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2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)最新文献

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80Kb 10ns read cycle logic Embedded High-K charge trap Multi-Time-Programmable Memory scalable to 14nm FIN with no added process complexity 嵌入式高k电荷阱多时间可编程存储器,可扩展至14nm FIN,无需增加工艺复杂性
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573462
Janakiraman Viraraghavan, D. Leu, Balaji Jayaraman, A. Cestero, Robert Kilker, M. Yin, J. Golz, R. R. Tummuru, Ramesh Raghavan, D. Moy, Thejas Kempanna, F. Khan, T. Kirihata, S. Iyer
An 80Kb logic Embedded Multi-Time Programmable Memory (MTPM) employs charge trapping and de-trapping behavior in 32nm/22nm High-K transistor, resulting in no added process complexity. Multi-step verification with overwrite protection employs block-write and signal margin degradation (~30%) to satisfy 10 year retention at 105° C.
80Kb逻辑嵌入式多时间可编程存储器(MTPM)在32nm/22nm高k晶体管中采用电荷捕获和释放行为,不会增加工艺复杂性。具有覆盖保护的多步验证采用块写入和信号裕度退化(~30%),以满足105°C下10年的保留。
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引用次数: 11
3.5mW 1MHz AM detector and digitally-controlled tuner in a-IGZO TFT for wireless communications in a fully integrated flexible system for audio bag 3.5mW 1MHz调幅探测器和a- igzo TFT中的数字控制调谐器,用于无线通信,用于音频包的完全集成的灵活系统
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573508
T. Meister, K. Ishida, C. Carta, R. Shabanpour, B. K. Boroujeni, N. Münzenrieder, L. Petti, G. Salvatore, G. Schmidt, Pol Ghesquière, S. Kiefl, G. Toma, T. Faetti, A. Hübler, G. Tröster, F. Ellinger
We developed a fully flexible AM (amplitude modulation) radio receiver suitable for integration in an “audio bag”, by exploiting the heterogeneous integration of several fully flexible technologies. In this paper, we present a 2.9 mW 2-bit digitally-controlled tuner with a 576 kHz tuning range, a 3.5 mW 1 MHz AM detector and their integration in such a fully-flexible system. Their optimized power consumptions are essential because thin flexible batteries and organic solar cells serve as power supply. The circuits are fabricated in a low-temperature amorphous indium gallium zinc oxide (a-IGZO) technology. For the system integration textile techniques as well as flexible inkjet-printed packages and printed circuit boards (IPCBs) were used.
我们开发了一种完全灵活的AM(调幅)无线电接收机,适合集成在“音频包”中,通过利用几种完全灵活的技术的异构集成。在本文中,我们提出了一个2.9 mW的2位数字控制调谐器,具有576 kHz的调谐范围,一个3.5 mW的1 MHz调幅探测器,并将它们集成在这样一个完全灵活的系统中。他们的优化功耗是必不可少的,因为薄柔性电池和有机太阳能电池作为电源。该电路采用低温非晶铟镓锌氧化物(a- igzo)技术制造。对于系统集成,采用了纺织技术以及柔性喷墨印刷封装和印刷电路板(ipcb)。
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引用次数: 6
95% light-load efficiency single-inductor dual-output DC-DC buck converter with synthesized waveform control technique for USB type-C 95%轻载效率单电感双输出DC-DC降压变换器,采用USB type-C合成波形控制技术
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573476
Wen-Hau Yang, Chiun-He Lin, Ke-Horng Chen, Chinder Wey, Ying-Hsi Lin, Jian-Ru Lin, Tsung-Yen Tsai, Jui-Lung Chen
The proposed single-inductor dual-output (SIDO) converter can provide wide range in duty ratio control to convert input voltage 5-20V to dual output voltages 3.3V and 1.2V when its switching frequency is raised to 10MHz for compact size solution. The proposed synthesized waveform control (SWC) technique can emulate the inductor current without being affected by switching noise. Thus, the minimum allowable duty ratio can be lowered to 6% to meet the requirement of USB-C in one-stage low duty ratio conversion. Moreover, the switching frequency is dynamically decreased by the derived DC loading information from the SWC technique. Not only the output power MOSFET but also the main power MOSFET switch in a load-dependent switching frequency for power saving. 67% more power reduction can be obtained. 95% and 83% efficiency are achieved at light and heavy loads, respectively, when the silicon is limited within 1400μm*1350μm.
