to show stable electrical behavior. The fatigue test results were then used to assess the reliability of micro contact springs under fatigue loading for wafer probing applications.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"648-654"},"PeriodicalIF":0.0,"publicationDate":"2010-10-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2058113","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"62520721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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