首页 > 最新文献

2018 International Semiconductor Conference (CAS)最新文献

英文 中文
Modeling of High Total Ionizing Dose (TID) Effects for Enclosed Layout Transistors in 65 nm Bulk CMOS 65nm CMOS封装封装晶体管高总电离剂量效应建模
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539806
Aristeidis Nikolaou, M. Bucher, N. Makris, A. Papadopoulou, Loukas Chcvas, G. Borghello, H. D. Koch, F. Faccio
High doses of ionizing radiation drastically impair the electrical performance of CMOS technology. Enclosed gate layout remains an effective means to reduce this impact. Nevertheless, high total ionizing dose (TID) effects remain strong. The paper presents an effective approach to analytically model high TID effects in both NMOS and PMOS transistors with enclosed-gate layout in 65 nm commercial CMOS.
高剂量的电离辐射会严重损害CMOS技术的电学性能。封闭闸门的布置仍然是减少这种影响的有效手段。然而,高总电离剂量(TID)效应仍然很强。本文提出了一种有效的方法来解析模拟65nm商用CMOS中具有封闭栅极布局的NMOS和PMOS晶体管的高TID效应。
{"title":"Modeling of High Total Ionizing Dose (TID) Effects for Enclosed Layout Transistors in 65 nm Bulk CMOS","authors":"Aristeidis Nikolaou, M. Bucher, N. Makris, A. Papadopoulou, Loukas Chcvas, G. Borghello, H. D. Koch, F. Faccio","doi":"10.1109/SMICND.2018.8539806","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539806","url":null,"abstract":"High doses of ionizing radiation drastically impair the electrical performance of CMOS technology. Enclosed gate layout remains an effective means to reduce this impact. Nevertheless, high total ionizing dose (TID) effects remain strong. The paper presents an effective approach to analytically model high TID effects in both NMOS and PMOS transistors with enclosed-gate layout in 65 nm commercial CMOS.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"16 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116851597","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Session PS 会话PS
Pub Date : 2018-10-01 DOI: 10.1109/smicnd.2018.8539795
Plenary Sessions
全体会议
{"title":"Session PS","authors":"","doi":"10.1109/smicnd.2018.8539795","DOIUrl":"https://doi.org/10.1109/smicnd.2018.8539795","url":null,"abstract":"Plenary Sessions","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125872379","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Second Harmonic Generation: A Non-Destructive Characterization Method for Dielectric-Semiconductor Interfaces 二次谐波的产生:介电-半导体界面的无损表征方法
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539758
I. Ionica, D. Damianos, A. Kaminski-Cachopo, A. Bouchard, X. Mescot, M. Gri, G. Grosa, S. Cristoloveanu, G. Vitrant, D. Blanc-Pélissier, M. Lei, J. Chanzala
This paper reviews the application of second harmonic generation (SHG) to characterize dielectric-semiconductor interfaces used in microelectronics and photovoltaics. Based on non-linear optics, the method is non-destructive, so particularly advantageous for thin films. The theoretical background shows the possibility to access the electric field at interfaces and consequently to have a non-destructive measurement for interface state densities or fixed charges in oxides. Two more detailed examples of application of SHG characterization will be shown: field-effect passivation of silicon using thin film deposited alumina and interface analysis of silicon-on-insulator substrates.
