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2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)最新文献

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Embedded memory and ARM Cortex-M0 core using 60-nm C-axis aligned crystalline indium-gallium-zinc oxide FET integrated with 65-nm Si CMOS 嵌入式存储器和ARM Cortex-M0内核采用60纳米c轴排列晶体铟镓氧化锌场效应管集成65纳米Si CMOS
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573504
T. Onuki, W. Uesugi, H. Tamura, A. Isobe, Y. Ando, S. Okamoto, K. Kato, T. Yew, Chen Bin Lin, J. Y. Wu, C. Shuai, Shao Hui Wu, James Myers, K. Doppler, M. Fujita, S. Yamazaki
Low-power embedded memory and an ARM Cortex-M0 core that operate at 30 MHz were fabricated in combination with a 60-nm c-axis aligned crystalline indium-gallium-zinc oxide FET and a 65-nm Si CMOS. The embedded memory adopted a structure in which oxide semiconductor-based 1T1C cells are stacked on Si sense amplifiers. This memory achieved a standby power of 3 nW while retaining data and an active power of 11.7 μW/MHz by making each bitline as short as each sense amplifier. The M0 core adopted the flip-flop in which an oxide semiconductor-based 3T1C cell is stacked on the Si scan flip-flop cell without area overhead and achieved a standby power of 6 nW while retaining data. The combination of the embedded memory and the M0 core provided high-performance, low-power Internet of Things devices operating with a broad range of active standby power ratios.
低功耗嵌入式存储器和工作频率为30 MHz的ARM Cortex-M0内核由60 nm c轴排列晶体铟镓氧化锌场效应管和65 nm Si CMOS组合而成。嵌入式存储器采用的结构是基于氧化物半导体的1T1C单元堆叠在硅感测放大器上。通过使每个位线与每个感测放大器一样短,该存储器在保留数据的同时实现了3nw的待机功率和11.7 μW/MHz的有功功率。M0核心采用了触发器,其中基于氧化物半导体的3T1C电池堆叠在Si扫描触发器电池上,没有面积开销,在保留数据的情况下实现了6 nW的待机功率。嵌入式存储器和M0核心的结合提供了高性能,低功耗的物联网设备,具有广泛的工作待机功率比。
{"title":"Embedded memory and ARM Cortex-M0 core using 60-nm C-axis aligned crystalline indium-gallium-zinc oxide FET integrated with 65-nm Si CMOS","authors":"T. Onuki, W. Uesugi, H. Tamura, A. Isobe, Y. Ando, S. Okamoto, K. Kato, T. Yew, Chen Bin Lin, J. Y. Wu, C. Shuai, Shao Hui Wu, James Myers, K. Doppler, M. Fujita, S. Yamazaki","doi":"10.1109/VLSIC.2016.7573504","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573504","url":null,"abstract":"Low-power embedded memory and an ARM Cortex-M0 core that operate at 30 MHz were fabricated in combination with a 60-nm c-axis aligned crystalline indium-gallium-zinc oxide FET and a 65-nm Si CMOS. The embedded memory adopted a structure in which oxide semiconductor-based 1T1C cells are stacked on Si sense amplifiers. This memory achieved a standby power of 3 nW while retaining data and an active power of 11.7 μW/MHz by making each bitline as short as each sense amplifier. The M0 core adopted the flip-flop in which an oxide semiconductor-based 3T1C cell is stacked on the Si scan flip-flop cell without area overhead and achieved a standby power of 6 nW while retaining data. The combination of the embedded memory and the M0 core provided high-performance, low-power Internet of Things devices operating with a broad range of active standby power ratios.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"44 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"78570595","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Adaptive clocking with dynamic power gating for mitigating energy efficiency & performance impacts of fast voltage droop in a 22nm graphics execution core 具有动态功率门控的自适应时钟,可减轻22nm图形执行核心中快速电压下降对能效和性能的影响
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573529
M. Cho, Carlos Tokunaga, Stephen T. Kim, J. Tschanz, M. Khellah, V. De
Combining adaptive clocking with dynamic power gating in an optimal manner mitigates energy efficiency and performance impacts of fast supply voltage droop in a 22nm graphics execution core more effectively than adaptive clocking alone. Measurements show that there is an optimal VMIN where the combination provides the best improvement - 14% lower energy at 890MHz vs. 4% with adaptive clocking.
