Materials & Design最新文献

英文中文

Local plastic deformation in the vicinity of topologically close-packed phases in a Ni-based single crystal superalloy

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113600

Sangwon Lee , Jeonghyeon Do , Baig Gyu Choi , Ujjval Bansal , Christoph Kirchlechner , Pyuck-Pa Choi , Subin Lee

The role of a topologically close-packed (TCP) phase (μ phase) on the plastic deformation of a Ni-based superalloy was investigated employing a combination of in situ scanning electron microscope micropillar compression and atomic-scale characterization using atom probe tomography and transmission electron microscopy. Micropillar tests revealed two distinct slip behaviors: TCP-free pillars deformed via multiple slip systems, whereas TCP-containing pillars deformed by single slip. Notably, while previous studies have reported fracture at the TCP/γ' interface, our findings revealed that in the TCP-containing pillars, deformation was rarely observed at the interface. Instead, slip predominantly occurred in regions approximately 50–100 nm away from the interface. Chemical analysis near the TCP/γ' interface via APT showed an excess Ta content near the interface increasing the antiphase boundary energy and enhancing local order strengthening. Moreover, an approximate 8% lattice misfit at the TCP/γ' interface, coupled with the elastic mismatch between the two phases, provided additional slip resistance in the vicinity of the interface. This study sheds light on the intricate interplay between TCP phase formation, microstructural evolution, and mechanical properties in Ni-based superalloys offering valuable insights into the role of the TCP phases.

{"title":"Local plastic deformation in the vicinity of topologically close-packed phases in a Ni-based single crystal superalloy","authors":"Sangwon Lee , Jeonghyeon Do , Baig Gyu Choi , Ujjval Bansal , Christoph Kirchlechner , Pyuck-Pa Choi , Subin Lee","doi":"10.1016/j.matdes.2025.113600","DOIUrl":"10.1016/j.matdes.2025.113600","url":null,"abstract":"<div><div>The role of a topologically close-packed (TCP) phase (μ phase) on the plastic deformation of a Ni-based superalloy was investigated employing a combination of <em>in situ</em> scanning electron microscope micropillar compression and atomic-scale characterization using atom probe tomography and transmission electron microscopy. Micropillar tests revealed two distinct slip behaviors: TCP-free pillars deformed via multiple slip systems, whereas TCP-containing pillars deformed by single slip. Notably, while previous studies have reported fracture at the TCP/γ' interface, our findings revealed that in the TCP-containing pillars, deformation was rarely observed at the interface. Instead, slip predominantly occurred in regions approximately 50–100 nm away from the interface. Chemical analysis near the TCP/γ' interface via APT showed an excess Ta content near the interface increasing the antiphase boundary energy and enhancing local order strengthening. Moreover, an approximate 8% lattice misfit at the TCP/γ' interface, coupled with the elastic mismatch between the two phases, provided additional slip resistance in the vicinity of the interface. This study sheds light on the intricate interplay between TCP phase formation, microstructural evolution, and mechanical properties in Ni-based superalloys offering valuable insights into the role of the TCP phases.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113600"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165217","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Strength-plasticity synergistic enhancement of dispersion strengthened copper by interaction of nano-Al2O3 and Cr particles

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113602

Hao Song , Shaolin Li , Xiuhua Guo , Kexing Song , Song Liu , Keke Qi

To further regulate the coordinated matching of mechanical properties and plastic deformation ability of Al₂O₃/Cu composites. In this paper, Al₂O₃/Cu-Cr composites with different Cr contents were prepared by replacing some Al₂O₃ particles with Cr using a deformation heat treatment process, and the effects of Cr contents on the microstructure, electrical conductivity, and mechanical properties of Al₂O₃/Cu-Cr composites were investigated with a focus on the contribution of the composite strengthening mechanism. The results show that with the increase of Cr content and the decrease of Al₂O₃ content, the strength of the composites gradually decreases, and the plasticity and electrical conductivity are enhanced. Among them, the elongation of 1.1 Al₂O₃/Cu-0.3Cr composites was enhanced from 10% to 15% while the strength was not considerably reduced. The addition of Cr promotes grain growth and dynamic recrystallization, whereas Al₂O₃ particles enhance the aging precipitation response of Cr particles. The results of strength mechanism calculations show that the tensile strength of Al₂O₃/Cu-Cr composites mainly consists of Orowan strengthening caused by Al₂O₃ particles and dislocation strengthening in cold rolled deformation, while the dislocation strengthening is weakened at higher Cr content.

