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2017 12th European Microwave Integrated Circuits Conference (EuMIC)最新文献

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Gain-configurable lower sideband parametric downconverter 增益可配置的下边带参数下变频器
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230673
Zhixing Zhao, S. Magierowski, L. Belostotski
This paper presents a gain-configurable CMOS parametric downconverter operating at 5.275 GHz. The downconverter measured gain is 24 dB at 5.275 GHz with no DC power drawn by the RF amplification component. This report is the first demonstration of a CMOS parametric downconverter operated in the 6-GHz regime.
本文提出了一种工作频率为5.275 GHz、可配置增益的CMOS参数下变频器。下变频器在5.275 GHz时的测量增益为24 dB,射频放大元件不消耗直流功率。本报告首次演示了在6 ghz频段工作的CMOS参数下变频器。
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引用次数: 3
A concurrent triple-band digital transmitter using feedforward noise cancellation for delta-sigma modulation 一种采用前馈噪声消除的并发三波段数字发射机,用于delta-sigma调制
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230743
SungWon Chung, R. Ma, S. Shinjo, K. Yamanaka, K. Teo
A concurrent triple-band digital transmitter architecture with relaxed RF output filter requirement is presented in this paper. With non-contiguous inter-band carrier aggregation, all digital transmitters based on delta-sigma modulation and pulse-width modulation have suffered from out-of-band noise and spurious tones, requiring extremely demanding RF output filter design. We demonstrate a feedforward noise cancellation technique in order to suppress the out-of-band quantization noise of concurrent triple-band delta-sigma modulation for the first time. An experimental prototype based on an asymmetric RF power combiner and a 5-bit 7-GS/s DAC for noise cancellation realizes concurrent triple-band transmission of LTE Advanced signals, which consist of 710 MHz, 1750 MHz, and 2510 MHz bands with 30-MHz aggregated total bandwidth. The prototype achieves better than 42-dB spurious-free dynamic range (SFDR) and −47-dBc adjacent channel power ratio (ACPR), enabled by up to 12-dB out-of-band noise suppression.
提出了一种对射频输出滤波器要求较低的并发三频带数字发射机结构。在非连续带间载波聚合的情况下,所有基于δ - σ调制和脉宽调制的数字发射机都受到带外噪声和杂散音的影响,对RF输出滤波器的设计要求极高。为了抑制并发三波段δ - σ调制的带外量化噪声,首次提出了一种前馈噪声消除技术。基于非对称射频功率合成器和5位7-GS/s降噪DAC的实验样机实现了LTE Advanced信号的三频带并发传输,分别为710 MHz、1750 MHz和2510 MHz,总带宽为30 MHz。该原型实现了优于42 db的无杂散动态范围(SFDR)和- 47 dbc的相邻通道功率比(ACPR),并实现了高达12 db的带外噪声抑制。
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引用次数: 8
Low-loss and compact 2.4-GHz CMOS bandpass filter with finite transmission zeros 具有有限传输零点的低损耗和紧凑的2.4 ghz CMOS带通滤波器
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230733
Ru-Yu Wang, Sen Wang
In this paper, a low-loss and high-selectivity compact CMOS bandpass filter at S band is presented. The filter based on lumped elements achieves low insertion loss and ultrawide bandwidth. Moreover, the resonators of the filter result in two finite transmission zeros. One transmission zero is in the lower stopband, and the other is in the upper stopband, thus improving the selectivity of the filter significantly. The filter is designed and fabricated in a standard 0.18-μm CMOS technology with a chip area of 745 mm × 790 mm including all testing pads. The filter achieves 2.7-dB insertion loss and 64% 3-dB bandwidth at 2.5 GHz. Measured results also show that the two transmission zeros are at 1.1 GHz and 4.8 GHz featuring 26.6-dB and 44.5-dB rejection, respectively.
