Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382129
G. Lee, J. Lin
Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion.
{"title":"The introduction of high heat dissipation material","authors":"G. Lee, J. Lin","doi":"10.1109/IMPACT.2009.5382129","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382129","url":null,"abstract":"Along with the increase in circuit density, it becomes more difficult to dissipate heat through the surface of the components. Therefore, the designs and applications for the materials used in heat dissipation as well as high thermal conductivity and low CTE have become the focal point for discussion.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"39 1","pages":"240-243"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84421004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382162
Po-Hao Chang, K. Chiang, J. Lai, Yu-Po Wang
An integrated passive device (IPD) solution is one of the important implementation employing the advanced redistribution layers (RDL) technology to fabricate the design passive components.
集成无源器件(IPD)解决方案是采用先进的重分布层(RDL)技术制造设计无源器件的重要实现之一。
{"title":"Advanced integrated passive device (IPD) low pass filter designs on WLCSP","authors":"Po-Hao Chang, K. Chiang, J. Lai, Yu-Po Wang","doi":"10.1109/IMPACT.2009.5382162","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382162","url":null,"abstract":"An integrated passive device (IPD) solution is one of the important implementation employing the advanced redistribution layers (RDL) technology to fabricate the design passive components.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"159 1","pages":"132-135"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85327750","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382161
Meng Tsung Lee, Jung-Pang Huang, G. Lin, Y. Lin, Y. Jiang, S. Chiu, C. Huang
In this paper we present new approaches in the development of flip chip technology. We assess the challenges presented by micro bump interconnection. In order to study that we have evaluated different bump designs of stagger 50 um pitch using different flip-chip packages methods Mold Under-filling (MUF) & Capillary Under-filling (CUF). (Figure 1) Finally this paper will conclude by identifying the most robust Cu pillar bump design for fine pitch FCCSP devices.
{"title":"Optimization of copper pillar bump design for fine pitch flip-chip packages","authors":"Meng Tsung Lee, Jung-Pang Huang, G. Lin, Y. Lin, Y. Jiang, S. Chiu, C. Huang","doi":"10.1109/IMPACT.2009.5382161","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382161","url":null,"abstract":"In this paper we present new approaches in the development of flip chip technology. We assess the challenges presented by micro bump interconnection. In order to study that we have evaluated different bump designs of stagger 50 um pitch using different flip-chip packages methods Mold Under-filling (MUF) & Capillary Under-filling (CUF). (Figure 1) Finally this paper will conclude by identifying the most robust Cu pillar bump design for fine pitch FCCSP devices.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"1 1","pages":"128-131"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"79529735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382184
Shung-Wen Kang, Meng-chang Tsai, M. Weng, Chao-Hsiang Hsu
Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.
{"title":"Development of Thermal spreading technology nowadays","authors":"Shung-Wen Kang, Meng-chang Tsai, M. Weng, Chao-Hsiang Hsu","doi":"10.1109/IMPACT.2009.5382184","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382184","url":null,"abstract":"Thermal spreading is a technology of decreasing the hot spot for electronic cooling and other high heat flux applications, and is characterized by high heat transfer, uniformity of heat removal. Vapor chamber is one of the Thermal spreading technologies which depend on two phase heat pipe technology. This paper provides an introduction to vapor chamber for electronic cooling, high power LEDs, multi heat sources, communication devices, and bio technology applications, reviews the development of thermal spreading technology nowadays, and summarizes the data regarding effects of vapor chamber inside thermal module, future applications, and suggestion. Some models of multi heat sources cooling were also presented.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"27 1 1","pages":"328-335"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89738712","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382136
Shao-cheng Lo, Yu-Ping Hsieh, Y. Yen
This study investigate the interfacial reactions and mechanical property between Sn-4.0Ag-0.5Cu (SAC, in wt%) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG, in wt%) lead free solders with Au/Ni(P)/Cu substrate by CO2 laser reflow. These results compare with the same systems under a conventional hot-air reflowing method in the oven. After reflowing, all samples were then taken heat-treatment at 150°C for 1000 hours. Under CO2 laser reflowing, mixtures of the (Cu,Ni)6Sn5 and (Ni,Cu)3Sn4 phases and (Ni,P,Cu) solid solution were formed at the interface. After taking a long period of heat-treatment, the (Cu,Ni)6Sn5+(Ni,Cu)3Sn4 were still observed at the interface. But, the Ni(P)+Cu solid solution disappeared as increasing reaction times. The experimental results compared with the same couples by conventional hot-air reflowing at 240°C, three layer structures, (Cu,Ni)6Sn5, (Ni,Cu)3Sn4 and Ni3P phases, were formed at the interface. The spalling intermetallic compounds could be observed in the SACNG/Au/Ni/Cu couple. The mechanical strength of solder joints by the laser reflowing technique is very similar to that by the hot-air reflowing method.