以最佳方式将自适应时钟与动态功率门控相结合,可以比单独使用自适应时钟更有效地减轻22nm图形执行核心中快速电源电压下降的能效和性能影响。测量结果表明,存在一个最佳的VMIN,其中组合提供了最佳的改进-在890MHz时能量降低14%,而自适应时钟降低4%。
{"title":"Adaptive clocking with dynamic power gating for mitigating energy efficiency & performance impacts of fast voltage droop in a 22nm graphics execution core","authors":"M. Cho, Carlos Tokunaga, Stephen T. Kim, J. Tschanz, M. Khellah, V. De","doi":"10.1109/VLSIC.2016.7573529","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573529","url":null,"abstract":"Combining adaptive clocking with dynamic power gating in an optimal manner mitigates energy efficiency and performance impacts of fast supply voltage droop in a 22nm graphics execution core more effectively than adaptive clocking alone. Measurements show that there is an optimal VMIN where the combination provides the best improvement - 14% lower energy at 890MHz vs. 4% with adaptive clocking.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"56 5","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72577612","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
A 260µW infrared gesture recognition system-on-chip for smart devices 用于智能设备的260µW红外手势识别片上系统
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573546
Sechang Oh, Ngoc Le Ba, S. Bang, Junwon Jeong, D. Blaauw, T. T. Kim, D. Sylvester
This paper presents a low-power infrared motion detection system suitable for smart devices such as wearables. The SoC incorporates instrumentation chopper amplifiers (ICA), LPFs, ADCs, and a DSP. The low-noise ICAs amplify very low frequency μV-level thermopile outputs with 2.0 NEF and provide programmable gain modes. To reduce standby power the ICA uses lower current when the system is in idle mode. Wakeup can be triggered by detection of a simple gesture. For the LPF, source degeneration by pseudo-resistors and gm division techniques are used for both improved linearity and 30Hz bandwidth. The DSP employs a motion history image technique to achieve low-power detection. The system consumes 260μW in active mode and 46μW in idle mode while processing 16×4 infrared data at 30fps. A complete system demonstration is shown.
本文提出了一种适用于可穿戴设备等智能设备的低功耗红外运动检测系统。SoC集成了仪器斩波放大器(ICA)、lpf、adc和DSP。低噪声集成电路放大极低频μ v级热电堆输出2.0 NEF,并提供可编程增益模式。为了减少待机功率,ICA在系统处于空闲模式时使用较小的电流。唤醒可以通过检测一个简单的手势来触发。对于LPF,采用伪电阻源退化和gm分频技术来提高线性度和30Hz带宽。DSP采用运动历史图像技术实现低功耗检测。当系统以30fps的速度处理16×4红外数据时,在活动模式下消耗260μW,在空闲模式下消耗46μW。给出了一个完整的系统演示。
{"title":"A 260µW infrared gesture recognition system-on-chip for smart devices","authors":"Sechang Oh, Ngoc Le Ba, S. Bang, Junwon Jeong, D. Blaauw, T. T. Kim, D. Sylvester","doi":"10.1109/VLSIC.2016.7573546","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573546","url":null,"abstract":"This paper presents a low-power infrared motion detection system suitable for smart devices such as wearables. The SoC incorporates instrumentation chopper amplifiers (ICA), LPFs, ADCs, and a DSP. The low-noise ICAs amplify very low frequency μV-level thermopile outputs with 2.0 NEF and provide programmable gain modes. To reduce standby power the ICA uses lower current when the system is in idle mode. Wakeup can be triggered by detection of a simple gesture. For the LPF, source degeneration by pseudo-resistors and gm division techniques are used for both improved linearity and 30Hz bandwidth. The DSP employs a motion history image technique to achieve low-power detection. The system consumes 260μW in active mode and 46μW in idle mode while processing 16×4 infrared data at 30fps. A complete system demonstration is shown.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"10 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73313694","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
A 8.2-mW 10-b 1.6-GS/s 4× TI SAR ADC with fast reference charge neutralization and background timing-skew calibration in 16-nm CMOS 一个8.2 mw 10-b 1.6-GS/s 4× TI SAR ADC,具有快速参考电荷中和和16nm CMOS背景时偏校准功能
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573536
Ying-Zu Lin, Chih-Hou Tsai, Shan-Chih Tsou, Chao-Hsin Lu
This paper presents a 4-way 1.6-GS/s time-interleaved (TI) SAR ADC with fast reference charge neutralization (CN) and background timing-skew calibration. The SAR sub-ADC uses a flip-flop-less digital control unit to achieve 400MS/s operation. The prototype in 16-nm CMOS occupies an active area of 0.023 mm2. From a 0.95-V supply, the power consumption is 8.2 mW at 1.6 GS/s. The peak SNDR is 55 dB and HF FOM is 19 fJ/conversion-step.