提出的单电感双输出(SIDO)转换器可以提供宽范围的占空比控制,当开关频率提高到10MHz时,可以将5-20V的输入电压转换为3.3V和1.2V的双输出电压,以实现紧凑的尺寸解决方案。所提出的合成波形控制(SWC)技术可以在不受开关噪声影响的情况下对电感电流进行仿真。因此,最小允许占空比可以降低到6%,以满足USB-C在一级低占空比转换中的要求。此外,从SWC技术中得到的直流负载信息动态地降低了开关频率。不仅输出功率MOSFET,而且主功率MOSFET的开关频率也与负载相关,以节省功耗。可获得67%以上的功耗降低。当硅被限制在1400μm*1350μm时,轻负载和重负载下的效率分别达到95%和83%。
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引用次数: 8
A high-density CMOS multi-modality joint sensor/stimulator array with 1024 pixels for holistic real-time cellular characterization 一种具有1024像素的高密度CMOS多模态关节传感器/刺激器阵列,用于整体实时细胞表征
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573469
Jong Seok Park, T. Chi, Amy Su, Chengjie Zhu, J. H. Sung, H. Cho, Mark P. Styczynski, Hua Wang
This paper presents a fully integrated 1024-pixel world-first joint multi-modality sensor/stimulator array in CMOS for holistic real-time cell characterization. Each pixel supports extracellular voltage recording, optical detection, and cellular impedance measurement, as well as current-mode cellular stimulation. Four independent on-chip temperature sensors monitor the ambient temperature variation. The chip is implemented in a 130nm CMOS process with a pixel size of 58μm×58μm, achieving the largest array-size and smallest pixel for a multi-modality joint sensor/stimulator array in CMOS. The electrical and biological measurements demonstrate the utility of this high-density multi-modality array in cell-based assays for drug and chemical screening.
本文提出了一种完全集成的1024像素CMOS联合多模态传感器/刺激器阵列,用于整体实时细胞表征。每个像素支持细胞外电压记录,光学检测,细胞阻抗测量,以及电流模式细胞刺激。四个独立的片上温度传感器监测环境温度变化。该芯片采用130nm CMOS工艺实现,像素尺寸为58μm×58μm,实现了CMOS中多模态关节传感器/刺激器阵列的最大阵列尺寸和最小像素。电学和生物学测量证明了这种高密度多模态阵列在基于细胞的药物和化学筛选分析中的实用性。
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引用次数: 14
A 9.84–73.2 nJ, 0.048 mm2 time-domain impedance sensor that provides values of resistance and capacitance 9.84-73.2 nJ, 0.048 mm2时域阻抗传感器,提供电阻和电容值
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573534
Yan Hong, Yong Wang, W. Goh, Yuan Gao, Lei Yao
A new time-domain impedance sensor readout circuit based on 0.18-μm CMOS technology is presented. A current DAC is used to charge the device under test (DUT) to increase the node voltage of the DUT. Using a time-domain comparator and a counter, a time period between the start of charge till the moment that the node voltage reaches a reference level is recorded and digitally converted. The resistance and capacitance components of the impedance can be quantized by using the time period data. The fabricated prototype consumes only 9.84 to 73.2 nJ of energy and requires merely 3 ms per measurement, where both are >103 times' reductions as compared to the state-of-the-arts. Moreover, to the best of the authors' knowledge, this proposed readout chip is the first of its kind that is able to deduce each resistance and capacitance component of the impedance. The chip takes up 0.048-mm2 of area.