采用CO2激光回流技术研究了Au/Ni(P)/Cu衬底与Sn-4.0Ag-0.5Cu (SAC, wt%)和Sn-4.0Ag-0.5Cu-0.05Ni-0.01 ge (sacg, wt%)无铅钎料之间的界面反应和力学性能。这些结果与传统热风回流法下的相同系统进行了比较。回流后，所有样品在150℃下热处理1000小时。在CO2激光回流下，界面处形成了(Cu,Ni)6Sn5和(Ni,Cu)3Sn4相和(Ni,P,Cu)固溶体的混合物。经过长时间的热处理后，界面处仍然存在(Cu,Ni)6Sn5+(Ni,Cu)3Sn4。随着反应时间的增加，Ni(P)+Cu固溶体逐渐消失。实验结果表明，与240℃下常规热空气回流处理相比，界面处形成了(Cu,Ni)6Sn5、(Ni,Cu)3Sn4和Ni3P相三层结构。SACNG/Au/Ni/Cu合金中存在剥落的金属间化合物。激光回流焊的焊接点机械强度与热空气回流焊的焊接点机械强度相当。
{"title":"Interfacial reactions and mechanism properties between SAC 405 and SACNG lead-free solders with Au/Ni(P)/Cu substrates reflowed by CO2 laser","authors":"Shao-cheng Lo, Yu-Ping Hsieh, Y. Yen","doi":"10.1109/IMPACT.2009.5382136","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382136","url":null,"abstract":"This study investigate the interfacial reactions and mechanical property between Sn-4.0Ag-0.5Cu (SAC, in wt%) and Sn-4.0Ag-0.5Cu-0.05Ni-0.01Ge (SACNG, in wt%) lead free solders with Au/Ni(P)/Cu substrate by CO<inf>2</inf> laser reflow. These results compare with the same systems under a conventional hot-air reflowing method in the oven. After reflowing, all samples were then taken heat-treatment at 150°C for 1000 hours. Under CO<inf>2</inf> laser reflowing, mixtures of the (Cu,Ni)<inf>6</inf>Sn<inf>5</inf> and (Ni,Cu)<inf>3</inf>Sn<inf>4</inf> phases and (Ni,P,Cu) solid solution were formed at the interface. After taking a long period of heat-treatment, the (Cu,Ni)<inf>6</inf>Sn<inf>5</inf>+(Ni,Cu)<inf>3</inf>Sn<inf>4</inf> were still observed at the interface. But, the Ni(P)+Cu solid solution disappeared as increasing reaction times. The experimental results compared with the same couples by conventional hot-air reflowing at 240°C, three layer structures, (Cu,Ni)<inf>6</inf>Sn<inf>5</inf>, (Ni,Cu)<inf>3</inf>Sn<inf>4</inf> and Ni<inf>3</inf>P phases, were formed at the interface. The spalling intermetallic compounds could be observed in the SACNG/Au/Ni/Cu couple. The mechanical strength of solder joints by the laser reflowing technique is very similar to that by the hot-air reflowing method.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"54 1","pages":"224-226"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88301788","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382140
S. Chiang
There are 180 LED lamps located at the LED panel for 85W power consumption for the LED backlight. The LED lamps dissipate 68W for heat. The 32” LCD TV geometry is 800 mm(L) * 500 mm(W) * 90 mm(H). There are six light-bars on the LED panel and 30 LEDs per bar. The single LED package emits red, green and blue. For fitting the LCD TV package case, the overall thermal module size is 700 mm(L)* 400 mm(W). In order to thin the LCD TV, the fins height is designed from 20 mm to 70 mm per 10 mm. Moreover, the fins length is set as 10 mm to 25 mm by every 5 mm. The thermal modules combine several types of fin under the natural convection. The thermal module multiplies the several fins types in one. Moreover, the stratified module is separated to upper and lower regions. The stratified thermal module provides higher fins for the upper region and induced supplied air-flow by the second opening. The results represent the upper region temperature is reduced from 68°C to 58°C obviously. The cold air-flow entrains the second opening and decreases the thermal and flow boundary effect. As the results, the temperature distribution of the whole thermal module obtains more uniform pattern by stratified design. So, the stratified thermal module enhances the temperature uniformity and increases that the air-flow passes through the tunnel of the fins.
