Pub Date : 2025-11-24DOI: 10.1016/j.ultramic.2025.114282
Aaditya Bhat, Colin Gilgenbach, Junghwa Kim, Michael Xu, Menglin Zhu, James M. LeBeau
Here, we evaluate multislice electron ptychography as a tool for depth-resolved atomic-resolution characterization of point defects, using silicon carbide as a case study. Through multislice electron scattering simulations and multislice ptychographic reconstructions, we investigate the phase contrast arising from individual silicon vacancies, antisite defects, and a wide range of substitutional transition metal dopants (VSi to WSi), as well as their potential detectability. Simulating defect types, positions, and microscope conditions, we show that isolated point defects can be located within a unit cell along the sample’s depth. The influence of electron energy, dose, defocus, and convergence semi-angle is also explored to determine their role in governing defect contrast. These results guide experiments aimed at analyzing point defects using multislice electron ptychography.
{"title":"Sensitivity of multislice electron ptychography to point defects: A case study in SiC","authors":"Aaditya Bhat, Colin Gilgenbach, Junghwa Kim, Michael Xu, Menglin Zhu, James M. LeBeau","doi":"10.1016/j.ultramic.2025.114282","DOIUrl":"10.1016/j.ultramic.2025.114282","url":null,"abstract":"<div><div>Here, we evaluate multislice electron ptychography as a tool for depth-resolved atomic-resolution characterization of point defects, using silicon carbide as a case study. Through multislice electron scattering simulations and multislice ptychographic reconstructions, we investigate the phase contrast arising from individual silicon vacancies, antisite defects, and a wide range of substitutional transition metal dopants (V<sub>Si</sub> to W<sub>Si</sub>), as well as their potential detectability. Simulating defect types, positions, and microscope conditions, we show that isolated point defects can be located within a unit cell along the sample’s depth. The influence of electron energy, dose, defocus, and convergence semi-angle is also explored to determine their role in governing defect contrast. These results guide experiments aimed at analyzing point defects using multislice electron ptychography.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114282"},"PeriodicalIF":2.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145615331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-24DOI: 10.1016/j.ultramic.2025.114284
Austin Irish , Lukas Hrachowina , David Alcer , Magnus Borgström , Rainer Timm
Surface physics play an outsized role in nanostructured electronic devices such as solar cells. Semiconductor nanowires are perfect candidates for advanced solar cells due to their outstanding light absorption properties and their flexibility in axially stacking materials of different doping and band gap. Due to nanowire geometry, however, their surfaces dominate device performance and at the same time are challenging to investigate. Kelvin probe force microscopy (KPFM), an atomic force microscopy (AFM)-based method, provides a unique structural and electrical characterization even in unconventional 3D geometries. We demonstrate a high-resolution, non-destructive AFM technique for directly measuring nanowires within an array and still on their growth substrate. This in situ approach ensures measurement integrity and relevance while preserving the structures for subsequent measurement and processing. When compared with electron beam-induced current, cross-sectional KPFM is both more surface sensitive and less destructive. Utilizing such a cross-sectional approach facilitates rapid and comprehensive characterization of nanoelectronic surfaces.