{"title":"Strength-plasticity synergistic enhancement of dispersion strengthened copper by interaction of nano-Al2O3 and Cr particles","authors":"Hao Song , Shaolin Li , Xiuhua Guo , Kexing Song , Song Liu , Keke Qi","doi":"10.1016/j.matdes.2025.113602","DOIUrl":"10.1016/j.matdes.2025.113602","url":null,"abstract":"<div><div>To further regulate the coordinated matching of mechanical properties and plastic deformation ability of Al<sub>2</sub>O<sub>3</sub>/Cu composites. In this paper, Al<sub>2</sub>O<sub>3</sub>/Cu-Cr composites with different Cr contents were prepared by replacing some Al<sub>2</sub>O<sub>3</sub> particles with Cr using a deformation heat treatment process, and the effects of Cr contents on the microstructure, electrical conductivity, and mechanical properties of Al<sub>2</sub>O<sub>3</sub>/Cu-Cr composites were investigated with a focus on the contribution of the composite strengthening mechanism. The results show that with the increase of Cr content and the decrease of Al<sub>2</sub>O<sub>3</sub> content, the strength of the composites gradually decreases, and the plasticity and electrical conductivity are enhanced. Among them, the elongation of 1.1 Al<sub>2</sub>O<sub>3</sub>/Cu-0.3Cr composites was enhanced from 10% to 15% while the strength was not considerably reduced. The addition of Cr promotes grain growth and dynamic recrystallization, whereas Al<sub>2</sub>O<sub>3</sub> particles enhance the aging precipitation response of Cr particles. The results of strength mechanism calculations show that the tensile strength of Al<sub>2</sub>O<sub>3</sub>/Cu-Cr composites mainly consists of Orowan strengthening caused by Al<sub>2</sub>O<sub>3</sub> particles and dislocation strengthening in cold rolled deformation, while the dislocation strengthening is weakened at higher Cr content.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113602"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165225","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Tailing and axisymmetric static laser beam shapes to steer microstructure and improve mechanical properties of autogenously laser welded AA6082 alloy

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113619

Venkat Vivek Pamarthi , Tianzhu Sun , Abhishek Das , Qamar Hayat , Alexander Griffiths , Lewis Johnson , Pasquale Franciosa

Laser beam shaping technology has advanced remote laser welding applications, yet welding AA6xxx alloys remains challenging due to their sensitivity to cracking. Recent studies on these alloys have focussed on axisymmetric shapes, with a limited understanding of molten flow dynamics and microstructural evolution in the context of non-axisymmetric shapes. This study examines the impact of tailing and axisymmetric laser beam shapes on steering microstructure, and cracking mitigation in AA6082 alloy by combining multiphysics CFD simulation and experimental observations. Two sets of beam shapes were investigated: (1) four axisymmetric core-to-ring beam shapes with varying ring diameter, and power, and (2) a tailing beam shape with a 3 mm elongated tail. The findings indicate that introducing a 580 µm ring to the core beam reduces crack formation by lowering thermal gradients; however, increasing the power of the ring beam at a constant diameter, coarsens the microstructure, producing axial columnar grains with higher crack sensitivity. Expanding the ring beam diameter to 1200 µm reduced molten flow and thermal gradients, resulting in decreased cracking and increased tensile strength by 36%, compared to the core-only shape. The tailing shape beam further lowered thermal gradients owing to the larger molten pool and elongated tail, achieving a 62% grain size reduction compared to the core-only shape.

