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2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103)最新文献

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Analog front end IC for category I and II ADSL I类和II类ADSL的模拟前端IC
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852884
J. Guido, V. Leung, J. Kenney, J. Trackim, A. Agrillo, E. Zimany, R. Shariatdoust
A 0.6 um CMOS analog front end IC supporting ADSL central office and remote terminal (category I and II) modem applications is developed. The receive path contains a low-noise programmable gain amplifier, analog equalizer, antialiasing filter, and a 12 bit A/D converter. The transmit channel incorporates a 14 bit D/A converter and a low-pass filter. The IC consumes 525 mW on a 5 V supply.
开发了一种支持ADSL中局和远程终端(I类和II类)调制解调器应用的0.6 um CMOS模拟前端IC。接收路径包含一个低噪声可编程增益放大器、模拟均衡器、抗混叠滤波器和一个12位a /D转换器。发射通道包含一个14位的D/ a转换器和一个低通滤波器。集成电路在5v电源上消耗525mw。
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引用次数: 10
A 2 dB NF, fully differential, variable gain, 900 MHz CMOS LNA 一个2db NF,全差分,可变增益,900mhz CMOS LNA
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852860
E. Sacchi, I. Bietti, F. Gatta, F. Svelto, R. Castello
A fully differential 900 MHz CMOS LNA using, as input stage, nMOS and pMOS inductively degenerated pairs, in shunt configuration, achieves the following performance: 2 dB NF, 22 dB voltage gain, -3 dBm IIP3 with 8 mA current consumption. As additional feature of this LNA is a variable gain. Measurements have been performed on packaged dies. No external components are used, except for an SMD inductor (used for tuning purposes), placed in series with the on-chip gate spiral inductor.
采用nMOS和pMOS电感退化对作为输入级,并联配置的全差分900 MHz CMOS LNA可实现以下性能:2 dB NF, 22 dB电压增益,-3 dBm IIP3, 8ma电流消耗。这个LNA的附加特性是可变增益。对封装的模具进行了测量。除了SMD电感器(用于调谐目的)外,不使用外部元件,与片上门螺旋电感器串联。
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引用次数: 31
A 256-Mb Double-Data-Rate SDRAM with a 10-mW Analog DLL Circuit 带有10mw模拟DLL电路的256 mb双数据速率SDRAM
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852856
Hideharu Yahata, Y. Okuda, Hiroki Miyashita, H. Chigasaki, Binhaku Taruishi, T. Akiba, Y. Kawase, T. Tachibana, S. Ueda, S. Aoyama, A. Tsukimori, Ken Shibata, M. Horiguchi, Yozo Saiki, Y. Nakagome
The developed 256-Mb double-data-rate (DDR) SDRAM employs a one-cycle stage-selection analog DLL (delayed-locked loop) circuit-running at IO mW with a 20-ps jitter and a 65- cycles lock-in - and a fully differential clocking system to provide 2~ 0.33-ns clock-to-data-output delay, 0.06-ns setup time and 0.26-ns hold time with respect to the data strobe. This performance represents the possibility of over 250-MHz (500 Mb/s/pin) operation. An even/odd-shared redundancy circuit for a 2-b prefetch reduces the number of fuses by 33%.
开发的256 mb双数据速率(DDR) SDRAM采用一个单周期级选择模拟DLL(延迟锁定环路)电路,运行在IO mW,具有20 ps抖动和65周期锁定,以及一个完全差分时钟系统,提供2~ 0.33 ns时钟到数据输出延迟,0.06 ns设置时间和0.26 ns保持时间相对于数据频闪器。该性能代表了超过250 mhz (500 Mb/s/引脚)操作的可能性。一个偶数/奇数共享冗余电路为一个2-b预取减少保险丝的数量33%。
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引用次数: 7
A 10-Gb/s CMOS clock and data recovery circuit 一个10gb /s CMOS时钟和数据恢复电路
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852871
J. Savoj, B. Razavi
A 10-Gb/s phase-locked clock and data recovery circuit incorporates a 5-GHz interpolating voltage-controlled oscillator and a half-rate phase detector. The phase detector provides a linear characteristic while retiming and demultiplexing the data with no systematic phase offset. Fabricated in a 0.18-/spl mu/m CMOS technology, the circuit exhibits an rms jitter of 6.6 ps in the recovered clock with random data input of length 2/sup 23/-1. The power dissipation is 99 mW from a 2.6-V supply.