{"title":"On the Edge: In situ Kelvin probe AFM on InP nanowire arrays","authors":"Austin Irish , Lukas Hrachowina , David Alcer , Magnus Borgström , Rainer Timm","doi":"10.1016/j.ultramic.2025.114284","DOIUrl":"10.1016/j.ultramic.2025.114284","url":null,"abstract":"<div><div>Surface physics play an outsized role in nanostructured electronic devices such as solar cells. Semiconductor nanowires are perfect candidates for advanced solar cells due to their outstanding light absorption properties and their flexibility in axially stacking materials of different doping and band gap. Due to nanowire geometry, however, their surfaces dominate device performance and at the same time are challenging to investigate. Kelvin probe force microscopy (KPFM), an atomic force microscopy (AFM)-based method, provides a unique structural and electrical characterization even in unconventional 3D geometries. We demonstrate a high-resolution, non-destructive AFM technique for directly measuring nanowires within an array and still on their growth substrate. This <em>in situ</em> approach ensures measurement integrity and relevance while preserving the structures for subsequent measurement and processing. When compared with electron beam-induced current, cross-sectional KPFM is both more surface sensitive and less destructive. Utilizing such a cross-sectional approach facilitates rapid and comprehensive characterization of nanoelectronic surfaces.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"281 ","pages":"Article 114284"},"PeriodicalIF":2.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145678990","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-24DOI: 10.1016/j.ultramic.2025.114283
Yang Liu , Hongsheng Shi , Siyuan Shen , Yuan Lu , Shuchen Zhang , Jingyi Yu , Yi Yu
Atomic-scale imaging of radiation-sensitive materials has been a challenge for both materials science and life science. While low-dose transmission electron microscopy (TEM) is particularly useful for minimizing the radiation damage, the noisy images with poor resolution make it extremely difficult for the purpose of fine structure analysis. Here, this work presents a phase retrieval method to achieve high-quality atomic-scale imaging of radiation-sensitive materials under low-dose TEM conditions. By integrating neural fields (NF) with traditional exit wave reconstruction (EWR), it is able to reveal atomic details from limited low-dose experimental data. Taking the radiation-sensitive organic–inorganic hybrid halide perovskite CHNHPbI (MAPbI) as an example, the EWR-NF method demonstrates superior performance in reconstructing the pristine atomic structure using as few as just three low-dose images, which is beyond the limits of conventional methods. In this manner, EWR-NF enables higher temporal resolution to reveal intermediate states during irradiation-induced decomposition. An example of stacking of MAPbI with its as-decomposed product is shown. EWR-NF offers a promising tool for atomic-level structure analysis of sensitive halide perovskites and understanding irradiation-induced structure changes, with implications for a wide range of applications in materials science and beyond.
{"title":"Neural field enhanced phase retrieval of atomic-scale structural dynamics in radiation sensitive materials","authors":"Yang Liu , Hongsheng Shi , Siyuan Shen , Yuan Lu , Shuchen Zhang , Jingyi Yu , Yi Yu","doi":"10.1016/j.ultramic.2025.114283","DOIUrl":"10.1016/j.ultramic.2025.114283","url":null,"abstract":"<div><div>Atomic-scale imaging of radiation-sensitive materials has been a challenge for both materials science and life science. While low-dose transmission electron microscopy (TEM) is particularly useful for minimizing the radiation damage, the noisy images with poor resolution make it extremely difficult for the purpose of fine structure analysis. Here, this work presents a phase retrieval method to achieve high-quality atomic-scale imaging of radiation-sensitive materials under low-dose TEM conditions. By integrating neural fields (NF) with traditional exit wave reconstruction (EWR), it is able to reveal atomic details from limited low-dose experimental data. Taking the radiation-sensitive organic–inorganic hybrid halide perovskite CH<span><math><msub><mrow></mrow><mrow><mn>3</mn></mrow></msub></math></span>NH<span><math><msub><mrow></mrow><mrow><mn>3</mn></mrow></msub></math></span>PbI<span><math><msub><mrow></mrow><mrow><mn>3</mn></mrow></msub></math></span> (MAPbI<span><math><msub><mrow></mrow><mrow><mn>3</mn></mrow></msub></math></span>) as an example, the EWR-NF method demonstrates superior performance in reconstructing the pristine atomic structure using as few as just three low-dose images, which is beyond the limits of conventional methods. In this manner, EWR-NF enables higher temporal resolution to reveal intermediate states during irradiation-induced decomposition. An example of stacking of MAPbI<span><math><msub><mrow></mrow><mrow><mn>3</mn></mrow></msub></math></span> with its as-decomposed product is shown. EWR-NF offers a promising tool for atomic-level structure analysis of sensitive halide perovskites and understanding irradiation-induced structure changes, with implications for a wide range of applications in materials science and beyond.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114283"},"PeriodicalIF":2.0,"publicationDate":"2025-11-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145615330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-11DOI: 10.1016/j.ultramic.2025.114278
Evgenii Vlasov, Wouter Heyvaert, Tom Stoops, Sandra Van Aert, Johan Verbeeck, Sara Bals
Secondary electron (SE) imaging offers a powerful complementary capabilities to conventional scanning transmission electron microscopy (STEM) by providing surface-sensitive, pseudo-3D topographic information. However, contrast interpretation of such images remains empirical due to complex interactions of emitted SE with the magnetic field in the objective field of TEM. Here, we propose an analytical physical model that takes into account the physics of SE emission and interaction of the emitted SEs with magnetic field. This enables more reliable image interpretation and potentially lay the foundation for novel 3D surface reconstruction algorithms.