{"title":"Tailing and axisymmetric static laser beam shapes to steer microstructure and improve mechanical properties of autogenously laser welded AA6082 alloy","authors":"Venkat Vivek Pamarthi , Tianzhu Sun , Abhishek Das , Qamar Hayat , Alexander Griffiths , Lewis Johnson , Pasquale Franciosa","doi":"10.1016/j.matdes.2025.113619","DOIUrl":"10.1016/j.matdes.2025.113619","url":null,"abstract":"<div><div>Laser beam shaping technology has advanced remote laser welding applications, yet welding AA6xxx alloys remains challenging due to their sensitivity to cracking. Recent studies on these alloys have focussed on axisymmetric shapes, with a limited understanding of molten flow dynamics and microstructural evolution in the context of non-axisymmetric shapes. This study examines the impact of tailing and axisymmetric laser beam shapes on steering microstructure, and cracking mitigation in AA6082 alloy by combining multiphysics CFD simulation and experimental observations. Two sets of beam shapes were investigated: (1) four axisymmetric core-to-ring beam shapes with varying ring diameter, and power, and (2) a tailing beam shape with a 3 mm elongated tail. The findings indicate that introducing a 580 µm ring to the core beam reduces crack formation by lowering thermal gradients; however, increasing the power of the ring beam at a constant diameter, coarsens the microstructure, producing axial columnar grains with higher crack sensitivity. Expanding the ring beam diameter to 1200 µm reduced molten flow and thermal gradients, resulting in decreased cracking and increased tensile strength by 36%, compared to the core-only shape. The tailing shape beam further lowered thermal gradients owing to the larger molten pool and elongated tail, achieving a 62% grain size reduction compared to the core-only shape.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113619"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165234","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113592

E. Zanchi , H. Javed , S.De La Pierre , M. Ferraris , G. Cempura , A. Benelli , A.R. Boccaccini , F. Smeacetto

Applying an alumina-based coating at the sealant interface on interconnects can significantly reduce degradation and extend the lifetime of Solid Oxide Cell (SOC) stacks. This study introduces an innovative aluminization process achieved through Electrophoretic Deposition (EPD) of metallic aluminum powder on Crofer22APU stainless steel, reported here for the first time. The EPD suspensions and coating consolidation treatments were optimized for intermediate temperature applications in SOC stack interconnects. The alumina-based coating enhances steel resistance to high-temperature oxidation and improves the interface at the joined areas with the sealant by increasing surface roughness. Alumina-coated interconnect-glass sealant samples were subjected to static air ageing at 850 °C for up to 1000 h to evaluate interface evolution and potential corrosion product formation. The mechanical resistance of the alumina-coated steel joints, both in their initial state and after 1000-hour aging, was assessed via torsion tests, with a shear strength of 31.2 ± 2.0 MPa and 33.0 ± 1.0 MPa for as-prepared and aged samples, respectively, revealing a cohesive fracture mode and no interface degradation even after prolonged aging.

{"title":"An innovative aluminization process for solid oxide cell interconnects: From the design to the processing and testing","authors":"E. Zanchi , H. Javed , S.De La Pierre , M. Ferraris , G. Cempura , A. Benelli , A.R. Boccaccini , F. Smeacetto","doi":"10.1016/j.matdes.2025.113592","DOIUrl":"10.1016/j.matdes.2025.113592","url":null,"abstract":"<div><div>Applying an alumina-based coating at the sealant interface on interconnects can significantly reduce degradation and extend the lifetime of Solid Oxide Cell (SOC) stacks. This study introduces an innovative aluminization process achieved through Electrophoretic Deposition (EPD) of metallic aluminum powder on Crofer22APU stainless steel, reported here for the first time. The EPD suspensions and coating consolidation treatments were optimized for intermediate temperature applications in SOC stack interconnects. The alumina-based coating enhances steel resistance to high-temperature oxidation and improves the interface at the joined areas with the sealant by increasing surface roughness. Alumina-coated interconnect-glass sealant samples were subjected to static air ageing at 850 °C for up to 1000 h to evaluate interface evolution and potential corrosion product formation. The mechanical resistance of the alumina-coated steel joints, both in their initial state and after 1000-hour aging, was assessed via torsion tests, with a shear strength of 31.2 ± 2.0 MPa and 33.0 ± 1.0 MPa for as-prepared and aged samples, respectively, revealing a cohesive fracture mode and no interface degradation even after prolonged aging.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113592"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165648","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

