Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962781
I. Maus, H. Preu, M. Niessner, H. Nabi, K. Jansen, R. Pantou, L. Weiss, B. Michel, B. Wunderle
Electrically conductive adhesives are widely used in semiconductor technology. The focus of this work is set on Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles. The aim of this work is the material characterization of highly filled epoxy based die attaches materials by dynamic mechanical analysis (DMA) and relaxation experiments in order to derive elastic and viscoelastic material models in a wide temperature range. The measurement of the epoxy based highly filled die attach material is a challenging topic. We show how to overcome the difficulties in measuring these materials. Critical interface fracture data, which include the Critical (Strain) Energy Release Rate Gc(Ψ) as a function of temperature, humidity or aging, are crucially needed in microelectronic industry for failure modeling, lifetime prediction and design evaluation associated with reliability [1], but they are rarely given in literature. Therefore fast measurement methods are needed [2, 3]. This work shows a measurement method of the critical fracture mechanic properties with the micro Mixed Mode Tester (μMMT) [2] on samples cut from real products and their numerical evaluation using linear elastic fracture mechanics and cohesive zone modeling.
{"title":"Characterization of adhesives for microelectronic industry in DMA and relaxation experiments for interfacial fracture toughness characterization — Difficulties and solution","authors":"I. Maus, H. Preu, M. Niessner, H. Nabi, K. Jansen, R. Pantou, L. Weiss, B. Michel, B. Wunderle","doi":"10.1109/ESTC.2014.6962781","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962781","url":null,"abstract":"Electrically conductive adhesives are widely used in semiconductor technology. The focus of this work is set on Isotropic Conductive Adhesives (ICA) with a high amount of electrically conductive filler particles. The aim of this work is the material characterization of highly filled epoxy based die attaches materials by dynamic mechanical analysis (DMA) and relaxation experiments in order to derive elastic and viscoelastic material models in a wide temperature range. The measurement of the epoxy based highly filled die attach material is a challenging topic. We show how to overcome the difficulties in measuring these materials. Critical interface fracture data, which include the Critical (Strain) Energy Release Rate Gc(Ψ) as a function of temperature, humidity or aging, are crucially needed in microelectronic industry for failure modeling, lifetime prediction and design evaluation associated with reliability [1], but they are rarely given in literature. Therefore fast measurement methods are needed [2, 3]. This work shows a measurement method of the critical fracture mechanic properties with the micro Mixed Mode Tester (μMMT) [2] on samples cut from real products and their numerical evaluation using linear elastic fracture mechanics and cohesive zone modeling.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116655590","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962752
Leandro Matiolli Machado, G. Delrosso, F. Borin, Juliano Rodrigues Fernandes de Oliveira, V. Corso, Luis Henrique Hecker de Carvalho, Julio Cesar Rodrigues Fernandes de Oliveira
This paper shows recent developments and achievements at Centro de Pesquisa e Desenvolvimento em Telecomunicações (CPqD), Campinas, Brazil, concerning advanced photonic devices based respectively on Silicon Photonics (SiP) and Thin Film Polymer on Silicon (TFPS™) integration technologies to drive the next generation of ultra-fast optical communication networks. The Brazilian's first SiP-based 100G DP-QSPK modulator and a 100Gbps DP-QPSK Transmit Optical Sub-Assemblies (TOSA) module, suitable for CFP2 transceivers are reviewed. CPqD extensive research and development programme, the largest of its kind in Latin America, has produced ICT solutions for both private and public corporations in communications, multimedia, financial, utilities, industrial, defence and security sectors. Its Optical System Division is in charge of numerous projects in high capacity / ultra-fast optical systems and networks management, (software-defined networking and smart algorithms) as needed for the forthcoming future high-capacity elastic optical networks.