{"title":"Secondary electron topographical contrast formation in scanning transmission electron microscopy","authors":"Evgenii Vlasov, Wouter Heyvaert, Tom Stoops, Sandra Van Aert, Johan Verbeeck, Sara Bals","doi":"10.1016/j.ultramic.2025.114278","DOIUrl":"10.1016/j.ultramic.2025.114278","url":null,"abstract":"<div><div>Secondary electron (SE) imaging offers a powerful complementary capabilities to conventional scanning transmission electron microscopy (STEM) by providing surface-sensitive, pseudo-3D topographic information. However, contrast interpretation of such images remains empirical due to complex interactions of emitted SE with the magnetic field in the objective field of TEM. Here, we propose an analytical physical model that takes into account the physics of SE emission and interaction of the emitted SEs with magnetic field. This enables more reliable image interpretation and potentially lay the foundation for novel 3D surface reconstruction algorithms.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114278"},"PeriodicalIF":2.0,"publicationDate":"2025-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145518035","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-09DOI: 10.1016/j.ultramic.2025.114277
Yanli Li , Yichen Ping , Yue Wu , Yao Liu , Huibin Zhao , Li Han
Reflected and transmitted secondary electron images of Si3N4 window are obtained in scanning electron microscopy (SEM) by using SEM and scanning transmission electron microscopy (STEM) holders. The figure of Si3N4 window becomes distinguishable as the accelerating voltage increases. However, the brightness of Si3N4 window relative to the surroundings in images for SEM and STEM holders is completely opposite. It changes from dark to bright, which means the number of detected secondary electron increases. The difference of the two kinds of image is caused by the fact that secondary electrons emitted from the bottom surface can also be detected when using STEM holder. The images are consistent with Monte Carlo simulation results. Image figures are sensitive to accelerating voltages and sample thicknesses. Therefore, more characteristics of thin sample could be analyzed via combining the two kinds of image.
{"title":"Reflected and transmitted secondary electron images of thin Si3N4 window","authors":"Yanli Li , Yichen Ping , Yue Wu , Yao Liu , Huibin Zhao , Li Han","doi":"10.1016/j.ultramic.2025.114277","DOIUrl":"10.1016/j.ultramic.2025.114277","url":null,"abstract":"<div><div>Reflected and transmitted secondary electron images of Si<sub>3</sub>N<sub>4</sub> window are obtained in scanning electron microscopy (SEM) by using SEM and scanning transmission electron microscopy (STEM) holders. The figure of Si<sub>3</sub>N<sub>4</sub> window becomes distinguishable as the accelerating voltage increases. However, the brightness of Si<sub>3</sub>N<sub>4</sub> window relative to the surroundings in images for SEM and STEM holders is completely opposite. It changes from dark to bright, which means the number of detected secondary electron increases. The difference of the two kinds of image is caused by the fact that secondary electrons emitted from the bottom surface can also be detected when using STEM holder. The images are consistent with Monte Carlo simulation results. Image figures are sensitive to accelerating voltages and sample thicknesses. Therefore, more characteristics of thin sample could be analyzed via combining the two kinds of image.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114277"},"PeriodicalIF":2.0,"publicationDate":"2025-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145514278","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-09DOI: 10.1016/j.ultramic.2025.114279
Yupeng Yin , Ruiqi Zhan , Yufeng Du , Chi Xu , Somei Ohnuki , Farong Wan , Wentuo Han
The electron threshold energy (Et) of a material is a critical parameter for anyone conducting research using transmission electron microscopy (TEM). For studies involving irradiation damage, the electron beam energy must exceed the material’s Et to enable in-situ electron irradiation experiments. In contrast, for researchers focused on microstructural characterization, it is essential to ensure that the beam energy remains below Et to avoid electron-beam-induced radiation damage, which could compromise the accuracy and reliability of the TEM analysis. This study revisits the commonly used formula for calculating Et, originally cited in the textbook by Williams and Carter, and identifies significant discrepancies when compared with experimental observations and the original formulation. A corrected formula is proposed and applied to compute Et values for 81 elements using their minimum displacement energies (Ed min). The results are presented in a periodic-table-based diagram, providing practical reference for selecting appropriate TEM accelerating voltages to either induce or avoid irradiation damage.