An additive manufacturing approach for fabrication of agarose hydrogel structures for protein sorption application

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113581

Feng Cao , Hossein Najaf Zadeh , Klaudia Świacka , Jakub Maculewicz , Dan Bowles , Tim Huber , Don Clucas

Additive manufacturing of hydrogels is a rapidly evolving field due to the unique properties of hydrogels and their potential applications in various sectors. However, the low production rate and coarse resolution of current additive manufacturing methods limit their use. This article proposes a Stencil Additive Manufacturing (SAM) method to produce agarose hydrogel structures with horizontal and vertical resolutions of 500 and 80 μm using a novel SAM printer. Compared to peer methods, the shape fidelity of printed structures was improved and errors resulting from the Barus effect were minimized to 1.7 % and 7.1 %, depending on stencil patterns. Mechanical and thermal properties of agarose hydrogels were investigated by considering chemical crosslinking and agarose concentration, and the gelation and melting temperatures were determined. The analysis of hydrogel microstructures illustrated the change in porosity by regulating agarose concentration and the gelation rate. Static bovine serum albumin binding tests were performed using printed structures with varying concentrations and resolutions to explore the protein adsorption capacity. The results indicated that structure resolutions affect the adsorption capacity dramatically, which was increased from 100.44 to 144.13 mg/ml as resolutions were improved from 500 to 350 µm. Therefore, SAM-printing agarose hydrogels with periodic structures demonstrates potential in applications.

{"title":"An additive manufacturing approach for fabrication of agarose hydrogel structures for protein sorption application","authors":"Feng Cao , Hossein Najaf Zadeh , Klaudia Świacka , Jakub Maculewicz , Dan Bowles , Tim Huber , Don Clucas","doi":"10.1016/j.matdes.2025.113581","DOIUrl":"10.1016/j.matdes.2025.113581","url":null,"abstract":"<div><div>Additive manufacturing of hydrogels is a rapidly evolving field due to the unique properties of hydrogels and their potential applications in various sectors. However, the low production rate and coarse resolution of current additive manufacturing methods limit their use. This article proposes a Stencil Additive Manufacturing (SAM) method to produce agarose hydrogel structures with horizontal and vertical resolutions of 500 and 80 μm using a novel SAM printer. Compared to peer methods, the shape fidelity of printed structures was improved and errors resulting from the Barus effect were minimized to 1.7 % and 7.1 %, depending on stencil patterns. Mechanical and thermal properties of agarose hydrogels were investigated byconsidering chemical crosslinking and agarose concentration, and the gelation and melting temperatures were determined. The analysis of hydrogel microstructures illustrated the change in porosity by regulating agarose concentration and the gelation rate. Static bovine serum albumin binding tests were performed using printed structures with varying concentrations and resolutions to explore the protein adsorption capacity. The results indicated that structure resolutions affect the adsorption capacity dramatically, which was increased from 100.44 to 144.13 mg/ml as resolutions were improved from 500 to 350 µm. Therefore, SAM-printing agarose hydrogels with periodic structures demonstrates potential in applications.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113581"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143164067","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113637

Balázs Illés , Agata Skwarek , Tamás Hurtony , Olivér Krammer , Bálint Medgyes , Krzysztof Szostak , Gábor Harsányi , András Kovács , Béla Pécz