提出了一种具有快速基准电荷中和和背景时偏校准功能的4路1.6 gs /s时交错SAR ADC。SAR子adc采用无触发器数字控制单元实现400MS/s的操作。16纳米CMOS的原型占据0.023 mm2的有效面积。在0.95 v的电源下,1.6 GS/s的功耗为8.2 mW。峰值SNDR为55 dB,高频FOM为19 fJ/转换步长。
{"title":"A 8.2-mW 10-b 1.6-GS/s 4× TI SAR ADC with fast reference charge neutralization and background timing-skew calibration in 16-nm CMOS","authors":"Ying-Zu Lin, Chih-Hou Tsai, Shan-Chih Tsou, Chao-Hsin Lu","doi":"10.1109/VLSIC.2016.7573536","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573536","url":null,"abstract":"This paper presents a 4-way 1.6-GS/s time-interleaved (TI) SAR ADC with fast reference charge neutralization (CN) and background timing-skew calibration. The SAR sub-ADC uses a flip-flop-less digital control unit to achieve 400MS/s operation. The prototype in 16-nm CMOS occupies an active area of 0.023 mm2. From a 0.95-V supply, the power consumption is 8.2 mW at 1.6 GS/s. The peak SNDR is 55 dB and HF FOM is 19 fJ/conversion-step.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"14 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"84329340","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 28
A 35µW 96.8dB SNDR 1 kHz BW multi-step incremental ADC using multi-slope extended counting with a single integrator 35µW 96.8dB SNDR 1 kHz BW多步增量ADC,采用多斜率扩展计数和单积分器
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573464
Yi Zhang, Chia-Hung Chen, Tao He, G. Temes
A multi-step incremental ADC (IADC) with multi-slope extended counting is presented. In the proposed IADC, the accuracy is enhanced by reconfiguring it as a multi-slope ADC in two additional steps. For the same accuracy, the conversion cycle is shortened by a factor of about 29 as compared to the single-step IADC. Fabricated in 0.18-μm CMOS process, the prototype ADC operates at 642 kHz and achieves a peak SNDR = 96.8 dB and DR = 99.7 dB over a 1 kHz bandwidth. The power consumption is 35 μW, which results in an excellent Schreier FoM of 174.6 dB.
提出了一种多斜率扩展计数的多步增量ADC (IADC)。在提出的IADC中,通过两个额外步骤将其重新配置为多斜率ADC来提高精度。对于相同的精度,与单步IADC相比,转换周期缩短了约29倍。该原型ADC采用0.18 μm CMOS工艺制造,工作频率为642 kHz,在1 kHz带宽下峰值SNDR = 96.8 dB和DR = 99.7 dB。功耗为35 μW,可获得174.6 dB的优良Schreier FoM。
{"title":"A 35µW 96.8dB SNDR 1 kHz BW multi-step incremental ADC using multi-slope extended counting with a single integrator","authors":"Yi Zhang, Chia-Hung Chen, Tao He, G. Temes","doi":"10.1109/VLSIC.2016.7573464","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573464","url":null,"abstract":"A multi-step incremental ADC (IADC) with multi-slope extended counting is presented. In the proposed IADC, the accuracy is enhanced by reconfiguring it as a multi-slope ADC in two additional steps. For the same accuracy, the conversion cycle is shortened by a factor of about 29 as compared to the single-step IADC. Fabricated in 0.18-μm CMOS process, the prototype ADC operates at 642 kHz and achieves a peak SNDR = 96.8 dB and DR = 99.7 dB over a 1 kHz bandwidth. The power consumption is 35 μW, which results in an excellent Schreier FoM of 174.6 dB.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"22 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"82784593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
A 16nm dual-port SRAM with partial suppressed word-line, dummy read recovery and negative bit-line circuitries for low VMIN applications 一种16nm双端口SRAM,具有部分抑制字线、虚拟读取恢复和负位线电路,适用于低VMIN应用
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573459
Yen-Huei Chen, Kao-Cheng Lin, Ching-Wei Wu, W. Chan, J. Liaw, H. Liao, Jonathan Chang
A total solution for 8T dual-port (DP) SRAM to improve its operating voltage range (VMIN/VMAX) is proposed. Partial suppressed word-line (PSWL) technique improves the static noise margin (SNM) when both ports (A, B ports) access at the same time. Dummy read recovery (DRR) and negative bit-line (NBL) techniques are introduced to eliminate the dummy read induced write recovery failure and write contention failure, respectively. The silicon results show that the VDD operation window can be improved from 220mV to 570mV in 16nm FinFET technology.