一个10 gb /s锁相时钟和数据恢复电路包含一个5 ghz插值压控振荡器和一个半速率鉴相器。相位检测器在对数据进行重定时和解复用时提供线性特性,而没有系统相位偏移。该电路采用0.18-/spl μ m CMOS工艺制作,在随机数据输入长度为2/sup 23/-1时,恢复时钟的rms抖动为6.6 ps。2.6 v电源的功耗为99 mW。
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引用次数: 26
470 ps 64-bit parallel binary adder [for CPU chip] 470ps 64位并行二进制加法器[用于CPU芯片]
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852887
Jaehong Park, H. Ngo, S. Dhong
This paper presents a fast 64-bit parallel carry look-ahead binary adder implemented in a 1 GHz research prototype 64-bit PowerPC microprocessor. Efficient use of dynamic compound gates enables implementation of the adder in just three stages of delayed reset dynamic logic. The computation uses only G (Generate) and P (Propagate), and the inverse of Carry is computed from G, P, and a strobe signal.
本文提出了一种在1 GHz研究原型64位PowerPC微处理器上实现的快速64位并行进位预判二进制加法器。动态复合门的有效使用使加法器在延迟复位动态逻辑的三个阶段实现。计算只使用G(生成)和P(传播),并且从G、P和频闪信号计算进位的逆。
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引用次数: 30
Sub 1-V 5-GHz-band up- and down-conversion mixer cores in 0.35-/spl mu/m CMOS Sub - 1v - 5ghz波段上下转换混频器内核,采用0.35-/spl mu/m CMOS
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852861
T. Wakimoto, T. Hatano, C. Yamaguchi, H. Morimura, S. Konaka
To lower the supply voltage and reduce the power dissipation of the RF front-end of wireless communication systems, a double-balanced square-law MOSFET mixer is proposed. It is applied to up- and down-conversion mixer cores. Implemented in a 0.35-/spl mu/m CMOS process, the up-conversion mixer core operates with a supply voltage of 0.5 V and a supply current of 0.8 mA in the 5-GHz band. The local leakage is suppressed below -40 dBc. The down-conversion mixer core drains 0.4 mA from a 1-V supply in the same band. The conversion gain is 6 dB and the 3rd-order input-referred intercept point (IIP3) is +5 dBm.
为了降低无线通信系统射频前端的电源电压和功耗,提出了一种双平衡方律MOSFET混频器。它适用于上下转换混频器铁芯。在0.35-/spl mu/m CMOS工艺中实现,上转换混频器核心在5 ghz频段工作,电源电压为0.5 V,电源电流为0.8 mA。局部漏电抑制在- 40dbc以下。下变频混频器芯在同一频段从1 v电源消耗0.4 mA。转换增益为6db,三阶输入参考截距点(IIP3)为+ 5dbm。
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引用次数: 3
A Si BiCMOS trans-impedance amplifier for 10 Gb SONET receiver 一种用于10gb SONET接收机的Si BiCMOS跨阻抗放大器
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852881
H.H. Kim, S. Chandrasekhar, C. Burrus, J. Bauman
A trans-impedance amplifier integrated with an InP PIN photodiode has been demonstrated for 10 Gb SONET receiver. The shunt feedback trans-impedance amplifier is fabricated in 0.25 /spl mu/m modular Si BICMOS technology. The feedback resistance of 870 /spl Omega/ is achieved with a bandwidth of 8.5 GHz. The sensitivity of the trans-impedance amplifier at 10 Gb/s is -17 dBm at a bit-error-rate (BER) of 10/sup -12/ with 2/sup 31/-1 pseudo-random bits.