本文综述了二次谐波产生(SHG)在微电子和光电领域中表征介电-半导体界面的应用。该方法基于非线性光学,具有非破坏性,因此对薄膜特别有利。理论背景表明,可以在界面处获得电场,从而对氧化物中的界面态密度或固定电荷进行无损测量。将展示两个更详细的应用SHG表征的例子:使用薄膜沉积氧化铝对硅进行场效应钝化和对绝缘体上硅衬底进行界面分析。
{"title":"Second Harmonic Generation: A Non-Destructive Characterization Method for Dielectric-Semiconductor Interfaces","authors":"I. Ionica, D. Damianos, A. Kaminski-Cachopo, A. Bouchard, X. Mescot, M. Gri, G. Grosa, S. Cristoloveanu, G. Vitrant, D. Blanc-Pélissier, M. Lei, J. Chanzala","doi":"10.1109/SMICND.2018.8539758","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539758","url":null,"abstract":"This paper reviews the application of second harmonic generation (SHG) to characterize dielectric-semiconductor interfaces used in microelectronics and photovoltaics. Based on non-linear optics, the method is non-destructive, so particularly advantageous for thin films. The theoretical background shows the possibility to access the electric field at interfaces and consequently to have a non-destructive measurement for interface state densities or fixed charges in oxides. Two more detailed examples of application of SHG characterization will be shown: field-effect passivation of silicon using thin film deposited alumina and interface analysis of silicon-on-insulator substrates.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125036059","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
International Semiconductor Conference (CAS) 2018 2018国际半导体大会(CAS
Pub Date : 2018-10-01 DOI: 10.1109/smicnd.2018.8539845
C. Dunare, J. Stevenson, A. Gundlach, A. Walton, W. Parkes
International Semiconductor Conference (CAS) 2018
2018国际半导体大会(CAS
{"title":"International Semiconductor Conference (CAS) 2018","authors":"C. Dunare, J. Stevenson, A. Gundlach, A. Walton, W. Parkes","doi":"10.1109/smicnd.2018.8539845","DOIUrl":"https://doi.org/10.1109/smicnd.2018.8539845","url":null,"abstract":"International Semiconductor Conference (CAS) 2018","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129263699","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Enhanced Photoconductivity of SIGE-Trilayer Stack by Retrenching Annealing Conditions 通过强化退火条件增强sige -三层堆叠的光电导率
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539775
M. T. Sultan, J. Gudmundsson, A. Manolescu, M. Ciurea, C. Palade, A. Maraloiu, H. Svavarsson
We studied the effect of short term furnace annealing over the photoconductive properties of tristacked layer i.e. TiO2/(SiGe/TiO2)3. The structure was prepared by depositing alternate layers of TiO2 and SiGe films, using direct-current magnetron sputtering technique. A transmission electron microscopy and grazing incidence spectroscopy was used to analyze the morphology of the structure. Photoconductive properties were studied by measuring photocurrent spectra at different applied voltages and temperatures. Tristack layers were obtained with 5–10 nm SiGe nanocrystals (NCs) by annealing at 600 °C for 5 min. No sign of SiO2 formation was found inside stacked layers. A maximum in the photocurrent spectra was observed at 994 nm at 300 K but it red-shifted gradually to 1045 nm with decrease in temperature to 100 K. This transition in peak maxima is attributed to SiGe NCs, due to lattice vibration and to contribution of non-radiative recombination at low temperatures.
研究了短期炉内退火对三层TiO2/(SiGe/TiO2)3光导性能的影响。该结构采用直流磁控溅射技术,通过沉积TiO2和SiGe薄膜的交替层来制备。利用透射电子显微镜和掠入射光谱分析了结构的形貌。通过测量不同外加电压和温度下的光电流谱,研究了光导性能。在600℃下退火5 min,得到了5 ~ 10 nm的SiGe纳米晶(NCs),堆叠层内未发现SiO2形成的迹象。在300 K时,光电流光谱在994 nm处达到最大值,但随着温度降低到100 K,光电流光谱逐渐红移至1045 nm。由于晶格振动和低温下的非辐射复合作用,这种峰最大值的转变归因于SiGe NCs。
{"title":"Enhanced Photoconductivity of SIGE-Trilayer Stack by Retrenching Annealing Conditions","authors":"M. T. Sultan, J. Gudmundsson, A. Manolescu, M. Ciurea, C. Palade, A. Maraloiu, H. Svavarsson","doi":"10.1109/SMICND.2018.8539775","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539775","url":null,"abstract":"We studied the effect of short term furnace annealing over the photoconductive properties of tristacked layer i.e. TiO2/(SiGe/TiO2)3. The structure was prepared by depositing alternate layers of TiO2 and SiGe films, using direct-current magnetron sputtering technique. A transmission electron microscopy and grazing incidence spectroscopy was used to analyze the morphology of the structure. Photoconductive properties were studied by measuring photocurrent spectra at different applied voltages and temperatures. Tristack layers were obtained with 5–10 nm SiGe nanocrystals (NCs) by annealing at 600 °C for 5 min. No sign of SiO2 formation was found inside stacked layers. A maximum in the photocurrent spectra was observed at 994 nm at 300 K but it red-shifted gradually to 1045 nm with decrease in temperature to 100 K. This transition in peak maxima is attributed to SiGe NCs, due to lattice vibration and to contribution of non-radiative recombination at low temperatures.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129270448","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Surface Recombination Evaluation in Bipolar Junction Transistors by Combined Electro-Optical Method 复合电光法评价双极结晶体管表面复合
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539746
V. Banu, J. Montserrat, X. Jordà, P. Godignon
This paper describes an original method for very short minority carrier lifetime evaluation of semiconductor junctions that is aimed to be mainly used for the surface recombination studies of bipolar junction transistors made on silicon carbide, where an important surface recombination between base and emitter occurs. The presented method is based on combined electrooptical measurements and it was prior tested and calibrated using silicon bipolar transistors.