提出了一种基于0.18 μm CMOS技术的时域阻抗传感器读出电路。电流DAC用于给被测设备(DUT)充电,以增加被测设备的节点电压。使用时域比较器和计数器,从开始充电到节点电压达到参考电平的时刻之间的时间段被记录并进行数字转换。阻抗的电阻和电容分量可以利用时间周期数据量化。制造的原型仅消耗9.84至73.2 nJ的能量,每次测量仅需3毫秒,与最先进的技术相比,两者都减少了103倍以上。此外,据作者所知,这种提出的读出芯片是同类中第一个能够推断阻抗的每个电阻和电容分量的芯片。该芯片的面积为0.048 mm2。
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引用次数: 2
A 1.40mm2 141mW 898GOPS sparse neuromorphic processor in 40nm CMOS 40nm CMOS 141mW 898GOPS稀疏神经形态处理器
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573526
Phil C. Knag, Chester Liu, Zhengya Zhang
Sparsity is a brain-inspired property that enables a significant reduction in workload and power dissipation of deep learning. This work presents a 1.40mm2 40nm CMOS sparse neuromorphic processor that implements a two-layer convolutional restricted Boltzmann machine (CRBM) for inference and a support vector machine (SVM) classifier. The processor incorporates sparse convolvers to realize sparsity-proportional workload reduction. The architecture is parallelized along a non-sparse dimension to minimize stalling. At 0.9V and 240MHz, the processor achieves an effective 898.2GOPS performance, dissipating 140.9mW. Using sparsity, we reduce the workload, datapath power consumption and area by 3.4×, 3.3× and 1.74×, respectively. The design uses latch-based memory to reduce area and dynamic clock gating to save power.
稀疏性是一种受大脑启发的特性,它可以显著减少深度学习的工作量和功耗。这项工作提出了一个1.40mm2 40nm的CMOS稀疏神经形态处理器,该处理器实现了用于推理的两层卷积受限玻尔兹曼机(CRBM)和支持向量机(SVM)分类器。该处理器采用稀疏卷积来实现稀疏比例的工作量减少。该架构沿着非稀疏维度并行化,以最小化延迟。在0.9V和240MHz下,处理器实现了898.2GOPS的有效性能,功耗为140.9mW。通过使用稀疏性,我们将工作负载、数据路径功耗和面积分别降低了3.4倍、3.3倍和1.74倍。该设计采用基于锁存的存储器来减小内存面积,并采用动态时钟门控来节省功耗。
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引用次数: 10
A fully integrated GaN-based power IC including gate drivers for high-efficiency DC-DC Converters 完全集成的基于gan的功率IC,包括用于高效率DC-DC转换器的栅极驱动器
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573496
S. Ujita, Y. Kinoshita, H. Umeda, T. Morita, K. Kaibara, S. Tamura, M. Ishida, T. Ueda
In this paper, we present a state-of-the-art integrated GaN power IC capable of operating in a high frequency (MHz) regime. This realizes system size reduction, 60% maximum, of a power IC. The IC consists of two output power transistors (PT) and two gate drivers (GD). The key devices in the IC are normally-off gate injection transistors (GITs) for PT and GD and a normally-on hetero-junction field effect transistor (HFET) for GD. Novel local control of carrier concentration of an identical 2 dimensional electron gas (2DEG) at an AlGaN/GaN interface which made integration of the transistors with such a large threshold voltage difference possible is described. A specially developed post-passivation interconnection process giving low parasitic components is also described. The IC applied to a 12V-1.8V DC-DC converter shows high frequency switching operation well beyond the limit of Si pointing to future improvement in consumer electronics power supply systems.