{"title":"The stratified thermal modules for the LCD TV with LED backlight","authors":"S. Chiang","doi":"10.1109/IMPACT.2009.5382140","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382140","url":null,"abstract":"There are 180 LED lamps located at the LED panel for 85W power consumption for the LED backlight. The LED lamps dissipate 68W for heat. The 32” LCD TV geometry is 800 mm(L) * 500 mm(W) * 90 mm(H). There are six light-bars on the LED panel and 30 LEDs per bar. The single LED package emits red, green and blue. For fitting the LCD TV package case, the overall thermal module size is 700 mm(L)* 400 mm(W). In order to thin the LCD TV, the fins height is designed from 20 mm to 70 mm per 10 mm. Moreover, the fins length is set as 10 mm to 25 mm by every 5 mm. The thermal modules combine several types of fin under the natural convection. The thermal module multiplies the several fins types in one. Moreover, the stratified module is separated to upper and lower regions. The stratified thermal module provides higher fins for the upper region and induced supplied air-flow by the second opening. The results represent the upper region temperature is reduced from 68°C to 58°C obviously. The cold air-flow entrains the second opening and decreases the thermal and flow boundary effect. As the results, the temperature distribution of the whole thermal module obtains more uniform pattern by stratified design. So, the stratified thermal module enhances the temperature uniformity and increases that the air-flow passes through the tunnel of the fins.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"725 1","pages":"207-210"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"74771411","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382292
Liang-Cheng Chang, Da-Sheng Lee, Ping-Hei Chen
The forward current draft with the temperature changes is a characteristic of LED. This research used this characteristic to achieve control optimization of LED by the forward current feedback. Temperature detection through forward current measurements was applied to LED PWM to carry out the best thermal management of LED arrays under temperature variations, which can offer steady illumination and keep constant chromaticity. LED spotlight products are mainly used for lighting show box display to replace the incandescent lamp which has been forbidden by EU from the year of 2009. Such kind of products now is available on the market. However, the illumination decay and chromaticity changes with operation temperature obstruct wide distribution of LED spotlight for decorative lighting systems. The developed technology by this research can be used to control the chromaticity and the illumination of the LED spotlight and a great niche is outward. This research tested various types of LED are provided by different manufacturers, and the database of the changes of LED chip grains against forward current is build. Constant temperature bath was employed to get the curve of forward current and temperature, which will be a basis of forward current feedback and temperature conversions. Self-developed driving circuits were used to control LED to make the relative illumination decays to be less than 5% and the coordinate excursion of Color rendering index on the CIE chromaticity diagram is lower than 0.1. The circuit control of LED spotlight with low difference of illumination and Color rendering index were therefore successfully realized in this study.
{"title":"A novel led driving circuits development for decorative lighting system energy saving","authors":"Liang-Cheng Chang, Da-Sheng Lee, Ping-Hei Chen","doi":"10.1109/IMPACT.2009.5382292","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382292","url":null,"abstract":"The forward current draft with the temperature changes is a characteristic of LED. This research used this characteristic to achieve control optimization of LED by the forward current feedback. Temperature detection through forward current measurements was applied to LED PWM to carry out the best thermal management of LED arrays under temperature variations, which can offer steady illumination and keep constant chromaticity. LED spotlight products are mainly used for lighting show box display to replace the incandescent lamp which has been forbidden by EU from the year of 2009. Such kind of products now is available on the market. However, the illumination decay and chromaticity changes with operation temperature obstruct wide distribution of LED spotlight for decorative lighting systems. The developed technology by this research can be used to control the chromaticity and the illumination of the LED spotlight and a great niche is outward. This research tested various types of LED are provided by different manufacturers, and the database of the changes of LED chip grains against forward current is build. Constant temperature bath was employed to get the curve of forward current and temperature, which will be a basis of forward current feedback and temperature conversions. Self-developed driving circuits were used to control LED to make the relative illumination decays to be less than 5% and the coordinate excursion of Color rendering index on the CIE chromaticity diagram is lower than 0.1. The circuit control of LED spotlight with low difference of illumination and Color rendering index were therefore successfully realized in this study.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"47 1","pages":"734-737"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81707829","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382190
F. Lin, C. Yeh, Shen-Chun Wu, Yau‐Ming Chen
A mathematical steady-state model of a loop heat pipe (LHP) system was developed in this study. The model was based on the energy conservation and the phase-change heat transfer in porous media. The evaporator temperature was predicted including using a monoporous wick structure and using a biporous wick structure, which has two characteristic pore sizes. Experiments were also executed in this study. The model indicated that the monoporous wick with narrow pore size distribution accumulated gradually the vapor blanket; it brought the higher thermal resistance at increasing heat load. The biporous wick with the lager pores providing the passages for vapor and thus improved the heat transfer capacity of a LHP's evaporator. The calculation results showed that, at 10°C of sink temperature, 25°C of ambient temperature, and 350W of heat load, the evaporator temperature of monoporous wick was 88°C and the thermal resistance of the vapor blanket was 0.13°C/W, 60% of the total thermal resistance of the system (0.22°C/W). At the same modeling condition, the evaporator temperature of biporous wick was 50°C and the thermal resistance of the vapor blanket was 0.003°C/W, about 3% of the total thermal resistance (0.1°C/W). It indicated the biporous wick effectively enhanced the heat transfer performance of a LHP. To summarize, the development of this model could be a useful tool for predicting the performance of a LHP using the monoporous and biporous wicks.