本文提出了一种低损耗、高选择性的S波段紧凑型CMOS带通滤波器。基于集总元的滤波器实现了低插入损耗和超宽带宽。此外,滤波器的谐振器导致两个有限传输零。一个传输零在下阻带,另一个在上阻带,从而显著提高了滤波器的选择性。该滤波器采用标准的0.18 μm CMOS技术设计和制造,芯片面积为745 mm × 790 mm,包括所有测试垫。该滤波器在2.5 GHz时实现2.7 db的插入损耗和64%的3db带宽。测量结果还表明,两个传输零点分别为1.1 GHz和4.8 GHz,抑制度分别为26.6 db和44.5 db。
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引用次数: 0
Design of a reconfigurable rectangular waveguide phase shifter with metallic posts 金属柱可重构矩形波导移相器的设计
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230730
Lucas Polo‐López, J. Masa-Campos, J. Ruiz‐Cruz
In this work the design of a Ku-band reconfigurable phase shifter implemented in waveguide technology is presented. The reconfiguration capability of the device is achieved by the insertion of a pair of adjustable metallic posts. A prototype of this device has been manufactured using a 3D printing technique in order to show the proposed concept. The measured return loss and phase performances of this prototype are compared with the simulated full-wave response of the phase shifter. The proposed waveguide component shows a great application potential in the area of beam steering phased arrays implemented in waveguide technology, since the presented phase shifter is fully developed in waveguide, not requiring the additional transitions to planar structures usually needed to integrate lumped components.
本文介绍了一种基于波导技术的ku波段可重构移相器的设计。该装置的重新配置能力是通过插入一对可调节的金属柱来实现的。为了展示所提出的概念,该设备的原型已经使用3D打印技术制造。将该样机的回波损耗和相位性能与仿真移相器的全波响应进行了比较。由于所提出的移相器完全在波导中发展,不需要在集成集总元件时额外过渡到平面结构,因此该波导元件在波导技术中实现的波束导向相控阵领域显示出巨大的应用潜力。
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引用次数: 9
6–18GHz 13W reactive matched GaN power amplifier MMIC 6-18GHz 13W无功匹配GaN功率放大器MMIC
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230732
H. Tao, W. Hong, Bin Zhang
The design and performance of a compact 6–18GHz power amplifier MMIC utilizing 0.2 pm gallium nitride (GaN) high electron mobility transistor (HEMT) technology is presented. An output power of 41.4 dBm to 43.3 dBm (average 42.3dBm) with over 16 dB power gain and a power added efficiency (PAE) of 21% to 35% over the band of 6–18 GHz under a drain voltage of 28 V in CW mode have been achieved. The chip size is compact with the size of 2.6∗3.6 mm2 and it delivers an average output power density 1.83 W/mm2 over the chip area. The thermal resistance is 1.55 T7W measured in CW mode.
介绍了一种采用0.2 pm氮化镓(GaN)高电子迁移率晶体管(HEMT)技术的6-18GHz功率放大器MMIC的设计和性能。在连续波模式下,漏极电压为28 V,输出功率为41.4 ~ 43.3 dBm(平均42.3dBm),功率增益超过16 dB,功率附加效率(PAE)在6 ~ 18 GHz频带范围内达到21% ~ 35%。芯片尺寸紧凑,尺寸为2.6 * 3.6 mm2,在芯片面积上的平均输出功率密度为1.83 W/mm2。连续波模式下的热阻为1.55 T7W。
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引用次数: 13
A 2 GS/s 118 mW digital-mapping direct digital frequency synthesizer in 65nm CMOS 65nm CMOS数字映射直接数字频率合成器2gs /s 118mw
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230701
Abdel Martinez Alonso, Xia Yuan, M. Miyahara, A. Matsuzawa
This paper describes a Digital-Mapping Direct Digital Frequency Synthesizer consuming only 118 mW when operating at 2 GS/s in 65nm CMOS. The active area is 0.142 mm2 with an accumulator size and amplitude resolution of 24 and 10 bits respectively. The Spurious-Free Dynamic Range is better than 41 dBc for synthesized frequencies below 750 MHz and 30 dBc over the entire Nyquist bandwidth. The Power Efficiency reaches 59 mW/(GS/s) by implementing a Complementary DualPhase Latch-Based architecture. Prototypes encapsulated in a 144-pin Low-Profile Quad Flat Package were employed during measurements. The achieved FoM is 542 GS/s • 2(SFDR/6)/W.