Sn whisker growth was investigated from submicron Sn layers on Cu substrates in thermal vacuum conditions to compare the growth differences in ambient and space conditions. Cu substrates were covered with 500 nm thick Sn by PVD. The samples were kept at 50 °C and 8.3x10^-6 mbar for 1000 h in order to simulate the space conditions. Numerous Sn whiskers were found on the samples after some days of sample preparation. More but shorter whiskers with different structures were developed in a vacuum than in ambient conditions before. The vacuum-grown whiskers had segmented block-like bodies with a plain surface, while ambient-grown whiskers had a twisted body with grooves. TEM investigations found a weak correlation between the crystal structure and the shape of the different whiskers. However, it proved that the high mechanical stress of the Cu₆Sn₅ intermetallic layer growth initiated the interface flow mechanism, which transported Cu₆Sn₅ into the whiskers. The vacuum-grown whiskers contained approximately half the amount of Cu₆Sn₅ inclusions than the ambient-grown ones, which could be related to the more uniform stress relaxation of the oxide-free surface in the vacuum. The higher amount Cu₆Sn₅ inclusions could cause the twisting of the whisker bodies in ambient conditions.

{"title":"Risk of transition to lead-free in the space sector: Sn whisker growth in thermal vacuum conditions from submicron Sn layer","authors":"Balázs Illés , Agata Skwarek , Tamás Hurtony , Olivér Krammer , Bálint Medgyes , Krzysztof Szostak , Gábor Harsányi , András Kovács , Béla Pécz","doi":"10.1016/j.matdes.2025.113637","DOIUrl":"10.1016/j.matdes.2025.113637","url":null,"abstract":"<div><div>Sn whisker growth was investigated from submicron Sn layers on Cu substrates in thermal vacuum conditions to compare the growth differences in ambient and space conditions. Cu substrates were covered with 500 nm thick Sn by PVD. The samples were kept at 50 °C and 8.3x10<sup>-6</sup> mbar for 1000 h in order to simulate the space conditions. Numerous Sn whiskers were found on the samples after some days of sample preparation. More but shorter whiskers with different structures were developed in a vacuum than in ambient conditions before. The vacuum-grown whiskers had segmented block-like bodies with a plain surface, while ambient-grown whiskers had a twisted body with grooves. TEM investigations found a weak correlation between the crystal structure and the shape of the different whiskers. However, it proved that the high mechanical stress of the Cu<sub>6</sub>Sn<sub>5</sub> intermetallic layer growth initiated the interface flow mechanism, which transported Cu<sub>6</sub>Sn<sub>5</sub> into the whiskers. The vacuum-grown whiskers contained approximately half the amount of Cu<sub>6</sub>Sn<sub>5</sub> inclusions than the ambient-grown ones, which could be related to the more uniform stress relaxation of the oxide-free surface in the vacuum. The higher amount Cu<sub>6</sub>Sn<sub>5</sub> inclusions could cause the twisting of the whisker bodies in ambient conditions.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113637"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A tunable encoder with circular dichroism and polarization encoding function based on a layered metastructure in the GHz range

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113636

Chuan-Qi Wu, Jun-Yang Sui, Qi Chen, Xing-Zhou Tang, Hai-Feng Zhang

In this paper, based on a layered metastructure, a tunable encoder capable of circular dichroism (CD) and polarization conversion (PC) is researched, which contains one common medium, magnetized plasma, and yttrium iron garnet (YIG). The linear polarization waves (LPWs) are elected as incident waves. The incident angle and external magnetic field intensity are θ and H_O. A modulable dielectric layer (MDL), composed of YIG, is optionally added to the preceding item of the given metastructure, which owns a certain thickness. By adjusting the proper θ, H_O, and adding the MDL, the CD can be obtained at a certain frequency point, where the right-handed circular polarization waves (CPWs) and left-handed CPWs have different reflections. Meanwhile, the LPWs can be converted to CPWs or other polarization waves in a specific frequency band. Furthermore, the θ and addition of the MDL are considered as the first and second logic levels, respectively, to form four logic codes, which can realize the PC from LPWs to CPWs or LPWs within the same specific frequency band. Hence, the designed encoder has a promising potential in the precise control of PC in the special bandwidth, which can provide excellent support for the research of tunable and diverse polarization splitters and selectors.