本文展示了巴西Campinas Pesquisa e Desenvolvimento em Telecomunicações (CPqD)关于基于硅光子学(SiP)和硅上薄膜聚合物(TFPS™)集成技术的先进光子器件的最新发展和成就，以推动下一代超高速光通信网络。对巴西首个基于sip的100G DP-QSPK调制器和100Gbps DP-QPSK传输光子组件(TOSA)模块进行了审查，适用于CFP2收发器。CPqD广泛的研究和发展计划是拉丁美洲同类计划中规模最大的，为通信、多媒体、金融、公用事业、工业、国防和安全部门的私营和公共公司提供了ICT解决方案。其光学系统部负责高容量/超快速光学系统和网络管理(软件定义网络和智能算法)的众多项目，以满足即将到来的未来高容量弹性光网络的需要。
{"title":"Advanced optical communication systems and devices","authors":"Leandro Matiolli Machado, G. Delrosso, F. Borin, Juliano Rodrigues Fernandes de Oliveira, V. Corso, Luis Henrique Hecker de Carvalho, Julio Cesar Rodrigues Fernandes de Oliveira","doi":"10.1109/ESTC.2014.6962752","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962752","url":null,"abstract":"This paper shows recent developments and achievements at Centro de Pesquisa e Desenvolvimento em Telecomunicações (CPqD), Campinas, Brazil, concerning advanced photonic devices based respectively on Silicon Photonics (SiP) and Thin Film Polymer on Silicon (TFPS™) integration technologies to drive the next generation of ultra-fast optical communication networks. The Brazilian's first SiP-based 100G DP-QSPK modulator and a 100Gbps DP-QPSK Transmit Optical Sub-Assemblies (TOSA) module, suitable for CFP2 transceivers are reviewed. CPqD extensive research and development programme, the largest of its kind in Latin America, has produced ICT solutions for both private and public corporations in communications, multimedia, financial, utilities, industrial, defence and security sectors. Its Optical System Division is in charge of numerous projects in high capacity / ultra-fast optical systems and networks management, (software-defined networking and smart algorithms) as needed for the forthcoming future high-capacity elastic optical networks.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122078717","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962724
G. Feix, M. Hutter, E. Hoene, K. Lang
Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.
{"title":"On double sided cooling","authors":"G. Feix, M. Hutter, E. Hoene, K. Lang","doi":"10.1109/ESTC.2014.6962724","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962724","url":null,"abstract":"Since about 15 years back, there were several attempts to increase power density by double-sided cooling of power semiconductors, mostly by a sandwich stack with two DCBs. This paper gives an overview over the developments and approaches over the last years and some results of another project concerning double sided cooling.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122389319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962851
Si Chen, D. Jiang, L. Ye, Johan Liu
In this paper, a solder joint structure was developed for the electronic packaging industry. Vertically aligned carbon nanofibres (VACNFs) were grown, transferred and used at the interface between Si/Au pads and Sn-3.0Ag-0.5Cu (SAC305) alloy as reinforcements in order to increase the solder joint thermal fatigue resistance. The transfer and assembly processes related to VACNFs were optimised and developed. The thermal cycling test results show that the thermal fatigue life of VACNF/SAC305 solder joints is 40% longer than that of pure SAC305. The dye and pry analysis and scanning electron microscopy observation prove that the VACNFs can effectively delay the crack propagation near the interface and consequently prolong the solder joint thermal fatigue life.
{"title":"A solder joint structure with vertically aligned carbon nanofibres as reinforcements","authors":"Si Chen, D. Jiang, L. Ye, Johan Liu","doi":"10.1109/ESTC.2014.6962851","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962851","url":null,"abstract":"In this paper, a solder joint structure was developed for the electronic packaging industry. Vertically aligned carbon nanofibres (VACNFs) were grown, transferred and used at the interface between Si/Au pads and Sn-3.0Ag-0.5Cu (SAC305) alloy as reinforcements in order to increase the solder joint thermal fatigue resistance. The transfer and assembly processes related to VACNFs were optimised and developed. The thermal cycling test results show that the thermal fatigue life of VACNF/SAC305 solder joints is 40% longer than that of pure SAC305. The dye and pry analysis and scanning electron microscopy observation prove that the VACNFs can effectively delay the crack propagation near the interface and consequently prolong the solder joint thermal fatigue life.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"35 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124919820","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962827
M. Koganemaru, M. Uchino, A. Ikeda, T. Asano
This paper examines a novel approach to measure residual stresses in an electronic package. The presented method applies a phase-shifted sampling moiré method to X-ray images of the test chip (Si) in the electronic package. In this study, the test chip including an Au bump grid are made by general semiconductor processes for forming Au bumps on Si chip, and X-ray images of the test chip are taken before and after packaging (resin-molding). Then the phase difference of the sampling moiré fringe patterns before and after packaging can be obtained from the X-ray images of the test chip before and after packaging. The phase difference corresponds to the deformation of the test chip. The results of this examination indicate that the presented method is possible to be used for measuring residual stresses in electronic packages.