提出了一种提高8T双端口SRAM工作电压范围(VMIN/VMAX)的整体解决方案。部分抑制字线(PSWL)技术提高了两个端口(A、B端口)同时接入时的静态噪声裕度(SNM)。引入虚拟读恢复技术(DRR)和负位线技术(NBL),分别消除虚拟读引起的写恢复失败和写争用失败。结果表明,在16nm FinFET技术下,VDD操作窗口可以从220mV提高到570mV。
{"title":"A 16nm dual-port SRAM with partial suppressed word-line, dummy read recovery and negative bit-line circuitries for low VMIN applications","authors":"Yen-Huei Chen, Kao-Cheng Lin, Ching-Wei Wu, W. Chan, J. Liaw, H. Liao, Jonathan Chang","doi":"10.1109/VLSIC.2016.7573459","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573459","url":null,"abstract":"A total solution for 8T dual-port (DP) SRAM to improve its operating voltage range (VMIN/VMAX) is proposed. Partial suppressed word-line (PSWL) technique improves the static noise margin (SNM) when both ports (A, B ports) access at the same time. Dummy read recovery (DRR) and negative bit-line (NBL) techniques are introduced to eliminate the dummy read induced write recovery failure and write contention failure, respectively. The silicon results show that the VDD operation window can be improved from 220mV to 570mV in 16nm FinFET technology.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"72 1 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"90724063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
A field-programmable mixed-signal IC with time-domain configurable analog blocks 具有时域可配置模拟块的现场可编程混合信号IC
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573510
Yunju Choi, Yoontaek Lee, Seung-Heon Baek, Sung-Joon Lee, Jaeha Kim
A field-programmable mixed-signal IC for fast-prototyping and low-cost production of mixed-signal system is presented. The IC contains time-domain configurable analog blocks (TCABs) that can be programmed into a time-to-digital converter (TDC), digitally controlled oscillator (DCO), digitally controlled delay element, digital pulse-width modulator (DPWM), or phase interpolator (PI). The prototype IC fabricated in 65-nm CMOS demonstrates its versatile programmability with the successful operations as a 1-GHz PLL with 12.3-psrms integrated jitter, 50-MS/s ADC with 32.5-dB SNDR, and 1.2-to-0.7V DC-DC converter with 95.5% efficiency.
提出了一种用于混合信号系统快速成型和低成本生产的现场可编程混合信号集成电路。该IC包含时域可配置模拟块(tcab),可将其编程为时间-数字转换器(TDC)、数字控制振荡器(DCO)、数字控制延迟元件、数字脉宽调制器(DPWM)或相位插补器(PI)。该原型IC采用65纳米CMOS制造,具有广泛的可编程性,成功实现了1 ghz锁相环、12.3 psrms集成抖动、50 ms /s ADC、32.5 db SNDR和效率为95.5%的1.2- 0.7 v DC-DC转换器。
{"title":"A field-programmable mixed-signal IC with time-domain configurable analog blocks","authors":"Yunju Choi, Yoontaek Lee, Seung-Heon Baek, Sung-Joon Lee, Jaeha Kim","doi":"10.1109/VLSIC.2016.7573510","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573510","url":null,"abstract":"A field-programmable mixed-signal IC for fast-prototyping and low-cost production of mixed-signal system is presented. The IC contains time-domain configurable analog blocks (TCABs) that can be programmed into a time-to-digital converter (TDC), digitally controlled oscillator (DCO), digitally controlled delay element, digital pulse-width modulator (DPWM), or phase interpolator (PI). The prototype IC fabricated in 65-nm CMOS demonstrates its versatile programmability with the successful operations as a 1-GHz PLL with 12.3-psrms integrated jitter, 50-MS/s ADC with 32.5-dB SNDR, and 1.2-to-0.7V DC-DC converter with 95.5% efficiency.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"4 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88091518","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
An 8.3M-pixel 480fps global-shutter CMOS image sensor with gain-adaptive column ADCs and 2-on-1 stacked device structure 具有增益自适应列式adc和2对1堆叠器件结构的8.3 m像素480fps全局快门CMOS图像传感器
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573543
Y. Oike, Kentaro Akiyama, Luong D. Hung, Wataru Niitsuma, A. Kato, Mamoru Sato, Yuri Kato, Wataru Nakamura, Hiroshi Shiroshita, Y. Sakano, Y. Kitano, Takuya Nakamura, T. Toyama, H. Iwamoto, T. Ezaki
A 4K2K 480 fps global-shutter CMOS image sensor has been developed with super 35 mm format. This sensor employs newly developed gain-adaptive column ADCs to attain a dark random noise of 140 μVrms for the full-scale readout of 923 mV. An on-chip online correction of the error between two switchable gains maintains the nonlinearity of output image within 0.18 %. The 16-channel output interfaces with 4.752 Gbps/ch are implemented in 2 diced logic chips stacked on a sensor chip with 38K micro bumps.