{"title":"Evaluation of electron threshold energy for predicting radiation damage in transmission electron microscopy","authors":"Yupeng Yin , Ruiqi Zhan , Yufeng Du , Chi Xu , Somei Ohnuki , Farong Wan , Wentuo Han","doi":"10.1016/j.ultramic.2025.114279","DOIUrl":"10.1016/j.ultramic.2025.114279","url":null,"abstract":"<div><div>The electron threshold energy (E<sub>t</sub>) of a material is a critical parameter for anyone conducting research using transmission electron microscopy (TEM). For studies involving irradiation damage, the electron beam energy must exceed the material’s E<sub>t</sub> to enable in-situ electron irradiation experiments. In contrast, for researchers focused on microstructural characterization, it is essential to ensure that the beam energy remains below E<sub>t</sub> to avoid electron-beam-induced radiation damage, which could compromise the accuracy and reliability of the TEM analysis. This study revisits the commonly used formula for calculating E<sub>t</sub>, originally cited in the textbook by Williams and Carter, and identifies significant discrepancies when compared with experimental observations and the original formulation. A corrected formula is proposed and applied to compute E<sub>t</sub> values for 81 elements using their minimum displacement energies (E<sub>d min</sub>). The results are presented in a periodic-table-based diagram, providing practical reference for selecting appropriate TEM accelerating voltages to either induce or avoid irradiation damage.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114279"},"PeriodicalIF":2.0,"publicationDate":"2025-11-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145514262","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Lorentz transmission electron microscopy (LTEM) is a powerful tool for high-resolution imaging of magnetic textures, including their dynamics under external stimuli and ultrafast nonequilibrium conditions. However, magnetic imaging is often hindered by non-magnetic diffraction contrast arising from inhomogeneous sample deformation or a non-parallel electron beam. In this study, we develop a precession LTEM system that can suppress diffraction contrast by changing the incident angle of the electron beam relative to the sample in a precessional manner. By comparing LTEM images acquired at different precession angles (), we show that diffraction contrast is significantly reduced with increasing . However, large values lead to an undesired broadening of the magnetic contrast, highlighting the importance of optimizing . Furthermore, defocus-dependent measurements reveal that magnetic contrast is particularly improved at small defocus values. These findings demonstrate the potential of precession LTEM as a powerful technique for studying magnetic dynamics.
{"title":"Development of precession Lorentz transmission electron microscopy","authors":"Shunsuke Hayashi , Dongxue Han , Hidenori Tsuji , Kyoko Ishizaka , Asuka Nakamura","doi":"10.1016/j.ultramic.2025.114276","DOIUrl":"10.1016/j.ultramic.2025.114276","url":null,"abstract":"<div><div>Lorentz transmission electron microscopy (LTEM) is a powerful tool for high-resolution imaging of magnetic textures, including their dynamics under external stimuli and ultrafast nonequilibrium conditions. However, magnetic imaging is often hindered by non-magnetic diffraction contrast arising from inhomogeneous sample deformation or a non-parallel electron beam. In this study, we develop a precession LTEM system that can suppress diffraction contrast by changing the incident angle of the electron beam relative to the sample in a precessional manner. By comparing LTEM images acquired at different precession angles (<span><math><mi>θ</mi></math></span>), we show that diffraction contrast is significantly reduced with increasing <span><math><mi>θ</mi></math></span>. However, large <span><math><mi>θ</mi></math></span> values lead to an undesired broadening of the magnetic contrast, highlighting the importance of optimizing <span><math><mi>θ</mi></math></span>. Furthermore, defocus-dependent measurements reveal that magnetic contrast is particularly improved at small defocus values. These findings demonstrate the potential of precession LTEM as a powerful technique for studying magnetic dynamics.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114276"},"PeriodicalIF":2.0,"publicationDate":"2025-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145518128","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-06DOI: 10.1016/j.ultramic.2025.114268
Yu-Chen Yang , Tung-Huan Chou , Ya-Lan Hsu , Kun-Lin Lin , Zhiqiang Wang , Kuen-Hsing Lin
This study developed a simple femtosecond (fs)-laser-assisted focused ion beam (FIB) method for rapidly fabricating tip samples for atom probe tomography (APT). In this method, a microtip array is fabricated directly on a Si sample to avoid the use of conventional lift-out procedures. The proposed method comprises two steps: fs-laser ablation and Ga FIB annular milling. Fs-laser ablation results in the formation of a damaged amorphous layer; however, this layer is small, does not affect the results of APT, and can be removed through subsequent Ga FIB annular milling. APT analysis of a tip sample fabricated using the proposed approach confirmed the feasibility of the method. This method not only enhanced the stability of the tip sample but also had a considerably shorter sample preparation time compared with conventional Ga FIB and Xe FIB fabrication processes.