{"title":"Examination of residual stress measurement in electronic packages using phase-shifted sampling moiré method and X-ray images","authors":"M. Koganemaru, M. Uchino, A. Ikeda, T. Asano","doi":"10.1109/ESTC.2014.6962827","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962827","url":null,"abstract":"This paper examines a novel approach to measure residual stresses in an electronic package. The presented method applies a phase-shifted sampling moiré method to X-ray images of the test chip (Si) in the electronic package. In this study, the test chip including an Au bump grid are made by general semiconductor processes for forming Au bumps on Si chip, and X-ray images of the test chip are taken before and after packaging (resin-molding). Then the phase difference of the sampling moiré fringe patterns before and after packaging can be obtained from the X-ray images of the test chip before and after packaging. The phase difference corresponds to the deformation of the test chip. The results of this examination indicate that the presented method is possible to be used for measuring residual stresses in electronic packages.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125036054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962742
K. Keranen, Samuli Yrjana, Arttu Huttunen, M. Korkalainen, M. Tuomikoski
The direct medical care cost of all hospital treated injuries in the EU is estimated to be at least 78 billion Euros each year. Therefore, significant savings can be achieved in economical and human resources, when amount of injuries are decreased. Intelligent and active warning sign can prevent accidents more effectively than traditional passive graphical warning sign. Intelligent and active warning sign alerts person approaching potentially dangerous spot using both visual and audible warning. In areas without infrastructure, however, intelligent warning sign need to be autonomous. We have manufactured an intelligent and autonomous warning sign prototype utilising printed functionalities and hybrid integration. Our intelligent warning sign system utilises low energy radio network operating at 2.4 GHz ISM waveband in wireless communication. Radio system provides wireless link to other warning signs nearby and up and down gateway to server. In addition, system retains energy harvesting system based on flexible solar cell and bendable Li-Ion battery. Sensing is based on infrared sensor enabling person detection by emitted thermal radiation from 2 meter distance. Microcontroller decodes sensor signal and controls operations for warning signals based on six blinking LEDs and beeping buzzer. LED flexible substrate was PET foil on which conductive traces were printed using Asahi 411AW silver ink. Miniature high brightness 0402 size μSMD LEDs producing up to 50 mcd in ±65° angle were bonded on PET foil using isotropic conductive adhesive, type EPOTEK H20E. Final measures of the prototype were 75 mm × 220 mm with maximum thickness of 20 mm and weight of 58 grams. System assembly with rigid central part and flexible flanges enabled prototype attachment on flat, angulated or curved surfaces. Implemented warning sign system platform offers also possibility to implement other intelligent guiding and sensing information transmission applications in areas lacking connection to grid and wired Internet.