在本文中,我们提出了一种能够在高频(MHz)范围内工作的最先进的集成GaN功率IC。该集成电路由两个输出功率晶体管(PT)和两个栅极驱动器(GD)组成。该集成电路的关键器件是用于PT和GD的常关栅注入晶体管(GITs)和用于GD的常开异质结场效应晶体管(HFET)。本文描述了在AlGaN/GaN界面上对相同二维电子气(2DEG)载流子浓度进行局部控制的新方法,使具有如此大阈值电压差的晶体管集成成为可能。还描述了一种专门开发的低寄生成分的钝化后互连工艺。应用于12V-1.8V DC-DC转换器的IC显示了远远超出Si极限的高频开关操作,这表明消费电子电源系统的未来改进。
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引用次数: 17
A 50MHz 5V 3W 90% efficiency 3-level buck converter with real-time calibration and wide output range for fast-DVS in 65nm CMOS 50MHz 5V 3W 90%效率3电平降压转换器,具有实时校准和宽输出范围,适用于65nm CMOS快速dvs
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573475
Xun Liu, Cheng Huang, P. Mok
In this paper, a 50-MHz 5-V input 3-W output 3-level buck converter is presented. A real-time flying capacitor (CF) calibration is proposed to ensure a constant Vg/2 voltage across the CF, which is essential to ensure the reliability and maintain the advantages of 3-level converters. A 0.6-4.2V wide output range, a 90% peak efficiency and a 23-29ns/V reference tracking response are observed in measurements with 65nm process. A significantly reduced VO ripple is achieved after enabling the proposed calibration.
本文设计了一种50mhz 5v输入3w输出的3电平降压变换器。提出了一种实时飞行电容(CF)校准方法,以确保CF上的Vg/2电压恒定,这是确保可靠性和保持3电平变换器优势的必要条件。在65nm制程的测量中,观察到0.6-4.2V的宽输出范围,90%的峰值效率和23-29ns/V的参考跟踪响应。在启用所提出的校准后,实现了显着降低的VO纹波。
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引用次数: 16
A 18.5-fJ/step VCO-based 0–1 MASH ΔΣ ADC with digital background calibration 18.5 fj /step VCO-based 0-1 MASH ΔΣ数字背景校准ADC
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573465
A. Sanyal, Nan Sun
A scaling-friendly and energy-efficient 0-1 MASH ΔΣ ADC is proposed in this work. An 8b SAR is used as the 1st stage for coarse quantization. A ring VCO is used as the 2nd stage for fine quantization. The proposed ADC uses digital background calibration to track VCO gain variation across PVT. A 40nm CMOS prototype achieves a Walden FoM of 18.5 fJ/conv-step while operating from 1.1V supply.
本文提出了一种缩放友好且节能的0-1 MASH ΔΣ ADC。使用8b SAR作为粗量化的第一阶段。环形压控振荡器作为第二级进行精细量化。所提出的ADC使用数字背景校准来跟踪VCO在pvt中的增益变化。在1.1V电源下,40nm CMOS原型实现了18.5 fJ/ v-step的Walden FoM。
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引用次数: 25
A microelectrode array with 8,640 electrodes enabling simultaneous full-frame readout at 6.5 kfps and 112-channel switch-matrix readout at 20 kS/s 具有8,640个电极的微电极阵列,可同时以6.5 kfps的速度读出全帧,并以20 kS/s的速度读出112通道开关矩阵
Pub Date : 2016-06-15 DOI: 10.1109/VLSIC.2016.7573558
X. Yuan, S. Kim, J. Juyon, M. D'Urbino, Torsten Bullmann, Yihui Chen, A. Stettler, A. Hierlemann, U. Frey
CMOS microelectrode arrays allow for recording from neurons at thousands of sites. Here, we introduce the concept of a `dual-mode operation' microelectrode array, leveraging the advantages of full-frame scanning and switch-matrix array architectures into a single device. The chip was fabricated in 0.18 μm CMOS technology. Measured noise levels were 11.1 μVrms for full-frame scanning and 1.6 μVrms for switch-matrix mode at 3.3 μW and 38.1 μW per channel power consumption. Recordings of electrical activity from cultured neurons have been successfully conducted.
CMOS微电极阵列允许记录数千个位置的神经元。在这里,我们介绍了“双模式操作”微电极阵列的概念,利用全帧扫描和开关矩阵阵列架构的优势到单个器件中。该芯片采用0.18 μm CMOS工艺制备。在每通道功耗分别为3.3 μW和38.1 μW时,全帧扫描和开关矩阵模式下的实测噪声水平分别为11.1 μVrms和1.6 μVrms。已经成功地进行了培养神经元的电活动记录。
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引用次数: 14
期刊
2016 IEEE Symposium on VLSI Circuits (VLSI-Circuits)
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