介绍了一种集成了InP PIN光电二极管的跨阻抗放大器,用于10gb SONET接收机。并联反馈反阻抗放大器采用0.25 /spl mu/m模块化Si BICMOS技术制作。反馈电阻为870 /spl ω /,带宽为8.5 GHz。该反阻抗放大器在10gb /s时的灵敏度为- 17dbm,误码率为10/sup -12/,伪随机位为2/sup 31/-1。
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引用次数: 2
A DDR/SDR-compatible SDRAM design with a three-size flexible column redundancy DDR/ sdr兼容SDRAM设计,具有三尺寸灵活的列冗余
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852866
T. Sakata, S. Morita, O. Nagashima, H. Noda, T. Takahashi, T. Sonoda, H. Tadokoro, H. Ichikawa, T. Adou, S. Hanzawa, M. Ohi, S. Ookuma, Y. Suzuki, H. Tanaka, K. Ishii
Two circuit techniques are proposed to design a SDRAM which operates both at a double-data-rate (DDR) and a single-data-rate (SDR). The common/separated I/O scheme enables 2-bit prefetching under a DDR and interrupt operations under an SDR with half the number of data-bus lines otherwise needed. The SSTL/LVTTL-compatible input buffer allows a narrow setup/hold time. Furthermore, the three-size flexible column redundancy enhances the yield. To evaluate these techniques, a 256-Mb SDRAM has been designed assuming 0.16-/spl mu/m technology and simulated with 167-MHz operations.
提出了两种电路技术来设计双数据速率(DDR)和单数据速率(SDR)的SDRAM。通用/分离I/O方案支持DDR下的2位预取,并在SDR下中断操作,否则需要的数据总线数只有一半。SSTL/ lvttl兼容的输入缓冲器允许较窄的设置/保持时间。此外,三尺寸柔性柱冗余提高了成品率。为了评估这些技术,我们设计了一个256 mb的SDRAM,假设0.16-/spl mu/m的技术,并在167 mhz的操作下进行了模拟。
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引用次数: 2
A 1.6 ns access, 1 GHz two-way set-predicted and sum-indexed 64-kByte data cache 1.6 ns访问,1ghz双向集预测和求和索引64 kbyte数据缓存
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852896
J. Silberman, N. Aoki, N. Kojima, Sang Dhong
A 64-kByte cache exploits combined address generation and word line decoding in the SRAM array, translation array, and directory. In place of a late select, set selection in the two-way associative cache is accomplished in the decode path by accessing a stored prediction from a sum-indexed array built into the decoder.
64-kByte缓存利用SRAM数组、翻译数组和目录中的组合地址生成和字行解码。在解码路径中,双向关联缓存中的集合选择通过访问内置到解码器中的和索引数组中的存储预测来代替后期选择。
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引用次数: 2
Where does memory go in the 21C? (Evolution and revolution of memory technology) 21世纪的记忆何去何从?(存储技术的演变与革命)
Pub Date : 2000-06-15 DOI: 10.1109/VLSIC.2000.852859
C. Hwang
For the new millennium, several "third" dimensional approaches in the memory area will take place with continuous revolutionary development from current technologies for various customers' demands. In the mean time, various and combined evolutionary technologies such as micro-machining technology, multi-chip stacking techniques, mixed digital/analog circuits, merged memories on a chip, cloning and genetics, biochemistry and magnetics areas are awaiting a breakthrough and will be pursued toward the generic memory goals of high density, high speed and low power more closely.
在新的千禧年,随着当前技术的不断革命性发展,存储领域将出现几种“第三”维方法,以满足各种客户的需求。与此同时,微加工技术、多芯片堆叠技术、数模混合电路、片上合并存储器、克隆与遗传学、生物化学、磁学等多种进化技术和组合技术正在等待突破,并将更加紧密地向高密度、高速、低功耗的通用存储器目标迈进。
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引用次数: 3
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2000 Symposium on VLSI Circuits. Digest of Technical Papers (Cat. No.00CH37103)
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