{"title":"Femtosecond-laser-assisted focused ion beam method for the fabrication of tip specimens for atom probe tomography","authors":"Yu-Chen Yang , Tung-Huan Chou , Ya-Lan Hsu , Kun-Lin Lin , Zhiqiang Wang , Kuen-Hsing Lin","doi":"10.1016/j.ultramic.2025.114268","DOIUrl":"10.1016/j.ultramic.2025.114268","url":null,"abstract":"<div><div>This study developed a simple femtosecond (fs)-laser-assisted focused ion beam (FIB) method for rapidly fabricating tip samples for atom probe tomography (APT). In this method, a microtip array is fabricated directly on a Si sample to avoid the use of conventional lift-out procedures. The proposed method comprises two steps: fs-laser ablation and Ga FIB annular milling. Fs-laser ablation results in the formation of a damaged amorphous layer; however, this layer is small, does not affect the results of APT, and can be removed through subsequent Ga FIB annular milling. APT analysis of a tip sample fabricated using the proposed approach confirmed the feasibility of the method. This method not only enhanced the stability of the tip sample but also had a considerably shorter sample preparation time compared with conventional Ga FIB and Xe FIB fabrication processes.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114268"},"PeriodicalIF":2.0,"publicationDate":"2025-11-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145518127","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-03DOI: 10.1016/j.ultramic.2025.114267
Diederik Jan Maas
An electrostatic aberration corrector (AC), based on a quadrupole-octupole design, for a low voltage scanning electron microscope (LV-SEM) has been developed, integrated and tested in a modified commercial SEM for improving image quality. After quantitative assessment and adjustment of the chromatic aberration and qualitive adjustment of the spherical aberration, LV-SEM image resolution and contrast improved by almost a factor three. Some unavoidable electromagnetic interference (EMI) accounts for the difference between the experimentally demonstrated AC-SEM edge resolution of 3.0 nm at a beam energy of 1000 eV and the corresponding theoretical probe size of 2.2 nm. After cancelling the chromatic and spherical aberrations of the objective lens of a scanning electron microscope (SEM) the reachable image resolution is limited by spot blur due to EMI, higher order aberrations and, more fundamentally, by the interaction volume of the focused electron beam in a sample and beam-induced alterations to the sample. Furthermore, the practical performance of the purely electrostatic aberration corrector integrated into an AC-SEM is demonstrated on typical material and life science samples at a beam energy of 500 and 1000 eV. Whereas electro-magnetic aberration correctors struggle with re-alignment iterations after a beam energy change due to remanent magnetic fields, a purely electrostatic corrector is swiftly adjusted by proportional scaling of electrode voltages. In principle, an electrostatic corrector can also be applied to low-voltage ion microscopy.
Summarising, an easy-to-use purely electrostatic corrector has been developed which, after proper integration into a state-of-the-art SEM, is capable of delivering the ultimate low-voltage SEM images.