本文描述了一种评估半导体结极短少数载流子寿命的原始方法,该方法主要用于碳化硅双极结晶体管的表面复合研究,其中基极和发射极之间发生重要的表面复合。该方法是基于光电组合测量,并事先使用硅双极晶体管进行了测试和校准。
{"title":"Surface Recombination Evaluation in Bipolar Junction Transistors by Combined Electro-Optical Method","authors":"V. Banu, J. Montserrat, X. Jordà, P. Godignon","doi":"10.1109/SMICND.2018.8539746","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539746","url":null,"abstract":"This paper describes an original method for very short minority carrier lifetime evaluation of semiconductor junctions that is aimed to be mainly used for the surface recombination studies of bipolar junction transistors made on silicon carbide, where an important surface recombination between base and emitter occurs. The presented method is based on combined electrooptical measurements and it was prior tested and calibrated using silicon bipolar transistors.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"93 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122310703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Low-Temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration 低温封装方法是微系统组装和集成的关键推动因素
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539847
S. Stoukatch, F. Dupont, M. Kraft
The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.
本文报道了如何将微系统组装和集成为全功能系统。我们表明,在集成电路常用的各种装配技术和方法中,有些也可以成功地用于微系统的装配。MS对组装和集成过程中可能发生的热暴露特别敏感。
{"title":"Low-Temperature Packaging Methods as a Key Enablers for Microsystems Assembly and Integration","authors":"S. Stoukatch, F. Dupont, M. Kraft","doi":"10.1109/SMICND.2018.8539847","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539847","url":null,"abstract":"The paper reports on assembly and integration of MS (microsystems) into fully functional system. We show that among varieties of assembly techniques and methods commonly used for IC, some can be successfully used also for the assembly of microsystems. MS are specifically sensitive to thermal exposure that can occur during the assembly and integration process.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126098993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Design Aspects and Experimental Results on Broadband Monopole Dielectric Resonator Antenna 宽带单极介质谐振器天线的设计要点与实验结果
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539809
S. Simion, S. Iordanescu
A configuration of broadband dielectric resonator (DR) based monopole antenna covering the whole X-frequency band is analyzed numerically, as well as experimentally. The analysis is performed for two cases: with and without PTFE covering the part of the monopole antenna which is extended above the DR. It is shown that the presence of the PTFE may improve the return loss of the antenna. Experimental results for the return loss and antenna directivity are presented, too.