{"title":"Mathematical model of heat and mass transfer in a wick structure of a loop heat pipe","authors":"F. Lin, C. Yeh, Shen-Chun Wu, Yau‐Ming Chen","doi":"10.1109/IMPACT.2009.5382190","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382190","url":null,"abstract":"A mathematical steady-state model of a loop heat pipe (LHP) system was developed in this study. The model was based on the energy conservation and the phase-change heat transfer in porous media. The evaporator temperature was predicted including using a monoporous wick structure and using a biporous wick structure, which has two characteristic pore sizes. Experiments were also executed in this study. The model indicated that the monoporous wick with narrow pore size distribution accumulated gradually the vapor blanket; it brought the higher thermal resistance at increasing heat load. The biporous wick with the lager pores providing the passages for vapor and thus improved the heat transfer capacity of a LHP's evaporator. The calculation results showed that, at 10°C of sink temperature, 25°C of ambient temperature, and 350W of heat load, the evaporator temperature of monoporous wick was 88°C and the thermal resistance of the vapor blanket was 0.13°C/W, 60% of the total thermal resistance of the system (0.22°C/W). At the same modeling condition, the evaporator temperature of biporous wick was 50°C and the thermal resistance of the vapor blanket was 0.003°C/W, about 3% of the total thermal resistance (0.1°C/W). It indicated the biporous wick effectively enhanced the heat transfer performance of a LHP. To summarize, the development of this model could be a useful tool for predicting the performance of a LHP using the monoporous and biporous wicks.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"1 1","pages":"356-359"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83132472","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382289
Tsaitzu Lee, Yo-Shen Lin, Chiajiun Chen
In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.
{"title":"Design and fabrication of passive components using TF-IPD technology","authors":"Tsaitzu Lee, Yo-Shen Lin, Chiajiun Chen","doi":"10.1109/IMPACT.2009.5382289","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382289","url":null,"abstract":"In this paper, we develop a low-cost manufacturing technology for RF system-in-package applications. This high-performance process technology for integrated passive devices is achieved by electroplated formed thick Cu metal trace and back-side substrate thinning process on 8-inch glass wafer. This paper first presents investigations for common integration of inductors, resistors, capacitors in this thin film process technology and examines their RF performance. Then, a lowpass filter design for 2.4 GHz ISM band application is also demonstrated. Good RF performance as well as small form factor are achieved.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"117 1","pages":"722-725"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"85698300","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2009-10-01DOI: 10.1109/IMPACT.2009.5382231
G. Chang, Chi-Ko Yu, T. Shao, C. Chen, J. Lee
In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study.
{"title":"The correlation investigation between cyclic bending and thermal cycle testing in CSP package on board","authors":"G. Chang, Chi-Ko Yu, T. Shao, C. Chen, J. Lee","doi":"10.1109/IMPACT.2009.5382231","DOIUrl":"https://doi.org/10.1109/IMPACT.2009.5382231","url":null,"abstract":"In this paper, a new application of 4-point cyclic bending test for the solder joint reliability evaluation is discussed. In light of the long cycle time of thermal cycle testing, the industry has been searching for a more cost-effective and time-effective way to achieve the evaluation task. The 4-point cyclic bending test is considered a good candidate in this study.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"42 1","pages":"510-513"},"PeriodicalIF":0.0,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81946278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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