{"title":"An electrostatic aberration corrector for improved Low-Voltage SEM imaging","authors":"Diederik Jan Maas","doi":"10.1016/j.ultramic.2025.114267","DOIUrl":"10.1016/j.ultramic.2025.114267","url":null,"abstract":"<div><div>An electrostatic aberration corrector (AC), based on a quadrupole-octupole design, for a low voltage scanning electron microscope (LV-SEM) has been developed, integrated and tested in a modified commercial SEM for improving image quality. After quantitative assessment and adjustment of the chromatic aberration and qualitive adjustment of the spherical aberration, LV-SEM image resolution and contrast improved by almost a factor three. Some unavoidable electromagnetic interference (EMI) accounts for the difference between the experimentally demonstrated AC-SEM edge resolution of 3.0 nm at a beam energy of 1000 eV and the corresponding theoretical probe size of 2.2 nm. After cancelling the chromatic and spherical aberrations of the objective lens of a scanning electron microscope (SEM) the reachable image resolution is limited by spot blur due to EMI, higher order aberrations and, more fundamentally, by the interaction volume of the focused electron beam in a sample and beam-induced alterations to the sample. Furthermore, the practical performance of the purely electrostatic aberration corrector integrated into an AC-SEM is demonstrated on typical material and life science samples at a beam energy of 500 and 1000 eV. Whereas electro-magnetic aberration correctors struggle with re-alignment iterations after a beam energy change due to remanent magnetic fields, a purely electrostatic corrector is swiftly adjusted by proportional scaling of electrode voltages. In principle, an electrostatic corrector can also be applied to low-voltage ion microscopy.</div><div>Summarising, an easy-to-use purely electrostatic corrector has been developed which, after proper integration into a state-of-the-art SEM, is capable of delivering the ultimate low-voltage SEM images.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114267"},"PeriodicalIF":2.0,"publicationDate":"2025-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145468577","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-11-03DOI: 10.1016/j.ultramic.2025.114266
N.G. Rudawski, M.A. Downing
Amorphous Si (a-Si) evaporated using electron beam physical vapor deposition (EBPVD) was investigated as a protective coating for dual focused ion beam/scanning electron microscope (FIB/SEM) preparation of lamellae for scanning/transmission electron microscopy (S/TEM) analysis. EBPVD a-Si films were evaporated on polished, undoped (001) SrTiO3 substrates and then dual FIB/SEM was used to prepare lamellae for S/TEM analysis. It was revealed that the EBPVD a-Si coating suppressed charging-related instabilities during dual FIB/SEM preparation. Subsequent S/TEM analyses using TEM imaging, high-angle annular dark-field (HAADF) STEM imaging, and selected area electron diffraction revealed the EBPVD a-Si films deposit with a smooth surface, non-porous microstructure, and amorphous crystal structure, which ultimately results in high-quality lamellae with smooth, curtain-free sidewalls. High-resolution TEM and HAADF-STEM imaging also revealed that the EBPVD process did not damage the surface of the (001) SrTiO3 substrates and that EBPVD a-Si is robust to both O2-based plasma cleaning and typical high-dose electron irradiation performed during atomic-resolution elemental mapping using energy dispersive spectroscopy. It is thus demonstrated that EBPVD a-Si meets all requirements for an ideal protective coating for dual FIB/SEM preparation of high-quality lamellae for S/TEM analysis and is advantageous over all other coatings previously investigated in this capacity.
{"title":"Evaporated amorphous Si protective coatings for dual FIB/SEM preparation of high-quality lamellae for S/TEM analysis","authors":"N.G. Rudawski, M.A. Downing","doi":"10.1016/j.ultramic.2025.114266","DOIUrl":"10.1016/j.ultramic.2025.114266","url":null,"abstract":"<div><div>Amorphous Si (a-Si) evaporated using electron beam physical vapor deposition (EBPVD) was investigated as a protective coating for dual focused ion beam/scanning electron microscope (FIB/SEM) preparation of lamellae for scanning/transmission electron microscopy (S/TEM) analysis. EBPVD a-Si films were evaporated on polished, undoped (001) SrTiO<sub>3</sub> substrates and then dual FIB/SEM was used to prepare lamellae for S/TEM analysis. It was revealed that the EBPVD a-Si coating suppressed charging-related instabilities during dual FIB/SEM preparation. Subsequent S/TEM analyses using TEM imaging, high-angle annular dark-field (HAADF) STEM imaging, and selected area electron diffraction revealed the EBPVD a-Si films deposit with a smooth surface, non-porous microstructure, and amorphous crystal structure, which ultimately results in high-quality lamellae with smooth, curtain-free sidewalls. High-resolution TEM and HAADF-STEM imaging also revealed that the EBPVD process did not damage the surface of the (001) SrTiO<sub>3</sub> substrates and that EBPVD a-Si is robust to both O<sub>2</sub>-based plasma cleaning and typical high-dose electron irradiation performed during atomic-resolution elemental mapping using energy dispersive spectroscopy. It is thus demonstrated that EBPVD a-Si meets all requirements for an ideal protective coating for dual FIB/SEM preparation of high-quality lamellae for S/TEM analysis and is advantageous over all other coatings previously investigated in this capacity.</div></div>","PeriodicalId":23439,"journal":{"name":"Ultramicroscopy","volume":"280 ","pages":"Article 114266"},"PeriodicalIF":2.0,"publicationDate":"2025-11-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145468576","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}