{"title":"Intelligent warning sign system utilising printed functionalities and hybrid integration","authors":"K. Keranen, Samuli Yrjana, Arttu Huttunen, M. Korkalainen, M. Tuomikoski","doi":"10.1109/ESTC.2014.6962742","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962742","url":null,"abstract":"The direct medical care cost of all hospital treated injuries in the EU is estimated to be at least 78 billion Euros each year. Therefore, significant savings can be achieved in economical and human resources, when amount of injuries are decreased. Intelligent and active warning sign can prevent accidents more effectively than traditional passive graphical warning sign. Intelligent and active warning sign alerts person approaching potentially dangerous spot using both visual and audible warning. In areas without infrastructure, however, intelligent warning sign need to be autonomous. We have manufactured an intelligent and autonomous warning sign prototype utilising printed functionalities and hybrid integration. Our intelligent warning sign system utilises low energy radio network operating at 2.4 GHz ISM waveband in wireless communication. Radio system provides wireless link to other warning signs nearby and up and down gateway to server. In addition, system retains energy harvesting system based on flexible solar cell and bendable Li-Ion battery. Sensing is based on infrared sensor enabling person detection by emitted thermal radiation from 2 meter distance. Microcontroller decodes sensor signal and controls operations for warning signals based on six blinking LEDs and beeping buzzer. LED flexible substrate was PET foil on which conductive traces were printed using Asahi 411AW silver ink. Miniature high brightness 0402 size μSMD LEDs producing up to 50 mcd in ±65° angle were bonded on PET foil using isotropic conductive adhesive, type EPOTEK H20E. Final measures of the prototype were 75 mm × 220 mm with maximum thickness of 20 mm and weight of 58 grams. System assembly with rigid central part and flexible flanges enabled prototype attachment on flat, angulated or curved surfaces. Implemented warning sign system platform offers also possibility to implement other intelligent guiding and sensing information transmission applications in areas lacking connection to grid and wired Internet.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129121968","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962794
T. Erlbacher, H. Schwarzmann, F. Krach, A. Bauer, S. Berberich, I. Kasko, L. Frey
The reliability of monolithic integrated 200 V RC-snubbers in silicon is investigated both on wafer and module level. The wafer level measurements indicate that the capacitor dielectric is capable of repetitively withstanding 200 V pulses with a continuous use voltage of 150 V for 46 years with a failure rate of 1 ppm. Potentially early failing devices can be identified on wafer level by a screening test. The RC-snubbers exhibit excellent stability to high temperature and high humidity high temperature based stress tests and to thermal cycling. This makes these devices a promising alternative to discrete surface mounted devices in RC snubber applications for modules in power electronic applications.
{"title":"Reliability of monolithic RC-snubbers in MOS-based power modules","authors":"T. Erlbacher, H. Schwarzmann, F. Krach, A. Bauer, S. Berberich, I. Kasko, L. Frey","doi":"10.1109/ESTC.2014.6962794","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962794","url":null,"abstract":"The reliability of monolithic integrated 200 V RC-snubbers in silicon is investigated both on wafer and module level. The wafer level measurements indicate that the capacitor dielectric is capable of repetitively withstanding 200 V pulses with a continuous use voltage of 150 V for 46 years with a failure rate of 1 ppm. Potentially early failing devices can be identified on wafer level by a screening test. The RC-snubbers exhibit excellent stability to high temperature and high humidity high temperature based stress tests and to thermal cycling. This makes these devices a promising alternative to discrete surface mounted devices in RC snubber applications for modules in power electronic applications.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127744932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962820
G. Wróblewski, M. Słoma, C. Kallmayer, J. Marques, J. Haberland, D. Janczak, M. Jakubowska
We present a new method of fabrication of electroluminescent displays for the integration in plastic cards trough the lamination process. Our approach adapt new printed electronics technology for fabrication of elastic electroluminescent displays with lamination process which is impossible to replace in the production of such cards. Polycarbonate foils used as regular materials for such types of cards are used with specially developed transparent electrodes with double walled carbon nanotubes, dielectric and luminophore ink, deposited with spray coating technique. Silver nanopowder ink is printed as the bottom electrode with an ink-jet printer. In our solution the display can be integrated in cards only by printing and lamination without the use of additional processes or introducing additional electronic components.