本文介绍了一种采用65nm CMOS的数字映射直接数字频率合成器,当工作在2gs /s时,功耗仅为118mw。有效面积为0.142 mm2,累加器尺寸和振幅分辨率分别为24位和10位。在750 MHz以下的合成频率下,无杂散动态范围优于41 dBc,在整个奈奎斯特带宽上优于30 dBc。通过实现互补的双相锁存架构,功率效率达到59 mW/(GS/s)。在测量过程中使用了封装在144针低轮廓四平面封装中的原型。实现的FoM为542 GS/s•2(SFDR/6)/W。
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引用次数: 4
3.5-GHz ultra-compact GaN class-E integrated Doherty MMIC PA for 5G massive-MIMO base station applications 3.5 ghz超紧凑型GaN e类集成Doherty MMIC PA,用于5G大规模mimo基站应用
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230693
S. Maroldt, M. Ercoli
This paper presents a high gain ultra-compact Doherty PA design approach based on 28 V two-stage GaN MMICs. A 20 W asymmetric and 26 W symmetric Doherty amplifier operating in the 3.4–3.6 GHz band were designed into a small footprint 7×7 mm2 QFN plastic package for 5G massive MIMO base station applications. The use of package-integrated low-loss passive devices to realize the class-E like inverted Doherty combiner resulted in excellent final stage drain efficiencies of 60 % at 8 dB output power back-off and 65 % in saturation, to the best of the authors' knowledge the highest reported final stage drain efficiency for GaN MMIC based integrated Doherty PAs in the 3.5 GHz band. The full asymmetric PA board yields a measured line-up efficiency of 43 % with an associated gain of 26 dB at 35 dBm average power of a 20 MHz LTE signal, corresponding to 8 dB output power back-off.
本文提出了一种基于28 V两级GaN mmic的高增益超紧凑Doherty放大器设计方法。设计了一款工作在3.4-3.6 GHz频段的20w非对称和26w对称Doherty放大器,采用占地面积7×7 mm2的QFN塑料封装,用于5G大规模MIMO基站应用。使用封装集成的低损耗无源器件来实现e类反向Doherty合成器,在8 dB输出功率回调时达到60%,在饱和时达到65%,据作者所知,这是3.5 GHz频段基于GaN MMIC的集成Doherty PAs的最高末级漏极效率。在20mhz LTE信号的平均功率为35 dBm时,全非对称PA板的测量线路效率为43%,相关增益为26 dB,对应于8 dB输出功率回退。
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引用次数: 24
Reactively matched 3-stage C-X-Ku band GaN MMIC power amplifier 反应匹配三级C-X-Ku波段GaN MMIC功率放大器
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230668
G. C. Barisich, E. Gebara, Huifang Gu, C. Storey, Pouya Aflaki, J. Papapolymerou
A 3-stage wideband power amplifier (PA) using a 0.15 pm gallium nitride (GaN) monolithic microwave integrated circuit (MMIC) process from NRC is designed, fabricated, and measured. After characterization of the high electron mobility transistor (HEMT), a non-linear model was created from the measured data for use in the design. The reactively matched 3.8 mm × 1.8 mm PA also uses resistive elements for gain compensation and circuit stability. Measurements at 20 dBm source power show 35–38 dBm output power and 10–18% PAE over a 6 to 17 GHz bandwidth. These results demonstrate the highest output power per die area for a 3-stage GaN MMIC PA of this bandwidth in this power range.