开发了一种4K2K 480 fps全快门CMOS图像传感器,采用超35mm格式。该传感器采用新开发的增益自适应列adc,在满量程读数为923 mV时,暗随机噪声为140 μVrms。在片上对两个可切换增益之间的误差进行在线校正,使输出图像的非线性保持在0.18%以内。16通道输出接口的速度为4.752 Gbps/ch,由2块逻辑芯片实现,堆叠在38K微凸点传感器芯片上。
{"title":"An 8.3M-pixel 480fps global-shutter CMOS image sensor with gain-adaptive column ADCs and 2-on-1 stacked device structure","authors":"Y. Oike, Kentaro Akiyama, Luong D. Hung, Wataru Niitsuma, A. Kato, Mamoru Sato, Yuri Kato, Wataru Nakamura, Hiroshi Shiroshita, Y. Sakano, Y. Kitano, Takuya Nakamura, T. Toyama, H. Iwamoto, T. Ezaki","doi":"10.1109/VLSIC.2016.7573543","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573543","url":null,"abstract":"A 4K2K 480 fps global-shutter CMOS image sensor has been developed with super 35 mm format. This sensor employs newly developed gain-adaptive column ADCs to attain a dark random noise of 140 μVrms for the full-scale readout of 923 mV. An on-chip online correction of the error between two switchable gains maintains the nonlinearity of output image within 0.18 %. The 16-channel output interfaces with 4.752 Gbps/ch are implemented in 2 diced logic chips stacked on a sensor chip with 38K micro bumps.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"148 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88654735","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 40
Lensless Smart Sensors: Optical and thermal sensing for the Internet of Things 无透镜智能传感器:用于物联网的光学和热传感
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573486
P. Gill, T. Vogelsang
Lensless Smart Sensors (LSS) add optical and thermal sensing capabilities to the Internet of Things (IoT) in a form factor that cannot be achieved with traditional lensed systems. Different from lensed systems, LSS is based on diffraction instead of refraction, and different from other diffractive optical elements in that it can operate with a wide field of view (FOV) and over a wide wavelength band. LSS's use of computation to extract information from a captured scene makes LSS a good fit for applications where the goal is not to create an image for human consumption, but for machine viewing (e.g. to trigger actions in a connected device). Since the raw sensed image is encoded by the grating structure, LSS opens applications where the use of a camera would create privacy concerns. This paper describes the operational principle of LSS and discusses three examples in more detail.