{"title":"Printed electroluminescent structures for smart cards","authors":"G. Wróblewski, M. Słoma, C. Kallmayer, J. Marques, J. Haberland, D. Janczak, M. Jakubowska","doi":"10.1109/ESTC.2014.6962820","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962820","url":null,"abstract":"We present a new method of fabrication of electroluminescent displays for the integration in plastic cards trough the lamination process. Our approach adapt new printed electronics technology for fabrication of elastic electroluminescent displays with lamination process which is impossible to replace in the production of such cards. Polycarbonate foils used as regular materials for such types of cards are used with specially developed transparent electrodes with double walled carbon nanotubes, dielectric and luminophore ink, deposited with spray coating technique. Silver nanopowder ink is printed as the bottom electrode with an ink-jet printer. In our solution the display can be integrated in cards only by printing and lamination without the use of additional processes or introducing additional electronic components.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122880947","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962828
J. Al Ahmar, S. Wiese
Finite element modelling of multilayer ceramic capacitors (MLCCs) is presented. The stress distribution due to thermo-mechanical loads is estimated. Thermal cool down after soldering process is considered and afterwards a three point bending test has been done. Once the critical stress regions on ceramic are estimated, a fracture mechanics analysis has been performed. Cracks are initiated and fracture parameters were estimated using a direct approach, based on the crack opening displacement and also an energy approach by calculating the J-integral parameter. Finally the fracture mechanics parameters are used for investigating the crack bifurcation.
{"title":"Fracture mechanics analysis of cracks in multilayer ceramic capacitors","authors":"J. Al Ahmar, S. Wiese","doi":"10.1109/ESTC.2014.6962828","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962828","url":null,"abstract":"Finite element modelling of multilayer ceramic capacitors (MLCCs) is presented. The stress distribution due to thermo-mechanical loads is estimated. Thermal cool down after soldering process is considered and afterwards a three point bending test has been done. Once the critical stress regions on ceramic are estimated, a fracture mechanics analysis has been performed. Cracks are initiated and fracture parameters were estimated using a direct approach, based on the crack opening displacement and also an energy approach by calculating the J-integral parameter. Finally the fracture mechanics parameters are used for investigating the crack bifurcation.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132162258","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2014-11-24DOI: 10.1109/ESTC.2014.6962739
H. Sillanpaa, A. Vehkaoja, D. Vorobiev, Sampo Nurmentaus, J. Lekkala, M. Mantysalo
Home and remote healthcare services based on the Internet-of-Things (IoT) have great business potential in future. Despite enormous development in ICT and cloud computing, there is still some technology development needed before such services can be applied into practice and penetrate into markets. One of the key components for IoT based mobile healthcare is an accurate, low-cost, and user-friendly physiological monitoring device. In this study, such an intelligent, unobtrusive conformable, user friendly physiological monitoring device is presented. In particular, the inkjet printing of silver nano-particle ink, NPS-JL from Harima Chemicals, is used to fabricate interconnections and a 2.4 GHz antenna on low-cost stretchable plastics. Interconnections between RF SoC and passive components are made with isotropic conductive adhesive. Finally, the platform is demonstrated as a `plaster' like sensor node that measures the ECG signal and transmits that in real-time to a mobile device using Bluetooth low-energy protocol. Up to 14 m reading distance was demonstrated using the printed antenna in a close vicinity of the body.
{"title":"Integration of inkjet and RF SoC technologies to fabricate wireless physiological monitoring system","authors":"H. Sillanpaa, A. Vehkaoja, D. Vorobiev, Sampo Nurmentaus, J. Lekkala, M. Mantysalo","doi":"10.1109/ESTC.2014.6962739","DOIUrl":"https://doi.org/10.1109/ESTC.2014.6962739","url":null,"abstract":"Home and remote healthcare services based on the Internet-of-Things (IoT) have great business potential in future. Despite enormous development in ICT and cloud computing, there is still some technology development needed before such services can be applied into practice and penetrate into markets. One of the key components for IoT based mobile healthcare is an accurate, low-cost, and user-friendly physiological monitoring device. In this study, such an intelligent, unobtrusive conformable, user friendly physiological monitoring device is presented. In particular, the inkjet printing of silver nano-particle ink, NPS-JL from Harima Chemicals, is used to fabricate interconnections and a 2.4 GHz antenna on low-cost stretchable plastics. Interconnections between RF SoC and passive components are made with isotropic conductive adhesive. Finally, the platform is demonstrated as a `plaster' like sensor node that measures the ECG signal and transmits that in real-time to a mobile device using Bluetooth low-energy protocol. Up to 14 m reading distance was demonstrated using the printed antenna in a close vicinity of the body.","PeriodicalId":299981,"journal":{"name":"Proceedings of the 5th Electronics System-integration Technology Conference (ESTC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116973742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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