{"title":"A tunable encoder with circular dichroism and polarization encoding function based on a layered metastructure in the GHz range","authors":"Chuan-Qi Wu, Jun-Yang Sui, Qi Chen, Xing-Zhou Tang, Hai-Feng Zhang","doi":"10.1016/j.matdes.2025.113636","DOIUrl":"10.1016/j.matdes.2025.113636","url":null,"abstract":"<div><div>In this paper, based on a layered metastructure, a tunable encoder capable of circular dichroism (CD) and polarization conversion (PC) is researched, which contains one common medium, magnetized plasma, and yttrium iron garnet (YIG). The linear polarization waves (LPWs) are elected as incident waves. The incident angle and external magnetic field intensity are <em>θ</em> and <em>H<sub>O</sub></em>. A modulable dielectric layer (MDL), composed of YIG, is optionally added to the preceding item of the given metastructure, which owns a certain thickness. By adjusting the proper <em>θ</em>, <em>H<sub>O</sub></em>, and adding the MDL, the CD can be obtained at a certain frequency point, where the right-handed circular polarization waves (CPWs) and left-handed CPWs have different reflections. Meanwhile, the LPWs can be converted to CPWs or other polarization waves in a specific frequency band. Furthermore, the <em>θ</em> and addition of the MDL are considered as the first and second logic levels, respectively, to form four logic codes, which can realize the PC from LPWs to CPWs or LPWs within the same specific frequency band. Hence, the designed encoder has a promising potential in the precise control of PC in the special bandwidth, which can provide excellent support for the research of tunable and diverse polarization splitters and selectors.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113636"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165229","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Biomimetic mineralization of diatom exoskeleton for sustainable pH-sensitive colored chitosan/silica hybrid self-supported films

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2024.113571

Sandra Castanié , Laurent Billon

A gentle bio-inspired approach to the biosilicification occurring in diatom frustule is proposed to develop, at room temperature and without addition of a co-solvent, self-supported hybrid organic/inorganic films with pH-sensitive properties. It was found that chitosan (CS) biopolymer, a polysaccharide possessing numerous amine groups (–NH₂) is capable of mimicking the action of the silaffins proteins of diatom frustule in the polycondensation process of the TetraEthoxyOrthoSilicate (TEOS) silica precursor to form a cohesive self-supported hybrid film under soft conditions in aqueous media. Thanks to its good film-forming property, hybrid chitosan/silica (CS/SiO₂) films have been elaborated varying the amount of TEOS to study their optical and mechanical properties. It is shown that increasing the amount of TEOS up to 90 wt% improves the transparency, strength and stability of the films due to the interpenetration of the chitosan and silicaq networks. The incorporation of sustainable pH-sensitive alizarin dye during the elaboration of the films does not affect their mechanical properties whatever the composition. Moreover, these colored hybrid materials show good pH-sensitiveness under basic environment. Therefore, thanks to their antimicrobial properties and their pH-sensitivity, such self-supported films could be designed for applications such as smart sustainable food packaging and food degradation indicator.