对一种覆盖整个x频段的宽带介质谐振器单极天线结构进行了数值分析和实验研究。对单极天线延伸到dr以上的部分进行了带PTFE和不带PTFE两种情况的分析,结果表明,PTFE的存在可以改善天线的回波损耗。给出了回波损耗和天线指向性的实验结果。
{"title":"Design Aspects and Experimental Results on Broadband Monopole Dielectric Resonator Antenna","authors":"S. Simion, S. Iordanescu","doi":"10.1109/SMICND.2018.8539809","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539809","url":null,"abstract":"A configuration of broadband dielectric resonator (DR) based monopole antenna covering the whole X-frequency band is analyzed numerically, as well as experimentally. The analysis is performed for two cases: with and without PTFE covering the part of the monopole antenna which is extended above the DR. It is shown that the presence of the PTFE may improve the return loss of the antenna. Experimental results for the return loss and antenna directivity are presented, too.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116081850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Manufacture and Investigation of a Vertical MEMS Switch 垂直MEMS开关的制造与研究
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539774
A. Baracu, R. Müller, R. Voicu, A. Dinescu, M. Pustan, C. Bîrleanu
This paper presents a switch with vertical movement, based on surface micromachining processes. The central thermal driving structure contains a suspended rectangular shape connected by 5 pairs of symmetric mobile beams. SEM investigations and COVENTOR simulations were performed in order to investigate the behavior of the switch.
提出了一种基于表面微加工工艺的垂直运动开关。中央热驱动结构包含一个由5对对称移动梁连接的悬浮矩形。为了研究开关的行为,进行了SEM调查和covenor模拟。
{"title":"Manufacture and Investigation of a Vertical MEMS Switch","authors":"A. Baracu, R. Müller, R. Voicu, A. Dinescu, M. Pustan, C. Bîrleanu","doi":"10.1109/SMICND.2018.8539774","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539774","url":null,"abstract":"This paper presents a switch with vertical movement, based on surface micromachining processes. The central thermal driving structure contains a suspended rectangular shape connected by 5 pairs of symmetric mobile beams. SEM investigations and COVENTOR simulations were performed in order to investigate the behavior of the switch.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131280722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Comparative Study of the Electrical Properties of CZTS-TiO2 and CZTS-ZnO Heterojunctions for PV Applications 光伏应用中CZTS-TiO2和CZTS-ZnO异质结电性能的比较研究
Pub Date : 2018-10-01 DOI: 10.1109/SMICND.2018.8539820
M. Covei, C. Bogatu, D. Perniu, S. Cisse, A. Duţă
Two heterojunctions based on CU2ZnSnS4 were obtained as thin films, on FTO glass, by spray pyrolysis deposition. The choice of the n-type layer (TiO2 or ZnO) has impacted the nucleation and growth of the CZTS layers deposited on top. Crystalline thin films were obtained with drastically different morphologies. Small spherical grains promoted a better match at the interface between TiO2 and CZTS, while the hexagonal plates of ZnO promoted discontinuations. Both junctions proved photosensitive and gave good rectifying behavior but efficiencies lower than 0.01% suggest charge recombination at the interface or in the CZTS layer.
采用喷雾热解沉积的方法,在FTO玻璃表面制备了CU2ZnSnS4异质结薄膜。n型层(TiO2或ZnO)的选择影响了上面沉积的CZTS层的成核和生长。得到了形貌完全不同的晶体薄膜。小的球形颗粒促进了TiO2与CZTS界面的更好匹配,而ZnO的六角形板则促进了界面的中断。这两个结都证明了光敏性和良好的整流行为,但效率低于0.01%表明在界面或CZTS层中电荷重组。
{"title":"Comparative Study of the Electrical Properties of CZTS-TiO2 and CZTS-ZnO Heterojunctions for PV Applications","authors":"M. Covei, C. Bogatu, D. Perniu, S. Cisse, A. Duţă","doi":"10.1109/SMICND.2018.8539820","DOIUrl":"https://doi.org/10.1109/SMICND.2018.8539820","url":null,"abstract":"Two heterojunctions based on CU2ZnSnS4 were obtained as thin films, on FTO glass, by spray pyrolysis deposition. The choice of the n-type layer (TiO2 or ZnO) has impacted the nucleation and growth of the CZTS layers deposited on top. Crystalline thin films were obtained with drastically different morphologies. Small spherical grains promoted a better match at the interface between TiO2 and CZTS, while the hexagonal plates of ZnO promoted discontinuations. Both junctions proved photosensitive and gave good rectifying behavior but efficiencies lower than 0.01% suggest charge recombination at the interface or in the CZTS layer.","PeriodicalId":247062,"journal":{"name":"2018 International Semiconductor Conference (CAS)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132607899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
期刊
2018 International Semiconductor Conference (CAS)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1