采用NRC的0.15 pm氮化镓(GaN)单片微波集成电路(MMIC)工艺设计、制作和测量了一种三级宽带功率放大器(PA)。在对高电子迁移率晶体管(HEMT)进行表征后,根据测量数据创建了一个非线性模型,用于设计。响应匹配的3.8 mm × 1.8 mm PA还使用电阻元件进行增益补偿和电路稳定性。在20 dBm源功率下的测量显示,在6至17 GHz带宽上,输出功率为35-38 dBm, PAE为10-18%。这些结果表明,在此功率范围内,此带宽的3级GaN MMIC PA的每个芯片面积的最高输出功率。
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引用次数: 7
Highly efficient GaN RF power amplifier MMIC using low-voltage driver 采用低压驱动的高效GaN射频功率放大器MMIC
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230691
M. Acar, O. Ceylan, Felicia Kiebler, S. Pires, S. Maroldt
In this paper, we show that low-voltage operation of a GaN transistor (5.5V) as a driver allows very high line-up efficiency, including driver and end-stage. We realized two-stage MMIC in 0.25pm GaN HEMT technology. The MMIC die and high harmonic matching circuits were assembled into a standard ceramic RF package. The load-pull measurement results of the packaged MMIC show that the line-up efficiency is preserved to >70% in the presence of an 8 dB output power variation. We designed a PCB based on the load-pull measurement data as a demonstration board. We measured 76% line-up efficiency with an output power of 35.4dBm and a linear gain of 27dB at 2.14 GHz. Applying a WCDMA signal, a −52.4dBc ACLR performance was observed at 29.4dBm average output power using a vector switched generalized memory polynomial digital pre-distortion (VS-GMP DPD) algorithm.
在本文中,我们展示了GaN晶体管(5.5V)作为驱动器的低压操作可以实现非常高的排列效率,包括驱动器和终端级。我们在0.25pm GaN HEMT技术中实现了两级MMIC。MMIC芯片和高谐波匹配电路被组装成一个标准的陶瓷射频封装。封装MMIC的负载-拉力测量结果表明,在8 dB输出功率变化的情况下,线路效率保持在>70%。我们根据负载-拉力测量数据设计了一个PCB作为演示板。我们在2.14 GHz时测量了76%的线路效率,输出功率为35.4dBm,线性增益为27dB。应用WCDMA信号,采用矢量开关广义记忆多项式数字预失真(VS-GMP DPD)算法,在29.4dBm平均输出功率下,ACLR性能为- 52.4dBc。
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引用次数: 0
High performance GaN single-chip frontend for compact X-band AESA systems 用于紧凑型x波段AESA系统的高性能GaN单芯片前端
Pub Date : 2017-10-01 DOI: 10.23919/EUMIC.2017.8230655
P. Schuh, H. Sledzik, R. Reber
A next generation of AESA antennas will be challenged with the need for lower size, weight, power and cost (SWAP-C). This leads to enhanced demands especially with regard to the integration density of the RF-part inside a T/R module. The semiconductor material GaN has proven its capacity for high power amplifiers, robust receive components as well as switch components for separation of transmit and receive mode. This paper will describe the design and measurement results of a GaN-based single-chip T/R module frontend (HPA, LNA and SPDT) using UMS GH25 technology and covering the frequency range from 8 GHz to 12 GHz. Key performance parameters of the frontend are 13 W minimum transmit (TX) output power over the whole frequency range with peak power up to 17 W. The frontend in receive (RX) mode has a noise figure below 3.2 dB over the whole frequency range, and can survive more than 5 W input power. The large signal insertion loss of the used SPDT is below 0.9 dB at 43 dBm input power level.
下一代AESA天线将面临更小尺寸、更轻重量、更低功耗和更低成本(SWAP-C)的挑战。这导致了更高的要求,特别是在T/R模块内射频部分的集成密度方面。半导体材料GaN已经证明了其用于高功率放大器,鲁棒接收元件以及用于发射和接收模式分离的开关元件的能力。本文将描述一种基于gan的单芯片T/R模块前端(HPA, LNA和SPDT)的设计和测量结果,该前端采用umsgh25技术,覆盖频率范围为8 GHz至12 GHz。前端的关键性能参数是整个频率范围内的最小发射(TX)输出功率为13w,峰值功率可达17w。接收(RX)模式的前端在整个频率范围内的噪声系数低于3.2 dB,并且可以承受大于5w的输入功率。在43 dBm输入功率下,SPDT的大信号插入损耗低于0.9 dB。
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引用次数: 8
期刊
2017 12th European Microwave Integrated Circuits Conference (EuMIC)
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