{"title":"Biomimetic mineralization of diatom exoskeleton for sustainable pH-sensitive colored chitosan/silica hybrid self-supported films","authors":"Sandra Castanié , Laurent Billon","doi":"10.1016/j.matdes.2024.113571","DOIUrl":"10.1016/j.matdes.2024.113571","url":null,"abstract":"<div><div>A gentle bio-inspired approach to the biosilicification occurring in diatom frustule is proposed to develop, at room temperature and without addition of a co-solvent, self-supported hybrid organic/inorganic films with pH-sensitive properties. It was found that chitosan (CS) biopolymer, a polysaccharide possessing numerous amine groups (–NH<sub>2</sub>) is capable of mimicking the action of the silaffins proteins of diatom frustule in the polycondensation process of the TetraEthoxyOrthoSilicate (TEOS) silica precursor to form a cohesive self-supported hybrid film under soft conditions in aqueous media. Thanks to its good film-forming property, hybrid chitosan/silica (CS/SiO<sub>2</sub>) films have been elaborated varying the amount of TEOS to study their optical and mechanical properties. It is shown that increasing the amount of TEOS up to 90 wt% improves the transparency, strength and stability of the films due to the interpenetration of the chitosan and silicaq networks. The incorporation of sustainable pH-sensitive alizarin dye during the elaboration of the films does not affect their mechanical properties whatever the composition. Moreover, these colored hybrid materials show good pH-sensitiveness under basic environment. Therefore, thanks to their antimicrobial properties and their pH-sensitivity, such self-supported films could be designed for applications such as smart sustainable food packaging and food degradation indicator.</div></div>","PeriodicalId":383,"journal":{"name":"Materials & Design","volume":"250 ","pages":"Article 113571"},"PeriodicalIF":7.6,"publicationDate":"2025-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143165641","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Millimeter-wave reconfigurable antenna based on VO2 ink achieved by a simple process

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113583

Suwu Ma , Wanchen Yang , Jinghao Li , Quan Xue , Wenquan Che

The growth of communication demands have boosted the development of millimeter-wave technology, as the spectrum migrates to higher frequencies. And reconfigurable antennas emerge as a promising solution for complex communication systems. Nevertheless, the deployment of millimeter-wave reconfigurable antennas is impeded by the limitations of conventional switching devices like PIN diodes and varactors, which are unsuitable for millimeter-wave applications. Vanadium dioxide (VO₂), as a phase-change material, possesses high isolation and low loss at millimeter-wave band, enabling it to function effectively as a switching device. Despite its advantages, traditional VO₂ film fabrication methods are costly and time-consuming, greatly limiting its application. This paper presents a simple VO₂ ink fabrication technique, which is cost-effective, stable, and easy to integrate. Based on the VO₂ ink, a frequency-reconfigurable millimeter-wave antenna is designed and fabricated. The results confirm the feasibility of using VO₂ ink for millimeter-wave applications and demonstrate its tolerance to fabrication inaccuracies, marking a significant advancement in the design of reconfigurable antennas and broadening the potential for future research and applications.

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引用次数: 0

Novel electromagnetic oscillation method for uniform grain refinement and mechanical properties enhancement of flat-shaped aerospace components

IF 7.6 2区材料科学 Q1 MATERIALS SCIENCE, MULTIDISCIPLINARY

Materials & Design

Pub Date : 2025-02-01 DOI: 10.1016/j.matdes.2025.113597

Zong-sheng Xie , Xin Hao , Guo-huai Liu , Hang Zheng , Ye Wang , Chu-shan Yi , Zhao-dong Wang

Uniform fine grain structure is essential for enhancing the mechanical properties of flat-shaped aerospace components at the typical working temperature of 870 °C. However, the issue of grain coarsening after investment casting has remained intractable, necessitating reliable and efficient grain refinement methods. In this study, magnetic field distributions are simulated by ANSYS Maxwell, resulting in the design of three self-developed optimized electromagnetic oscillation (EMO) devices for grain refinement of different-sized flat-shaped aerospace components. The results show that the position of high magnetic field regions can be controlled by adjusting the iron core and hoop structure, ensuring magnetic field intensities > 70 KA/m in regions requiring grain refinement. The reliability of simulations is verified by successfully producing castings with uniform and fine equiaxed grains. Meanwhile, the tensile samples prepared with the EMO device under the 200A/20 Hz EMO process exhibit a 98.15 % reduction in grain size compared to direct casting, with strength properties slightly improved and elongation and section shrinkage significantly increased by 102.9 % and 110.9 %, respectively, at 870 °C. Grain refinement caused by EMO facilitated uniform deformation distribution, allowing samples to withstand larger deformations, causing the effect of deformation strengthening to outweigh the grain boundary strength reduction, thus enhancing strength properties.

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引用次数: 0

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