无透镜智能传感器(LSS)为物联网(IoT)增加了光学和热传感功能,这是传统透镜系统无法实现的。与透镜系统不同的是,LSS是基于衍射而不是折射的,与其他衍射光学元件不同的是,它可以在宽视场(FOV)和宽波长范围内工作。LSS使用计算从捕获的场景中提取信息,这使得LSS非常适合那些目标不是为人类消费创建图像,而是为机器查看(例如,在连接的设备中触发动作)的应用程序。由于原始感测图像是由光栅结构编码的,因此LSS打开了使用相机会产生隐私问题的应用程序。本文介绍了LSS的工作原理,并详细讨论了三个实例。
{"title":"Lensless Smart Sensors: Optical and thermal sensing for the Internet of Things","authors":"P. Gill, T. Vogelsang","doi":"10.1109/VLSIC.2016.7573486","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573486","url":null,"abstract":"Lensless Smart Sensors (LSS) add optical and thermal sensing capabilities to the Internet of Things (IoT) in a form factor that cannot be achieved with traditional lensed systems. Different from lensed systems, LSS is based on diffraction instead of refraction, and different from other diffractive optical elements in that it can operate with a wide field of view (FOV) and over a wide wavelength band. LSS's use of computation to extract information from a captured scene makes LSS a good fit for applications where the goal is not to create an image for human consumption, but for machine viewing (e.g. to trigger actions in a connected device). Since the raw sensed image is encoded by the grating structure, LSS opens applications where the use of a camera would create privacy concerns. This paper describes the operational principle of LSS and discusses three examples in more detail.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"192 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76521350","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
A 0.034mm2, 725fs RMS jitter, 1.8%/V frequency-pushing, 10.8–19.3GHz transformer-based fractional-N all-digital PLL in 10nm FinFET CMOS 一个0.034mm2, 725fs RMS抖动,1.8%/V频率推进,10.8-19.3GHz基于变压器的10nm FinFET CMOS分数n全数字锁相环
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573551
Chao-Chieh Li, Tsung-Hsien Tsai, Min-Shueh Yuan, Chia-Chun Liao, Chih-Hsien Chang, Tien-Chien Huang, Hsien-Yuan Liao, Chung-Ting Lu, Hung-Yi Kuo, K. Hsieh, Mark Chen, A. Ximenes, R. Staszewski
A tiny LC-tank-based ADPLL in 10nm FinFET CMOS achieves an area comparable to that of inverter-based ring-oscillator PLLs. A DCO occupying 0.016mm2 uses a controllable multi-turn magnetic coupling transformer to extend its tuning range to 10.8-19.3GHz (56.5%). A diversity of fine-tune capacitor banks limits the max/min step-size ratio to 2.3×. A new metastability-resolution scheme allows to use the frequency reference (FREF) clock directly instead of a retimed FREF (CKR) of conventional ADPLLs. A low-complexity estimator calculates inverse of the TDC. The fractional phase jitter (725fs) reaches sub-ps for the first time among PLLs of <;0.1mm2. Frequency pushing is 1.8%/V, which is at least 50× better than in traditional ring-type PLLs.
在10nm FinFET CMOS中,基于lc槽的微型ADPLL实现了与基于逆变器的环形振荡器pll相当的面积。占地0.016mm2的DCO采用可控多匝磁耦合变压器,将其调谐范围扩展到10.8-19.3GHz(56.5%)。多种微调电容器组将最大/最小步长比限制在2.3×。一种新的亚稳分辨率方案允许直接使用频率参考(FREF)时钟而不是传统adpll的重定时FREF (CKR)。一个低复杂度的估计器计算TDC的逆。在< 0.1mm2的锁相环中,分数阶相位抖动(725fs)首次达到亚ps级。频率推进率为1.8%/V,比传统环型锁相环提高至少50倍。
{"title":"A 0.034mm2, 725fs RMS jitter, 1.8%/V frequency-pushing, 10.8–19.3GHz transformer-based fractional-N all-digital PLL in 10nm FinFET CMOS","authors":"Chao-Chieh Li, Tsung-Hsien Tsai, Min-Shueh Yuan, Chia-Chun Liao, Chih-Hsien Chang, Tien-Chien Huang, Hsien-Yuan Liao, Chung-Ting Lu, Hung-Yi Kuo, K. Hsieh, Mark Chen, A. Ximenes, R. Staszewski","doi":"10.1109/VLSIC.2016.7573551","DOIUrl":"https://doi.org/10.1109/VLSIC.2016.7573551","url":null,"abstract":"A tiny LC-tank-based ADPLL in 10nm FinFET CMOS achieves an area comparable to that of inverter-based ring-oscillator PLLs. A DCO occupying 0.016mm2 uses a controllable multi-turn magnetic coupling transformer to extend its tuning range to 10.8-19.3GHz (56.5%). A diversity of fine-tune capacitor banks limits the max/min step-size ratio to 2.3×. A new metastability-resolution scheme allows to use the frequency reference (FREF) clock directly instead of a retimed FREF (CKR) of conventional ADPLLs. A low-complexity estimator calculates inverse of the TDC. The fractional phase jitter (725fs) reaches sub-ps for the first time among PLLs of <;0.1mm2. Frequency pushing is 1.8%/V, which is at least 50× better than in traditional ring-type PLLs.","PeriodicalId":6512,"journal":{"name":"2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)","volume":"44 1","pages":"1-2"},"PeriodicalIF":0.0,"publicationDate":"2016-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87114362","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
期刊
2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)
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